CGHV1F025S [CREE]

25 W, DC - 15 GHz, 40V, GaN HEMT;
CGHV1F025S
型号: CGHV1F025S
厂家: CREE, INC    CREE, INC
描述:

25 W, DC - 15 GHz, 40V, GaN HEMT

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CGHV1F025S  
25 W, DC - 15 GHz, 40V, GaN HEMT  
Cree’s CGHV1F025S is an unmatched, gallium nitride (GaN) high electr
mobility transistor (HEMT) designed specifically for high efficiency, high ga
and wide bandwidth capabilities. The device can be deployed for L, S, C, X an
Ku-Band amplifier applications. The datasheet specifications are based on
X-Band (8.9 - 9.6 GHz) amplifier. The CGHV1F025S operates on a 40 volt rai
circuit while housed in a 3mm x 4mm, surface mount, dual-flat-no-lead (DFN)  
package. Under reduced power, the transistor can operate below 40V to as low  
as 20V VDD, maintaining high gain and efficiency.  
Typical Performance 8.9 - 9.6 GHz (TC = 25˚C) , 40 V  
Parameter  
8.9 GHz  
9.2 GHz  
9.4 GHz  
9.6 GHz  
Units  
Output Power @ PIN = 37 dBm  
24  
29  
27  
25  
W
Drain Efficiency @ PIN = 37 dBm  
43.5  
48.5  
11.6  
48  
46  
%
Gain @ PIN = 0 dBm  
10.7  
11.3  
11.1  
dB  
Note:  
Measured in the CGHV1F025S-TB1 application circuit. Pulsed 100 µs 10% duty.  
Features  
•ꢀ Up to 15 GHz Operation  
•ꢀ 25 W Typical Output Power  
•ꢀ 11 dB Gain at 9.4 GHz  
•ꢀ Application circuit for 8.9 - 9.6 GHz  
Subject to change without notice.  
www.cree.com/rf  
1
Absolute Maximum Ratings (not simultaneous) at 25˚C Case Temperature  
Parameter  
Symbol  
VDSS  
VGS  
Rating  
100  
Units  
Volts  
Volts  
˚C  
Notes  
25˚C  
25˚C  
Drain-Source Voltage  
Gate-to-Source Voltage  
-10, +2  
-65, +150  
225  
Storage Temperature  
TSTG  
TJ  
Operating Junction Temperature  
Maximum Forward Gate Current  
Maximum Drain Current1  
Soldering Temperature2  
˚C  
IGMAX  
IDMAX  
TS  
4.8  
mA  
25˚C  
25˚C  
2
A
245  
˚C  
Case Operating Temperature3,4  
Thermal Resistance, Junction to Case5  
TC  
-40, +150  
3.4  
˚C  
RθJC  
˚C/W  
85˚C  
Note:  
1
Current limit for long term, reliable operation  
2
3
Refer to the Application Note on soldering at www.cree.com/rf/document-library  
Simulated at PDISS = 2.4 W  
4 TC = Case temperature for the device. It refers to the temperature at the ground tab underneath the package. The PCB will add  
additional thermal resistance.  
5 Pulsed (100 µs, 10% Duty). Rth for Cree’s reference design using a 10 mil Rogers 5880 PCB with 31 (Ø13 mil) Vias would be 3.6 °C/W.  
For CW operation, the Rth numbers increase to 5°C/W for just the device, and 7.3 °C/W including the board.  
