CLD-DS45 [CREE]
Cree? XLamp? XB-D White LEDs; 克里？的XLamp ？ XB -D白光LED
| 型号： | CLD-DS45 |
| 厂家： | 
CREE, INC |
| 描述： | Cree? XLamp? XB-D White LEDs |
| 文件： | 总12页 (文件大小：899K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product family data sheet
cꢀꢁꢁ® Xlꢂꢃp® XB-d Wꢄꢅꢆꢁ ledꢇ
Product descriPtioN
features
taBle of coNteNts
The XLamp XB-D is Cree’s newest
lighting class LꢀD, bringing the
next generation of performance and
price to LꢀD lighting applications.
The XLamp XB-D delivers similar
performance to the XP-G LꢀD in a
package that is 48% smaller than
the XLamp XP footprint.
•ꢀ Cree’s smallest lighting class
LꢀD: 2.45 X 2.45 mm
Flux Characteristics...................2
Characteristics .........................3
Relative Spectral Power
•ꢀ Up to 136 lm/W in cool white
(@ 85 °C, 350 mA)
Distribution..............................3
•ꢀ Available in white, 80-min CRI
white, and 70-min CRI cool
white
RelativeꢀFluxꢀvs.ꢀJunctionꢀ
Temperature (IF = 350 mA)........4
ꢀlectrical Characteristics............4
Thermal Design........................5
Relative Flux vs. Current ...........5
Relative Chromaticity vs.
•ꢀ 1 A maximum drive current
•ꢀ Low thermal resistance:
6.5 °C/W
Using Cree’s newest generation of
silicon carbide-based LꢀD chips,
XB-D is optimized to dramatically
lower system cost in any illumination
application.
•ꢀ Wide viewing angle: 115°
•ꢀ Reflowꢀsolderableꢀ-ꢀJEDECꢀ
J-STD-020Cꢀcompatible
•ꢀ Unlimitedꢀfloorꢀlifeꢀatꢀ
≤ꢀ30ꢀ°C/85%ꢀRH
Temperature and Current...........6
Typical Spatial Distribution.........7
ReflowꢀSolderingꢀCharacteristics .8
Notes......................................9
ꢃechanical Dimensions............ 10
Tape and Reel ........................ 11
Packaging.............................. 12
•ꢀ ꢀlectrically neutral thermal path
•ꢀ RoHS-ꢀandꢀREACH-compliant
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree
logo and XLamp are registered trademarks of Cree, Inc.
USA Tel: +1.919.313.5300
xlamp xB-D white leDs
fluX characteristics (tJ = 85 °c) - White
The following table provides several base order codes for XLamp XB-D LꢀDs. It is important to note that the base order
codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as
a complete description of the order-code nomenclature, please consult the XLamp XB-D Binning and Labeling document.
Bꢂꢇꢁ oꢀꢊꢁꢀ cꢈꢊꢁꢇ
mꢅn. lꢋꢃꢅnꢈꢋꢇ fꢉꢋx
@ 350 ꢃa (ꢉꢃ)
cꢂꢉꢌꢋꢉꢂꢆꢁꢊ mꢅnꢅꢃꢋꢃ
lꢋꢃꢅnꢈꢋꢇ fꢉꢋx (ꢉꢃ)*
cct rꢂngꢁ
cꢈꢉꢈꢀ
oꢀꢊꢁꢀ cꢈꢊꢁ
mꢅn.
mꢂx.
Gꢀꢈꢋp
R4
fꢉꢋx (ꢉꢃ)
130
700 ꢃa
227
213
199
199
187
172
172
164
153
172
164
153
1000 ꢃa
287
XBDAWT-00-0000-000000G51
XBDAWT-00-0000-000000F51
XBDAWT-00-0000-000000ꢀ51
XBDAWT-00-0000-00000Lꢀꢀ4
XBDAWT-00-0000-00000LDꢀ4
XBDAWT-00-0000-00000LCꢀ4
XBDAWT-00-0000-00000HCE7
XBDAWT-00-0000-00000HBE7
XBDAWT-00-0000-00000HAE7
XBDAWT-00-0000-00000LCꢀ7
XBDAWT-00-0000-00000LBꢀ7
XBDAWT-00-0000-00000LAꢀ7
Cool White
5,000 K
3,700 K
2,600 K
2,600 K
8,300 K
R3
122
270
R2
114
252
R2
114
252
Neutral White
5,000 K
4,300 K
3,700 K
Q5
Q4
Q4
Q3
Q2
Q4
Q3
Q2
107
236
100
222
100
222
80 CRI
ꢃinimum White
93.9
87.4
100
207
193
222
Warm White
93.9
87.4
207
193
Notes:
•ꢀ Creeꢀmaintainsꢀaꢀtoleranceꢀofꢀ±7%ꢀonꢀfluxꢀandꢀpowerꢀmeasurementsꢀandꢀ±2ꢀonꢀCRIꢀmeasurements.
