ATS-04B-37-C1-R0

pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:4-CORNER,BLUE,NO TIM
暂无信息
ATS

KEPAU-111M3-H/Q

Plug-in Signal Conditioners K-UNIT
暂无信息
MSYSTEM

W2PE-12B-M2/N

Space-saving Dual Output Signal Conditioners Mini-MW Series
暂无信息
MSYSTEM

GCG1550C1H9R2DA01#

汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],植入式以外的医疗器械设备 [GHTF A/B/C]
医疗 医疗器械
MURATA

STC32K33O07G

Ceramic SMT 4 Pad Clipped Sinewave (VC)TCXO
石英晶振 温度补偿晶振
SUNTSU

W2PP-312R-M2/Q

Space-saving Dual Output Signal Conditioners Mini-MW Series
暂无信息
MSYSTEM

FD3501MNTXG

VR13/13.HC Digital Multiphase Controller with PMBus
暂无信息
ONSEMI

KEPAU-142M3-C/Q

Plug-in Signal Conditioners K-UNIT
暂无信息
MSYSTEM

STC32K27P16FA

Ceramic SMT 4 Pad Clipped Sinewave (VC)TCXO
石英晶振 温度补偿晶振
SUNTSU

PA5003.122NLT

High Current Composite Inductor
暂无信息
PULSE

STC32K30F37G

Ceramic SMT 4 Pad Clipped Sinewave (VC)TCXO
石英晶振 温度补偿晶振
SUNTSU

GRM155R11H152JA01#

民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备]
医疗 医疗器械
MURATA

W2PE-5GA-M2/N

Space-saving Dual Output Signal Conditioners Mini-MW Series
暂无信息
MSYSTEM

W2PE-10E-P/UL

Space-saving Dual Output Signal Conditioners Mini-MW Series
暂无信息
MSYSTEM

W2PP-911N-R/Q

Space-saving Dual Output Signal Conditioners Mini-MW Series
暂无信息
MSYSTEM

KEPAU-112M1-P/Q

Plug-in Signal Conditioners K-UNIT
暂无信息
MSYSTEM

W2PE-1AF-R2/Q

Space-saving Dual Output Signal Conditioners Mini-MW Series
暂无信息
MSYSTEM

MPAU-B1L5-J/Q

Plug-in Signal Conditioners M-UNIT
暂无信息
MSYSTEM

MKE15Z64VFP4

Kinetis KE1xZ with up to 64 KB Flash
暂无信息
NXP

STC32K33F27V

Ceramic SMT 4 Pad Clipped Sinewave (VC)TCXO
石英晶振 温度补偿晶振
SUNTSU

TLF11251EP

OPTIREG™ PMIC (Automotive)
集成电源管理电路
INFINEON

STB02-1-5

STD and STB Markers
暂无信息
TE

ATS-01G-38-C3-R0

pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:4-CORNER,BLUE,T412
暂无信息
ATS

MPAU-A1MD-C

Plug-in Signal Conditioners M-UNIT
暂无信息
MSYSTEM

STSPIN32F0601

Advanced 600 V three-phase BLDC controller with embedded STM32 MCU
暂无信息
STMICROELECTR

STC32K27F16E

Ceramic SMT 4 Pad Clipped Sinewave (VC)TCXO
石英晶振 温度补偿晶振
SUNTSU

PCIMX6X4AVO08AB

i.MX 6SoloX Applications Processors for Consumer Products
暂无信息
NXP

ATS19580LSNBTN-RSNHPO

Direction Sensor IC for Gear Tooth Sensing
暂无信息
ALLEGRO

M2CE-1G-M2/CE

Super-mini Signal Conditioners Mini-M Series
暂无信息
MSYSTEM

CYW89820

The AIROC™ CYW89820 Automotive Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.2 core spec compliant device for automotive and industrial applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW89820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.
暂无信息
INFINEON
KYOCERA AVX
AMPHENOL
SAMTEC
WALSIN
VISHAY
MSYSTEM
GLENAIR
ITT
MICROSEMI
YAGEO
ECLIPTEK
ABRACON
MOLEX
VICOR
KEMET
MTRONPTI
TI
PANASONIC
CTS
SCHURTER
KNOWLES
MURATA
TE
TOREX
SILICON
BOURNS
GOLLEDGE
STMICROELECTRONICS
RCD
BEL
NXP
MICROCHIP
TDK
KOA
INFINEON
FOXCONN
EUROQUARTZ
MAXIM
LITTELFUSE
VCC
RENESAS
CDE
IDT
AVAGO
HONEYWELL
ONSEMI
FH
NICHICON
APITECH
ROHM
EPCOS
AGILENT
GRAYHILL
ADI
Carling Technologies
RICOH

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