ZALM-301-1C [CEL]
APEX LT SERIES TRANSCEIVER MODULES; APEX LT系列收发器模块
| 型号： | ZALM-301-1C |
| 厂家： | 
CALIFORNIA EASTERN LABS |
| 描述： | APEX LT SERIES TRANSCEIVER MODULES |
| 文件： | 总19页 (文件大小：1731K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
APEX LT SEriES TrANSCEiVEr MODULES
ZALM-301-1
integꢀated Tꢀansceꢁveꢀ Modules foꢀ ZꢁgBee / iEEE 802.15.4
Evaluatꢁon Kꢁt avaꢁlable: ZAXM-201-KiT-1
DESCriPTiON
Apex modules provide a cost-effective RF transceiver solution for 2.4GHz
ZigBee and IEEE 802.15.4 data links and wireless networks.
APEX LT MODULE
•ꢀ Ember0ꢀplatform
ZALM-301-1
•ꢀ IntegratedEEꢀ802.15.4ꢀ
PHY and MAC
•ꢀ Dedicatedꢀnetworkꢀprocessor
SPIꢀorꢀUARTꢀinterfaceꢀto
applicationꢀmicrocontroller
•ꢀ HandlesꢀꢀZigBeerocessingꢀ&ꢀ
ꢀ timingꢀintensiveꢀtasks
The ZALM-301-1 Apex LT module is based on EmberTM EM260
ZigBee network processor. Also onboard are a 100mW Power Amplifier
and SPI-based microprocessor interface, providing you with the flexibility
to choose an external microprocessor based on your application’s needs.
The APEX LT provide over 4000 feet of range and is designed to deliver
constant RF output power across the 2.1 to 3.6V voltage input, ensuring
consistent performance over the entire life of the battery.
APPLiCATiONS
FEATUrES
• 1 - 100mW output power, software configured
• Designed for EmberZNet networks
• Miniature footprint: 1.00” x 1.275”
• Integrated PCB trace antenna
AutomadꢀMeterꢀ
rea
industꢀꢁal Contꢀols
•ꢀFoodꢀprocessingꢀcontrols
•ꢀTrafficꢀManagement
•ꢀSensorꢀNetworks
•ꢀAssetꢀManagement
•ꢀBarcodeꢀreader
•ꢀInꢀmetecations
•ꢀThermostas
• Optional MMCX connector for external antenna
• 16 RF channels (Channel 16 operates at reduced power levls)
• Over 4000 feet of range
•ꢀInhomeꢀdisplayꢀunits
Homeꢀ&ꢀ
BuildingꢀAutomation
• Integrated hardware support for Ember InSight Development
Environment
•ꢀPatientꢀMonitoring
•ꢀGlucoseꢀmonitor
• Non-intrusive debug interface (SIF)
• AES 128 bit encryption
•ꢀSecurity
•ꢀHVACꢀcontrol
•ꢀLightingꢀcontrol
•ꢀThermostats
• Low power consumption
• Constant RF output power over 2.1– 3.6 V voltage range
• FCC, IC, and CE certified
• RoHS compliant
The information in this document is subject to change without notice, please confirm data is current.
Document No: 0003-00-07-00-000 (Issue C)
Date Published: April 29, 2010
ZALM-300 Series
ORDERINGꢀINFORMATION
PartꢀNumber
OrderꢀNumber Descꢀꢁptꢁon
Mꢁns/Mults
Status
ZALM-301-1
Apex Lite 100mW transceiver module PCB Trace Antenna
Apex Lite 100mW transceiver module PCB Trace Antenna Bulk (1 tray)
Apex Lite 100mW transceiver MMCX connector installed
160 pcs / 160 pcs
32 pcs / 32 pcs
5,120 pcs / 160 pcs
N/A
Not Recommended
For New Design
APEX LT
ZALM-301-1-B
ZALM-301-1C
ZALM-301
ZALM-301-1C-B Apex Lite 100mW transceiver MMCX connector installed Bulk (1 tray)
Discontinued
ZALM-300 Series
APEXꢀLTꢀMODULEꢀBLOCKꢀDIAGRAM
24 MHz
XTAL
PWR
Reg
ANT
Ember EM260
ZigbeeTM SOC
RF Front End
(Renesas PA &
Renesas Switch)
Micro
processor
Radio
APEX LT
EVALUATiON KiT
CEL provides Apex Evaluation Kits to assist users in eval
Apex and Apex LT modules. The key componets of the Apex
Evaluation Kit are the interface board and the CEL’s Apex radio
module.
