CY7C1019D-12VXC [CYPRESS]

Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, LEAD FREE, SOJ-32;
CY7C1019D-12VXC
型号: CY7C1019D-12VXC
厂家: CYPRESS    CYPRESS
描述:

Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, LEAD FREE, SOJ-32

静态存储器 光电二极管
文件: 总9页 (文件大小:196K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY7C1019D  
PRELIMINARY  
1-Mbit (128K x 8) Static RAM  
Features  
Functional Description[1]  
• Pin- and function-compatible with CY7C1019B  
• High speed  
The CY7C1019D is a high-performance CMOS static RAM  
organized as 131,072 words by 8 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and tri-state drivers. This  
device has an automatic power-down feature that significantly  
reduces power consumption when deselected.  
— tAA = 10 ns  
• CMOS for optimum speed/power  
• Low active power  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the eight  
I/O pins (I/O0 through I/O7) is then written into the location  
specified on the address pins (A0 through A16).  
— ICC = 60 mA @ 10 ns  
• Low CMOS standby power  
— ISB2 = 1.2 mA (‘L’ Version only)  
• Data Retention at 2.0V  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
• Center power/ground pinout  
• Automatic power-down when deselected  
• Easy memory expansion with CE and OE options  
• Functionally equivalent to CY7C1019B  
• Available in Pb-Free Packages  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE LOW, and WE LOW).  
The CY7C1019D is available in standard 32-pin TSOP Type  
II and 400-mil-wide SOJ Pb-Free packages.  
Logic Block Diagram  
Pin Configurations  
/TSOPII  
SOJ  
Top View  
A
A
1
A
A
32  
1
0
16  
31  
30  
2
3
4
5
6
15  
A
2
A
14  
A
13  
A
29  
28  
3
I/O  
0
CE  
I/O  
OE  
I/O  
I/O  
6
INPUT BUFFER  
27  
26  
0
7
I/O  
I/O  
1
2
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
I/O  
7
1
25  
24  
23  
22  
21  
V
V
8
9
10  
11  
12  
13  
V
V
CC  
I/O  
5
I/O  
CC  
SS  
SS  
I/O  
3
I/O  
4
I/O  
5
512 x 256 x 8  
ARRAY  
I/O  
I/O  
2
3
4
A
A
A
WE  
12  
11  
A
4
20  
19  
A
5
10  
I/O  
14  
15  
16  
6
7
POWER  
DOWN  
COLUMN  
DECODER  
CE  
WE  
A
6
A
9
A
8
18  
17  
I/O  
A
7
OE  
Note:  
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05464 Rev. *C  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised January 11, 2005  
PRELIMINARY  
CY7C1019D  
Selection Guide  
CY7C1019D-10  
CY7C1019D-12  
Unit  
ns  
Maximum Access Time  
10  
60  
3
12  
50  
3
Maximum Operating Current  
Maximum Standby Current  
mA  
mA  
L
1.2  
1.2  
Document #: 38-05464 Rev. *C  
Page 2 of 9  
PRELIMINARY  
CY7C1019D  
Current into Outputs (LOW)......................................... 20 mA  
Maximum Ratings  
Static Discharge Voltage...........................................> 2001V  
(per MIL-STD-883, Method 3015)  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Latch-up Current.....................................................> 200 mA  
Storage Temperature .................................65°C to +150°C  
Operating Range  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Ambient  
Supply Voltage on VCC to Relative GND[2] .... –0.5V to +7.0V  
Range  
Commercial  
Industrial  
Temperature  
0°C to +70°C  
–40°C to +85°C  
VCC  
DC Voltage Applied to Outputs  
5V ± 10%  
5V ± 10%  
in High-Z State[2] ....................................–0.5V to VCC + 0.5V  
DC Input Voltage[2].................................–0.5V to VCC + 0.5V  
Electrical Characteristics Over the Operating Range  
7C1019D-10  
7C1019D-12  
Min. Max.  
Parameter  
VOH  
Description  
Test Conditions  
Min.  
Max.  
Unit  
V
Output HIGH Voltage VCC = Min., IOH = –4.0 mA  
Output LOW Voltage VCC = Min., IOL = 8.0 mA  
Input HIGH Voltage  
2.4  
2.0  
2.4  
VOL  
0.4  
0.4  
V
VIH  
VCC  
2.0  
VCC  
V
+ 0.3  
+ 0.3  
VIL  
IIX  
Input LOW Voltage[2]  
–0.5  
–1  
0.8  
+1  
+1  
–0.5  
–1  
0.8  
+1  
+1  
V
Input Load Current  
GND < VI < VCC  
µA  
µA  
IOZ  
Output Leakage  
Current  
GND < VI < VCC  
,
–1  
–1  
Output Disabled  
ICC  
VCC Operating  
Supply Current  
VCC = Max., IOUT = 0 mA,  
f = fMAX = 1/tRC  
60  
50  
mA  
mA  
ISB1  
Automatic CE  
Power-Down Current VIN > VIH or  
—TTL Inputs  
Max. VCC, CE > VIH  
10  
10  
10  
10  
L
L
V
IN < VIL, f = fMAX  
ISB2  
Automatic CE  
Max. VCC  
,
3.0  
1.2  
3.0  
1.2  
mA  
Power-Down Current CE > VCC – 0.3V,  
—CMOS Inputs IN > VCC – 0.3V,  
or VIN < 0.3V, f = 0  
V
Capacitance[3]  
Parameter  
Description  
Test Conditions  
Max.  
