CAT24C208WI-1.8TE13 [CATALYST]

EEPROM;
CAT24C208WI-1.8TE13
型号: CAT24C208WI-1.8TE13
厂家: CATALYST SEMICONDUCTOR    CATALYST SEMICONDUCTOR
描述:

EEPROM

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总14页 (文件大小:124K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Advance Information  
E
CAT24C208  
8K (1K x 8) -Bit Dual Port Serial EEPROM for VESA Plug and Play Applications  
in LCD Projectors and Monitors  
TM  
FEATURES  
400 kHz I2C bus compatible*  
1,000,000 program/erase cycles  
100 year data retention  
Complies with VESA E-EDID, E-DDC, DI-EXT  
and M1 specifications  
8-pin DIP, SOIC, TSSOP or MSOP packages  
- Green package option  
1.8 to 5.5 volt operation  
Industrial and extended temperature ranges  
Low power CMOS technology  
16-byte page write buffer  
Self-timed write cycle with auto-clear  
DESCRIPTION  
Using Catalyst's advanced CMOS technology which  
substantially reduces device power requirements, the  
CAT24C208 can be powered from either of two  
independent VCC inputs.  
The CAT24C208 is an 8k-bit Dual Port Serial CMOS  
EEPROM internally organized as 1k words of 8 bits  
each. The CAT24C208 features a 16-byte page write  
buffer and can be accessed from either of two separate  
I2C compatible ports, DSP (SDA, SCL) and DDC (SDA,  
SCL) which conform to the VESA E-EDID EEPROM  
Standard.  
The CAT24C208 operates over the full industrial and  
extended temperature range and is available in  
miniature 8-pin DIP, SOIC, TSSOP and MSOP  
packages.  
Arbitration between the two interface ports is automatic  
and allows the appearance of simultaneous access to  
the memory from both interfaces.  
BLOCK DIAGRAM  
DSP VCC  
DDC VCC  
ARBITRATION  
LOGIC  
D
E
C
O
D
E
R
S
D
E
C
O
D
E
R
S
1K X 8  
MEMORY  
ARRAY  
DDC  
CONTROL  
LOGIC  
DISPLAY  
CONTROL  
LOGIC  
DSP SCL  
DSP SDA  
DDC SCL  
DDC SDA  
CONFIGURATION  
REGISTER  
DDC SEL  
VSS  
2
* Catalyst Semiconductor is licensed by Philips Corporation to carry the I C Bus Protocol.  
© 2003 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1044, Rev. B  
1
CAT24C208  
PIN CONFIGURATION  
DIP Package (P, L)  
SOIC Package (J, W)  
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
DSP V  
DDC V  
CC  
DSP V  
DDC V  
CC  
CC  
CC  
DSP SCL  
EDID SEL  
DDC SCL  
DDC SDA  
DSP SCL  
DSP SDA  
EDID SEL  
DDC SCL  
DDC SDA  
DSP SDA  
V
V
SS  
SS  
MSOP Package (R, Z)  
TSSOP Package (U, Y)  
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
DSP V  
DDC V  
CC  
DSP V  
CC  
DSP SCL  
DDC V  
CC  
CC  
DSP SCL  
DSP SDA  
EDID SEL  
DDC SCL  
DDC SDA  
EDID SEL  
DDC SCL  
DDC SDA  
DSP SDA  
V
V
SS  
SS  
PIN DESCRIPTION  
Pin Number  
Pin Name  
Function  
1
DSP VCC  
Device power from display controller  
The CAT24C208 DSP serial clock input pin is used to clock all data  
transfers into or out of the device DSP SDA pin.  
2
3
DSP SCL  
DSP SDA  
DSP Serial Data/Address. The bidirectional DSP serial  
data/address pin is used to transfer data into and out of the device  
from a display controller. The DSP SDA pin is an open drain output  
and can be wire-OR'ed with other open drain or open collector  
outputs.  
4
5
VSS  
Device ground.  
DDC Serial Data/Address. The bidirectional DDC serial  
data/address pin is used to transfer data into and out of the device  
from a DDC host. The DDC SDA pin is an open drain output and  
can be wire-OR'ed with other open drain or open collector outputs.  
DDC SDA  
The CAT24C208 DDC serial clock input pin is used to clock all data  
transfers into or out of the device DDC SDA pin.  
