CMPA25650025F [CREE]
RF/Microwave Amplifier,;型号: | CMPA25650025F |
厂家: | CREE, INC |
描述: | RF/Microwave Amplifier, |
文件: | 总12页 (文件大小:992K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CMPA2560025F
25 W, 2500 - 6000 MHz, GaN MMIC Power Amplifier
Description
Cree’s CMPA2560025F is a gallium nitride (GaN) High Electron Mobility
Transistor (HEMT) based monolithic microwave integrated circuit
(MMIC). GaN has superior properties compared to silicon or gallium
arsenide, including higher breakdown voltage, higher saturated
electron driꢀ velocity and higher thermal conductivity. GaN HEMTs also
offer greater power density and wider bandwidths compared to Si and
GaAs transistors. This MMIC contains a two-stage reactively matched
amplifier enabling very wide bandwidths to be achieved in a small
footprint screw-down package featuring a Copper-Tungsten heat-sink.
PN: CMPA2560025F
Package Type: 780019
Typical Performance Over 2.5 - 6.0 GHz (TC = 25˚C)
Parameter
2.5 GHz
27.5
4.0 GHz
14.9
6.0 GHz
23.1
Units
Gain
dB
W
1
Saturated Output Power, PSAT
Power Gain @ POUT 43 dBm
PAE @ POUT 43 dBm
35.8
177
25.6
23.1
100
16.3
dB
%
31.5
11.6
30.7
Note:
1 PSAT is defined as the RF output power where the device starts to draw positive gate current in the range of 7-13 mA
Features
Applications
•
•
•
•
•
24 dB Small Signal Gain
25 W Typical PSAT
Operation up to 28 V
High Breakdown Voltage
High Temperature Operation
•
•
•
•
Ultra Broadband Amplifiers
Fiber Drivers
Test Instrumentation
EMC Amplifier Drivers
Figure 1.
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
CMPA2560025F
2
Absolute Maximum Ratings (not simultaneous) at 25˚C
Parameter
Symbol
VDSS
Rating
84
Units
VDC
VDC
˚C
Drain-source Voltage
Gate-source Voltage
VGS
-10, +2
-65, +150
225
Storage Temperature
Operating Junction Temperature
Forward Gate Current
Screw Torque
TSTG
T
˚C
J
IG
13
mA
T
40
in-oz
˚C/W
Thermal Resistance, Junction to Case
RθJC
2.5
Electrical Characteristics (Frequency = 2.5 GHz to 6.0 GHz unless otherwise stated; TC = 25˚C)
Characteristics
Symbol Min. Typ. Max. Units Conditions
DC Characteristics
Gate Threshold Voltage
Gate Quiescent Voltage
V(GS)TH
V(GS)Q
-3.8
–
-3.0
-2.7
100
9.7
-2.3
–
V
VDS = 10 V, ID = 20 mA
VDD = 28 V, ID = 1200 mA
VGS = -8 V, ID = 20 mA
VDS = 6.0 V, VGS = 2.0 V
VDC
V
Drain-Source Breakdown Voltage VBD
84
8.0
–
Saturated Drain Current1
RF Characteristics2
Small Signal Gain
Input Return Loss
Output Return Loss
Power Output1
IDC
–
A
S21
S11
S22
POUT
POUT
POUT
PAE
PAE
PAE
GP
19.5
–
24
–
dB
dB
dB
W
VDD = 28 V, ID = 1200 mA
-8
-5
-3
–
VDD = 28 V, ID = 1200 mA
–
-8
VDD = 28 V, ID = 1200 mA
22.0
12.5
15.5
34
30
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 4.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 5.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 6.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 4.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 5.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 6.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 4.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 5.0 GHz
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 6.0 GHz
Power Output2
17
–
W
Power Output3
20
–
W
Power Added Efficiency1
Power Added Efficiency2
Power Added Efficiency3
Power Gain1
40
–
%
20
26
–
%
24
30
–
%
17.5
15.0
16.0
18.8
16.3
17.0
–
dB
dB
dB
Power Gain2
GP
–
Power Gain3
GP
–
No damage at all phase angles,
