CY7C1019BV33-10ZC [CYPRESS]
128K x 8 Static RAM; 128K ×8静态RAM型号: | CY7C1019BV33-10ZC |
厂家: | CYPRESS |
描述: | 128K x 8 Static RAM |
文件: | 总9页 (文件大小:259K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
019V33
CY7C1019BV33
CY7C1018BV33
128K x 8 Static RAM
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O
pins (I/O0 through I/O7) is then written into the location speci-
fied on the address pins (A0 through A16).
Features
• High speed
— tAA = 10 ns
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing Write
Enable (WE) HIGH. Under these conditions, the contents of
the memory location specified by the address pins will appear
on the I/O pins.
• CMOS for optimum speed/power
• Center power/ground pinout
• Automatic power-down when deselected
• Easy memory expansion with CE and OE options
• Functionally equivalent to CY7C1019V33 and/or
CY7C1018V33
The eight input/output pins (I/O0 through I/O7) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), or during a write
operation (CE LOW, and WE LOW).
Functional Description
The CY7C1019BV33/CY7C1018BV33 is a high-performance
CMOS static RAM organized as 131,072 words by 8 bits. Easy
memory expansion is provided by an active LOW Chip Enable
(CE), an active LOW Output Enable (OE), and three-state driv-
ers. This device has an automatic power-down feature that
significantly reduces power consumption when deselected.
The CY7C1019BV33 is available in standard 32-pin TSOP
Type II and 400-mil-wide package. The CY7C1018BV33 is
available in a standard 300-mil-wide package.
Logic Block Diagram
Pin Configurations
SOJ / TSOPII
Top View
A
A
1
A
32
1
2
3
4
5
6
0
16
31
30
A
A
A
15
A
2
14
13
I/O
0
A
3
29
28
INPUT BUFFER
CE
OE
I/O
I/O
6
I/O
I/O
1
27
26
I/O
0
1
A
0
7
A
1
I/O
V
7
8
9
2
A
2
25
24
23
22
21
V
CC
SS
A
3
4
V
V
CC
I/O
I/O
SS
A
I/O
3
I/O
4
I/O
5
512 x 256 x 8
ARRAY
A
6
I/O
I/O
5
10
11
12
13
2
3
5
A
4
A
7
8
A
A
WE
A
4
12
11
A
20
19
A
5
A
10
14
15
16
I/O
6
7
A
6
A
9
A
8
POWER
DOWN
18
17
COLUMN
DECODER
CE
A
7
I/O
WE
OE
Selection Guide
7C1019BV33-10
7C1018BV33-10
7C1019BV33-12
7C1018BV33-12
7C1019BV33-15
7C1018BV33-15
Maximum Access Time (ns)
10
175
5
12
160
5
15
145
5
Maximum Operating Current (mA)
Maximum Standby Current (mA)
L
−
0.5
0.5
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
June 11, 2001
CY7C1019BV33
CY7C1018BV33
Current into Outputs (LOW)......................................... 20 mA
Maximum Ratings
Static Discharge Voltage ........................................... >2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Latch-Up Current..................................................... >200 mA
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Operating Range
Ambient
Supply Voltage on VCC to Relative GND[1] .... –0.5V to +7.0V
Range
Temperature[2]
VCC
DC Voltage Applied to Outputs
Commercial
0°C to +70°C
3.3V ± 10%
in High Z State[1]....................................–0.5V to VCC + 0.5V
DC Input Voltage[1].................................–0.5V to VCC + 0.5V
Electrical Characteristics Over the Operating Range
7C1019BV33-10 7C1019BV33-12 7C1019BV33-15
7C1018BV33-10 7C1018BV33-12 7C1018BV33-15
Parameter
Description
Test Conditions
Min.
Max.
Min.
Max.
Min.
Max.