6
DDC SCL  
EDID select. The CAT24C208 EDID select input selects the active  
bank of memory to be accessed via the DDC SDA/SCL interface as  
set in the configuration register.  
7
8
EDID SEL  
DDC VCC  
Device power when powered from a DDC host.  
Doc. No. 1044, Rev. B  
2
CAT24C208  
ABSOLUTE MAXIMUM RATINGS*  
*COMMENT  
Temperature Under Bias .................. -55°C to +125°C  
Storage Temperature........................ -65°C to +150°C  
Stresses above those listed under Absolute Maximum  
Ratingsmay cause permanent damage to the device.  
These are stress ratings only, and functional operation of  
the device at these or any other conditions outside of those  
listed in the operational sections of this specification is not  
implied. Exposure to any absolute maximum rating for  
extended periods may affect device performance and  
reliability.  
Voltage on Any Pin with  
Respect to Ground(1) ............ -2.0V to +VCC + 2.0V  
VCC with Respect to Ground ................ -2.0V to +7.0V  
Package Power Dissipation  
Capability (TA = 25°C) ................................... 1.0W  
Lead Soldering Temperature (10 secs) ............ 300°C  
Output Short Circuit Current(2) ........................ 100mA  
RELIABILITY CHARACTERISTICS  
Symbol  
Parameter  
Reference Test Method  
Min  
Typ  
Max  
Units  
Cycles/Byte  
Years  
(3)  
NEND  
Endurance  
MIL-STD-883, Test Method 1033 1,000,000  
(3)  
TDR  
Data Retention  
ESD Susceptibility  
Latch-up  
MIL-STD-883, Test Method 1008  
MIL-STD-883, Test Method 3015  
JEDEC Standard 17  
100  
4000  
100  
(3)  
VZAP  
Volts  
(3)(4)  
ILTH  
mA  
D.C. OPERATING CHARACTERISTICS  
V
CC  
= +1.8V to +5.5V, unless otherwise specified.  
Symbol  
ICC  
Parameter  
Test Conditions  
fSCL = 100 KHz  
Min  
Typ  
Max  
Units  
mA  
µA  
Power Supply Current  
Standby Current (VCC = 5.0V)  
Input Leakage Current  
Output Leakage Current  
Input Low Voltage  
3
0
(5)  
ISB  
VIN = GND or VCC  
VIN = GND to VCC  
VOUT = GND to VCC  
ILI  
10  
10  
µA  
ILO  
VIL  
VIH  
µA  
1  
VCC x 0.3  
VCC + 0.5  
V
V
Input High Voltage  
VCC x 0.7  
0.05  
VHYS  
VOL1  
Input Hysteresis  
V
Output Low Voltage (VCC = 3.0V)  
Output Low Voltage (VCC = 1.8V)  
IOL = 3 mA  
0.4  
0.5  
100  
V
VOL2  
IOL = 1.5 mA  
V
VCCL1  
Leakage DSP to VCC  
DDC to VCC  
µA  
VCCL2  
Leakage DDC VCC to DSP VCC  
100  
µA  
Note:  
(1) The minimum DC input voltage is 0.5V. During transitions, inputs may undershoot to 2.0V for periods of less than 20 ns. Maximum DC  
voltage on output pins is V +0.5V, which may overshoot to V + 2.0V for periods of less than 20ns.  
CC  
CC  
(2) Output shorted for no more than one second. No more than one output shorted at a time.  
(3) This parameter is tested initially and after a design or process change that affects the parameter.  
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from 1V to V +1V.  
CC  
(5) Standby Current (I ) = 0µA (<900nA).  
SB  
Doc. No. 1044, Rev. B  
3
CAT24C208  
CAPACITANCE T = 25°C, f = 1.0 MHz, V  
= 5V  
CC  
A
Symbol  
Parameter  
Conditions  
VI/O = 0V  
VIN = 0V  
Min  
Typ  
Max  
Units  
pF  
(1)  
CI/O  
Input/Output Capacitance (SDA)  
Input Capacitance (VCLK, SCL)  
8
6
(1)  
CIN  
pF  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
A.C. CHARACTERISTICS  
V
CC  
= +1.8V to +6.0V, unless otherwise specified.  