VDD = 28 V, IDQ = 1200 mA, PIN = 26 dBm
Y
Output Mismatch Stress
VSWR
–
–
5 : 1
Notes:
1 Scaled from PCM data
2 All data CW tested in CMPA2560025F-AMP
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
CMPA2560025F
3
Typical Performance
Small Signal Gain vs Frequency
Input & Output Return Losses vs Frequency
30
28
26
24
22
20
18
16
14
12
10
0
-2
S11 Typical
S22 Typical
-4
-6
-8
-10
-12
-14
-16
-18
-20
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Frequency (GHz)
Frequency (GHz)
Gain vs Output Power as
a Function of Frequency
Power Gain vs Frequency
30
28
26
24
22
20
18
16
14
12
10
30
28
26
24
22
20
18
16
14
12
10
Output Power = 44 dBm
Output Power = 43 dBm
2.5 GHz
4.0 GHz
6.0 GHz
18
22
30
34
38
42
46
26Output Power (dBm)
2.0
2.5
3.0
3.5
4.0
5.0
5.5
6.0
6.5
Frequency4(.5GHz)
Rev 3.1 – April 2020
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CMPA2560025F
4
Typical Performance
Saturated Output Power Performance (PSAT) vs Frequency
50
49
Frequency (GHz)
PSAT (dBm)
45.54
PSAT (W)
35.8
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
48
47
46
45
44
43
42
41
40
Typical Psat (dBm)
44.43
27.7
45.52
35.7
45.74
37.5
44.82
30.4
45.08
32.2
45.07
32.1
44.08
25.6
Note:
PSAT is defined as the RF output power where the device starts
to draw positive gate current in the range of 7-13 mA.
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Frequency (GHz)
Power Added Efficiency vs Output Power
PAE at 43 dBm and 44 dBm Output
Power vs Frequency
as a Function of Frequency
45%
40%
35%
30%
25%
20%
15%
10%
5%
45%
40%
35%
30%
25%
20%
15%
10%
5%
2.5 GHz
4.0 GHz
6.0 GHz
PAE 44 dBm
PAE 43 dBm
0%
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
0%
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Frequency (GHz)
Output Power, POUT(dBm)
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
CMPA2560025F
5
Typical Performance
2ND Harmonic vs Output Power
as a Function of Frequency
IM3 vs Total Average Power
as a Function of Frequency
0
-10
-20
-30
-40
-50
-60
-70
0
-5
2.5 GHz
4.0 GHz
6.0 GHz
2.5 GHz
4.0 GHz
6.0 GHz
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
22
24
26
28
30
32
34
36
38
40
42
44
46
Output Power, POUT (dBm)
Total Average Output Power (dBm)
Gain at POUT of 40 dBm at
25°C & 75°C vs Frequency
30
25
20
15
10
5
Ambient (25°C)
Hot (75°C)
0
2.5
2.8
3.1
3.4
3.7
4.0
Frequency (GHz)
Note: The temperature coefficient is -0.05 dB/°C
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
CMPA2560025F
6
General Device Information
The CMPA2560025F is a two stage GaN HEMT MMIC Power Amplifier, which operates between 2.5- 6.0 GHz. The amplifier typically
provides 25 dB of small signal gain and 25 W saturated output power with an associated power added efficiency of better than
30 %. The wideband amplifier’s input and output are internally matched to 50 Ohm. The amplifier requires bias from dedicated
ports. The RF-input and output both require an external DC-block. DC voltage should not be applied to the RF output pin due to
the internal matching elements. The two gate pins, G1 and G2, are internally connected so it is sufficient to apply bias to only one
of them. The drain pins, D1 and D2, should both be connected to the drain supply. The component has internal DC-decoupling on
the gate and drain pins, 1840pF and 920pF respectively. The test fixture also provides extra decoupling capacitors on all supply
lines. Details of these components can be found on the bill of materials.
