CY7C1021CV26_05 [CYPRESS]

1-Mbit (64K x 16) Static RAM; 1兆位( 64K ×16 )静态RAM
CY7C1021CV26_05
型号: CY7C1021CV26_05
厂家: CYPRESS    CYPRESS
描述:

1-Mbit (64K x 16) Static RAM
1兆位( 64K ×16 )静态RAM

文件: 总9页 (文件大小:183K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY7C1021CV26  
1-Mbit (64K x 16) Static RAM  
an automatic power-down feature that significantly reduces  
power consumption when deselected.  
Features  
• Temperature Range  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is  
written into the location specified on the address pins (A0  
through A15). If Byte High Enable (BHE) is LOW, then data  
from I/O pins (I/O9 through I/O16) is written into the location  
specified on the address pins (A0 through A15).  
— Automotive: –40°C to 125°C  
• High speed  
— tAA = 15 ns  
• Optimized voltage range: 2.5V–2.7V  
• Low active power: 360 mW (max.)  
• Automatic power-down when deselected  
• Independent control of upper and lower bits  
• CMOS for optimum speed/power  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O9 to I/O16. See  
the truth table at the end of this data sheet for a complete  
description of Read and Write modes.  
• Packages offered: 44-pin TSOP II and 44-Lead (400-Mil)  
Molded SOJ  
• Offered in both lead-free and non lead-free packages  
The input/output pins (I/O1 through I/O16) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE  
are disabled (BHE, BLE HIGH), or during a Write operation  
(CE LOW, and WE LOW).  
Functional Description  
The CY7C1021CV26 is a high-performance CMOS static  
RAM organized as 65,536 words by 16 bits. This device has  
Logic Block Diagram  
DATA IN DRIVERS  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
64K x 16  
I/O1–I/O8  
RAM Array  
512 X 2048  
I/O9–I/O16  
A0  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Selection Guide[1]  
CY7C1021CV26-15  
Unit  
ns  
Maximum Access Time  
15  
80  
10  
Maximum Operating Current  
Maximum CMOS Standby Current  
Note:  
mA  
mA  
1. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V = V  
, T = 25°C.  
A
CC  
CC(typ.)  
Cypress Semiconductor Corporation  
Document #: 38-05589 Rev. *A  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised March 7, 2005  
CY7C1021CV26  
Pin Configuration[2]  
TSOP II -Top View  
44  
1
A
4
A
5
43  
42  
41  
40  
39  
38  
A
A
2
3
4
5
6
3
6
A
A
2
7
OE  
A
1
BHE  
BLE  
I/O  
A
0
CE  
I/O  
7
1
16  
37  
36  
35  
34  
33  
I/O  
I/O  
8
I/O  
I/O  
2
3
15  
14  
13  
9
10  
11  
12  
13  
I/O  
V
SS  
I/O  
4
CC  
V
SS  
V
V
CC  
32  
I/O  
I/O  
I/O  
5
6
7
8
12  
11  
31  
30  
29  
28  
I/O  
I/O  
I/O  
14  
15  
16  
I/O  
10  
9
I/O  
WE 17  
NC  
18  
27  
26  
25  
A
A
8
15  
19  
A
A
14  
9
A
13  
20  
21  
22  
A
11  
10  
A
A
12  
24  
23  
NC  
NC  
Pin Definitions  
Pin Name  
A0–A15  
Pin Number  
I/O Type  
Description  
1–5, 18–21, Input  
24–27,  
42–44  
Address Inputs used to select one of the address locations.  
I/O1–I/O16  
7–10,  
Input/Output  
Bidirectional Data I/O lines. Used as input or output lines depending on  
operation.  
13–16,  
29–32,  
35–38  
NC  
22, 23, 28  
17  
No Connect  
Input/Control  
No Connects. This pin is not connected to the die.  
WE  
Write Enable Input, active LOW. When selected LOW, a Write is conducted.  
When selected HIGH, a Read is conducted.  
CE  
6
Input/Control  
Input/Control  
Input/Control  
Chip Enable Input, active LOW. When LOW, selects the chip. When HIGH,  
deselects the chip.  
BHE, BLE  
OE  
39, 40  
41  
Byte Write Select Inputs, active LOW. BLE controls I/O8–I/O1, BHE controls  
I/O16–I/O9.  
Output Enable, active LOW. Controls the direction of the I/O pins. When LOW,  
the I/O pins are allowed to behave as outputs. When deasserted HIGH, I/O pins  
are three-stated, and act as input data pins.  