Apex LT module combines an EEM260 (Apex LT)
transceiver IC with an NEC high Power Amplifier and a high
performance NEC RFIC switch.
The interface board features a serial commuion interface, a
power manageodule, peripherals potentiometer
and acceleromGPIO headers. The valuation Kit also
contains four Aes and two les.
For more detail information regarding Apex Evaluation Kit, refer to
the ApexꢀModuleꢀEvaluationꢀKitꢀUserꢀGuide document. (http://
www.cel.com/pdf/misc/apexsries_ug.pdf)
Kꢁt Contents:
•ꢀEvaluationꢀBoardsꢀ(2)
•ꢀZigBeeꢀModulesꢀ(2)
•ꢀUSBꢀCablesꢀ(2)
OrderꢀNumber
Descꢀꢁptꢁon
•ꢀAAꢀBatteriesꢀ(4)
•ꢀTechnicalꢀꢀInformationꢀCDꢀ(1)
ZAXM-201-KiT-1*
Engineering Evaluation Kit
• To evaluate the ZALM-301-1 module, please utilize the
ZAXM-201-KIT-1
ZALM-300 Series
TABLE OF CONTENTS
IntroductionꢀandꢀOverview
Descꢀꢁptꢁon..............................................................................................................................................................................................
Featuꢀes..................................................................................................................................................................................................
Applꢁcatꢁons............................................................................................................................................................................................
OrderingꢀInformation.............................................................................................................................................................................
ApexꢀLTꢀModuleꢀBlockꢀDiagram...................................................................................................................................................
Evaluatꢁon Kꢁt.........................................................................................................................................................................
1
1
1
1
3
3
SystemꢀLevelꢀFunction
Apex LT Module Mꢁcꢀopꢀocessoꢀ.........................................................................................................................................................
Antenna...................................................................................................................................................................................
ModesꢀofꢀOperationꢀ(TX,ꢀRX,ꢀSleep)...........................................................................................................................................
Pꢀocessoꢀ ACTiVE........................................................................................................................................................................
Pꢀocessoꢀ iDLE.....................................................................................................................................................................................
PowerꢀAmplifierꢀRegulatorꢀControlꢀLine.............................................................................................................................................
SiF inteꢀface........................................................................................................................................................................................
HostꢀProtocolꢀInterfaceꢀCommands................................................................................................................................................
5
5
7
7
7
8
8
8
ElectricalꢀSpecification
AbsoluteꢀMaximumꢀRatings............................................................................................................................................................
Recommendedꢀ(OperatingꢀCondition).....................................................................................................................
DCꢀCharacteristics.....................................................................................................................................................
9
9
9
RFꢀCharacteristics................................................................................................................................................................................ 10
PinꢀSignalꢀ&ꢀInterfaces
PinꢀSignalsꢀI/OꢀConfiguration............................................................................................................................................................. 10
ApexꢀLTꢀI/OꢀPinꢀAssignment..................................................................................................................................................... 11
ApexꢀLTꢀModuleꢀDimensions............................................................................................................................................................. 12
PCBꢀCopperꢀPatternꢀLayout................................................................................................................................................................... 13
PCB Stencꢁl Patteꢀn........................................................................................................................................................................... 13
PCB Keep-Ou................................................................................................................................................................. 14
15
Pꢀocessꢁng
17
AgecyꢀCeifications
18
Shipment,ꢀStorageꢀ&ꢀHandling
19
Referencesꢀ&ꢀRevisionꢀHistory
ZALM-300 Series
APEX LT MODULE MiCrOPrOCESSOr
APEX LT modules provide a connection to the Ember Serial API over the SPI allowing the application development to be
completed on a host microprocessor of your choice. In addition to the SPI signals, two additional signals (nHOST_INT and
nWAKE) provide a handshake mechanism. The module provides a slave device with all transactions initiated by the host.
