JANTX1N981C-1 [CDI-DIODE]
Zener Diode, 68V V(Z), 2%, 0.48W, Silicon, Unidirectional, DO-204AH,;
| 型号： | JANTX1N981C-1 |
| 厂家： | 
COMPENSATED DEUICES INCORPORATED |
| 描述： | Zener Diode, 68V V(Z), 2%, 0.48W, Silicon, Unidirectional, DO-204AH, 测试 二极管 |
| 文件： | 总28页 (文件大小：208K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 6 January 2006.
INCH-POUND
MIL-PRF-19500/117N
6 October 2005
SUPERSEDING
MIL-PRF-19500/117M
13 January 2004
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR,
TYPES 1N962B-1 THROUGH 1N992B-1, AND 1N962BUR-1 THROUGH 1N992BUR-1, 1N962C-1 THROUGH
1N992C-1, AND 1N962CUR-1 THROUGH 1N992CUR-1, AND 1N962D-1 THROUGH 1N992D-1, 1N962DUR-1
THROUGH 1N992DUR-1, JAN, JANTX, JANTXV, AND JANHC
JANS level (see 6.4).
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall
consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for 500 milliwatt, silicon, voltage regulator
diodes with voltage tolerances of 5 percent, 2 percent, and 1 percent. Three levels of product assurance are provided
for each encapsulated device type as specified in MIL-PRF-19500. One level of product assurance is provided for
each unencapsulated device type.
1.2 Physical dimensions. See figure 1 (similar to DO-35), figure 2 ( DO-213AA), and figure 3 for (JANHC die).
* 1.3 Maximum ratings. Maximum ratings are as shown in maximum and primary test ratings (see 3.8) herein and
as follows:
a. PTL = 500 mW, (DO-35) at TL = +50°C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink
at L = .375 inch (9.53 mm). Derate IZ to 0.0 mA dc at +175°C.
b. PTEC = 500 mW, (DO-213AA) at TEC = +125°C, derate to 0 at +175°C. -65°C ≤ TJ ≤ +175°C; -65°C ≤ TSTG
+175°C.
≤
c. PT(PCB) = 500 mW, TA = 75°C.
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus,
ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dscc.dla.mil. Since
contact information can change, you may want to verify the currency of this address information using the ASSIST
Online database at http://assist.daps.dla.mil.
AMSC N/A
FSC 5961
MIL-PRF-19500/117N
* 1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in maximum and primary test
ratings (see 3.8) herein and as follows:
a. 11 V dc ≤ VZ ≤ 200 V dc.
b. 1N962B-1 through 1N992B-1 are 5 percent voltage tolerance.
c. 1N962C-1 through 1N992C-1 are 2 percent voltage tolerance.
d. 1N962D-1 through 1N992D-1 are 1 percent voltage tolerance.
Thermal resistance:
RθJL = 250°C/W maximum at L = .375 inch (9.53 mm) (DO-35).
RθJEC = 100°C/W maximum. Junction to end-caps (DO-213AA).
RθJA(PCB) = 300°C/W junction to ambient including PCB see note (1).
(1) See figures 4, 5, and 6 for derating curves. TA = +75°C for both axial and MELF (US) on printed circuit board
(PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, still air, pads (US) = .067 inch (1.70 mm) x
.105 inch (2.67 mm); pads (axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (7.62 mm) x 1 inch (25.4 mm)
long, axial lead length L ≤ .187 inch (≤ 4.76 mm); R
with a defined thermal resistance condition
θJA(PCB)
included is measured at I = as defined in the electrical characteristics tolerance table herein.
Z
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750 Test Methods for Semiconductor Devices.
-
Semiconductor Devices, General Specification for.
-
* (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
2
MIL-PRF-19500/117N
Symbol
Dimensions
Notes
Inches
Millimeters
Min
.055
.120
.018
1.000
Max
.090
.200
.022
1.500
.050
Min
1.40
3.05
0.46
25.40
Max
2.29
5.08
0.56
BD
BL
3
3
LD
LL
38.10
1.27
LL1
4
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Package contour optional within BD and length BL. Heat slugs, if any, shall be included within
this cylinder but shall not be subject to minimum limit of LD. The BL dimension shall include the
entire body including slugs (new note).
