CEFB104 [COMCHIP]

SMD Efficient Fast Recovery Rectifier; SMD高效快速恢复整流器
CEFB104
型号: CEFB104
厂家: COMCHIP TECHNOLOGY    COMCHIP TECHNOLOGY
描述:

SMD Efficient Fast Recovery Rectifier
SMD高效快速恢复整流器

文件: 总2页 (文件大小:71K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSMMDD EEffffiicciieenntt FFaasstt RReeccoovveerryy RReeccttiiffiieerr  
CCOOMMCCHHIIPP  
www.comchip.com.tw  
CEFB101 Thru CEFB105  
Reverse Voltage: 50 - 600 Volts  
Forward Current: 1.0 Amp  
Features  
Ideal for surface mount applications  
Easy pick and place  
SMB/DO-214AA  
Plastic package has Underwriters Lab.  
flammability classification 94V-0  
0.083(2.11)  
0.075(1.91)  
0.155(3.94)  
0.130(3.30)  
Super fast recovery time for high efficient  
Built-in strain relief  
Low forward voltage drop  
0.185(4.70)  
0.160(4.06)  
0.012(0.31)  
0.006(0.15)  
Mechanical Data  
0.096(2.44)  
0.083(2.13)  
Case: JEDEC DO-214AA molded plastic  
0.008(0.20)  
0.203(0.10)  
0.050(1.27)  
0.030(0.76)  
Terminals: solderable per MIL-STD-750,  
method 2026  
0.220(5.59)  
0.200(5.08)  
Polarity: Color band denotes cathode  
end  
Dimensions in inches and (millimeter)  
Mounting position: Any  
Approx. Weight:0.093 gram  
Maximum Ratings and Electrical Characterics  
CEFB  
101  
CEFB  
102  
CEFB  
103  
CEFB  
104  
CEFB  
105  
Unit  
Symbol  
VRRM  
VDC  
Parameter  
600  
600  
420  
50  
50  
35  
200  
200  
140  
400  
400  
280  
100  
100  
70  
Max. Repetitive PeakReverse Voltage  
Max. DC BlockingVoltage  
Max. RMS Voltage  
V
V
V
VRMS  
Peak Surge ForwardCurrent  
8.3ms single halfsine-wave  
superimposed on rateload  
( JEDEC method)  
IFSM  
A
30  
I o  
1.0  
Max. Average Forward Current  
A
Max. Instantaneous ForwardCurrent  
at 1.0 A  
0.875  
1.1  
1.25  
V F  
V
Trr  
Reverse recovery time  
25  
35  
50  
nS  
Max. DC ReverseCurrent at RatedDC  
I R  
5.0  
Blocking Voltage  
Ta=25 C  
Ta=100C  
uA  
250  
13  
R
JL  
Max. Thermal Resistance(Note 1)  
Operating Junction Temperature  
Storage Temperature  
C/W  
- 5 5 t o + 1 5 0  
T j  
C
- 5 5 t o + 1 5 0  
TSTG  
C
Note 1: Thermal resistance from junction to lead P.C.B. Mounted on 8.0x8.0 mm copper pad areas.  
Page 1  
MDS0208004C  
SSMMDD EEffffiicciieenntt FFaasstt RReeccoovveerryy RReeccttiiffiieerr  
CCOOMMCCHHIIPP  
www.comchip.com.tw  
Rating and Characteristic Curves (CEFB101 Thru CEFB105)  
Fig. 1 - Reverse Characteristics  
Fig.2 - Forward Characteristics  
100  
10  
CEFB101-103  
Tj=125 C  
CEFB104  
10  
1.0  
Tj=75 C  
1.0  
0.1  
CEFB105  
Tj=25 C  
0.01  
0.1  
Tj=25 C  
Pulse width 300uS  
4% duty cycle  
0. 01  
0
0.001  
15 30 45 60 75 90 105 120 135 150  
0
0.2  
0.4  
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
Forward Voltage (V)  
Percent of RatedPeak Reverse Voltage (%)  
Fig. 3 - Junction Capacitance  
Fig. 4 - Non Repetitive Forward  
Surge Current  
35  
30  
25  
20  
15  
10  
5
50  
8.3mS Single HalfSine  
Wave JEDEC methode  
f=1MHz and applied  
4VDC reverse voltage  
40  
Tj=25 C  
30  
CEFB101-103  
Tj=25 C  
20  
CEFB104-105  
10  
0
0
0.01  
0.1  
1.0  
10  
100  
1
5
10  
50  
1 00  
Reverse Voltage (V)  
Number of Cyclesat 60Hz  
Fig. 5 - Test Circuit Dai gram and Reverse Recovery Time Characteristics  
Fig. 6 - Current Derating Curve  
2.8  
trr  
50  
W
10W  
NONINDUCTIVE  
2.4  
2.0  
1.6  
1.2  
NONINDUCTIVE  
|
|
|
|
|
|
|
|
+0.5A  
(
)
(+)  
0
D.U.T.  
25Vdc  
PULSE  
GENERATOR  
(NOTE 2)  
(approx.)  
-0.25A  
(
)
(+)  
Single Phase  
0.8  
1W  
OSCILLISCOPE  
(NOTE 1)  
NON-  
Half Wave 60Hz  
INDUCTIVE  
0.4  
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.  
2. Rise Time= 10ns max., Source Impedance= 50 ohms.  
-1.0A  
0
0
25  
50  
75  
100 125 150 175  
1cm  
Ambient Temperature ( C)  
SET TIME BASE FOR  
50 / 10ns / cm  
Page 2  
MDS0208004C  

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