Please consult the EM260 datasheet for details on the SPI Protocol including:
•
•
•
•
•
•
•
Physical Interface Configuration
SPI Transactions
SPI Protocol Timing Parameters & Waveforms
Data Formatting
SPI Commands & Responses
Handling Resets and Power Cycling
Transaction Examples
ANTENNA
APEX and APEX LT modules include an integrated PCB trace antenna.
An optional MMCX connector can be specified, enabling connection to
a 50-ohm external antenna of the user’s choice. See Ordering
Information.
TOP VIEW
TOP VIEW
The PCB antenna employs an F-Antenna topology that is compact and
supports an omni-directional radiation pattern.To mize antenna efficien adequate ground plane must be provided
on the host PCB. If positioned correctly, the grouon the host bor the module can contribute significantly
to antenna performance.
The position of the module on the host board and verall design of the product enclosure contribute to antenna perfor-
mance. Poor design effects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted
signal. Measured radiation patterns of these modules are available from California Eastern Labs and can be used to
benchmark design performan
Here are some design guidelines to help ensurantenna performance:
•
•
•
•
•
Never place the ground plane or te copper traces directly underneath the antenna portion of the module.
Never the antenna closetallic objects.
In the design, ensure that wiring and other components are not placed near the antenna.
Do not e the antenetallic or metallized plastic enclosure.
Keep lastic enclosures more from the antenna in any direction.
ZALM-300 Series
ANTENNA (Continued)
Orientation of EUT Peak Gain was in the Horizontal Position. The receiver antenna was in the Horizontal Position.
Frequency = 2405 MHz
Frequency = 2440 MHz
90
90
5
5
120
60
120
60
0
0
-5
-10
-15
-20
-25
-30
-5
-10
-15
-20
-25
-30
150
30
150
30
180
180
0
0
210
330
210
240
300
240
270
270
Vertical Polarization Gain (dBi)
min: -26.1 max: -7.3 avg: -14.7
Vertical Polarzation Gain (dBi)
min: -24.7 m-9.6 av: -14.8
Horizontal Polarization Gain (dBi)
min: -8.9 max: +1.8 avg: -2.7
Hoontal Polariation Gain (di)
min: 8.1 max: 0.4 avg: -3.4
Frequency = 2480 MHz
90
5
120
60
0
-5
-10
-15
-20
-25
-30
150
30
180
0
210
330
240
300
270
VerPolarization Gin (dBi)
min: -22.1
max: -8.7 vg: -1.9
Horizontal Polarization Gn (dBi)
min: -15.2
max: +1.4 avg: -3.1
ZALM-300 Series
MODES OF OPErATiON
The Apex LT supports three power modes: Processor ACTIVE, processor IDLE, and DEEP SLEEP.
Pꢀocessoꢀ ACTiVE
In this mode all operations are running normally.
Pꢀocessoꢀ iDLE
While in idle mode, code execution halts until any interrupt occurs. All modules of the EM260 including the radio continue to
operate normally. The EmberZNet stack automatically invokes idle as appropriate.
Deep Sleep
To achieve the lowest power consumption, the module can be set in DEEP SLEEP modn this mode most of the function-
alities of the modules are turned off with the exception of the critical functions such aads and RAM that is powered
by the high voltage supply (DCC_PADS).
The module can be taken out of DEEP SLEEP in 3 ways:
• Configuring the sleep timer to generate an interrupt after some periods of time.
• Issuing external interrupt signal.
• Issuing commands through the SIF interface.
In DEEP SLEEP the current consumption of the module will drop to 5.0μA (5.5μA with optional 32.768kHz oscillator en-
abled).
For more detail information on modes of operatioEmber EM260 deet available at Ember’s website
(www.ember.com)
ZALM-300 Series
POWERꢀAMPLIFIERꢀREGULATORꢀCONTROLꢀLINEꢀ
The APEX LT module includes a separate 1.8V regulator for a power amplifier bias that enables consistent module out-
put performance over the wide 2.1 – 3.6V voltage range. To prevent excessive sleep currents, this regulator should be
disabled when the module is in sleep mode. An external pull up resistor option is provided on each module (R6) that allows
the regulator to be constantly enabled. This option increases the sleep current of the module to a point well above the
specified values.
