IXD_602 [CLARE]
2-Ampere Dual Low-Side Ultrafast MOSFET Drivers; 2安培双低侧超快MOSFET驱动器
| 型号： | IXD_602 |
| 厂家： | 
CLARE |
| 描述： | 2-Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| 文件： | 总13页 (文件大小：1594K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IXD_602
2-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
Features
Description
• 2A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
The IXDF602/IXDI602/IXDN602 dual high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. Each of the two outputs
can source and sink 2A of peak current while
• Logic Input Withstands Negative Swing of up to 5V
• Matched Rise and Fall Times
• Low Propagation Delay Time
producing voltage rise and fall times of less than 10ns.
The input of each driver is CMOS compatible, and is
virtually immune to latch up. Proprietary circuitry
eliminates cross conduction and current
• Low 10μA Supply Current
• Low Output Impedance
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_602 family
ideal for high-frequency and high-power applications.
Applications
• Efficient Power MOSFET and IGBT Switching
• Switch Mode Power Supplies
• Motor Controls
• DC to DC Converters
• Class-D Switching Amplifiers
• Pulse Transformer Driver
The IXDN602 is configured as a dual non-inverting
driver, the IXDI602 is configured as a dual inverting
driver, and the IXDF602 has one inverting and one
non-inverting driver.
The IXD_602 family is available in a standard 8-pin
DIP (PI), an 8-pin SOIC (SIA), an 8-pin Power SOIC
with an exposed metal back (SI), and an 8-pin DFN
(D2) package.
RoHS
2002/95/EC
Pb
e3
Ordering Information
Logic
Configuration
Packing
Method
Part Number
Package Type
Quantity
IXDF602D2TR
IXDF602PI
8-Pin DFN
Tape & Reel
Tube
2000
50
8-Pin DIP
INA
OUTA
OUTB
A
B
IXDF602SI
8-Pin Power SOIC with Exposed Metal Back
Tube
100
IXDF602SITR
IXDF602SIA
IXDF602SIATR
IXDI602D2TR
IXDI602PI
8-Pin Power SOIC with Exposed Metal Back
Tape & Reel
Tube
2000
100
INB
8-Pin SOIC
8-Pin SOIC
Tape & Reel
Tape & Reel
Tube
2000
2000
50
8-Pin DFN
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
INA
INB
A
B
OUTA
OUTB
IXDI602SI
Tube
100
IXDI602SITR
IXDI602SIA
IXDI602SIATR
IXDN602D2TR
IXDN602PI
Tape & Reel
Tube
2000
100
8-Pin SOIC
Tape & Reel
Tape & Reel
Tube
2000
2000
50
8-Pin DFN
8-Pin DIP
INA
INB
OUTA
OUTB
A
B
IXDN602SI
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
Tube
100
IXDN602SITR
IXDN602SIA
IXDN602SIATR
Tape & Reel
Tube
2000
100
8-Pin SOIC
Tape & Reel
2000
DS-IXD_602 - R02
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1
IXD_602
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_602 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 IXDI602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 IXDF602. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 IXDN602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
R02
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2
IXD_602
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IXDF602
Pin Name
Description
NC
INA
1
2
3
4
8
7
6
5
NC
INA
INB
Channel A Logic Input
Channel B Logic Input
A
OUTA
VCC
GND
INB
B
OUTB
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
IXDI602
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn on or turn off a discrete MOSFET or IGBT
NC
INA
1
2
3
4
8
7
6
5
NC
V
Supply Voltage - Provides power to the device
CC
A
OUTA
VCC
Ground - Common ground reference for the
device
GND
INB
GND
B
OUTB
IXDN602
NC
INA
1
2
3
4
8
7
6
5
NC
A
B
OUTA
VCC
GND
INB
OUTB
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
Input Voltage
-0.3
-5.0
-
40
V
V
CC
V
VCC+0.3
IN
I
Output Current
Junction Temperature
Storage Temperature
2
A
OUT
T
°C
-55
-65
+150
+150
J
T
°C
STG
Unless otherwise specified, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
4.5
-40
35
V
CC
T
Operating Temperature Range
+125
°C
A
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3
IXD_602
1.5 Electrical Characteristics: T = 25°C
A
Test Conditions: 4.5V < V < 35V, one channel (unless otherwise noted).
