PC2708TB [CELDUC]
BIPOLAR ANALOG INTEGRATED CIRCUITS;
| 型号： | PC2708TB |
| 厂家： | 
celduc-relais |
| 描述： | BIPOLAR ANALOG INTEGRATED CIRCUITS |
| 文件： | 总13页 (文件大小：470K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
PC2709TB
5 V, SUPER MINIMOLD SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
DESCRIPTION
The PC2709TB is a silicon monolithic integrated circuits designed as 1st IF amplifier for DBS tuners. This IC is
packaged in super minimold package which is smaller than conventional minimold.
The PC2709TB has compatible pin connections and performance to PC2709T of conventional minimold
version. So, in the case of reducing your system size, PC2709TB is suitable to replace from PC2709T.
These IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
•
•
•
•
•
•
High-density surface mounting : 6-pin super minimold package (2.0 1.25 0.9 mm)
Wideband response
Medium output power
Supply voltage
: fu = 2.3 GHz TYP. @3 dB bandwidth
: PO (sat) = +11.5 dBm@f = 1 GHz with external inductor
: VCC = 4.5 to 5.5 V
Power gain
: GP = 23 dB TYP. @f = 1 GHz
: input/output 50
Port impedance
APPLICATIONS
•
•
1st IF amplifiers in DBS converters
RF stage buffer in DBS tuners, etc.
ORDERING INFORMATION (PB-Free)
Part Number
Package
Marking
C1E
Supplying Form
Embossed tape 8 mm wide.
PC2709TB-E3-A
6-pin super minimold
1, 2, 3 pins face the perforation side of the tape.
Qty 3 kpcs/reel.
Remark To order evaluation samples, please contact your local sales office (Part number for sample order:
PC2709TB-A).
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm
that this is the latest version.
Document No. P12653EJ3V0DS00 (3rd edition)
Date Published November 2000 N CP(K)
The mark shows major revised points.
+PC2709TB
PIN CONNECTIONS
Pin No.
Pin Name
INPUT
GND
(Top View)
(Bottom View)
1
2
3
4
5
6
3
2
1
4
5
6
4
5
6
3
2
1
GND
OUTPUT
GND
VCC
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER
(TA = +25°C, VCC = Vout = 5.0 V, ZS = ZL = 50 1)
fu
PO (sat)
(dBm)
GP
NF
ICC
Part No.
Package
6-pin minimold
Marking
C1D
(GHz)
(dB)
(dB)
(mA)
+PC2708T
+PC2708TB
+PC2709T
+PC2709TB
+PC2710T
+PC2710TB
+PC2776T
+PC2776TB
6.5
@f = 1 GHz
2.9
2.3
1.0
2.7
+10.0
+11.5
+13.5
+8.5
15
23
33
23
26
25
22
25
6-pin super minimold
6-pin minimold
5
C1E
@f = 1 GHz
6-pin super minimold
6-pin minimold
3.5
C1F
@f = 0.5 GHz
6-pin super minimold
6-pin minimold
6.0
@f = 1 GHz
C2L
6-pin super minimold
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Caution The package size distinguishes between minimold and super minimold.
2
Data Sheet P12653EJ3V0DS00
+PC2709TB
SYSTEM APPLICATION EXAMPLE
EXAMPLE OF DBS CONVERTERS
BS Antenna (DBS ODU)
IF Amp.
RF Amp.
Mixer
To IDU
Parabola
Antenna
+PC2709TB
Oscillator
EXAMPLE OF 900 MHz BAND, 1.5 GHz BAND DIGITAL CELLULAR TELEPHONE
RX
I
DEMOD.
Q
PLL
PLL
SW
I
= 2
Driver
0 $
TX
PA
F/F
90 $
+PC2709TB
Q
3
Data Sheet P12653EJ3V0DS00
+PC2709TB
PIN EXPLANATION
Applied
Voltage
(V)
Pin
Pin
No.