Electrical Characteristics (TC = 25˚C) - 40 V Typical  
Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Units  
Conditions  
DC Characteristics1  
Gate Threshold Voltage  
VGS(th)  
VGS(Q)  
IDS  
-3.8  
-3.0  
-2.7  
-4.3  
-2.3  
VDC  
VDC  
A
VDS = 10 V, ID = 4.8 mA  
VDS = 40 V, ID = 240 mA  
VDS = 6.0 V, VGS = 2.0 V  
VGS = -8 V, ID = 4.8 mA  
Gate Quiescent Voltage  
Saturated Drain Current2  
Drain-Source Breakdown Voltage  
3.8  
100  
V(BR)DSS  
VDC  
RF Characteristics3 (TC = 25˚C, F0 = 6.0 GHz unless otherwise noted)  
Gain  
G
POUT  
η
16  
29  
55  
-
-
dB  
W
VDD = 40 V, IDQ = 150 mA, PIN = 0 dBm  
VDD = 40 V, IDQ = 150 mA, PIN = 34 dBm  
VDD = 40 V, IDQ = 150 mA, PIN = 34 dBm  
Output Power4  
Drain Efficiency4  
%
No damage at all phase angles,  
VDD = 40 V, IDQ = 150 mA, POUT = 29 W  
Output Mismatch Stress4  
VSWR  
-
10 : 1  
-
Y
Dynamic Characteristics  
Input Capacitance5  
CGS  
CDS  
CGD  
5.9  
2
pF  
pF  
pF  
VDS = 40 V, Vgs = -8 V, f = 1 MHz  
VDS = 40 V, Vgs = -8 V, f = 1 MHz  
VDS = 40 V, Vgs = -8 V, f = 1 MHz  
Output Capacitance5  
Feedback Capacitance  
Notes:  
Measured on wafer prior to packaging  
Scaled from PCM data  
0.21  
1
2
3
Measured in CGHV1F025S-TB  
4
Pulsed 100 µs, 10% duty cycle  
5 Includes package  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
www.cree.com/rf  
2
CGHV1F025S Rev 0.2 - Preliminary  
Electrical Characteristics When Tested in CGHV1F025S-TB1  
Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Units  
Conditions  
RF Characteristics1 (TC = 25˚C, F0 = 8.9 - 9.6 GHz unless otherwise noted)  
Gain  
G
POUT  
η
11.6  
29  
-
-
dB  
W
%
Y
VDD = 40 V, IDQ = 150 mA, PIN = 0 dBm  
VDD = 40 V, IDQ = 150 mA, PIN = 37 dBm  
VDD = 40 V, IDQ = 150 mA, PIN = 37 dBm  
VDS = 40 V, Vgs = -8 V, POUT = 25 W  
Output Power2  
Drain Efficiency2  
Output Mismatch Stress2  
48.5  
10 : 1  
VSWR  
Notes:  
1
Measured in CGHV1F025S-TB1 Application Circuit  
Pulsed 100 µs, 10% duty cycle  
2
Typical Performance - CGHV1F025S-TB1  
Figure 1. - Typical Small Signal Response of CGHV1F025S-TB1 Application Circuit  
VDD = 40 V, IDQ = 150 mA  
16  
14  
12  
10  
8
6
4
2
0
-2  
-4  
-6  
-8  
-10  
-12  
S21  
-14  
S11  
-16  
S22  
-18  
-20  
8.2  
8.4  
8.6  
8.8  
9.0  
9.2  
9.4  
9.6  
9.8  
10.0  
10.2  
10.4  
10.6  
Frequency (GHz)  
Cree, Inc.  
4600 Silicon Drive  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
www.cree.com/rf  
3
CGHV1F025S Rev 0.2 - Preliminary  
Typical Performance in Application Circuit CGHV1F025S-TB1  
Figure 2. - Typical Large Signal Response  
VDD = 40 V, IDQ = 150 mA, PIN = 37 dBm  
Tcase = 25°C, Pulse Width = 100 μs, Duty Cycle = 10 %  
50  
20  
Drain Efficiency  
Output Power  
Power Gain  
Figure 3. - GMAX and K-Factor vs Frequency  
VDD = 40 V, IDQ = 150 mA, Tcase = 25°C  
40  
35  
30  
25  
20  
15  
10  
5
3.5  
Gmax  
3
K-Factor  
2.5  
2
1.5  
1
0.5  
0
0
2
4
6
8
10  
12  
14  
16  
Frequency (GHz)  
Cree, Inc.  
