PACDN010 [CALMIRCO]

P/ACTIVE SCHOTTKY DIODE MEMORY BUS TERMINATOR; P / ACTIVE肖特基二极管存储器总线端接
PACDN010
型号: PACDN010
厂家: CALIFORNIA MICRO DEVICES CORP    CALIFORNIA MICRO DEVICES CORP
描述:

P/ACTIVE SCHOTTKY DIODE MEMORY BUS TERMINATOR
P / ACTIVE肖特基二极管存储器总线端接

存储 肖特基二极管
文件: 总4页 (文件大小:123K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CALIFORNIA MICRO DEVICES  
PACDN010  
P/ACTIVESCHOTTKY DIODE MEMORY BUS TERMINATOR  
Applications  
Features  
• Provides proper bus termination independent of  
card loading conditions  
• SDRAM Memory Bus Termination  
• PCI v2.1 Bus Termination for Intel-based Pentium®  
and Pentium Pro systems  
• Schottky diode technology; fast turn on  
and reverse recovery characteristics  
• 36 integrated diodes in a single package  
offers 18 channel, dual rail clamping action  
• 24-pin QSOP package saves board space and  
eases layout in space critical bus termination  
applications  
Refer to AP-201 Termination Application Note for  
further information.  
• Available in 24 pin TSSOP package for component  
height constrained modules  
Product Description  
Reflections on high speed Memory Buses lead to undershoot and overshoot disturbances which may result in improper  
system operation. Resistor terminations, when used to terminate high speed memory or data lines, increase power  
consumption and degrade output (high) levels resulting in reduced noise immunity. Schottky diode termination is the best  
overall solution for applications in which power consumption and noise immunity are critical considerations.  
†
CAMD’s P/Active DN010 Schottky Diode Memory Bus Terminator is specifically designed to minimize undershoot/  
overshoot disturbances caused by reflection noise on SDRAM bus lines as well as v2.1 66MHz PCI buses.  
This highly integrated Schottky diode network provides very effective termination performance for high speed Memory Bus  
lines under variable loading conditions. The packaged device supports up to 18 terminated lines — each of which can be  
simultaneously clamped to both ground and power supply rail.  
SCHEMATIC CONFIGURATION  
VDD  
19  
VDD  
24  
GND  
23  
22  
21  
20  
18  
17  
16  
15  
14 13  
1
2
3
4
5
6
7
8
9
10  
11 12  
VDD  
GND  
GND  
P/Active™ is a trademark of California Micro Devices Corp.  
Pentium Pro is a registered trademark of Intel.  
†
Covered by one or more of U.S. Pat. Nos. 5,355,014, 5,370,766, and 5,514,612 and other pending applications.  
C0120497D  
© 2000 California Micro Devices Corp. All rights reserved.  
4/00  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
1
CALIFORNIA MICRO DEVICES  
PACDN010  
S TA N D A R D S P E C IF IC A TIO N  
Ab so lu t e Ma xim u m Ra t in g s  
Pa ra m e t e r  
Sym b o l  
Ra t in g  
Supply Voltage  
VDD  
-0.3V to 7V  
± 50mA  
Channel clamp current (continuous)  
Operating Temperature  
I
clamp  
0°C to 70°C  
Storage Temperature  
Package Power Rating  
Tstg  
-60°C to 150°C  
1.00W, max.  
QSOP @ 70°C  
QSOP @ 70°C  
1.00W, max.  
The absolute maximum ratings are limiting values, to be applied individually, beyond which the device may be permanently damaged. Functional  
operation under any of these conditions is not guaranteed. Exposing the device to its absolute maximum rating may  
affect its reliability.  
D IO D E C H A R A C TE R IS TIC S ( T  
A
= 0 °C TO 7 0 °C )  
Param eter  
Diode forward Voltage  
Condition  
IF = 16mA  
Min  
Typ  
0.65V  
Max  
0.85V  
IF = 50mA  
0.80V  
125MHz  
0.1µA  
5pF  
1.0V  
Max. Bus Speed (See Note 1)  
Channel leakage  
Z = 50, Logic Swing 0.4V to 3.0V  
0
0 VIN VDD  
f = 1MHz, VIN = 2.5V, TA = 25°C, VDD = 5.0V  
MIL-STD-8 8 3 , Me t h o d 3 0 1 5  
5µA  
Input Capacitance  
ESD Protection  
2KV  
S TA N D A R D P A R T O R D E R IN G IN F O R M A TIO N  
Package  
Ordering Part Num ber  
Pins  
2 4  
2 4  
Style  
QSOP  
TSSOP  
Tubes  
PACDN0 1 0 Q/T  
PACDN0 1 0 T/T  
Tape & Reel  
PACDN0 1 0 Q/R  
PACDN0 1 0 T/R  
Part Marking  
PACDN0 1 0 Q  
PACDN0 1 0 T  
Note 1:  
The presence of a Schottky diode for clamping bus overshoots will cause additional delays of signal edges. These delays are the result of diode  
characteristics such as forward voltage, diode capacitance and the reverse recovery phenomenon. The ground clamp diode is most critical,  
particularly if VLSI circuits such as static or dynamic memories are directly connected to busses without any buffer stages. The incremental delay  
observed on a positive edge following a negative transition that forward biased the Schottky diode is less than 800 pS. That represents less than  
10% of the 125 MHz (8 nS period) bus cycle time.  
© 2000 California Micro Devices Corp. All rights reserved.  
4/00  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
2
CALIFORNIA MICRO DEVICES  
PACDN010  
QSOP - TOP VIEW  
Power Derating Curve  
N
CAMD  
E H  
1
M E C H A N IC A L S P E C IF IC A TIO N S  
D
Lead Plating  
Tin-Lead  
Lead Material  
Copper Alloy  
0.004"(0.102mm)  
Silicon  
Lead Coplanarity  
Substrate Material  
Body Material  
Flammabiltiy  
Molded Epoxy  
UL94V-0  
e
B
A
C
A1  
L
P a c k a g e D im e n s io n s , P o w e r D is s ip a t io n & In fo r m a t io n  
Pa cka g e  
Pin s  
QSOP  
24  
JEDEC  
MO137  
m m  
in ch e s  
m in  
1.35  
0.10  
0.20  
0.18  
8.56  
3.81  
m a x  
1.75  
0.25  
0.30  
0.25  
8.73  
3.98  
m in  
m a x  
0.069  
0.010  
0.012  
0.010  
0.344  
0.157  
0.053  
0.004  
0.008  
0.007  
0.337  
0.150  
A
A1  
B
C
D
E
0.64 BSC  
0.025 BSC  
e
5.79  
0.40  
6.19  
1.27  
0.228  
0.016  
0.244  
0.050  
H
L
PD @ 70°C  
# / t u b e  
# / t a p e & re e l  
1.00W  
58 p cs  
2,500 p cs  
© 2000 California Micro Devices Corp. All rights reserved.  
4/00  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
3
CALIFORNIA MICRO DEVICES  
PACDN010  
TSSOP - TOP VIEW  
Power Derating Curve  
H
CAMD  
E H  
1
M E C H A N IC A L S P E C IF IC A TIO N S  
Lead Plating  
Tin-Lead  
D
Lead Material  
Copper Alloy  
0.004"(0.102mm)  
Silicon  
Lead Coplanarity  
Substrate Material  
Body Material  
Flammabiltiy  
Molded Epoxy  
UL94V-0  
e
B
A
C
A1  
L
P a c k a g e D im e n s io n s , P o w e r D is s ip a t io n & In fo r m a t io n  
Pa cka g e  
Pin s  
TSSOP  
24  
JEDEC  
MO153  
m m  
in ch e s  
m in  
-
m a x  
1.10  
0.15  
0.30  
0.20  
7.90  
4.50  
m in  
-
m a x  
0.433  
0.006  
0.0118  
0.0079  
0.311  
0.177  
A
A1  
B
C
D
E
0.05  
0.19  
0.09  
7.70  
4.30  
0.002  
0.0075  
0.0035  
0.303  
0.169  
0.65 BSC  
0.0256 BSC  
0.256  
0.028  
e
H
L
6.25  
0.50  
6.50  
0.70  
0.246  
0.020  
PD @ 70°C  
# / t u b e  
# / t a p e & re e l  
1.00W  
62 p cs  
2,500 p cs  
© 2000 California Micro Devices Corp. All rights reserved.  
4/00  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
4