The CMPA2560025F is provided in a lead-less package format. The input and output connections are gold plated to enable gold
bond wire attach at the next level assembly.
The measurements in this data sheet were taken on devices wire-bonded to the test fixture with 2 mil gold bond wires. All losses
associated with the test fixture are included in the measurements.
Electrostatic Discharge (ESD) Classifications
Parameter
Symbol
Class
Test Methodology
Human Body Model
Charge Device Model
HBM
CDM
1A (> 250 V)
JEDEC JESD22 A114-D
JEDEC JESD22 C101-C
II (200 < 500 V)
Rev 3.1 – April 2020
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CMPA2560025F
7
CMPA2560025F CW Power Dissipation De-rating Curve
Note 1
Maximum Case Temperature (C)
Note 1: Area exceeds Maximum Case Operating Temperature (See Page 2)
Rev 3.1 – April 2020
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CMPA2560025F
8
CMPA2560025F-AMP Demonstration Amplifier Circuit
CMPA2560025F-AMP Demonstration Amplifier Circuit Outline
Rev 3.1 – April 2020
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CMPA2560025F
9
CMPA2560025F-AMP Demonstration Amplifier Circuit Bill of Materials
Designator
Description
Qty
2
J1,J2
CONNECTOR, SMA, AMP1052901-1
HEADER, RT. PLZ. 1, CEN LK, 5 POS
CAP, 2400 pF, BROADBAND BLOCK, C08BL242X-5UN-X0T 2
CAP, 0.1 UF, +/- 10 % , 0805
RES, 0 OHM, 1206
J3
1
C1,C2,C3
3
C4,C5,C6
3
R1
-
1
PCB, TACONIC, RF-35-0100-CH/CH
CMPA2560025F
1
Q1
1
Notes:
1 The CMPA2560025F is connected to the PCB with 2.0 mil Au bond wires
2 An external DC Block is required on the input and output
Product Dimensions CMPA2560025F (Package Type — 780019)
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
CMPA2560025F
10
Part Number System
CMPA2560025F
Package
Power Output (W)
Upper Frequency (GHz)
Lower Frequency (GHz)
Cree MMIC Power Amplifier Product Line
Table 1.
Parameter
Lower Frequency
Upper Frequency1
Power Output
Package
Value
13.75
14.5
Units
GHz
GHz
W
25
Flange
-
Note1: Alpha characters used in frequency code indicate a value
greater than 9.9 GHz. See Table 2 for value
Table 2.
Character Code
Code Value
A
B
C
D
E
F
0
1
2
3
4
5
6
7
8
9
G
H
J
K
1A = 10.0 GHz
2H = 27.0 GHz
Examples:
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
CMPA2560025F
11
Product Ordering Information
Order Number
Description
Unit of Measure
Image
CMPA25650025F
GaN HEMT
Each
CMPA2560025F-AMP
Test board with GaN HEMT installed
Each
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
CMPA2560025F
12
For more information, please contact:
4600 Silicon Drive
Durham, North Carolina, USA 27703
www.wolfspeed.com/RF
Sales Contact
RFSales@wolfspeed.com
RF Product Marketing Contact
RFMarketing@wolfspeed.com
Notes
Disclaimer
Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet
to be accurate and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other rights
of third parties which may result from its use. No license is granted by implication or otherwise under any patent or pat-
ent rights of Cree. Cree makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose. “Typical” parameters are the average values expected by Cree in large quantities and are provided for
information purposes only. These values can and do vary in different applications and actual performance can vary over
time. All operating parameters should be validated by customer’s technical experts for each application. Cree products
are not designed, intended or authorized for use as components in applications intended for surgical implant into the
body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury
or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility.
© 2008 - 2020 Cree, Inc. All rights reserved. Wolfspeed® and the Wolfspeed logo are registered trademarks of Cree, Inc.
Rev 3.1 – April 2020
4600 Silicon Drive | Durham, NC 27703 | wolfspeed.com
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