Read & Write Cycle Limits  
Symbol  
Parameter  
1.8V-5.5V  
2.5V-5.5V  
Min  
Max  
Min  
Max  
Units  
FSCL  
TI(1)  
Clock Frequency  
100  
200  
400  
200  
kHz  
ns  
Noise Suppression Time  
Constant at SCL, SDA Inputs  
tAA  
SCL Low to SDA Data Out  
and ACK Out  
3.5  
1
µs  
µs  
(1)  
tBUF  
Time the Bus Must be Free Before  
a New Transmission Can Start  
4.7  
1.2  
tHD:STA  
tLOW  
Start Condition Hold Time  
Clock Low Period  
4
4.7  
4
0.6  
1.2  
0.6  
0.6  
µs  
µs  
µs  
µs  
tHIGH  
Clock High Period  
tSU:STA  
Start Condition Setup Time  
4.7  
(for a Repeated Start Condition)  
tHD:DAT  
tSU:DAT  
Data In Hold Time  
0
0
ns  
ns  
µs  
ns  
µs  
ns  
Data In Setup Time  
50  
50  
(1)  
tR  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
Stop Condition Setup Time  
Data Out Hold Time  
1
0.3  
(1)  
tF  
300  
300  
tSU:STO  
tDH  
4
0.6  
100  
100  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
(2) t  
and t  
are the delays required from the time V is stable until the specified operation can be initiated.  
PUR  
PUW  
CC  
(1)(2)  
Power-Up Timing  
Symbol  
tPUR  
Parameter  
Min  
Typ  
Max  
Units  
Power-up to Read Operation  
Power-up to Write Operation  
1
1
ms  
ms  
tPUW  
Doc. No. 1044, Rev. B  
4
CAT24C208  
Write Cycle Limits  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
tWR  
Write Cycle Time  
5
ms  
interface circuits are disabled, SDA is allowed to remain  
high, and the device does not respond to its slave  
address.  
The write cycle time is the time from a valid stop  
condition of a write sequence to the end of the internal  
program/erase cycle. During the write cycle, the bus  
FUNCTIONAL DESCRIPTION  
The CAT24C208 has a total memory space of 1K bytes  
which is accessible from either of two I2C interface ports,  
(DSP_SDA and DSP_SCL) or (DDC_SDA and  
DDC_SCL).  
Each bank of memory can be used to store an E-EDID  
data structure. However, only one bank can be read  
through the DDC port at a time. The active bank of  
memory (that is, the bank that appears at address A0h  
on the DDC port) is controlled through the configuration  
register at 62h and the EDID_SEL pin.  
The entire memory appears as contiguous memory  
space from the perspective of the display interface  
(DSP_SDA and DSP_SCL).  
No write operations are possible from the DDC interface  
unless the DDC Write Enable bit is set (WE = 1) in the  
device configuration register at device address 62h.  
A configuration register at addresses 62/63h is used to  
configure the operation and memory map of the device  
as seen from the DDC interface, (DDC_SDA and  
DDC_SCL).  
The device automatically arbitrates between the two  
interfaces to allow the appearance of simultaneous  
access to the memory from both interfaces.  
Read and write operations can be performed on any  
location within the memory space from the display  
interface regardless of the state of the EDID SEL pin or  
the activity on the DDC interface. From the DDC  
interface,thememoryspaceappearsaseitheronelarge  
1K byte bank of memory or as two 500 byte banks of  
memory.  
In a typical E-EDID application the EDID_SEL pin is  
usually connected to the Analog Cable Detectpin of a  
VESA M1 compliant, dual-mode (analog and digital)  
display. In this manner, the E-EDID appearing at ad-  
dress A0h on the DDC port will be either the analog or  
digital E-EDID, depending on the state of the Analog  
Cable Detectpin (pin C3 of the M1-DA connector). See  
Figure 1.  
Figure 1.  