4. Within LL1 lead diameter may vary to allow for flash, lead finish build-up, and minor irregularities
other than heat slugs.
5. In accordance with ASME Y14.5M, diameters are equivalent to φX symbology.
FIGURE 1. Physical dimensions for types 1N962B-1 through 1N992B-1,
1N962C-1 through 1N992C-1, 1N962D-1 through 1N992 (DO-35).
3
MIL-PRF-19500/117N
Symbol
Dimensions
Inches
Millimeters
0.03 min
Min
.130
.063
.016
Max
.146
.067
.022
Min
3.30
1.60
0.41
Max
3.70
1.70
0.55
BL
BD
ECT
S
.001 min
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. In accordance with ASME Y14.5M, diameters are equivalent to φX symbology.
FIGURE 2. Physical dimensions for types 1N962BUR-1 through 1N992BUR-1,
1N962CUR-1 through 1N992CUR-1, 1N962DUR-1 through 1N992DUR-1 (DO-213AA).
4
MIL-PRF-19500/117N
Ltr
Dimensions
JANHCA
Millimeters
Min Max
.53 .63
.33 .43
JANHCB
Millimeters
Inches
Inches
Min Max
.024
.017
Min
Max
.025
.017
Min
0.61
0.43
Max
0.71
0.53
A
B
.021
.013
.028
.021
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. The physical characteristics of the die thickness are .010 ±.002 (0.25 mm). Metallization is top
= (anode)-AL, back: (cathode)-AU. AL thickness = 12,000 Å minimum for JANHCA and 40,000
Å minimum for JANHCB, AU thickness = 3,000 Å minimum for JANHCA, and 5,000 Å minimum
for JANHCA.
4. Circuit layout data: For zener operation, cathode must be operated positive with respect to
anode.
5. Requirements in accordance with appendix G of MIL-PRF-19500, are performed in a TO-5
package (see 6.5).
FIGURE 3. Physical dimensions (JANHCA and JANHCB die dimensions).
5
MIL-PRF-19500/117N
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
* 3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-19500, and as follows.
EC - - - - - - - - end-caps.
R
θJA(PCB) - - - thermal resistance junction to ambient, with a defined printed circuit board mounting.
RθJBB ................ Thermal resistance junction to burn-in board.
3.4 Interface and physical dimensions. The interface and physical dimensions shall be specified in
MIL-PRF-19500 and figures 1 and 2 (similar to DO-35 and DO-213AA), and figure 3 (die) herein.
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
* 3.4.2 Diode construction. All devices shall be metallurgically bonded double plug construction in accordance with
the requirements of category I, II, or III (see MIL-PRF-19500).
3.5 Selection of tight tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX, or
JANTXV devices, which have successfully completed all applicable screening, and groups A, B, and C testing as 5
percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2, at tightened
tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purpose to establish
correlation. For C and D tolerance levels, T = +25°C ±2°C at .375 inch from body or equivalent.
L
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I, II, and III.
* 3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3.8 Maximum and primary test ratings. Maximum and primary test ratings for voltage regulator diodes are
specified in table IV herein.
3.9 Marking. Devices shall be marked in accordance with MIL-PRF-19500. At the option of the manufacturer, the
DO-35 version may leave off “-“ portion of the type designator (example: JANTX1N962B1).
3.9.1 Marking of UR-1 version devices. For UR-1 version devices only, all marking (except polarity) may be
omitted from the body, but shall be retained on the initial container.
3.10 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
6
MIL-PRF-19500/117N
4. VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4, and table I, II, III, and IV).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 JANHC devices. JANHC devices shall be qualified in accordance with appendix G of MIL-PRF-19500.
4.2.2 Construction verification. Cross sectional photos from three devices shall be submitted in the qualification
report.