•ꢀ Typical CRI for Neutral White, 3700 K - 5000K CCT is 75.
•ꢀ Typical CRI for Warm White, 2600 K - 3700 K CCT is 80.
•ꢀ ꢃinimum CRI for 80 CRI ꢃinimum White is 80.
*ꢀꢀCalculatedꢀfluxꢀvaluesꢀareꢀforꢀreferenceꢀonly
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
2
xlamp xB-D white leDs
characteristics
cꢄꢂꢀꢂꢌꢆꢁꢀꢅꢇꢆꢅꢌꢇ
unꢅꢆ
mꢅnꢅꢃꢋꢃ
tꢍpꢅꢌꢂꢉ
mꢂxꢅꢃꢋꢃ
Thermal resistance, junction to solder point - white
Viewingꢀangleꢀ(FWHM)ꢀ-ꢀwhite
°C/W
degrees
mꢁ/°C
6.5
115
Temperatureꢀcoefficientꢀofꢀvoltageꢀ-ꢀwhite
ESDꢀclassificationꢀ(HBMꢀperꢀMil-Std-883D)
DC forward current - white
-2.5
Class 2
mA
ꢁ
1000
-5
Reverse voltage
Forward voltage (@ 350 mA, 85 °C) - white
LꢀD junction temperature
ꢁ
2.9
3.5
150
°C
relative sPectral PoWer distriButioN
100
80
60
40
20
0
5000K - 8300K CCT
2600K - 3700K CCT
400
450
500
550
600
650
700
750
Wavelength (nm)
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
3
xlamp xB-D white leDs
relative fluX vs. JuNctioN temPerature (if = 350 ma)
120%
100%
80%
60%
40%
20%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
electrical characteristics (tJ = 85 °c)
1200
1000
800
600
400
200
0
2.70
2.80
2.90
3.00
3.10
3.20
3.30
Forward Voltage (V)
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
4
xlamp xB-D white leDs
thermal desiGN
The maximum forward current is determined by the thermal resistance between the LꢀD junction and ambient. It is
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optomize lamp life and optical characteristics.
1200
1000
800
600
Rj-a = 10°C/W
Rj-a = 15°C/W
Rj-a = 20°C/W
400
Rj-a = 25°C/W
200
0
0
20
40
60
80
100
120
140
Ambient Temperature (ºC)
relative fluX vs. curreNt (tJ = 85 °c)
250%
200%
150%
100%
50%
0%
0
200
400
600
800
1000
Forward Current (mA)
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
5
xlamp xB-D white leDs
relative chromaticity vs. curreNt aNd temPerature (Warm White)
0.020
0.015
0.010
0.005
0.000
-0.005
-0.010
-0.015
-0.020
T = 85 °C
J
ΔCCx
ΔCCy
0
100
200
300
400
500
Current (mA)
600
700
800
900
1000
0.020
0.015
0.010
0.005
0.000
-0.005
-0.010
-0.015
-0.020
I = 350 mA
F
ΔCCx
ΔCCy
0
20
40
60
80
100
120
140
160
Tsp (°C)
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
6
xlamp xB-D white leDs
tyPical sPatial distriButioN
120
100
80
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
Angle (º)
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
7
xlamp xB-D white leDs
refloW solderiNG characteristics
Inꢀtesting,ꢀCreeꢀhasꢀfoundꢀXLampꢀXB-DꢀLEDsꢀtoꢀbeꢀcompatibleꢀwithꢀJEDECꢀJ-STD-020C,ꢀusingꢀtheꢀparametersꢀlistedꢀ
below.ꢀAsꢀaꢀgeneralꢀguideline,ꢀCreeꢀrecommendsꢀthatꢀusersꢀfollowꢀtheꢀrecommendedꢀsolderingꢀprofileꢀprovidedꢀbyꢀtheꢀ
manufacturer of solder paste used.
NoteꢀthatꢀthisꢀgeneralꢀguidelineꢀmayꢀnotꢀapplyꢀtoꢀallꢀPCBꢀdesignsꢀandꢀconfigurationsꢀofꢀreflowꢀsolderingꢀequipment.
tP
Critical Zone
TP
TL to TP
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
Time
Profile Feature
lꢁꢂꢊ-Bꢂꢇꢁꢊ sꢈꢉꢊꢁꢀ
lꢁꢂꢊ-fꢀꢁꢁ sꢈꢉꢊꢁꢀ
Average Ramp-Up Rate (Tsmax to Tp)
3 °C/second max.
100 °C
3 °C/second max.
150 °C
Preheat: Temperature ꢃin (Tsmin
Preheat: Temperature ꢃax (Tsmax
Preheat: Time (tsmin to tsmax
)
)
150 °C
60-120 seconds
183 °C
200 °C
60-180 seconds
217 °C
)
Time ꢃaintained Above: Temperature (TL)
Time ꢃaintained Above: Time (tL)
60-150 seconds
60-150 seconds
Peak/ClassificationꢀTemperatureꢀ(Tp)
215 °C
260 °C
Time Within 5 °C of Actual Peak Temperature (tp)
Ramp-Down Rate
10-30 seconds
6 °C/second max.
6 minutes max.
20-40 seconds
6 °C/second max.
8 minutes max.
Time 25 °C to Peak Temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
8
xlamp xB-D white leDs
Notes
Lumen ꢃaintenance Projections
Please read the XLamp Long-Term Lumen ꢃaintenance application note for more details on Cree’s lumen maintenance
testing and forecasting. Please read the XLamp Thermal ꢃanagement application note for details on how thermal design,
ambient temperature, and drive current affect the LꢀD junction temperature.
ꢃoisture Sensitivity
Inꢀtesting,ꢀCreeꢀhasꢀfoundꢀXLampꢀXB-DꢀLEDsꢀtoꢀhaveꢀunlimitedꢀfloorꢀlifeꢀinꢀconditionsꢀ≤30ꢀºC/85%ꢀrelativeꢀhumidityꢀ
(RH).ꢀMoistureꢀtestingꢀincludedꢀaꢀ168-hourꢀsoakꢀatꢀ85ꢀºC/85%ꢀRHꢀfollowedꢀbyꢀ3ꢀreflowꢀcycles,ꢀwithꢀvisualꢀandꢀelectricalꢀ
inspections at each stage.
Cree recommends keeping XLamp LꢀDs in their sealed moisture-barrier packaging until immediately prior to use. Cree
also recommends returning any unused LꢀDs to the resealable moisture-barrier bag and closing the bag immediately
after use.
RoHSꢀCompliance
The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (PꢂP), or
otherwise restricted materials in this product are below the maximum concentration values (also referred to as the
threshold limits) permitted for such substances, or are used in an exempted application, in accordance with ꢀU Directive
2002/95/ECꢀonꢀtheꢀrestrictionꢀofꢀtheꢀuseꢀofꢀcertainꢀhazardousꢀsubstancesꢀinꢀelectricalꢀandꢀelectronicꢀequipmentꢀ(RoHS),ꢀ
as amended through April 21, 2006.
ꢁision Advisory Claim
WARNING: Do not look at exposed lamp in operation. ꢀye injury can result. See LꢀD ꢀye Safety at www.cree.com/
products/pdf/XLamp_ꢀyeSafety.pdf.
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
9
xlamp xB-D white leDs
mechaNical dimeNsioNs
All measurements are ±.13 mm unless otherwise indicated.
1.84
2.45
1.633
0.355
0.76
0.817
2.45
2.285
R1.086
0.462
0.923
0.65
0.852
0.36
0.426
0.82
0.46
0.426
0.284
2.272
0.36
2.34
1.136
0.284
0.284
0.28
0.36
0.92
2.34
2.272
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
RECOMMENDED PCB SOLDER PAD
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
10
xlamp xB-D white leDs
taPe aNd reel
AllꢀCreeꢀcarrierꢀtapesꢀconformꢀtoꢀEIA-481D,ꢀAutomatedꢀComponentꢀHandlingꢀSystemsꢀStandard.
All dimensions in mm.
User Feed Direction
END
START
Loaded Pockets
(1,000 Lamps)
Trailer
Leader
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
11
xlamp xB-D white leDs
PackaGiNG
All dimensions in mm.
Vacuum-Sealed
Moisture Barrier Bag
Label with Cree Bin
Code, Qty, Lot #
Label with Cree Bin
Code, Qty, Lot #
Patent Label
Label with Customer Order Code,
Qty, Reel ID, PO#
Label with Cree Bin Code,
Qty, Lot #
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
12
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