Unit
VOH
Output HIGH Voltage VCC = Min.,
2.4
2.4
2.4
V
IOH = – 4.0 mA
VOL
VIH
Output LOW Voltage VCC = Min.,
IOL = 8.0 mA
0.4
0.4
0.4
V
V
Input HIGH Voltage
2.2
VCC
+ 0.3
2.2
VCC
+ 0.3
2.2
VCC
+ 0.3
VIL
IIX
Input LOW Voltage[1]
–0.3
–1
0.8
+1
+5
–0.3
–1
0.8
+1
+5
–0.3
–1
0.8
+1
+5
V
Input Load Current
GND < VI < VCC
µA
µA
IOZ
Output Leakage
Current
GND < VI < VCC
,
–5
–5
–5
Output Disabled
ICC
VCC Operating
Supply Current
VCC = Max.,
IOUT = 0 mA,
f = fMAX = 1/tRC
175
20
160
20
145
20
mA
mA
mA
ISB1
Automatic CE
Power-Down Current VIN > VIH or
—TTL Inputs
Max. VCC, CE > VIH
VIN < VIL, f = fMAX
ISB2
Automatic CE
Max. VCC
,
5
5
5
Power-Down Current CE > VCC – 0.3V,
L
−
0.5
0.5
—CMOS Inputs
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
Capacitance[3]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
Output Capacitance
TA = 25°C, f = 1 MHz,
VCC = 5.0V
6
8
pF
pF
COUT
Notes:
1. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
2. TA is the “Instant On” case temperature.
3. Tested initially and after any design or process changes that may affect these parameters.
2
CY7C1019BV33
CY7C1018BV33
AC Test Loads and Waveforms
R1 480 Ω
ALL INPUT PULSES
90%
10%
R1 480 Ω
3.3V
3.3V
OUTPUT
3.0V
GND
90%
10%
OUTPUT
R2
R2
255 Ω
30 pF
5 pF
255 Ω
≤ 3 ns
≤ 3 ns
INCLUDING
JIG AND
SCOPE
INCLUDING
JIG AND
SCOPE
(b)
(a)
THÉ
Equivalent to:
VENIN EQUIVALENT
167 Ω
1.73V
OUTPUT
Switching Characteristics[4] Over the Operating Range
7C1019BV33-10
7C1018BV33-10
7C1019BV33-12
7C1018BV33-12
7C1019BV33-15
7C1018BV33-15
Parameter
READ CYCLE
tRC
Description
Min.
10
3
Max.
Min.
Max.
Min.
15
3
Max.
Unit
Read Cycle Time
12
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tAA
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
OE LOW to Low Z
OE HIGH to High Z[5, 6]
CE LOW to Low Z[6]
CE HIGH to High Z[5, 6]
CE LOW to Power-Up
CE HIGH to Power-Down
10
12
15
tOHA
3
tACE
10
5
12
6
15
7
tDOE
tLZOE
0
3
0
0
3
0
0
3
0
tHZOE
tLZCE
tHZCE
tPU
5
5
6
6
7
7
tPD
10
12
15
WRITE CYCLE[7, 8]
tWC
tSCE
tAW
Write Cycle Time
10
8
12
9
15
10
10
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CE LOW to Write End
Address Set-Up to Write End
Address Hold from Write End
Address Set-Up to Write Start
WE Pulse Width
7
8
tHA
0
0
tSA
0
0
0
tPWE
tSD
7
8
10
8
Data Set-Up to Write End
Data Hold from Write End
WE HIGH to Low Z[6]
5
6
tHD
0
0
0
tLZWE
3
3
3
tHZWE
WE LOW to High Z[5, 6]
5
6
7
Notes:
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
5. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
7. The internal write time of the memory is defined by the overlap of CELOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of these
signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.
8. The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD
.
3
CY7C1019BV33
CY7C1018BV33
Data Retention Characteristics Over the Operating Range (L Version Only)
Parameter
VDR
Description
VCC for Data Retention
Conditions
Min.
Max.
Unit
V
No input may exceed VCC + 0.5V
VCC = VDR = 2.0V,
CE > VCC – 0.3V,
2.0
ICCDR
Data Retention Current
150
µA
ns
[3]
tCDR
Chip Deselect to Data Retention Time
Operation Recovery Time
0
VIN > VCC – 0.3V or VIN < 0.3V
tR
200
µs
Data Retention Waveform
DATA RETENTION MODE
3.0V
3.0V
V
DR
> 2V
V
CC
t
t
R
CDR
CE
Switching Waveforms
Read Cycle No. 1[9, 10]
t
RC
ADDRESS
t
AA
t
OHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled)[10, 11]
ADDRESS
CE
t
RC
t
ACE
OE
t
HZOE
t
DOE
t
HZCE
t
LZOE
HIGH
IMPEDANCE
HIGH IMPEDANCE
DATA OUT
DATA VALID
t
LZCE
t
PD
ICC
ISB
t
PU
V
CC
50%
50%
SUPPLY
CURRENT
Notes:
9. Device is continuously selected. OE, CE = VIL.
10. WE is HIGH for read cycle.
11. Address valid prior to or coincident with CE transition LOW.
4
CY7C1019BV33
CY7C1018BV33
Switching Waveforms (continued)
Write Cycle No. 1 (CE Controlled)[12, 13]
t
WC
ADDRESS
CE
t
SCE
t
SA
t
SCE
t
t
HA
AW
t
PWE
WE
t
t
HD
SD
DATA I/O
DATA VALID
Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[12, 13]
t
WC
ADDRESS
CE
t
SCE
t
t
HA
AW
t
SA
t
PWE
WE
OE
t
t
SD
HD
DATA VALID
DATA I/O
IN
NOTE 14
t
HZOE
Notes:
12. Data I/O is high impedance if OE = VIH
.
13. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
14. During this period the I/Os are in the output state and input signals should not be applied.
5
CY7C1019BV33
CY7C1018BV33
Switching Waveforms (continued)
Write Cycle No. 3 (WE Controlled, OE LOW)[13]
t
WC
ADDRESS
CE
t
SCE
t
t
HA
AW
t
SA
t
PWE
WE
t
t
HD
SD
NOTE 14
DATA I/O
DATA VALID
t
t
LZWE
HZWE
Truth Table
CE
H
X
OE
WE
X
I/O0–I/O7
Mode
Power
X
X
L
High Z
High Z
Power-Down
Power-Down
Read
Standby (ISB
Standby (ISB
Active (ICC
Active (ICC
Active (ICC
)
X
)
L
H
Data Out
Data In
High Z
)
L
X
H
L
Write
)
L
H
Selected, Outputs Disabled
)
6
CY7C1019BV33
CY7C1018BV33
Ordering Information
Speed
(ns)
Package
Name
Operating
Range
Ordering Code
Package Type
32-Lead 300-Mil Molded SOJ
10
CY7C1018V33-10VC
CY7C1019BV33-10VC
CY7C1019BV33-10ZC
CY7C1018BV33-12VC
CY7C1018BV33L-12VC
CY7C1019BV33-12VC
CY7C1019BV33-12ZC
CY7C1019BV33L-12VC
CY7C1019BV33L-12ZC
CY7C1018BV33-15VC
CY7C1018BV33L-15VC
CY7C1018BV33-15VI
CY7C1019BV33-15VC
CY7C1019BV33-15ZC
CY7C1019BV33L-15VC
CY7C1019BV33L-15ZC
CY7C1019BV33-15VI
CY7C1019BV33-15ZI
V32
V33
Commercial
32-Lead 400-Mil Molded SOJ
32-Lead TSOP Type II
ZS32
V32
12
15
32-Lead 300-Mil Molded SOJ
32-Lead 300-Mil Molded SOJ
32-Lead 400-Mil Molded SOJ
32-Lead TSOP Type II
V32
V33
ZS32
V33
32-Lead 400-Mil Molded SOJ
32-Lead TSOP Type II
ZS32
V32
32-Lead 300-Mil Molded SOJ
32-Lead 300-Mil Molded SOJ
32-Lead 300-Mil Molded SOJ
32-Lead 400-Mil Molded SOJ
32-Lead TSOP Type II
V32
V32
V33
ZS32
V33
32-Lead 400-Mil Molded SOJ
32-Lead TSOP Type II
ZS32
V33
32-Lead 400-Mil Molded SOJ
32-Lead TSOP Type II
ZS32
Industrial
Document #: 38-01053-*B
7
CY7C1019BV33
CY7C1018BV33
Package Diagram
32-Lead (400-Mil) Molded SOJ V33
51-85041-A
32-Lead (300-Mil) Molded SOJ V32
51-85041
8
CY7C1019BV33
CY7C1018BV33
Package Diagram
32-Lead
TSOP II ZS32
51-85095
© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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