FCRN3038452BB [CALMIRCO]

RESISTOR, THIN FILM, 0.2W, 0.1%, 25ppm, 84500ohm, SURFACE MOUNT, 0805, CHIP;
FCRN3038452BB
型号: FCRN3038452BB
厂家: CALIFORNIA MICRO DEVICES CORP    CALIFORNIA MICRO DEVICES CORP
描述:

RESISTOR, THIN FILM, 0.2W, 0.1%, 25ppm, 84500ohm, SURFACE MOUNT, 0805, CHIP

文件: 总2页 (文件大小:211K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CALIFORNIA MICRO DEVICES  
FCRN303  
0805 Precision Thin Film Resistor CSP (Chip Scale Package)  
Features  
Applications  
• Standard 0805 Format  
• Voltage dividers  
• Current sensing  
• Current limiting  
• SMD chips  
• Absolute tolerance of 0.1%  
• Temperature Coefficient (TCR) of 25ppm/°C  
• Precision gain setting  
Product Description  
California Micro Devices’ resistors offer a high degree of stability and oise wels the proven reliability charac-  
teristics of Tantalum Nitride. FCRN303 series offers these advantages n CSP (Chip Scale Package). FCRN303  
devices are built on ceramic with solder bumps for direct placement onto pred ircuit boards. They are compatible  
with 0805 footprint.  
SCHEMATIC CNFIGURATION  
1
2
Package Diagram  
2.032mm  
1.514mm  
9mm  
1.135mm  
1.272mm  
0.636mm  
0.381mm  
0.508mm  
ORDERING INFORMATION  
Resistive Value (XXXX) Tolerance  
1003  
Part Series  
FCRN303  
TCR  
A
J
First 3 digits are significant value  
(R indicates decimal point).  
Fourth digit represents number of  
zeros to follow.  
J = 5%  
G = 2%  
F = 1%  
D = 0.5%  
B = 0.1%  
No Letter = 100ppm  
A = 50ppm  
B = 25ppm  
(e.g. 100K = 1003)  
© 2001 California Micro Devices Corp. All rights reserved.  
C1240700  
4/3/2001 215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
1
FCRN303  
CALIFORNIA MICRO DEVICES  
RESISTANCE RANGE  
40Kto 150KΩ  
ELECTRICAL SPECIFICATIONS  
Parameter  
Test Condition  
TCR  
55°C to +125°C  
55°C to +125°C  
@ 70°C  
25ppm/°C  
100Vdc  
20
Max  
Max  
Max  
Max  
Operating Voltage  
Power Rating  
Absolute Tolerance  
+25°C  
Operating Temperature Range  
Storage Temperature  
C to 125°C  
6t+150°C  
CSP SPECIFINS  
2.032 x 1.272( 0.mm)  
0.500mm ( 0.075)  
0.381 x 1.135mm  
1.514mm
0.125mm m)  
Ceramic  
Final Die Size  
Die Thickness (Die & Bump)  
Pad Size  
Pad Pitch  
Bump Height  
80 x 50 mil ( )  
20 mil ( 3 mil)  
15 x 44.mil  
59.6 miominal  
5 mil ( mil)  
Ceic  
Die Substrate  
©2001 California Micro Devices Corp. All rights reserved.  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
4/3/2001  
2

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