Unit  
CIN  
Input Capacitance  
Output Capacitance  
TA = 25°C, f = 1 MHz,  
VCC = 5.0V  
6
8
pF  
pF  
COUT  
Thermal Resistance[3]  
Parameter  
Description  
Test Conditions  
All - Packages  
Unit  
ΘJA  
Thermal Resistance  
Still Air, soldered on a 3 × 4.5 inch,  
two-layer printed circuit board  
TBD  
°C/W  
(Junction to Ambient)[3]  
ΘJC  
Thermal Resistance  
(Junction to Case)[3]  
TBD  
°C/W  
Notes:  
2. V (min.) = –2.0V and V (max) = V + 2V for pulse durations of less than 20 ns.  
IL  
IH  
CC  
3. Tested initially and after any design or process changes that may affect these parameters.  
Document #: 38-05464 Rev. *C  
Page 3 of 9  
PRELIMINARY  
CY7C1019D  
AC Test Loads and Waveforms  
10-ns Devices  
12 -ns Devices  
Z = 50Ω  
R1 480Ω  
OUTPUT  
5V  
OUTPUT  
50Ω  
30 pF*  
* CAPACITIVE LOAD CONSISTS  
OF ALL COMPONENTS OF THE  
TEST ENVIRONMENT  
R2  
255Ω  
30 pF  
1.5V  
INCLUDING  
JIG AND  
SCOPE  
(a)  
(b)  
THÉ  
Equivalent to:  
OUTPUT  
VENIN EQUIVALENT  
167Ω  
High-Z characteristics:  
1.73V  
R1 480Ω  
5V  
ALL INPUT PULSES  
3.0V  
GND  
OUTPUT  
90%  
10%  
90%  
10%  
R2  
255Ω  
5 pF  
INCLUDING  
JIG AND  
SCOPE  
3 ns  
3ns  
(c)  
Switching Characteristics Over the Operating Range [5]  
7C1019D-10  
7C1019D-12  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
Read Cycle  
[4]  
tpower  
VCC(typical) to the first access  
Read Cycle Time  
100  
10  
100  
12  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRC  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z  
OE HIGH to High Z[6, 7]  
CE LOW to Low Z[7]  
CE HIGH to High Z[6, 7]  
CE LOW to Power-Up  
CE HIGH to Power-Down  
10  
12  
tOHA  
tACE  
tDOE  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tPU  
3
3
10  
5
12  
6
0
3
0
0
3
0
5
5
6
6
tPD  
10  
12  
Write Cycle[8, 9]  
tWC  
tSCE  
tAW  
tHA  
Write Cycle Time  
10  
8
12  
9
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
WE Pulse Width  
7
8
0
0
tSA  
0
0
tPWE  
7
8
tSD  
Data Set-Up to Write End  
5
6
Notes:  
4. t  
gives the minimum amount of time that the power supply should be at typical V values until the first memory access can be performed.  
CC  
POWER  
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified  
I
/I and 30-pF load capacitance.  
OL OH  
6. t  
, t  
, and t  
are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ±200 mV from steady-state voltage.  
HZOE HZCE  
HZWE  
7. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
8. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of  
these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.  
9. The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of t  
and t  
.
SD  
HZWE  
Document #: 38-05464 Rev. *C  
Page 4 of 9  
PRELIMINARY  
CY7C1019D  
Switching Characteristics Over the Operating Range (continued)[5]  
7C1019D-10  
7C1019D-12  
Parameter  
tHD  
tLZWE  
tHZWE  
Description  
Data Hold from Write End  
WE HIGH to Low Z[7]  
Min.  
Max.  
Min.  
Max.  
Unit  
ns  
0
3
0
3
ns  
WE LOW to High Z[6, 7]  
5
6
ns  
Data Retention Characteristics Over the Operating Range  
Parameter  
VDR  
Description  
Conditions  
Min.  
Max.  