CC
Parameter
Input Voltage, High
Conditions
Symbol
VIH
Minimum
Typical Maximum Units
4.5V < V < 18V
CC
3.0
-
-
-
0.8
10
-
V
4.5V < V < 18V
CC
Input Voltage, Low
VIL
-
-
0V < V < V
IN
Input Current
IIN
CC
-
μA
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
-
VOH
VOL
ROH
ROL
VCC-0.025
-
V
-
-
-
-
-
0.025
4
V
=18V, I =-10mA
OUT
CC
2.5
1.5
Ω
V
=18V, I =10mA
OUT
CC
3
Limited by package power
dissipation
Output Current, Continuous
IDC
-
-
1
A
V =18V, C
CC
=1000pF
=1000pF
=1000pF
=1000pF
Rise Time
tr
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
-
-
7.5
6.5
35
38
1
15
15
60
60
3
V =18V, C
Fall Time
tf
CC
ns
V =18V, C
On-Time Propagation Delay
Off-Time Propagation Delay
tondly
toffdly
CC
V =18V, C
CC
V
=18V, V =3.5V
IN
mA
CC
V =18V, V =0V
CC IN
Power Supply Current
ICC
<1
<1
10
10
μA
V
=18V, V =V
IN CC
CC
1.6 Electrical Characteristics: T = - 40°C to +125°C
A
Test Conditions: 4.5V < V < 35V, one channel (unless otherwise noted).
CC
Parameter
Input Voltage, High
Conditions
Symbol
VIH
Minimum
Maximum
Units
4.5V < V < 18V
CC
3.3
-
-
0.65
10
-
V
4.5V < V < 18V
CC
Input Voltage, Low
VIL
0V < V < V
IN
Input Current
IIN
CC
-10
μA
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
-
VOH
VOL
ROH
ROL
VCC-0.025
V
-
-
-
-
0.025
6
V
=18V, I =-10mA
OUT
CC
Ω
V
=18V, I =10mA
OUT
CC
5
Limited by package power
dissipation
Output Current, Continuous
IDC
-
1
A
V =18V, C
CC
=1000pF
=1000pF
=1000pF
=1000pF
Rise Time
tr
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
-
-
18
18
V =18V, C
Fall Time
tf
CC
ns
V =18V, C
On-Time Propagation Delay
Off-Time Propagation Delay
tondly
toffdly
CC
75
V =18V, C
CC
75
V
=18V, V =3.5V
IN
3.5
150
150
mA
CC
V =18V, V =0V
CC IN
Power Supply Current
ICC
μA
V
=18V, V =V
IN CC
CC
4
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R02
IXD_602
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
IXDD602D2 (8-Pin DFN)
IXD_602PI (8-Pin DIP)
35
125
85
θ
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
°C/W
°C/W
JA
IXD_602SI (8-Pin Power SOIC)
IXD_602SIA (8-Pin SOIC)
IXD_602SI (8-Pin Power SOIC)
120
10
θ
JC
2 IXD_602 Performance
2.1 Timing Diagrams
VIH
VIH
VIL
INx
INx
VIL
t
t
t
t
ondly
ondly
offdly
offdly
90%
90%
10%
OUTx
10%
OUTx
t
t
t
t
r
f
f
r
Non-Inverting Driver Waveforms
Inverting Driver Waveforms
2.2 Characteristics Test Diagram
+
VCC
VCC
INA
INB
OUTA
OUTB
0.1μF 10μF
-
Tektronix
Current Probe
CLOAD
GND
6302
VIN
Tektronix
Current Probe
6302
CLOAD
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5
IXD_602
3 Block Diagrams & Truth Tables
3.1 IXDI602
3.3 IXDN602
VCC
VCC
OUTA
INA
OUTA
INA
GND
GND
VCC
VCC
OUTB
INB
OUTB
INB
IN
OUT
IN
OUT
X
X
X
X
0
1
0
1
1
0
0
1
3.2 IXDF602
VCC
OUTA
INA
GND
VCC
OUTB
INB
INA
OUTA
0
1
1
0
INB
0
OUTB
0
1
1
6
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R02
IXD_602
4 Typical Performance Characteristics
Rise & Fall Time vs.Temperature
Rise Time vs. Supply Voltage
(VIN=0-5V, f=10kHz,TA=25ºC)
Fall Time vs. Supply Voltage
(VIN=0-5V, f=10kHz,TA=25ºC)
(VIN=0-5V, VCC=18V, CL=1nF)
12
11
10
9
120
100
80
60
40
20
0
120
100
80
60
40
20
0
t
r
CL=4.7nF
CL=1nF
CL=470pF
CL=4.7nF
CL=1nF
CL=470pF
8
t
f
7
6
5
4
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Temperature (ºC)
Supply Voltage (V)
Supply Voltage (V)
Fall Time vs. Load Capacitance
Rise Time vs. Load Capacitance
120
120
VCC=4.5V
VCC=8V
VCC=4.5V
VCC=8V
100
80
60
40
20
0
100
80
60
40
20
0
VCC=12V
VCC=18V
VCC=12V
VCC=18V
V
V
V
CC=25V
CC=30V
CC=35V
V
V
V
CC=25V
CC=30V
CC=35V
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
Load Capacitance (pF)
Load Capacitance (pF)
Propagation Delay vs.Temperature
Propagation Delay vs. Supply Voltage
Propagation Delay vs. Input Voltage
(VCC=18V, CL=1nF)