+5VDC  
(SUPPLIED  
BY DISLAY)  
28  
DDC +5V  
47.5K  
10K  
8
7
6
5
1
2
3
4
C3  
27  
28  
I2C TO PROJECTOR/MONITOR  
DISPLAY CONTROLLER  
E-EDID  
EEPROM  
TO HOST  
CONTROLLER  
DDC CLK  
DDC DATA  
FUSE, RESISTOR  
OR OTHER  
CURRENT LIMITING  
DEVICE REQUIRED  
IN ALL M1 DISPLAYS  
RELAY CONTACTS SHOWN IN  
DE-ENERGIZED POSITION  
26  
HPD  
2A MAX  
Doc. No. 1044, Rev. B  
5
CAT24C208  
I2C Bus Protocol  
Acknowledge  
ThefollowingdefinesthefeaturesoftheI2Cbusprotocol:  
After a successful data transfer, each receiving device is  
requiredtogenerateanacknowledge.Theacknowledging  
devicepullsdowntherespectiveSDAlineduringtheninth  
clock cycle, signaling that it received the 8 bits of data.  
(1) Data transfer may be initiated only when the bus is  
not busy.  
(2) During a data transfer, the data line must remain  
stable whenever the clock line is high. Any changes  
in the data line while the clock line is high will be  
interpreted as a START or STOP condition.  
The CAT24C208 responds with an acknowledge after  
receiving a START condition and its slave address. If the  
device has been selected along with a write operation, it  
responds with an acknowledge after receiving each 8-bit  
byte.  
START Condition  
The START Condition precedes all commands to the  
device, and is defined as a HIGH to LOW transition of  
either SDA when the respective SCL is HIGH. The  
CAT24C208 monitors the SDA and SCL lines and will  
not respond until this condition is met.  
When the CAT24C208 is in a READ mode it transmits 8  
bits of data, releases the respective SDA line, and  
monitors the line for an acknowledge. Once it receives  
this acknowledge, the CAT24C208 will continue to  
transmit data. If no acknowledge is sent by the Master,  
the device terminates data transmission and waits for a  
STOP condition.  
STOP Condition  
A LOW to HIGH transition of SDA when SCL is HIGH  
determinestheSTOPcondition.Alloperationsmustend  
with a STOP condition.  
Figure 2. Acknowledge Timing  
SCL FROM  
MASTER  
1
8
9
DATA OUTPUT  
FROM TRANSMITTER  
DATA OUTPUT  
FROM RECEIVER  
START  
ACKNOWLEDGE  
Doc. No. 1044, Rev. B  
6
CAT24C208  
256 bytes within a segment. Note that if the segment  
pointer is set to 00h then the device will behave like a  
standard DDC2B EEPROM.  
DEVICE ADDRESSING  
Both the DDC and DSP interfaces to the device are  
based on the I2C bus serial interface. All memory space  
operations are done at the A0/A1 DDC address pair.  
Note that the least significant bit (LSB) of the DDC  
address is used to determine if the data is being written  
(LSB=0) or read (LSB=1). As such, all write operations  
to the memory space are done at DDC address A0h and  
all read operations of the memory space are done at  
DDC address A1h.  
The segment pointer is a volatile register unlike the  
configuration register and the EEPROM used for the  
main memory space. The configuration register will be  
shipped in the erased (set to FFh) state.  
Figure 3 shows the bit sequence of a random read from  
anywhere within the memory space. The word offset  
determines which of the 256 bytes within segment 00h  
is being read. One can think of this sequence as a  
dummy write to address A0 of the word offset followed  
by a read of the data. The dummy write sets the word  
offset for the read to follow.  
The segment pointer is at the address 60h and is write-  
only. This means that a memory access at 61h will give  
undefined results. The segment pointer is a volatile  
register. Thedeviceconfigurationregisterat62/63(hex)  
is a non-volatile register.  