SPECIFICATIONSꢀꢀ—ꢀꢀVPA_ENꢀ(APEXꢀLT)
Parameter
Mꢁn
Typ
Max
Unꢁt
V
Regulator enable voltage
Regulator disable voltage
Enable line current (VEN = 0)
Enable line current (VEN = VDD)
Turn on Time
0.95
0.4
0.1
1
V
μA
μA
sec
25
On the APEX LT module the VPA_EN control must be provided by the host microprocessor. In normal operation, the VPA_
EN line must be set high. It must be set low when the module is put into sleep mode in conjuncion with putting the EM260
into deep sleep. Upon module wake-up, a 250µsec turn-on time mut be provided prior to any transmission, allowing the
module’s regulator to settle. Note that this 250µsec requirement applies only to the external power amplifier, the wake-up
time for the EM260 is separate from this value.
If the application does not put the module to sleep or if eep current is not an issue, the power amplifier regulator may
be permanently enabled by tying the control line high. In this seup, the sleep currnt will increase by 80μA over the 5μA
Standby Current figure provided in Electrical Spes.
SiF iNTErFACE
The APEX LT module provide access to the SIF module programmng and debug interface.
Consult the EM260 datasheet urther details on the following SIF features:
•
•
•
Production Testing
Firmware Download
Product Control and Charactertion
HOST PrOTOCOL iNTEE COMMANDS
For informatioon Host Protocol ace Commands and for other software-related documents refer to Ember’s website:
http://www.ember.com/products_documentation.html
ZALM-300 Series
ABSOLUTEꢀMAXIMUMꢀRATINGS
ratꢁng
Value
Unꢁt
Power Supply Voltage
3.6
Vdc
Voltage on Any Digital Pin
VDD + 0.3,
Max 3.6
Vdc
RF Input Power
+10
dBm
°C
Storage Temperature Range
-45 to 125
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDEDꢀ(OPERATINGꢀCONDITIONS)
Characteristic
Power Supply Voltage (VDD)
Input Frequency
Mꢁn
2.1
Typ
Max
3.6
Unꢁt
V
2405
-40
2480
85
MHz
°C
V
Ambient Temperature Range
Logic Input Low Voltage
Logic Input High Voltage
25
0
20% VDD
VDD
80% VDD
V
DC CHArACTEriSTiCS (@ 25°C, VDD = 3.3V unless otherwise noted)
Parameter
Mꢁn
Typ
Max
Unꢁt
V
Logic Input Low
Logic Input High
Logic Output Low
Logic Output High
0
0.2 x VDD
VDD
0.8 x VDD
0
V
0.18 x VDD
VDD
V
0.82 x DD
V
PowerꢀConsumption
Transmit Mode (100mW output):
APEX LT
Receive Mode:
APEX LT
170
37
mA
mA
Standby Mode:
10mW
5
5
μA
μA
100mW
ZALM-300 Series
rF CHArACTEriSTiCS (@ 25°C, VDD = 3.3V unless otherwise noted)
Parameter
Mꢁn
Typ
Max
Unꢁt
GeneralꢀCharcteristics
RF Frequency Range
RF Data Rate
2400
2483.5
MHz
kbps
250
Transmitter
Nominal Output Power
Programmable Output Power Range
Error Vector Magnitude
20
32
15
dBm
dB
35
receꢁveꢀ
Receiver Sensitivity (1% PER) – normal mode
Receiver Sensitivity (1% PER) – boost mode*
Saturation (Maximum Input Level) (1% PER)
802.15.4 Adjacent Channel Rejection:
APEX LT
-92
-93
0
-96
-97
dm
dBm
dBm
30
40
dB
dB
802.15.4 Alternate Channel Rejection
802.11 g Rejection (±10 MHz):
APEX LT
30
dB
*Boost Mode is an optional software-selectable high performance mode designed to increase receiver sensitivity.
Note: Refer to Ember EM260 datasheet for additional details.