Unit  
V
VCC for Data Retention  
Data Retention Current  
VCC = VDR = 2.0V,  
CE > VCC – 0.3V,  
VIN > VCC – 0.3V or  
2.0  
ICCDR  
Non-L, Com’l/Ind’l  
L-Version Only  
3
mA  
mA  
ns  
1.2  
V
IN < 0.3V  
[3]  
tCDR  
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
[10]  
tR  
tRC  
ns  
Data Retention Waveform  
DATA RETENTION MODE  
> 2V  
4.5V  
4.5V  
V
V
CC  
DR  
t
t
R
CDR  
CE  
Switching Waveforms  
Read Cycle No. 1[11, 12]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2 (OE Controlled)[12, 13]  
ADDRESS  
t
RC  
CE  
t
ACE  
OE  
t
HZOE  
t
DOE  
t
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
ICC  
t
PU  
V
CC  
50%  
50%  
SUPPLY  
CURRENT  
ISB  
Notes:  
10. Full device operation requires linear V ramp from V to V  
> 50 µs or stable at V > 50 µs.  
CC(min.)  
CC  
DR  
CC(min.)  
11. Device is continuously selected. OE, CE = V .  
IL  
12. WE is HIGH for read cycle.  
13. Address valid prior to or coincident with CE transition LOW.  
Document #: 38-05464 Rev. *C  
Page 5 of 9  
PRELIMINARY  
CY7C1019D  
Switching Waveforms (continued)  
Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[14, 15]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
SCE  
t
t
HA  
AW  
t
PWE  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
Write Cycle No. 3 (WE Controlled, OE LOW)[15]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
t
HD  
SD  
NOTE 16  
DATA I/O  
DATA VALID  
t
t
LZWE  
HZWE  
Notes:  
14. Data I/O is high impedance if OE = V  
.
IH  
15. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.  
16. During this period the I/Os are in the output state and input signals should not be applied.  
Document #: 38-05464 Rev. *C  
Page 6 of 9  
PRELIMINARY  
CY7C1019D  
Truth Table  
CE  
H
X
OE  
WE  
X
I/O0–I/O7  
Mode  
Power  
X
X
L
High Z  
High Z  
Power-Down  
Power-Down  
Read  
Standby (ISB  
Standby (ISB  
Active (ICC  
Active (ICC  
Active (ICC  
)
X
)
L
H
Data Out  
Data In  
High Z  
)
L
X
H
L
Write  
)
L
H
Selected, Outputs Disabled  
)
Ordering Information  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY7C1019D-10VXC  
Package Type  
10  
V33  
V33  
32-Lead 400-Mil Molded SOJ (Pb-Free)  
32-Lead 400-Mil Molded SOJ (Pb-Free)  
32-Lead TSOP Type II (Pb-Free)  
Commercial  
Industrial  
CY7C1019D-10VXI  
CY7C1019D-10ZXC  
CY7C1019D-10ZXI  
CY7C1019D-12VXC  
CY7C1019D-12VXI  
CY7C1019D-12ZXC  
CY7C1019D-12ZXI  
ZS32  
ZS32  
V33  
Commercial  
Industrial  
32-Lead TSOP Type II (Pb-Free)  
12  
32-Lead 400-Mil Molded SOJ (Pb-Free)  
32-Lead 400-Mil Molded SOJ (Pb-Free)  
32-Lead TSOP Type II (Pb-Free)  
Commercial  
Industrial  
V33  
ZS32  
ZS32  
Commercial  
Industrial  
32-Lead TSOP Type II (Pb-Free)  
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts.  
Package Diagrams  
32-Lead (400-Mil) Molded SOJ V33  
51-85033-A  
51-85033-*B  
Document #: 38-05464 Rev. *C  
Page 7 of 9  
PRELIMINARY  
CY7C1019D  
Package Diagrams (continued)  
32-Lead  
TSOP II ZS32  
51-85095-**  
All product or company names mentioned in this document may be the trademarks of their respective holders.  
Document #: 38-05464 Rev. *C  
Page 8 of 9  
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
PRELIMINARY  
CY7C1019D  
Document History Page  
Document Title: CY7C1019D 1-Mbit (128K x 8) Static RAM (Preliminary)  
Document Number: 38-05464  
Orig. of  
REV.  
**  
ECN NO.  
201560  
233715  
Issue Date  
See ECN  
See ECN  
Change  
Description of Change  
SWI  
Advance Information data sheet for C9 IPP  
*A  
RKF  
DC parameters are modified as per EROS (Spec # 01-2165)  
Pb-free offering in the Ordering Information  
*B  
*C  
262950  
307598  
See ECN  
See ECN  
RKF  
RKF  
Added Tpower Spec in Switching Characteristics table  
Added Data Retention Characteristics table and waveforms  
Shaded Ordering Information  
Reduced Speed bins to -10 and -12 ns  
Document #: 38-05464 Rev. *C  
Page 9 of 9  

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