VSS  
12, 34  
11, 33  
Ground  
Ground for the device. Should be connected to ground of the system.  
VCC  
Power Supply Power Supply inputs to the device.  
Note:  
2. NC pins are not connected on the die.  
Document #: 38-05589 Rev. *A  
Page 2 of 9  
CY7C1021CV26  
DC Input Voltage[3] ................................ –0.5V to VCC + 0.5V  
Current into Outputs (LOW)......................................... 20 mA  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .................................65°C to +150°C  
Latch-up Current......................................................>200 mA  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Supply Voltage on VCC to Relative GND[3] .... –0.5V to +4.6V  
Operating Range  
Ambient  
DC Voltage Applied to Outputs  
Range  
Automotive  
Temperature  
VCC  
in High-Z State[3] ......................................–0.5V to VCC+0.5V  
–40°C to +125°C  
2.5V–2.7V  
Electrical Characteristics Over the Operating Range  
CY7C1021CV26-15  
Parameter  
VOH  
VOL  
VIH  
Description  
Output HIGH Voltage  
Output LOW Voltage  
Test Conditions  
VCC = Min., IOH = –1.0 mA  
VCC = Min., IOL = 1.0 mA  
Min.  
Max.  
Unit  
V
2.3  
0.4  
VCC + 0.3  
0.8  
V
Input HIGH Voltage  
Input LOW Voltage[3]  
2.0  
–0.3  
–3  
V
VIL  
V
IIX  
Input Load Current  
GND < VI < VCC  
+3  
µA  
µA  
mA  
mA  
IOZ  
Output Leakage Current  
Output Short Circuit Current[4]  
VCC Operating Supply Current  
GND < VI < VCC, Output Disabled  
VCC = Max., VOUT = GND  
–3  
+3  
IOS  
–300  
80  
ICC  
VCC = Max., IOUT = 0 mA,  
f = fMAX = 1/tRC  
ISB1  
ISB2  
Automatic CE Power-Down  
Current —TTL Inputs  
Max. VCC, CE > VIH  
VIN > VIH or VIN < VIL, f = fMAX  
15  
10  
mA  
mA  
Automatic CE Power-Down  
Current —CMOS Inputs  
Max. VCC,  
CE > VCC – 0.3V, VIN > VCC – 0.3V,  
or VIN < 0.3V, f = 0  
Capacitance[5]  
Parameter  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
Max.  
Unit  
pF  
CIN  
TA = 25°C, f = 1 MHz,  
CC = 2.6V  
8
8
V
COUT  
pF  
Thermal Resistance[5]  
44-lead  
TSOP-II  
Parameter  
Description  
Test Conditions  
Unit  
ΘJA  
Thermal Resistance  
Still Air, soldered on a 3 × 4.5 inch, two-layer  
printed circuit board  
76.92  
°C/W  
(Junction to Ambient)[5]  
ΘJC  
Thermal Resistance  
(Junction to Case)[5]  
15.86  
°C/W  
Notes:  
3. V (min.) = –2.0V and V (max) = V + 0.5V for pulse durations of less than 20 ns.  
IL  
IH  
CC  
4. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.  
5. Tested initially and after any design or process changes that may affect these parameters.  
Document #: 38-05589 Rev. *A  
Page 3 of 9  
CY7C1021CV26  
AC Test Loads and Waveforms[6]  
R1  
ALL INPUT PULSES  
2.6V  
GND  
1830  
90%  
10%  
90%  
10%  
2.6 V  
OUTPUT  
R2  
30 pF  
1976Ω  
Fall Time: 1 V/ns  
Rise Time: 1 V/ns  
INCLUDING  
JIG AND  
(b)  
SCOPE  
(a)  
2.6V  
OUTPUT  
High-Z characteristics:  
R 317  
5 pF  
R2  
351Ω  
(c)  
Switching Characteristics Over the Operating Range[7]  
CY7C1021CV26-15  
Parameter  
Read Cycle  
tRC  
Description  
Min.  
Max.  