PINꢀSIGNALSꢀI/OꢀPORTꢀCONFIGURAT
The APEX LT module has a 28 edge I/O interfaces for connection
to the user’s host board. Figure 1 shows the layout of the 28 edge castellations.
PIN 19
IN 10
PIN 28
Figure 1 (Top Viw)
ZALM-300 Series
APEXꢀLTꢀI/OꢀPINꢀASSIGNMENTS
Pin #
Name
GROUND
GROUND
GROUND
GROUND
VDD
Type
GND
GND
GND
GND
PI
Description
1
2
Ground
Ground
3
Ground
4
Ground
5
Power Supply Input
6
nRESET
MOSI
DI
Reset, active low
7
DI
SPI Data, Master Out/Slave In (from Host to APEX LT)
SPI Data, Master In/Slave Out (from APEX LT to Host)
SPI Clock (from Host to APEX LT)
8
MISO
DO
DI
9
SCLK
10
VPA_EN
DI
APEX LT Enable, active high (see section wer Amplifier Regulator
Control Line”)
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
nRTS
nSSEL_INT/nCTS
PTI_EN
DO
DI
UART RTS
SPI Slave Select (from Host to APEX LT)/UART CTS
DO
DO
DO
PTI Frame signal
PTI Data signal
UART TXD
PTI_DATA
TXD
nHOST_INT/RXD
nWAKE
DO/DI Host Interrupt Signal (from APEX LT to Host) or UART RXD
DI
GND
DI
Wake Interrupt Signal (from host to APEX LT)
Ground
GROUND
SIF_CLK
SIF Inclock
SIF_MISO
SIF_MOSI
nSIF_LOAD
SDBG
DO
DI
SIF Imaster in/slave o
SIF Interface master out/slave in
DI/DO SIF Inerface load srobe
DO
DO
Spare Debug Signal
Link and Activity signal
Ground
LINK_ACTIVITY
GROUND
GROUND
GROUND
GROUND
GND
GND
GND
GND
Ground
Ground
Ground
UnusedꢀI/OhouldꢀbeꢀleftꢀunonnectedꢀandꢀtheꢀpinꢀstateꢀsetꢀviaꢀtheꢀHostꢀProtocol.
DI = Digital Inp
PI = Power Input
DO = Digital utput
AI = Analog Input
AO = Analog Output
GND = Ground
ZALM-300 Series
DiMENSiONS: ZALM-301-1 Apex LT
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
0.195
MAX
PIN 19: SIF_CLK
SIF_MISO
PIN 10: VPA_EN
SCLK
SIF_MOSI
MISO
nSIF_LOAD
SDBG
MOSI
nRESET
V
LINK_ACTIVITY
GROUND
GROUND
ROUND
ROUND
GROUND
PIN 1: GROUND
RF Shield
GROUND
PIN 28: GROUND
0.062
1.000
PCB Trace Antenna
TOP VIEW
DIMENSIONS:ꢀZALM-301-1CꢀApexꢀLTꢀptionalꢀMMCXnnector
Dimensions in inches. Tolerances = +/-0.005” uless otherwise noted.
0.195
MAX
PIN 19: IF_CLK
SIF_MISO
PIN 10: VPA_EN
SCLK
SIF_MOSI
MISO
nSIF_LOAD
SDBG
MOSI
nRESET
VDD
LINK_ACTIVITY
GROUND
GROUND
GROUND
GROUND
GROUND
PIN 1: GROUND
RF Shield
GROUND
PIN 28: GROUND
J2
J2
0.410
0.062
0.205 MAX
1.000
Optional MMCX Connector
for external antenna
Overall Height
w/MMCX Connector
TOP VIEW
ZALM-300 Series
PCB COPPEr PATTErN LAYOUT: Apex LT
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
0.040
0.100 Pitch Typ
0.125 Typ 28 Pads
0.040
0.025
0.070 Typ 28 Pads
0.090
0.050
28
PIN 1
0.240
0.025
0.850
Recommended Host PCB Board Edge
PCB PASTE STENCiL PATTErN: Apex LT
Dimensions in inches. Tolerances = +/-0.005” uness othrwise noted.