Sequentialreadscanbedoneinmuchthesamemanner  
by reading successive bytes after each acknowledge  
without generating a stop condition. See Figure 4. The  
device must automatically increment the word offset  
value (8-bit value) as well as the segment pointer up to  
the values permitted by the physical memory limitations  
and the state of the configuration bits in the control  
The segment pointer is used to expand the available  
DDC address space while maintaining backward com-  
patibility with older DDC interfaces such as DDC2B. For  
each value of the 8-bit segment pointer one segment  
(256 bytes) is available at the A0/A1 pair. The standard  
DDC 8-bit address is sufficient to address each of the  
Figure 3. Random Access Read (Segment 0 only)  
S
S
T
A
R
T
T
A
R
T
S
T
O
P
DDC  
ADDRESS  
BUS ACTIVITY:  
MASTER  
OFFSET  
ADDRESS  
DDC  
ADDRESS  
SDA LINE  
S
S
P
A
C
K
A
C
K
A
C
K
DATA n  
Figure 4. Sequential Read (Segment 0 only)  
S
T
A
R
T
S
T
A
R
T
S
T
O
P
DDC  
ADDRESS  
BUS ACTIVITY:  
MASTER  
OFFSET  
ADDRESS  
DDC  
ADDRESS  
DATA n+x  
DATA n  
DATA n+1  
DATA n+2  
SDA LINE  
S
P
S
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Doc. No. 1044, Rev. B  
7
CAT24C208  
register (DDC interface only). Note that the device  
should not acknowledge the read of the last allowable  
data byte.  
Arbitration logic within the device monitors activity on  
DDC_SCLandDSP_SCL.WhenbothI2Cportsareidle,  
DDC_SCL and DSP_SCL are both high and the  
arbitration logic is inactive. When either DDC_SCL or  
DSP_SCL is pulled low, initiating a read or write, the  
arbitration logic pulls down the other SCL line and holds  
it low, holding off activity on the other port (by stretching  
the clock on that port). When the initiating SCL line has  
remained high for one full second, the arbitration logic  
assumes that the initiating devices is finished and  
releases the other SCL line. If the non-initiating device  
has been waiting for access, it can now read or write the  
device.  
Figure 5 shows the bit sequence for a random read from  
anywhere within the allowable address space. The  
device must support sequential reads beginning at any  
location. The host indicates a sequential read by putting  
out a clock without generating a stop condition. Just as  
before the device signals the host that is has just  
received the last byte of a sequential read by not  
acknowledging the last byte. The host is responsible for  
generating the stop condition when it does not receive  
an acknowledge from a sequential read.  
For this scheme to work properly, both the DDC and  
DSP devices must properly implement clock stretching  
as defined by the I2C specification. Additionally, it is very  
important that when writing to the device that the SCL  
line never remains high longer than 1 second, until the  
write is complete. This prevents the other port from  
having access until the device is fully written.  
ARBITRATION  
The device performs a simplistic arbitration between the  
DDCanddisplayinterfaces.Whilethearbitrationscheme  
described is not foolproof, it does prevent most errors.  
The arbitration logic uses clock stretching, an I2C bus  
term, to hold off writes from one port while the other port  
is active.  
Figure 5. Byte Read From Any Loction  
S
T
A
R
T
S
T
A
R
T
S
T
O
P
SEGMENT  
POINTER  
DDC  
ADDRESS  
DDC  
ADDRESS  
BUS ACTIVITY:  
MASTER  
OFFSET  
ADDRESS (n)  
DDC  
ADDRESS  
SDA LINE  
S
S
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
N
O
DATA n  
A
C
K
Doc. No. 1044, Rev. B  
8
CAT24C208  
CONFIGURATION REGISTER  
M
S
B
L
S
B
7
6
5
4
3
2
1
0
Register Function  
X
X
X
X
WE  
AB1  
AB0  
NB  
Configuration Register  
Function Description:  
NB:  
AB0:  
Number of memory banks in DDC port memory map. 0 = 2 Banks, 1 = 1 Bank  
Active Bank Control Bit 0 (See Table 1-3)  
AB1:  
Active Bank Control Bit 1 (See Table 1-3)  
WE DDC:  
Write Enable 0 = Write Disabled, 1= Write Enabled  
Note: WE affects only write operations from the DDC port, not the display port. The display port always has write access.  