Pin
Name
Function and Applications
Internal Equivalent Circuit
Voltage
(V)Note
1
INPUT
<
1.05
Signal input pin. A internal
matching circuit, configured with
resistors, enables 50 1 connec-
tion over a wide band.
A multi-feedback circuit is de-
signed to cancel the deviations of
hFE and resistance.
This pin must be coupled to sig-
nal source with capacitor for DC
cut.
6
4
V
CC
OUT
4
6
OUTPUT Voltage
as same
<
Signal output pin. The inductor
must be attached between VCC
and output pins to supply current
to the internal output transistors.
as VCC
through
1
IN
external
inductor
VCC
4.5 to 5.5
<
<
Power supply pin, which biases
the internal input transistor.
This pin should be externally
equipped with bypass capacitor
to minimize its impedance.
3
2
5
GND
GND
2
3
5
GND
0
Ground pin. This pin should be
connected to system ground with
minimum inductance. Ground
pattern on the board should be
formed as wide as possible.
All the ground pins must be con-
nected together with wide ground
pattern to decrease impedance
defference.
Note Pin voltage is measured at VCC = 5.0 V
4
Data Sheet P12653EJ3V0DS00
+PC2709TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Symbol
VCC
Conditions
TA = +25°C, Pin 4 and 6
Ratings
6
Unit
V
Total Circuit Current
Power Dissipation
ICC
TA = +25°C
60
mA
mW
PD
Mounted on double copper clad 50 = 50 = 1.6 mm
epoxy glass PWB (TA = +85°C)
270
Operating Ambient Temperature
Storage Temperature
Input Power
TA
Tstg
Pin
<40 to +85
<55 to +150
+10
°C
°C
TA = +25°C
dBm
RECOMMENDED OPERATING RANGE
Parameter
Supply Voltage
Symbol
VCC
MIN.
4.5
TYP.
5.0
MAX.
5.5
Unit
V
Remark
The same voltage should be applied to pin
4 and 6.
Operating Ambient Temperature
TA
<40
+25
+85
°C
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = Vout = 5.0 V, ZS = ZL = 50 1)
Parameter
Circuit Current
Symbol
ICC
Test Conditions
MIN.
19
21.0
+9.0
<
TYP.
25
MAX.
32
26.5
<
Unit
mA
dB
No input signal
f = 1 GHz
Power Gain
GP
23.0
+11.5
5.0
Saturated Output Power
Noise Figure
PO (sat)
NF
f = 1 GHz, Pin = 0 dBm
f = 1 GHz
dBm
dB
6.5
<
Upper Limit Operating Frequency
Isolation
fu
3 dB down below flat gain at f = 0.1 GHz
f = 1 GHz
2.0
26
7
2.3
GHz
dB
ISL
31
<
Input Return Loss
Output Return Loss
Gain Flatness
RLin
RLout
6GP
f = 1 GHz
10
<
dB
f = 1 GHz
7
10
<
dB
f = 0.1 to 1.8 GHz
<
(1.0
<
dB
5
Data Sheet P12653EJ3V0DS00
+PC2709TB
TEST CIRCUIT
VCC
1 000 pF
C
3
L
6
50 1
C1
C2
50 1
OUT
4
1
IN
1 000 pF
1 000 pF
2, 3, 5
COMPONENTS OF TEST CIRCUIT FOR
MEASURING ELECTRICAL CHARACTERISTICS EXAMPLE OF ACTURAL APPLICATION COMPONENTS
Type
Value
Type
Value
1 000 pF
300 nH
100 nH
10 nH
Operating Frequency
100 MHz or higher
10 MHz or higher
100 MHz or higher
1.0 GHz or higher
C1 to C2
Bias Tee
Capacitor
Bias Tee
1 000 pF
1 000 pF
1 000 nH
C1 to C3
L
Chip capacitor
Chip inductor
C3
L
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors
for the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 1 load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2 /Rfc).
6
Data Sheet P12653EJ3V0DS00
+PC2709TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View
IN
C
L
OUT
C
Mounting direction
V
CC
C
COMPONENT LIST
Value
Notes
1. 30 = 30 = 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
C
L
1 000 pF
300 nH
3. Solder plated on pattern
4.