0.065
0.100 Pitc
0.100 Typ 8 Pad
0.065
0.070 Typ 28 Pads
28
PIN 1
0.900
ZALM-300 Series
PCB Keep-out aꢀeas: Apex LT
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
Component Keep Out Area:
No components within 0.100 inches of module
Edge of Host PCB
0.190
Recommended overhang
for PCB Antenna = 0.230
0.315
0.050
If module does not ovehang edge
of hosPCB, no components, copper
or trces are allowed in this area
1.000
1.200
If optional MMCX connector is specfied, edge
of host board must be notched as shown
For optimum antenna performnce, the APEX LT modules should be mounted with the PCB trace antenna overhanging
the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the
module, up to the PCB edge. The installation of an uninterrupted ground plane on a layer directly beneath the module will
also allow you to run traces under this CEL can provide assistance with your PCB layout.
ZALM-300 Series
PROCESSING
RecommendedꢀReflowꢀProfileꢀ
ParametersꢀValues
Ramp up rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
3º/sec max
150ºC
200ºC
60-120 sec
217ºC
TLiquidus
Time above TL
60-150 sec
260 + 0ºC
20-30 sec
8 min max
6ºC/sec max
Tpeak
Time within 5º of Tpeak
Time from 25º to Tpeak
Ramp down rate
Achieve the brightest possible solder fillets with a good shape and low contact angle.
Pb-Fꢀee Soldeꢀꢁng Paste
Use of “No Clean” soldering paste is strongly recommended, as does not require cleaning after the soldering process.
Note: The quality of the solder joints on the castellations (‘half vas’) where they contact the host board should meet the appropriate
IPC specification. See IPC-A-610-D Acceptability octronic Assemblies, s8.2.4 Castellated Terminations.
Cleanꢁng
In general, cleaning the populated modules is strogly discouraed. Residuals under the module cannot be easily removed
with any cleaning process.
•
Cleaning with water can lecapillary effects where water is absorbed into the gap between the host board and
the module. The combinf soldering flux residuas and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
•
•
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is
not accessible for post-washing inspn. The solvent could also damage any stickers or labels.
Ultrasonig could damage thmodule permanently.
The best approach is to consida “no clean” soldering paste and eliminate the post-soldering cleaning step.
Optꢁcal inspectꢁon
After soldering the Module to the host board, consider optical inspection to check the following:
•
•
•
Proper alignment and centering of the module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring pads, or vias.
ZALM-300 Series
PROCESSING (Continued)
RepeatingꢀReflowꢀSoldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldeꢀꢁng
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Hand Soldeꢀꢁng
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC mendations/
reference document IPC-7711.
Rework
The Apex LT Module can be unsoldered from the host board. Use of a hot air re-work thot plate for pre-heating from
underneath is recommended. Avoid overheating.
!Waꢀnꢁng Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate
warranty coverage.
AdditionalꢀGrounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
is done at the customers own risk. The numerous grounpins at the module perimeter should be sufficient for optimum
immunity to external RF interference.
ZALM-300 Series
AGENCYꢀCERTIFICATIONS
FCCꢀPartꢀ15.247ꢀModuleꢀCertifiedꢀ(Mobile)
The APEX LT modules comply with Part 15 of the Federal Communications Commission rules and regulations.
To meet the FCC Certification requirements, the user must meet these regulations:
•
•
The text on the FCC ID label provided with the module must be placed on the outside of the final product.
The modules may only use the antennas that have been tested and approved with these modules:
— The on-board PCB trace antenna
— Nearson S131CL-5-RMM-2450S antenna.
To meet the Section 15.209 emission requirements in the restricted frequency bands of Secton 15.205, he transceiver
transmitter power for the APEX LT (EM260) module needs to be reduced from the typical maximum setting on the upper
two channels (2475 MHz and 2480 MHz). Maximum values are TBD.
Per Section 2.109, the APEX LT module has been certified by the FCC for use with other ducts without additional
certification. Any modifications to this product may violate the rules of the Fedral Communications Commissioand make
operation of the product unlawful.
Per Sections 15.107 and 15.109, the user’s end product must be tesd founintentional radiators compliance.