4600 Silicon Drive  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
www.cree.com/rf  
4
CGHV1F025S Rev 0.2 - Preliminary  
CGHV1F025S-TB1 Application Circuit  
Bill of Materials  
CGHV1F025S-TB1 Application Circuit  
Designator  
Description  
Qty  
R1  
R2  
RES, 100, OHM, +1/-1%, 1/16 W, 0603  
RES, 10, OHM, +1/-1%, 1/16 W, 0603  
CAP, 1pF, ±0.1 pF, 0603, ATC  
CAP, 1.8pF, ±0.1 pF, 0603, ATC  
CAP, 0.6pF, ±0.1 pF, 0603, ATC  
CAP, 10 pF, ±5%, 0603, ATC  
1
1
2
2
2
1
2
2
1
1
1
2
1
1
1
1
C1, C2  
C3, C4  
C9, C10  
C5, C11  
C6, C12  
C7, C13  
C14  
CAP, 470 pF, 5%, 100 V, 0603, X  
CAP, 33000 pF, 0805, 100V, X7R  
CAP, 1.0 UF, 100V, 10%, X7R, 1210  
CAP, 10 UF, 16V TANTALUM  
C8  
C15  
CAP, 33UF, 20%, G CASE  
J1, J2  
J3  
CONN, SMA, PANEL MOUNT JACK, FLANGE  
HEADER RT>PLZ .1CEN LK 5POS  
QFN TRANSISTOR CGHV1F025S  
CABLE, 18 AWG, 4.2  
Q1  
W1  
Rogers 5880 PCB 10 mils  
Electrostatic Discharge (ESD) Classifications  
Parameter  
Symbol  
HBM  
Class  
Test Methodology  
JEDEC JESD22 A114-D  
JEDEC JESD22 C101-C  
Human Body Model  
Charge Device Model  
1A (> 250 V)  
CDM  
2 (125 V to 250 V)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
www.cree.com/rf  
5
CGHV1F025S Rev 0.2 - Preliminary  
CGHV1F025S-TB1 Application Circuit Schematic  
CGHV1F025S-TB1 Application Circuit Outline  
Cree, Inc.  
4600 Silicon Drive  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
www.cree.com/rf  
6
CGHV1F025S Rev 0.2 - Preliminary  
Product Dimensions CGHV1F025S (Package 3 x 4 DFN)  
Pin  
Input/Output  
1
2
GND  
RF IN  
RF IN  
RF IN  
RF IN  
GND  
3
4
5
6
7
GND  
8
RF OUT  
RF OUT  
RF OUT  
RF OUT  
GND  
9
10  
11  
12  
Cree, Inc.  
4600 Silicon Drive  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
www.cree.com/rf  
7
CGHV1F025S Rev 0.2 - Preliminary  
Part Number System  
CGHV1F025S  
Package  
Power Output (W)  
Upper Frequency (GHz)  
Cree GaN High Voltage  
Parameter  
Value  
Units  
Upper Frequency1  
15.0  
25  
GHz  
Power Output  
W
Surface  
Mount  
Package  
-
Table 1.  
Note1: Alpha characters used in frequency  
code indicate a value greater than 9.9 GHz.  
See Table 2 for value.  
Character Code  
Code Value  
A
B
C
D
E
F
0
1
2
3
4
5
6
7
8
9
G
H
J
K
1A = 10.0 GHz  
2H = 27.0 GHz  
Examples:  
Table 2.  
Cree, Inc.  
4600 Silicon Drive  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
www.cree.com/rf  
8
CGHV1F025S Rev 0.2 - Preliminary  
Disclaimer  
Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet  
to be accurate and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other  
rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent  
or patent rights of Cree. Cree makes no warranty, representation or guarantee regarding the suitability of its products  
for any particular purpose. “Typical” parameters are the average values expected by Cree in large quantities and are  
provided for information purposes only. These values can and do vary in different applications and actual performance  
can vary over time. All operating parameters should be validated by customer’s technical experts for each application.  
Cree products are not designed, intended or authorized for use as components in applications intended for surgical  
implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result  
in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear  
facility.  
For more information, please contact:  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
www.cree.com/rf  
Sarah Miller  
Marketing  
Cree, RF Components  
1.919.407.5302  
Ryan Baker  
Marketing  
Cree, RF Components  
1.919.407.7816  
Tom Dekker  
Sales Director  
Cree, RF Components  
1.919.313.5639  
Cree, Inc.  
4600 Silicon Drive  
Copyright © 2014 - 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks of Cree, Inc.  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
www.cree.com/rf  
9
CGHV1F025S Rev 0.2 - Preliminary  

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