(VIN=0-5V, CL=1nF, f=1kHz)
(VCC=18V, CL=1nF)
55
50
45
40
35
30
25
20
200
150
100
50
70
60
50
40
30
20
toffdly
tondly
t
offdly
t
offdly
t
ondly
t
ondly
0
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
40
0
5
10
15
20
Temperature (ºC)
Supply Voltage (V)
Input Voltage (V)
Input Threshold vs.Temperature
(VCC=18V, CL=1nF)
Input Threshold vs. Supply Voltage
3.5
3.0
2.5
2.0
1.5
1.0
2.8
2.6
2.4
2.2
2.0
1.8
Min VIH
Max VIL
Min VIH
Max VIL
0
5
10
15
20
25
30
35
40
-40 -20
0
20 40 60 80 100 120 140
Supply Voltage (V)
Temperature (ºC)
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IXD_602
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=18V)
300
250
200
150
100
50
200
150
100
50
200
150
100
50
f=2MHz
f=1MHz
f=2MHz
f=1MHz
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
0
100
0
100
0
100
1000
10000
1000
10000
1000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Load Capacitance (pF)
Supply Current vs. Frequency
Both Outputs Active
(VCC=12V)
Supply Current vs. Frequency
Both Outputs Active
(VCC=8V)
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
1000
100
10
1000
100
10
400
350
300
250
200
150
100
50
CL=4.7nF
CL=1nF
CL=470pF
CL=4.7nF
CL=1nF
CL=470pF
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
1
1
0.1
0.01
0.1
0.01
0
100
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
1000
10000
Frequency (kHz)
Frequency (kHz)
Load Capacitance (pF)
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
Quiescent Supply Current
vs.Temperature
(VCC=18V)
Supply Current vs. Frequency
Both Outputs Active
(VCC=35V)
1000
100
10
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
10
CL=4.7nF
CL=1nF
CL=470pF
CL=4.7nF
CL=1nF
CL=470pF
VIN=3.5V
VIN=5V
VIN=10V
1
1
0.1
0.01
0.1
0.01
VIN=0V & 18V
0.1
1
10
100
1000
10000
-40 -20
0
20 40 60 80 100 120 140
0.1
1
10
100
1000
10000
Frequency (kHz)
Temperature (ºC)
Frequency (kHz)
Output Source Current
vs. Supply Voltage
(CL=27nF)
Output Sink Current
vs. Supply Voltage
(CL=27nF)
Dynamic Supply Current
vs.Temperature
(VIN=0-5V, VCC=18V, CL=1nF, f=1kHz)
-8
-7
-6
-5
-4
-3
-2
-1
0
8
7
6
5
4
3
2
1
0
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
-40 -20
0
20 40 60 80 100 120 140
Supply Voltage (V)
Supply Voltage (V)
Temperature (ºC)
8
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R02
IXD_602
Output Source Current
vs.Temperature
(VCC=18V, CL=27nF)
Output Sink Current vs.Temperature
(VCC=18V, CL=27nF)
-5.0
-4.5
-4.0
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
-40 -20
0
20 40 60 80 100 120 140
-40 -20
0
20 40 60 80 100 120 140
Temperature (ºC)
Temperature (ºC)
Low State Output Resistance
vs. Supply Voltage
High-State Output Resistance
vs. Supply Voltage
(IOUT= +10mA)
(IOUT= -10mA)
10
8
10
8
6
6
4
4
2
2
0
0
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Supply Voltage (V)
Supply Voltage (V)
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IXD_602
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IXD_602SI / IXD_602SIA / IXD_602PI
IXD_602D2
MSL 1
MSL 3
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
IXD_602SI / IXD_602SIA / IXD_602D2
IXD_602PI
260°C for 30 seconds
250°C for 30 seconds
RoHS
2002/95/EC
Pb
e3
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IXD_602
5.4 Mechanical Dimensions
5.4.1 SIA (8-Pin SOIC)
0.10 / 0.25
(0.004 / 0.010)
1.27
(0.050)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.213)
5.80 / 6.20
(0.228 / 0.244)
1.55
(0.061)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
(0.024)
0º / 8º
Recommended PCB Land Pattern
4.80 / 5.00
(0.190 / 0.197)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.10 / 0.25
(0.004 / 0.010)
1.30 / 1.75
(0.051 / 0.069)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation AA.