* 4.3 Screening (JAN, JANTX, and JANTXV levels only). Screening shall be in accordance with table IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table IV
of
Measurement
MIL-PRF-19500)
JANTX and JANTXV levels
3a
Temperature cycling
(1) 3c
7a
Thermal impedance (see 4.3.2)
Not required
7b
Optional
9
Not required
11
12
IR1 and VZ
See 4.3.3, t = 48 hours
(2) 13
∆I
≤ 100 percent of initial reading or 50 nA dc,
R1
whichever is greater.
∆V ≤ ±2 percent initial reading.
Z
Subgroup 2 of table I herein.
14a
Not required
(3) 14b
Required
(1) Thermal impedance shall be performed any time after sealing provided temperature cycling is performed in
accordance with MIL-PRF-19500, screen 3 prior to this thermal test.
(2) PDA = 5 percent for screen 13 applies to ∆I
and ∆V . Thermal impedance (Z ) is not required in
R1
Z
θJX
screen 13.
(3) For clear glass diodes, the hermetic seal (gross leak) may be performed at anytime after temperature cycling.
4.3.1 Screening (JANHC). Screening of JANHC die shall be in accordance with appendix G of MIL-PRF-19500.
4.3.1.1 JAN testing. JAN level product will have temperature cycling and thermal impedance testing performed in
accordance with MIL-PRF-19500, JANTX level screening level requirements.
7
MIL-PRF-19500/117N
* 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 or 4081, as applicable, of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD (and
VC where appropriate). The thermal impedance limit shall comply with the thermal impedance graph on figures 7, 8,
and 9 (less than or equal to the curve value at the same tH time) and shall be less than the process determined
statistical maximum limit as outlined in method 3101 or 4081. (See table II, subgroup 4). See figure 10 for mounting
conditions.
* 4.3.3 Power burn-in conditions. Power burn-in conditions are as follows: IZPCB = column 8 of table IV; TA = 75°C
maximum. Test conditions in accordance with method 1038 of MIL-STD-750, condition B (see 4.5.9).
Adjust IZ or TA to achieve the required TJ. TJ = 125°C minimum.
or
Mounting condition shall be equivalent to the FR4 board (defined herein). R
θJA(PCB)
> R . Apply IZ = IZPCB.
θJBB
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. Group A inspection shall be performed on each sublot.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and 4.4.2.1 herein. Electrical
measurements (end-points) shall be in accordance with the applicable inspections of table III herein.
* 4.4.2.1 Group B inspection, table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500.
Subgroup
Method
1056
Condition
B2
B2
B2
0°C to +100°C, 10 cycles.
-55°C to +175°C, 25 cycles.
See 4.5.1.
1051
4066
*
B3
B4
1027
2101
IZM = column 8 of table IV (minimum). Adjust IZ or TA to achieve TJ = 150°C
minimum (see 4.5.9).
Decap analysis, scribe and break only.
8
MIL-PRF-19500/117N
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table III herein.
Subgroup
C2
Method
1056
Condition
0°C to +100°C, 10 cycles.
-55°C to +175°C, 20 cycles.
C2
1051
C2
2036
Tension: Test condition A; weight = 4 pounds, t = 15 seconds.
Lead fatigue: Test condition E. (Tension and lead fatigue are not required for
UR-1 suffix devices)
C2
C3
C5
1071
Test condition E.
Not applicable.
See 4.3.2 herein.
*
*
4081
1027
C6
IZM = column 8 of table IV (minimum). Adjust IZ or TA to achieve TJ = 150°C
minimum (see 4.5.9).
C7
C8
Not applicable.
4071
IZ = column 5 of table IV; T1 = +25°C ±5°C, T2 = +125°C ±5°C. (Maximum limit
in accordance with column 14 of table IV). Sample size = 22, c = 0. (See
4.5.4.)
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with appendix E, table IX of MIL-
PRF-19500 and table II herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Surge current (IZSM). The peak currents shown in column 10 of table IV shall be applied in the reverse
direction and these shall be imposed on the current (I = I
Z
Z1) (column 5 of table IV) a total of 5 surges at 1-minute
intervals. Each individual surge shall be one-half square-wave-pulse of one one-hundred twenty second duration or
an equivalent one-half sine wave with the same effective rms current.