Per Section 47 C.F.R. Sec.15.105(b), the APEX LT modules is crtified as mobile devies for the FCC radiation exposure
limits set forth for an uncontrolled environment. The antennaused with these modules must be installed to provide a
separation distance of at least 8 inches (20cm) from all persons. If the module s to be used in a handheld application, the
user is responsible for passing additional FCC part 2.1091 rules (SAR) and FCC uidelines for Human Exposure to Radio
Frequency Electromagnetic Fields, OET Bulletin applement C.
ICꢀCertificationꢀ—ꢀCanadaꢀ
The APEX LT module is IC certified. The labeling requirements for Indutry Canada are similar to those of the FCC. A
visible label on the outside of the final product must display the IC abeling. The user is responsible for the end product to
comply with IC ICES-003 (Uninntional radiators).
CEꢀCertificationꢀ—ꢀEuropeꢀ
The APEX module is CE certified. The Cmarking must be affixed legibly and indelibly to a visible location on the user’s
product.
FCC Appꢀoved Antennas
•ꢀꢀꢀIntegratedꢀPCBꢀtracꢀantenna
•ꢀꢀꢀNearsonꢀS131CL-5-RMM-2450Sꢀꢀ–ꢀA 2.4GHz Dipole antenna with a 5 inch cable and a right angle MMCX connector.
ZALM-300 Series
SHIPMENT,ꢀHANDLING,ꢀANDꢀSTORAGE
Shipmentꢀ
The Apex LT Module is delivered in trays of 32. Each package consist of 5 trays and therefore the total module quantity per
package is 160.
Handlꢁng
The Apex LT Module is designed and packaged to be processed in an automated assembly line.
!Waꢀnꢁng The Apex LT Module contain a highly sensitive electronic circuitry. Handling without prD protection
may destroy or damage the module permanently.
!Waꢀnꢁng According to JEDEC ISP, the Apex LT Module is moisture sensitive devices. Appropriate handling instructions
and precautions are summarized in Section 2.1. Read carefully to prevent permanent dame to moisture intake.
MoistureꢀSensitivityꢀLevelꢀ(MSL)
MSL 3, per J-STD-033
ZALM-300 Series
REFERENCESꢀ&ꢀREVISIONꢀHISTORY
refeꢀences
ReferenceꢀDocuments
Apex Module Evaluation Kit User Guide
Ember EM260 Datasheet (June 29, 2007)
RevisionꢀHistoryꢀ
Pꢀevꢁous Veꢀsꢁons
ChangesꢀtoꢀCurrentꢀVersion
Page
0002/3-00-07-00-000
(Issue A) May 7, 2008
Initial preliminary datasheet.
N/A
0003-00-07-00-000
(Issue B) January 22, 2009
Datasheet Unification for ZigBee product line
N/A
0003-00-07-00-000
(Issue C) April 29, 2010
The following corrections/changes were made: On page 11, e module height
was changed from 0.162” to 0.195”. On page 6, te deep sleep mode current
consumption was changed to 5.0μA.
6, 11
Disclaimerꢀ
• The information in this document is current as of the puhed date. The informas subjecto change without
notice. For actual design-in, refer to the latest publicCEL data sheets oks, etc., for the most
up-to-date specifications of CEL products. Not all pr/or types are availevery country. Please
check with an CEL sales representative for availability dditional infomation.
• No part of this document may be copied or rproducein any form oby any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may apper in this document.
• CEL does not assume any liability for iringement of patents, copyrights or other intellectual property rights of
third parties by or arising from se of CEL products listed in this document or any other liability arising from the
use of such products. No licxpress, implied or otherwie, is granted under any patents, copyrights or other
intellectual property rights of CL or others.
• Descriptions of circuis, software and other related information in this document are provided for illustrative
purposes in semiconductor product operatand application examples. The incorporation of these circuits,
software and mation in the design otomer’s •equipment shall be done under the full responsibility of the
customer. Cmes no responsibilitany losses incurred by customers or third parties arising from the use
of these cirware and infotion.
• While CEL endeavors to enhanlity, reliability and safety of CEL products, customers agree and
acknowledge that the possibility ots thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (includng death) to persons arising from defects in CEL products, customers must incorporate
sufficient safety measures their design, such as redundancy, fire-containment and anti-failure features.
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