CTLSH05-2M521HL [CENTRAL]
SURFACE MOUNT ULTRA LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULE; 表面安装超低VF硅肖特基二极管小型无模块
| 型号： | CTLSH05-2M521HL |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | SURFACE MOUNT ULTRA LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULE |
| 文件： | 总2页 (文件大小：155K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
CTLSH05-2M521HL
SURFACE MOUNT
Central
Semiconductor Corp.
ULTRA LOW V
F
DESCRIPTION:
SILICON
The CENTRAL SEMICONDUCTOR
SCHOTTKY DIODE
TINY LEADLESS MODULETM
CTLSH05-2M521HL is a high performance HiLo™ 0.5A
Schottky diode designed for applications where small
size and operational efficiency are the prime
requirements. With a maximum power dissipation of
0.90W, and a very small package footprint (comparable
to the SOT-563), this leadless package design is capable
of dissipating over 3 times the power of similar devices in
comparable sized surface mount packages.
FEATURES:
TLM521 CASE
• HiLo™ Device Characteristics
• High Thermal Efficiency
• Small TLM 2x1mm case
(High Current/Low V )
• Ultra Low Forward Voltage Drop
F
MARKING CODE: CF
(V =0.39V Typ. @ 0.5A)
F
APPLICATIONS:
• DC/DC Converters
• Battery Powered Portable
Equipment
• Voltage Clamping
• Protection Circuits
MAXIMUM RATINGS: (T =25°C)
A
SYMBOL
UNITS
Continuous Reverse Voltage
Average Forward Current
Power Dissipation
V
I
20
0.5
0.9
3.0
V
R
A
W*
A
F
P
D
Peak Forward Surge Current (8.3ms)
I
FSM
Operating and Storage
Junction Temperature
T , T
J
-65 to +150
139
°C
stg
Thermal Resistance
Θ
°C/W*
JA
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)
A
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
I
V =10V
R
I =1.0mA
R
0.2
1.0
mA
V
R
BV
R
20
V
F
I =100µA
F
0.030
0.065
0.145
0.235
0.280
0.390
0.060
0.100
0.200
0.280
0.330
0.460
TBD
V
V
V
F
I =500µA
F
V
F
I =10mA
F
V
V
F
I =100mA
F
V
V
F
I =200mA
F
V
V
F
I =500mA
F
V
C
T
pF
* FR-4 Epoxy PCB with copper mounting pad area of 33mm2.
R0 (20-January 2006)
CTLSH05-2M521HL
SURFACE MOUNT
TM
Central
ULTRA LOW V
F
Semiconductor Corp.
SILICON
SCHOTTKY DIODE
TINY LEADLESS MODULETM
TLM521 CASE - MECHANICAL OUTLINE
Suggested mounting pad layout
for maximum power dissipation
(Dimensions in mm)
For standard mounting refer
to TLM521 Package Details
LEAD CODE:
1) CATHODE
2) CATHODE
3) CATHODE
4) ANODE
5) ANODE
MARKING CODE: CF
R0 (20-January 2006)
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