Figure 6. Configuration Register Truth Table  
EDID  
Select Pin  
AB1  
AB0  
NP  
Active Bank  
0
0
1
1
X
X
X
0
0
1
0
0
0
0
1
Lower Bank  
Upper Bank  
X
X
X
Lower Bank  
1
Upper Bank  
X
Lower (only) Bank  
Doc. No. 1044, Rev. B  
9
CAT24C208  
ORDERING INFORMATION  
Prefix  
Device #  
24C208  
Suffix  
CAT  
J
I
-1.8  
TE13  
Temperature Range  
Product Number  
24C208: 8K  
Tape & Reel  
TE13: 2000/Reel  
Optional  
Company ID  
I = Industrial (-40 to 85 C)  
A = Automotive (-40 to 105 C)  
E = Extended (-40 to 125 C)  
Operating Voltage  
Blank: 2.5V - 5.5V  
1.8: 1.8V - 5.5V  
Package  
P: PDIP  
J: SOIC (JEDEC)  
U: TSSOP  
R: MSOP  
L: PDIP (Lead free, Halogen free)  
W: SOIC (Lead free, Halogen free)  
Y: TSSOP (Lead free, Halogen free)  
Z: MSOP (Lead free, Halogen free)  
Notes:  
(1) The device used in the above example is a CAT24C208JI-1.8TE13 (SOIC, Industrial Temperature, 1.8 Volt to 5.5 Volt Operating  
Voltage, Tape & Reel)  
PACKAGING INFORMATION  
8 Lead PDIP (P, L)  
0.245 (6.17)  
0.295 (7.49)  
0.300 (7.62)  
0.325 (8.26)  
D
0.120 (3.05)  
0.180 (4.57) MAX  
0.150 (3.81)  
0.015 (0.38)  
0.110 (2.79)  
0.150 (3.81)  
0.100 (2.54)  
BSC  
0.310 (7.87)  
0.380 (9.65)  
0.045 (1.14)  
0.060 (1.52)  
Dimension D  
0.014 (0.36)  
0.022 (0.56)  
Pkg  
8L  
Min  
0.355 (9.02)  
Max  
0.400 (10.16)  
Doc. No. 1044, Rev. B  
10  
CAT24C208  
PACKAGING INFORMATION  
8 Lead 150 mil Wide SOIC (J, W)  
0.149 (3.80)  
0.1574 (4.00)  
0.2284 (5.80)  
0.2440 (6.20)  
0.1890 (4.80)  
0.1968 (5.00)  
0.0532 (1.35)  
0.0688 (1.75)  
0.050 (1.27) BSC  
0.0040 (0.10)  
0.0098 (0.25)  
0.013 (0.33)  
0.020 (0.51)  
0.0099 (0.25)  
0.0196 (0.50)  
X 45  
˚
0.0075 (0.19)  
0.0098 (0.25)  
0˚-8˚  
0.016 (0.40)  
0.050 (1.27)  
Notes:  
1. Complies with JEDEC publication 95 MS-012 dimensions; however, some dimensions may be more stringent.  
2. All linear dimensions are in inches and parenthetically in millimeters.  
3. Lead coplanarity is 0.004" (0.102mm) maximum.  
Doc. No. 1044, Rev. B  
11  
CAT24C208  
PACKAGING INFORMATION  
8 Lead TSSOP (U, Y)  
Notes:  
1. Lead coplanarity is 0.004" (0.102mm) maximum.  
Doc. No. 1044, Rev. B  
12  
CAT24C208  
PACKAGING INFORMATION  
8 Lead MSOP (R, Z)  
0.38  
0.28  
0.0150  
0.0110  
0.1970  
0.1890  
5.00  
4.80  
S
0.0256 [0.65] BSC  
3.10  
2.90  
0.1220  
0.1142  
0.0374  
0.0295  
0.95  
0.75  
0.0433 [1.10] MAX.  
0.0059  
0.0020  
0.15  
0.05  
0.039 [0.10] MAX.  
S
S
0.0150  
0.0110  
0.38  
0.28  
WITH PLATING  
0.0091 0.23  
0.0051 0.13  
0.0050 [0.127]  
0.1220  
0.1142  
3.10  
2.90  
0.0276  
0.0157  
0.70  
0.40  
0˚ - 6˚  
WITH PLATING  
BASE METAL  
0.0118 [0.30] REF.  
SECTION A - A  
Doc. No. 1044, Rev. B  
13  
Copyrights, Trademarks and Patents  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
DPP ™  
AE2 ™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents  
issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS  
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE  
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING  
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or  
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a  
situation where personal injury or death may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets  
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate  
typical semiconductor applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
1250 Borregas Avenue  
Sunnyvale, CA 94089  
Phone: 408.542.1000  
Publication #: 1044  
Revison:  
Issue date:  
Type:  
B
6/24/03  
Advance  
Fax: 408.542.1200  
www.catalyst-semiconductor.com  

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