HP1-T06-CB [CTS]

METAL CASE, CASE-MOUNTED SEMICONDUCTORS; 金属外壳，机箱面板上半导体


型号：	HP1-T06-CB
厂家：	CTS
描述：	METAL CASE, CASE-MOUNTED SEMICONDUCTORS 金属外壳，机箱面板上半导体半导体
文件：	总7页 (文件大小：541K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Series HP1

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

HP1 Series for Single TO-3 or Stud Mount Devices

DESCRIPTION OF CURVES

A. N.C. Horiz. Device

Only Mounted to G-10.

A. N.C. Horiz. & Vert.

With Dissipator.

B. 200 RPM w/Diss.

C. 500 RPM w/Diss.

E. 1000 RPM w/Diss.

•

Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.

Derate 1.0 °C/watt for unplated part in natural convection only.

Ordering Information

IERC PART NO.

Semiconductor

Accommodated

Hole patt.

Ref. No.

(see pg.

1-28)

Max. Weight

(Grams)

Unplated

Comm’l. Black

Anodize

Mil. Black

Anodize

HP1-000-U

HP1-000-CB

HP1-000-B

HP1-TO3-B

HP1-TO3-33B

HP1-TO3-44B

HP1-436-B

HP1-T06-B

HP1-TO15-B

HP1-420-B

Undrilled

TO-3

TO-3 IC

TO-3 panel mount

TO-3 (4-pin)

TO-6, TO-36

TO-15, DO-5

Universal

35.0

HP1-TO3-U

HP1-TO3-33U

HP1-TO3-44U

HP1-436-U

HP1-TO6-U

HP1-TO15-U

HP1-420-U

HP1-TO3-CB

HP1-TO3-33CB

HP1-TO3-44CB

HP1-436-CB

HP1-T06-CB

HP1-TO15-CB

HP1-420-CB

HP1 Series for Single TO-66 Outline

DESCRIPTION OF CURVES

B. N.C. Horiz. Device

Only Mounted to G-10.

D. N.C. Horiz. & Vert.

With Dissipator.

E. 200 RPM w/Diss.

F. 500 RPM w/Diss.

E. 1000 RPM w/Diss.

•

Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.

Derate 1.0 °C/watt for unplated part in natural convection only.

Ordering Information

IERC PART NO.

Semiconductor

Accommodated

Hole patt.

Ref. No.

(see pg.

1-28)

Max. Weight

(Grams)

Unplated

Comm’l. Black

Anodize

Mil. Black

Anodize

HP1-TO66-U

HP1-TO66-CB

HP1-TO66-B

HP1-TO66-35B

HP1-TO66-49B

TO-66

TO-66 IC

TO-66 IC (Socket)

35.0

HP1-TO66-35U

HP1-TO66-49U

HP1-TO66-35CB

HP1-TO66-49CB

HP1 Series for Dual TO-66 Outline

DESCRIPTION OF CURVES

C. N.C. Horiz. Device

Only Mounted to G-10.

G. N.C. Horiz. & Vert.

With Dissipator.

H. 200 RPM w/Diss.

500 RPM w/Diss.

E. 1000 RPM w/Diss.

•

Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.

Derate 2.0 °C/watt per device for unplated part in natural convection only.

Case Temperatures Match Within 2°C at equivalent power levels.

Ordering Information

IERC PART NO.

Semiconductor

Accommodated

Hole patt.

Ref. No.

(see pg.

1-30)

Max. Weight

(Grams)

Unplated

Comm’l. Black

Anodize

Mil. Black

Anodize

HP1-TO66-4U

HP1-TO66-36U

HP1-TO66-4CB

HP1-TO66-36CB

HP1-TO66-4B

HP1-TO66-36B

Two TO-66s

Two TO-66 Ics

35.0

HP1 Series for Three TO-66 Outline

DESCRIPTION OF CURVES

D. N.C. Horiz. Device

Only Mounted to G-10.

J. N.C. Horiz. & Vert.

With Dissipator.

K. 200 RPM w/Diss.

L. 500 RPM w/Diss.

E. 1000 RPM w/Diss.

•

Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.

Derate 3.0 °C/watt per device for unplated part in natural convection only.

Case Temperatures Match Within 2°C at equivalent power levels in natural convection.

Ordering Information

IERC PART NO.

Semiconductor

Accommodated

Hole patt.

Ref. No.

(see pg.

1-30)

Max. Weight

(Grams)

Unplated

Comm’l. Black

Anodize

Mil. Black

Anodize

HP1-TO66-8U

HP1-TO66-39U

HP1-TO66-8CB

HP1-TO66-39CB

HP1-TO66-8B

HP1-TO66-39B

Two TO-66s

Two TO-66 Ics

35.0

HOLE PATTERNS

16. Hole pattern no. 1 accommodates T0-3s. Available in UP,

17. Hole pattern no. 202 accommodates T0-3 ICs. Available in

UP1, UP2, HP1, and HP3 series heat dissipators.

UP, UP1, UP2, HP1, and HP3 series heat dissipators.

18. Hole pattern no. 436 accommodates t0-3s (4-pin). Available

in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

19. Hole pattern no. 2 accommodates T0-6s or T0-36s.

Available in UP, UP1, UP2, HP1, and HP3 series heat

dissipators.

23. Hole pattern no. 3 accommodates TO-15s, DO-5s and other

¼” stud mount devices. Available in UP, UP1, UP2, HP1, and

HP3 series heat dissipators.

24. Hole pattern no. 114 accommodates TO-66s. Available in

UP, UP1, UP2, HP1, and HP3 series heat dissipators.

25. Hole pattern no. 199 accommodates TO-66 ICs. Available in

UP, UP1, UP2, HP1, and HP3 series heat dissipators.

26. Hole pattern no. 226 accommodates TO-66 ICs (socket).

Available in UP, UP1, UP2, HP1, and HP3 series heat

dissipators.

31. Hole pattern no. 213 accommodates one TO-3 (panel

mounted). Available in HP1 and HP3 series heat dissipators

only.

32. Hole pattern no. 150 accommodates two TO-66s. Available

in HP1 and HP3 series heat dissipators only.

33. Hole pattern no. 185 accommodates three TO-66s.

34. Hole pattern no. 201 accommodates two TO-66s ICs.

Available in HP1 and HP3 series heat dissipators only.

35. Hole pattern no. 203 accommodates three TO-66 ICs.

Available in HP1 and HP3 series heat dissipators only.

27. Hole pattern no. 420 (Universal) accommodates T0-3s, T0-

66s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2,

HP1, and HP3 series heat dissipators.

CTS IERC, Heat Sinks and Thermal Management Solutions

413 North Moss Street, Burbank, California 91502

Tel: (818) 842-7277

Fax: (818) 848-8872

Rev. 03-15-04

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