9
MIL-PRF-19500/117N
4.5.2 Regulator voltage measurements. The test current shall be applied until thermal equilibrium is attained (90
seconds minimum) prior to reading the breakdown voltage. For this test, the diode shall be suspended by its leads
with mounting clips whose inside edge is located at .375 inch (9.53 mm) from the body (UR version = 0 lead length)
and the mounting clips shall be maintained at a temperature of +25°C +8°C, and –2°C. This measurement may be
performed after a shorter time following application of the test current than that which provides thermal equilibrium if
correlation to stabilized readings can be established to the satisfaction of the Government.
Voltage regulation V (reg). Voltage regulation shall be determined by the difference of the regulator
Z
4.5.3
voltage measured at different currents as specified in table I, subgroup 7 herein. Both tests shall be performed at
thermal equilibrium. This ∆V shall not exceed column 9 of table IV.
Z
4.5.4 Temperature coefficient of regulator voltage (αV ). The device shall be temperature stabilized with current
Z
applied prior to reading regulator voltage at the specified ambient temperature as specified in 4.4.3, subgroup C8.
4.5.8 Scope display evaluation. Scope display evaluation shall be stable in accordance with method 4023 of
MIL-STD-750, condition A. Scope display may be performed on ATE (automatic test equipment) for screening only
with the approval of the qualifying activity. Scope display in table I, subgroup 4 shall be performed on a scope. The
reverse current over the knee shall be 500 µA peak.
* 4.5.9 Free air burn-in and life tests. Deliberate heat sinking, is prohibited unless otherwise approved by the
qualifying activity. The use of a current limiting or ballast resistor is permitted provided that each DUT still sees the
full Pt (minimum) and that the minimum applied voltage, where applicable, is maintained through out the burn-in
period. Use method 3100 of MIL-STD-750 to measure TJ (see figure 11).
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MIL-PRF-19500/117N
* TABLE I. Group A inspection.
Inspection 1/
Subgroup 1
MIL-STD-750
Symbol
Limits 2/
Unit
Method
2071
Conditions
Min
Max
Visual and mechanical
examination
Subgroup 2
Forward voltage
4011
IF = 200 mA dc.
VF
V dc
1N962 – 1N985 3/
1N986 – 1N992 3/
1.1
1.3
Reverse current
4016
4022
3101
DC method, VR = column 11 of
table IV.
IR1
Col. 12 µA dc
Regulator voltage (see
4.5.2)
I
Z1 = column 5 of table IV.
VZ
Col. 3
Col. 4
V dc
Thermal impedance
Subgroup 3
See 4.3.2
Z
°C/W
θJX
High temperature
operation
TA = 150°C
Reverse current
Subgroup 4
4016
DC method, VR = column 11 of
table IV.
IR2
Col. 13 µA dc
Small-signal reverse
breakdown impedance
4051
4051
4023
IZ = column 5 of table IV.
ZZ
Col. 6
Col. 7
ohm
ohm
I
SIG = 10 percent of IZ rms.
Small-signal reverse
breakdown impedance
I
I
ZK = 250 µA dc,
SIG = 25 µA rms.
ZZK
Scope display
See 4.5.8, n = 116, c = 0.
See footnotes at end of table.
11
MIL-PRF-19500/117N
* TABLE I. Group A inspection - Continued.
Inspection 1/
Subgroups 5
MIL-STD-750
Symbol
Limits 2/
Unit
Method
Conditions
Min
Max
Not applicable
Subgroup 6
Surge
4066
See 4.5.1
Electrical
measurements
See table III, steps 1, 3 and 4.
Subgroup 7
Voltage regulation (see
4.5.3)
IZ = 10 percent of column 8 of
table IV (current 1).
∆VZ
(reg)
Col. 9
V dc
IZ = 50 percent of column 8 of
table IV (current 2).
1/ For sampling plan, see MIL-PRF-19500.
2/ Column references are to table IV.
3/ Applies to all suffix versions.
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MIL-PRF-19500/117N
* TABLE II. Group E inspection qualification and requalification (all product assurance levels).
