CTL190NS10-T52 [CTMICRO]

N-Channel Enhancement MOSFET;
CTL190NS10-T52
型号: CTL190NS10-T52
厂家: CT Micro International Corporation    CT Micro International Corporation
描述:

N-Channel Enhancement MOSFET

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中文:  中文翻译
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CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Features  
Description  
The CTL190NS10-T52 is the N-Channel logic  
enhancement mode power field effect transistors  
are produced using high cell density, DMOS trench  
technology. This high density process is especially  
tailored to minimize on-state resistance. These  
devices are particularly suited for low voltage  
application.  
Drain-Source Breakdown Voltage VDSS 100V  
Drain-Source On-Resistance  
R
DS(ON) 65m  
, at VGS= 10V, ID= 12A  
, at VGS= 5V, ID= 12A  
RDS(ON) 75m  
19A  
Continuous Drain Current at TC=25 ID =  
Advanced high cell density Trench Technology  
RoHS Compliance & Halogen Free  
Applications  
DC/DC Converter  
Load Switch  
LCD Display inverter  
Package Outline  
Schematic  
Drain  
Drain  
Gate  
Gate  
Source  
Source  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 1  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Absolute Maximum Rating at 25oC  
Symbol  
Parameters  
Test Conditions  
Min  
V
Note  
Drain-Source Voltage  
100  
20  
V
DS  
GS  
Gate-Source Voltage  
V
V
Continuous Drain Current @TC=25  
19  
A
1
1
2
I
D
Pulsed Drain Current  
76  
A
IDM  
Total Power Dissipation @TC=25  
45  
W
°C  
°C  
P
D
Storage Temperature Range  
-55 to 150  
-55 to 150  
T
STG  
Operating Junction Temperature Range  
T
J
Thermal Characteristics  
Symbol  
Parameters  
Thermal Resistance  
Junction-Case  
Test Conditions  
Min  
--  
Typ  
Max  
2.8  
Units Notes  
R
ӨJC  
oC /W  
1,4  
--  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 2  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Electrical Characteristics TA = 25°C (unless otherwise specified)  
Static Characteristics  
Symbol  
Parameters  
Test Conditions  
= 250µA  
DS = 80V, VGS = 0V  
Min  
Typ  
Max  
-
Units Notes  
Drain-Source Breakdown Voltage  
Drain-Source Leakage Current  
Gate-Source Leakage Current  
V
GS= 0V, I  
D
100  
-
-
V
B
VDSS  
DSS  
V
-
-
1
µA  
nA  
I
-
IGSS  
V
GS = 20V, VDS = 0V  
100  
On Characteristics  
Symbol  
Parameters  
Test Conditions  
Min  
Typ  
65  
75  
-
Max  
78  
Units Notes  
V
GS = 10V, I  
GS = 5V, I  
GS = VDS, I  
D
= 12A  
= 12A  
=250µA  
-
-
mΩ  
mΩ  
V
3
3
3
Drain-Source On-Resistance  
Gate-Source Threshold Voltage  
RDS(ON)  
V
V
D
98  
1.0  
2.5  
VGS(th)  
D
Dynamic Characteristics  
Symbol  
Parameters  
Test Conditions  
VGS  
Min  
Typ  
1120  
83  
Max  
Units Notes  
Input Capacitance  
-
-
-
-
-
-
C
ISS  
=0V,  
Output Capacitance  
V
DS =15V  
f=1MHz  
pF  
C
OSS  
RSS  
Reverse Transfer Capacitance  
54  
C
Switching Characteristics  
Symbol  
Parameters  
Turn-On Delay Time  
Rise Time  
Test Conditions  
Min  
Typ  
25.5  
429  
45.5  
91.2  
16.8  
7.3  
Max  
Units  
Notes  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
T
D(ON)  
T
R
VDS = 50V , RG = 4.7Ω  
VGS = 5V, R = 3.3Ω  
ns  
L
Turn-Off Delay Time  
Fall Time  
T
D(OFF)  
T
F
Total Gate Charge  
Gate-Source Charge  
Gate-Drain (Miller) Charge  
VDS = 80V ,  
VGS = 5V,  
ID =15.7A  
Q
G
nC  
Q
GS  
9.7  
Q
GD  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 3  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Drain-Source Diode Characteristics  
Symbol  
Parameters  
Test Conditions  
Min  
Typ  
Max  
1.3  
1
Units  
Notes  
Body Diode Forward Voltage  
Body Diode Continuous Current  
V
GS = 0V, ISD = 1A  
-
-
-
-
V
A
1
1
VSD  
ISD  
Note:  
1.The power dissipation is limited by 150 junction temperature.  
The data tested by pulsed , pulse width  
300 s , duty cycle  
2%  
2.  
3.Thermal Resistance follow JESD51-3.  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 4  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Typical Characteristic Curves  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 5  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 6  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Test Circuits & Waveforms  
Figure 9: Gate Charge Test Circuit  
Figure 10: Gate Charge Waveform  
Figure 11: Switching Time Test Circuit  
Figure 12: Switching Time Waveform  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 7  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Package Dimension (TO-252)  
Dimensions in mm unless otherwise stated  
Recommended pad layout for surface mount leadform  
Dimensions in mm unless otherwise stated  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 8  
CTL190NS10-T52  
annel Enhancement MOSFET  
CT  
Denotes “ CT M
CT  
Device Numbe
Fiscal Year  
190NS10  
190NS10  
Y
Work Week  
WW  
A
YWWA  
Production Cod
Ordering Information  
Part Number  
Description  
Quantity  
CTL190NS10-T52  
TO-252 Reel  
2500 pcs  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 9  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
Reflow Profile  
Profile Feature  
Pb-Free Assembly Profile  
150°C  
Temperature Min. (Tsmin)  
Temperature Max. (Tsmax)  
Time (ts) from (Tsmin to Tsmax)  
Ramp-up Rate (tL to tP)  
200°C  
60-120 seconds  
3°C/second max.  
217°C  
Liquidous Temperature (TL)  
Time (tL) Maintained Above (TL)  
Peak Body Package Temperature  
Time (tP) within 5°C of 260°C  
Ramp-down Rate (TP to TL)  
Time 25°C to Peak Temperature  
60 – 150 seconds  
260°C +0°C / -5°C  
30 seconds  
6°C/second max  
8 minutes max.  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 10  
CTL190NS10-T52  
N-Channel Enhancement MOSFET  
DISCLAIMER  
CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY  
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
______________________________________________________________________________________  
CT MICRO ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF CT MICRO INTERNATIONAL CORPORATION.  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical  
implant into the body, or (b) support or sustain life,  
or (c) whose failure to perform when properly used  
in accordance with instruction for use provided in  
the labelling, can be reasonably expected to result  
in significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
CT Micro  
Proprietary & Confidential  
Rev 2  
Jun, 2015  
Page 11  

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