相关型号:

PACDN010Q/R

Diode Termination Array, 18-Line, PDSO24, MO-137, QSOP-24
CALMIRCO

PACDN010Q/T

APPLICATION SPECIFIC DIODE ARRAY|SO
CALMIRCO

PACDN010QR

P/ACTIVE SCHOTTKY DIODE MEMORY BUS TERMINATOR
CALMIRCO

PACDN010QT

P/ACTIVE SCHOTTKY DIODE MEMORY BUS TERMINATOR
CALMIRCO

PACDN010T/T

APPLICATION SPECIFIC DIODE ARRAY|SO
CALMIRCO

PACDN010TR

P/ACTIVE SCHOTTKY DIODE MEMORY BUS TERMINATOR
CALMIRCO

PACDN010TT

P/ACTIVE SCHOTTKY DIODE MEMORY BUS TERMINATOR
CALMIRCO

PACDN016

6 CHANNEL ESD PROTECTION ARRAY WITH ZENER SUPPLY CLAMP
CALMIRCO

PACDN016M

6 CHANNEL ESD PROTECTION ARRAY WITH ZENER SUPPLY CLAMP
CALMIRCO

PACDN016M/T

Trans Voltage Suppressor Diode, Unidirectional, 12 Element, Silicon, MSOP-8
CALMIRCO

PACDN016S

6 CHANNEL ESD PROTECTION ARRAY WITH ZENER SUPPLY CLAMP
CALMIRCO

PACDN017

18 CHANNEL ESD PROTECTION ARRAY WITH ZENER SUPPLY CLAMP
CALMIRCO