Qualification conformance
Inspection 1/
MIL-STD-750
Conditions
inspection (sampling plan)
Method
1051
Subgroup 1
Temperature cycling
Electrical measurements
Subgroup 2
45 devices, c = 0
500 cycles.
See table III, steps 1, 2, 3, 4, and 5.
45 devices, c = 0
Intermittent life
1037
6,000 cycles. IZ = column 8 of table IV.
See table III, steps 2, 3, 4, and 5.
Electrical measurements
Subgroup 4
N/A
Thermal impedance,
curves
Each supplier shall submit a thermal
impedance (Z
) histogram of the qual lot
θJX
and thermal impedance curves of the best
device and the qual lot average. A histogram
of thermal resistance (R ) shall be required
θJX
(116 devices). In addition, the optimal test
conditions and thermal impedance limit shall
be provided to the qualifying activity in the
qualification report for approval. The
approved thermal impedance conditions and
limit for Z
shall be used by the supplier in
θJX
screening and for end-point measurements as
applicable. The approved thermal impedance
conditions for R
supplier for conformance inspection.
shall be used by the
θJX
Subgroups 5 and 6
Not applicable
Subgroup 9
n = 45
Resistance to glass
cracking
1057
Condition B. Cool down after solder
immersion is permitted. Test until failure
occurs on all devices with the chosen sample
or to a maximum of 25 cycles, whichever
comes first.
1/ A separate sample may be pulled for each test.
13
MIL-PRF-19500/117N
* TABLE III. Group B, C, and E electrical and delta end-point measurements. 1/ 2/ 3/
Step
Inspection
MIL-STD-750
Conditions
Symbol
Limits
Unit
Method
4016
Min
Max
1.
2.
Reverse current
Reverse current
Column
12 of
table IV
µA dc
DC method; VR = column 11 of
table IV.
IR1
4016
4022
2
µA dc
DC method; VR = column 11 of
table IV.
IR3
3.
4.
5.
Regulator
voltage (see
4.5.2)
Column
3 of
Column
4 of
V dc
I
Z1 = column 5 of table IV.
VZ
table IV
table IV
Small-signal
breakdown
impedance
4051
3101
Column
6 of
table IV
Ohms
I
Z1 = column 5 of table IV.
ZZT
ISIG = 10 percent of IZ rms
See 4.3.2
Thermal
impedance
10
°C/W
∆ZθJX
percent
of initial
value
max.
1/ The electrical measurements for table VIb of MIL-PRF-19500 are as follows:
a. Subgroup 2, see table III herein, steps 1, 3, 4, and 5.
b. Subgroups 3 and 6, see table III herein, steps 2, 3, and 4.
2/ The electrical measurements for table VII of MIL-PRF-19500 are as follows:
a. Subgroup 2, see table III herein, steps 1, 3, 4, and 5.
b. Subgroup 6, see table III herein, steps 2, 3, and 4.
3/ The electrical measurements for table IX of MIL-PRF-19500 are as follows: Subgroup 2, see table III herein,
steps 2, 3, 4, and 5.
14
MIL-PRF-19500/117N
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MIL-PRF-19500/117N
16
MIL-PRF-19500/117N
17
MIL-PRF-19500/117N
Temperature-Power Derating Curve
D0-7, D0-35
600
500
400
300
200
100
0
25
DC Operation
Thermal Resistance Junction to Leads 3/8" = 250ºC/W
50
75
100
125
150
175
200
225
Tl (ºC) (Leads 3/8")
NOTES:
1. All devices are capable of operating at ≤ T specified on this curve. Any parallel line to this curve will intersect
J
the appropriate power for the desired maximum T allowed.
J
2. Derate design curve constrained by the maximum junction temperature (T ≤ 175°C) and power rating specified.
J
(See 1.3 herein.)
3. Derate design curve chosen at T ≤ 150°C, where the maximum temperature of electrical test is performed.
J
4. Derate design curves chosen at T ≤, 125°C, and 110°C to show power rating where most users want to limit T
J
J
in their application.
* FIGURE 4. Temperature-power derating curve.