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
0.10 / 0.25
(0.004 / 0.010)
1.55
(0.061)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
5.80 / 6.20
(0.228 / 0.244)
5.40
(0.209) (0.108)
2.75
(0.150 / 0.157)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
(0.024)
1.27
(0.050)
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
0º / 8º
4.80 / 5.00
(0.190 / 0.197)
Recommended PCB Land Pattern
0.03 / 0.10
(0.001 / 0.004)
1.30 / 1.75
(0.051 / 0.069)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTES:
2.29 / 2.79
1. Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
(0.090 / 0.110)
2. The exposed metal pad on the back of the SI package may be
left floating or connected to GND. It is not suitable for carrying
current.
3.30 / 3.81
(0.130 / 0.150)
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IXD_602
5.4.3 Tape & Reel Information for SI and SIA Packages
∅1.55 0.05
330.2 DIA.
4.00 0.10 See Note #2
(13.00 DIA.)
0.30 0.05
R0.50 TYP
1.75 0.10
2.00 0.10
B
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
5.50 0.10
(3.40)
B0=5.20 0.10
12.00 0.30
A
A
Embossed Carrier
1.80 0.10
K0=2.30 0.10
∅1.50 (MIN)
B
8.00 0.10
SECTION B-B
A0=6.40 0.10
Embossment
(4.70)
(1.20)
(70º)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
SECTION A-A
4. Unless otherwise specified, all dimensions in millimeters.
5.4.4 PI (8-Pin DIP)
8-0.900 DIA.
(8-0.035 DIA.)
2.540
(0.100)
9.02 / 10.16
(0.355 / 0.400)
0.20 / 0.38
(0.008 / 0.015)
7.50
(0.295)
1.40
(0.055)
6.10 / 6.86
(0.240 / 0.270)
7.62 BSC
(0.300 BSC)
2.540 BSC
(0.100 BSC)
7.37 / 8.26
(0.290 / 0.325)
7.62 / 10.92
(0.300 / 0.430)
PC Board Pattern
3.05 / 3.81
(0.120 / 0.150)
3.43 / 4.70
(0.135 / 0.185)
0.38 / 1.02
(0.015 / 0.040)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.14 / 1.65
3.18 / 3.81
(0.125 / 0.150)
(0.045 / 0.065)
0.38 / 0.58
(0.015 / 0.023)
NOTE: Molded package conforms to JEDEC standard configuration
MS-001 variation BA.
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IXD_602
5.4.5 D2 (8-Pin DFN)
5.00 BSC
(0.197 BSC)
0.35 x 45º
(0.014 x 45º)
0.80 / 1.00
(0.031 / 0.039)
0.20 REF
(0.008 REF)
0.95
(0.037)
4.50
(0.177)
Pin 1
4.00 BSC
(0.158 BSC)
3.05
(0.120)
0.45
(0.018)
0.00 / 0.05
(0.000 / 0.002)
2.55
(0.100)
1.20
(0.047)
0.76 / 0.81
(0.030 / 0.032)
Recommended PCB Land Pattern
3.04 / 3.09
(0.120 / 0.122)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.30 / 0.45
(0.012 / 0.018)
0.95 BSC
(0.037 BSC)
Pin 1
Pin 8
2.54 / 2.59
(0.100 / 0.102)
NOTE:
0.35 / 0.45 x 45º
(0.014 / 0.018 x 45º)
The exposed metal pad on the back of the D2 package may be
left floating or connected to ground. It is not suitable for carrying current.
5.4.6 Tape & Reel Information for D2 Package
∅1.55 0.05
330.2 DIA.
(13.00 DIA.)
4.00 0.10 See Note #2
2.00 0.05
1.75 0.10
R0.75 TYP
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
(0.05)
5º MAX
5.50 0.05
(0.05)
B0=5.40 0.10
12.00 0.30
Embossed Carrier
K0=1.90 0.10
∅1.50 (MIN)
8.00 0.10
NOTES:
5º MAX
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
A0=4.25 0.10
Embossment
4. Unless otherwise specified, all dimensions in millimeters.
0.30 0.05
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_602-R02
©Copyright 2011, Clare, Inc.
All rights reserved. Printed in USA.
2/3/2011
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