: Through holes
For more information on the use of this IC, refer to the following application note:
USAGE AND APPLICATION OF SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E).
7
Data Sheet P12653EJ3V0DS00
+PC2709TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C)
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
CIRCUIT CURRENT vs.
SUPPLY VOLTAGE
No input signal
40
35
30
25
20
15
10
5
40
No input signal
V
CC = 5.0 V
35
30
25
20
15
10
5
0
0
1
2
3
4
5
6
–60 –40 –20
0
+20 +40 +60 +80 +100
Supply Voltage VCC (V)
Operating Ambient Temperature TA ($C)
NOISE FIGURE, POWER GAIN
vs. FREQUENCY
POWER GAIN vs. FREQUENCY
8
7
6
5
4
30
25
20
30
25
VCC = 5.0 V
–40$C
TA = +25$C
5.0 V
VCC = 5.5 V
4.5 V
GP
+85$C
20
5.5 V
VCC = 5.0 V
NF
15
10
15
10
4.5 V
0.1
0.3
1.0
3.0
0.1
0.3
1.0
3.0
Frequency f (GHz)
Frequency f (GHz)
INPUT RETURN LOSS, OUTPUT
RETURN LOSS vs. FREQUENCY
ISOLATION vs. FREQUENCY
0
–10
–20
–30
0
VCC = 5.0 V
VCC = 5.0 V
–10
RLin
RLout
–20
–30
–40
–50
–40
–50
0.1
0.3
1.0
3.0
0.1
0.3
1.0
3.0
Frequency f (GHz)
Frequency f (GHz)
8
Data Sheet P12653EJ3V0DS00
+PC2709TB
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+15
+10
+5
+15
+10
+5
V
CC = 5.0 V
f = 1.0 GHz
5.5 V
f = 1.0 GHz
V
CC = 5.0 V
+25$C
TA = –40$C
4.5 V
+85$C
0
0
–5
–5
–10
–10
–15
–20
–15
–20
–35 –30 –25 –20 –15 –10 –5
Input Power Pin (dBm)
0
+5 +10
–35 –30 –25 –20 –15 –10 –5
Input Power Pin (dBm)
0
+5 +10
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+15
+10
+5
+15
+10
+5
f = 2.0 GHz
5.5 V
V
CC = 5.0 V
f = 0.5 GHz
f = 1.0 GHz
V
CC = 5.0 V
4.5 V
0
0
f = 2.0 GHz
–5
–5
–10
–10
–15
–20
–15
–20
–35 –30 –25 –20 –15 –10 –5
Input Power Pin (dBm)
0
+5 +10
–35 –30 –25 –20 –15 –10 –5
Input Power Pin (dBm)
0
+5 +10
SATURATED OUTPUT POWER vs.
FREQUENCY
3RD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
60
20
18
16
14
12
10
8
P
in = 0 dBm
f
= 1.000 GHz
f
2
1 = 1.002 GHz
50
40
30
20
10
5.5 V
V
CC = 5.0 V
V
CC = 5.0 V
5.5 V
4.5 V
6
4
4.5 V
2
0
0.1
0.3
1.0
3.0
–10 –8 –6 –4 –2
0
+2 +4 +6 +8 +10
Frequency f (GHz)
Output Power of Each Tone PO(each) (dBm)
Remark The graphs indicate nominal characteristics.