18
MIL-PRF-19500/117N
Temperature-Power Derating Curve
D0-213AA
600
500
400
300
200
100
0
25
DC Operation
Thermal Resistance Junction to End Cap = 100ºC/W
50
75
100
125
150
175
200
225
Tec (ºC) (End Cap)
NOTES:
1. All devices are capable of operating at ≤ T specified on this curve. Any parallel line to this curve will intersect
J
the appropriate power for the desired maximum T allowed.
J
2. Derate design curve constrained by the maximum junction temperature (T ≤ 175°C) and power rating specified.
J
(See 1.3 herein.)
3. Derate design curve chosen at T ≤ 150°C, where the maximum temperature of electrical test is performed.
J
4. Derate design curves chosen at T ≤, 125°C, and 110°C to show power rating where most users want to limit T
J
J
in their application.
* FIGURE 5. Temperature-power derating curve.
19
MIL-PRF-19500/117N
Temperature-Power Derating Curve
D0-7, D0-35
450
400
350
300
250
200
150
100
50
0
25
DC Operation
Thermal Resistance Junction to PCB = 300ºC/W
50
75
100
125
150
175
200
225
Tpcb (ºC) (PCB)
NOTES:
1. All devices are capable of operating at ≤ T specified on this curve. Any parallel line to this curve will intersect
J
the appropriate power for the desired maximum T allowed.
J
2. Derate design curve constrained by the maximum junction temperature (T ≤ 175°C) and power rating specified.
J
(See 1.3 herein.)
3. Derate design curve chosen at T ≤ 150°C, where the maximum temperature of electrical test is performed.
J
4. Derate design curves chosen at T ≤, 125°C, and 110°C to show power rating where most users want to limit T
J
J
in their application.
* FIGURE 6. Temperature-power derating curve.
20
MIL-PRF-19500/117N
Thermal Impedance
1000
100
10
1
0.0001
0.001
0.01
0.1
Time (s)
1
10
100
1000
Thermal impedance DO-35 PCB mount, FR4, 1oz Cu, 50x87 mil pad (MELF) and 92 mil diameter (axial with .125
inch (3.175 mm) lead length) at TA =25°C.
NOTE: Thermal resistance = 300°C/W. Maximum power rating = 400 mW at TA =55°C.
* FIGURE 7. Thermal impedance DO-35 PCB mount.
21
MIL-PRF-19500/117N
Thermal Impedance
1000
100
10
1
0.0001
0.001
0.01
0.1
1
10
100
Time (s)
Thermal impedance DO-35 axial, TJ = 25°C at .375 inch (9.52 mm) from body.
NOTE: Thermal resistance = 250°C/W. Maximum power rating = 500 mW at TJ = 50°C.
* FIGURE 8. Thermal impedance DO-35 Axial.
22
MIL-PRF-19500/117N
Thermal Impedance
1000
100
10
1
0.0001
0.001
0.01
0.1
1
10
Time (s)
Thermal impedance DO-35 MELF, Tec=25°C.
NOTE: Thermal resistance = 100°C/W. Power rating = 500 mW at Tec=125°C.
* FIGURE 9. Thermal impedance DO-213 MELF.
23
MIL-PRF-19500/117N
FIGURE 10. Mounting conditions.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or
within the Military Service’s system commands. Packaging data retrieval is available from the managing Military
Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible
packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Packaging requirements (see 5.1).
c. Lead finish (see 3.4.1).
d. Product assurance level and type designator.
* 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,
at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML 19500) whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the
products covered by this specification. Information pertaining to qualification of products may be obtained from
Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43218-3990 or e-mail
vqe.chief@dla.mil.
24
MIL-PRF-19500/117N
6.4 Cross reference substitution list. JANS level will no longer be built to MIL-PRF-19500/117. Devices in stock
are acceptable provided the date code does not exceed the date of 8 September 1997. Devices required for space
flight applications shall meet the requirements of MIL-PRF-19500/533. Existing supplies of parts can be used until
existing supplies are exhausted. A PIN for PIN replacement table follows, and these devices are directly
interchangeable:
JANS
superseded PIN
1N6327
1N6328
1N6329
1N6330
1N6331
1N6332
1N6333
1N6334
1N6335
1N6336
1N6337
1N6338
1N6339
1N6340
1N6341
JANS
superseding PIN
1N964B-1
1N965B-1
1N966B-1
1N967B-1
1N968B-1
1N969B-1
1N970B-1
1N971B-1
1N972B-1
1N973B-1
1N974B-1
1N975B-1
1N976B-1
1N977B-1
1N978B-1
JANS
superseded PIN
1N6342
1N6343
1N6344
1N6345
1N6346
1N6347
1N6348
1N6349
1N6350
1N6351
1N6352
1N6353
1N6354
1N6355
JANS
superseding PIN
1N979B-1
1N980B-1
1N981B-1
1N982B-1
1N983B-1
1N984B-1
1N985B-1
1N986B-1
1N987B-1
1N988B-1
1N989B-1
1N990B-1
1N991B-1
1N992B-1
25
MIL-PRF-19500/117N
6.5 Suppliers of JANHC and JANKC die. The qualified JANHC and JANKC die suppliers with the applicable letter
version (example JANHCA1N4370A) will be identified on the QML.
JANHC ordering information (1)
PIN
Manufacture CAGE
43611
12954
1N964B
1N965B
1N966B
1N967B
1N968B
1N969B
1N970B
1N971B
1N972B
1N973B
1N974B
1N975B
1N976B
1N977B
1N978B
1N979B
1N980B
1N981B
1N982B
1N983B
1N984B
1N985B
1N986B
1N987B
1N988B
1N989B
1N990B
1N991B
1N992B
JANHCA1N964B
JANHCA1N965B
JANHCA1N966B
JANHCA1N967B
JANHCA1N968B
JANHCA1N969B
JANHCA1N970B
JANHCA1N971B
JANHCA1N972B
JANHCA1N973B
JANHCA1N974B
JANHCA1N975B
JANHCA1N976B
JANHCA1N977B
JANHCA1N978B
JANHCA1N979B
JANHCA1N980B
JANHCA1N981B
JANHCA1N982B
JANHCA1N983B
JANHCA1N984B
JANHCA1N985B
JANHCA1N986B
JANHCA1N987B
JANHCA1N988B
JANHCA1N989B
JANHCA1N990B
JANHCA1N991B
JANHCA1N992B
JANHCB1N964B
JANHCB1N965B
JANHCB1N966B
JANHCB1N967B
JANHCB1N968B
JANHCB1N969B
JANHCB1N970B
JANHCB1N971B
JANHCB1N972B
JANHCB1N973B
JANHCB1N974B
JANHCB1N975B
JANHCB1N976B
JANHCB1N977B
JANHCB1N978B
JANHCB1N979B
JANHCB1N980B
JANHCB1N981B
JANHCB1N982B
JANHCB1N983B
JANHCB1N984B
JANHCB1N985B
JANHCB1N986B
JANHCB1N987B
JANHCB1N988B
JANHCB1N989B
JANHCB1N990B
JANHCB1N991B
JANHCB1N992B
(1) Applies to ”C” and “D” suffix versions also. Simply replace all “B”
suffixes with “C” or “D” as applicable for correct PIN.
6.6 Maximum power versus lead temperature. Typical maximum power rating as a function of lead temperature for
various lead lengths is shown on figure 11.
26
MIL-PRF-19500/117N
Inches
.000
Millimeters
0.00
.125
3.18
.250
6.35
.375
9.53
FIGURE 11. Maximum power versus lead temperature and lead length.
27
MIL-PRF-19500/117N
6.7 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where
changes from the previous issue were made. This was done as a convenience only and the Government assumes no
liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the
requirements of this document based on the entire content irrespective of the marginal notations and relationship to
the last previous issue.
Custodians:
Army - CR
Navy - EC
Air Force - 11
NASA - NA
DLA - CC
Preparing activity:
DLA - CC
Review activities:
Army – AR, AV, MI, SM
Navy – AS, MC
(Project 5961-2974)
Air Force – 19, 99
* NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at http://assist.daps.dla.mil.
28
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