9
Data Sheet P12653EJ3V0DS00
+PC2709TB
S-PARAMETERS (TA = +25$C, VCC = Vout = 5.0 V)
S11-FREQUENCY
0.1 G
1.0 G
3.0 G
S22-FREQUENCY
3.0 G
0.1 G
2.0 G
1.0 G
10
Data Sheet P12653EJ3V0DS00
+PC2709TB
TYPICAL S-PARAMETER VALUES (TA = +25°C)
VCC = Vout = 5.0 V, ICC = 26 mA
Frequency
MHz
S11
S21
S12
S22
K
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
100.0000
200.0000
0.227
0.239
0.245
0.244
0.243
0.247
0.265
0.284
0.301
0.305
0.299
0.300
0.314
0.328
0.354
0.359
0.373
0.371
0.379
0.386
0.387
0.374
0.360
0.339
0.338
0.334
0.330
0.311
0.291
0.258
0.240
0.2
1.0
13.698
13.724
13.830
13.998
14.109
14.246
14.538
14.703
15.051
15.331
15.605
15.773
16.152
16.282
16.337
16.370
16.256
15.977
15.529
15.307
14.745
14.212
13.633
12.846
11.990
11.265
10.560
9.942
–4.5
–9.6
0.027
0.027
0.026
0.027
0.026
0.027
0.028
0.028
0.028
0.029
0.029
0.029
0.030
0.030
0.032
0.031
0.033
0.032
0.033
0.034
0.033
0.033
0.033
0.032
0.033
0.033
0.033
0.033
0.035
0.035
0.035
–1.0
3.1
0.196
0.207
0.212
0.223
0.234
0.252
0.270
0.287
0.298
0.309
0.322
0.336
0.353
0.353
0.368
0.370
0.382
0.381
0.378
0.373
0.366
0.363
0.353
0.331
0.318
0.304
0.295
0.282
0.267
0.246
0.225
0.9
2.2
1.37
1.36
1.38
1.32
1.33
1.26
1.20
1.15
1.10
1.05
1.04
1.01
0.95
0.93
0.86
0.86
0.81
0.83
0.83
0.82
0.85
0.90
0.94
1.06
1.11
1.20
1.25
1.36
1.40
1.55
1.64
300.0000
2.9
–14.5
–19.9
–25.0
–30.4
–35.5
–41.3
–47.0
–53.5
–60.0
–66.7
–74.0
–81.0
–89.3
–96.5
–104.5
–112.7
–120.5
–128.1
–135.9
–143.7
–151.3
–158.7
–165.5
–172.1
–177.8
176.2
171.3
166.5
161.9
4.7
4.1
400.0000
500.0000
2.5
7.8
9.8
3.4
1.5
2.1
600.0000
700.0000
800.0000
900.0000
1000.0000
1100.0000
1200.0000
1300.0000
1400.0000
1500.0000
1600.0000
1700.0000
1800.0000
1900.0000
2000.0000
2100.0000
2200.0000
2300.0000
2400.0000
2500.0000
2600.0000
2700.0000
2800.0000
2900.0000
3000.0000
3100.0000
–1.5
11.9
13.6
14.9
17.2
18.8
20.9
22.5
23.8
26.1
25.6
26.8
28.0
29.3
31.3
31.0
32.2
30.5
33.9
35.5
38.0
39.1
40.8
43.5
44.9
47.4
53.4
–0.4
–3.2
–2.3
–3.6
–4.6
–3.3
–7.4
–2.4
–11.9
–17.1
–21.5
–24.8
–28.8
–35.5
–41.8
–46.9
–52.8
–57.8
–64.1
–70.8
–78.1
–83.0
–90.0
–95.6
–102.5
–108.3
–113.7
–118.6
–125.1
–131.2
–3.2
–6.3
–10.3
–14.4
–17.3
–19.5
–22.1
–26.8
–31.1
–36.0
–39.5
–43.8
–48.7
–55.4
–62.0
–66.0
–69.0
–69.9
–72.5
–76.5
–80.6
9.432
8.818
8.353
11
Data Sheet P12653EJ3V0DS00
+PC2709TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1(0.1
1.25(0.1
0.1 MIN.
12
Data Sheet P12653EJ3V0DS00
+PC2709TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC pin.
(4) The inductor (L) must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and condi-
tions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
Soldering Conditions
Recommended Condition Symbol
IR35-00-3
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: NoneNote
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: NoneNote
VP15-00-3
WS60-00-1
–
Wave Soldering
Partial Heating
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit: NoneNote
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: NoneNote
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
13
Data Sheet P12653EJ3V0DS00
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