Unit  
Read Cycle Time  
15  
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low-Z[8]  
OE HIGH to High-Z[8, 9]  
CE LOW to Low-Z[8]  
CE HIGH to High-Z[8, 9]  
CE LOW to Power-Up  
CE HIGH to Power-Down  
Byte Enable to Data Valid  
Byte Enable to Low-Z  
Byte Disable to High-Z  
15  
tOHA  
tACE  
15  
7
tDOE  
tLZOE  
0
3
0
tHZOE  
7
7
tLZCE  
tHZCE  
[10]  
tPU  
[10]  
tPD  
15  
7
tDBE  
tLZBE  
0
tHZBE  
7
Write Cycle[11]  
tWC  
tSCE  
tAW  
tHA  
Write Cycle Time  
15  
10  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
WE Pulse Width  
tSA  
0
tPWE  
tSD  
10  
8
Data Set-Up to Write End  
Data Hold from Write End  
tHD  
0
Notes:  
6. AC characteristics (except High-Z) are tested using the Thevenin load shown in Figure (a). High-Z characteristics are tested for all speeds using the test load  
shown in Figure (c).  
7. Test conditions assume signal transition time of 2.6 ns or less, timing reference levels of 1.3V, input pulse levels of 0 to 2.6V.  
8. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
9. t  
, t  
, t  
, and t  
are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.  
HZOE HZBE HZCE  
HZWE  
10. This parameter is guaranteed by design and is not tested.  
11. The internal Write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE/BLE LOW. CE, WE and BHE/BLE must be LOW to initiate a Write,  
and the transition of these signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the Write.  
Document #: 38-05589 Rev. *A  
Page 4 of 9  
CY7C1021CV26  
Switching Characteristics Over the Operating Range[7] (continued)  
CY7C1021CV26-15  
Parameter  
tLZWE  
tHZWE  
tBW  
Description  
WE HIGH to Low-Z[8]  
WE LOW to High-Z[8, 9]  
Min.  
Max.  
Unit  
ns  
3
7
ns  
Byte Enable to End of Write  
9
ns  
Switching Waveforms  
Read Cycle No. 1[12, 13]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2 (OE Controlled)[13, 14]  
ADDRESS  
t
RC  
CE  
t
ACE  
OE  
t
HZOE  
t
DOE  
BHE, BLE  
t
LZOE  
t
HZCE  
t
DBE  
t
LZBE  
t
HZBE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
VCC  
SUPPLY  
CURRENT  
DATA VALID  
t
LZCE  
t
PD  
I
CC
t
PU  
50%  
50%  
I
SB  
Notes:  
12. Device is continuously selected. OE, CE, BHE and/or BLE = V .  
IL  
13. WE is HIGH for Read cycle.  
14. Address valid prior to or coincident with CE transition LOW.  
Document #: 38-05589 Rev. *A  
Page 5 of 9  
CY7C1021CV26  
Switching Waveforms (continued)  
Write Cycle No. 1 (CE Controlled)[15, 16]  
t
WC  
ADDRESS  
t
SA  
t
SCE  
CE  
t
AW  
t
HA  
t
PWE  
WE  
t
BW  
BHE, BLE  
t
t
SD  
HD  
DATA I/O  
Write Cycle No. 2 (BLE or BHE Controlled)  
t
WC  
ADDRESS  
t
SA  
t
BW  
BHE, BLE  
t
AW  
t
HA  
t
PWE  
WE  
CE  
t
SCE  
t
t
SD  
HD  
DATA I/O  
Notes:  
15. Data I/O is high-impedance if OE or BHE and/or BLE= V  
.
IH  
16. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.  
Document #: 38-05589 Rev. *A  
Page 6 of 9  
CY7C1021CV26  
Switching Waveforms (continued)  
Write Cycle No. 3 (WE Controlled, LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
AW  
t
HA  
t
SA  
t
PWE  
WE  
t
BW  
BHE, BLE  
t
HZWE  
t
t
SD  
HD  
DATA I/O  
t
LZWE  
Truth Table  
CE OE WE BLE BHE  
I/O1–I/O8  
High-Z  
I/O9–I/O16  
Mode  
Power  
H
L
X
L
X
H
X
L
X
L
High-Z  
Data Out  
High-Z  
Data Out  
Data In  
High-Z  
Data In  
High-Z  
High-Z  
Power-down  
Read – All bits  
Standby (ISB  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
)
Data Out  
Data Out  
High-Z  
)
L
H
L
Read – Lower bits only  
Read – Upper bits only  
Write – All bits  
)
H
L
)
L
X
L
L
Data In  
Data In  
High-Z  
High-Z  
High-Z  
)
L
H
L
Write – Lower bits only  
Write – Upper bits only  
)
H
X
H
)
L
L
H
X
H
X
X
H
Selected, Outputs Disabled  
Selected, Outputs Disabled  
)
)
Ordering Information  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY7C1021CV26-15ZSE  
Package Type  
15  
Z44  
V34  
Z44  
44-lead TSOP Type II  
Automotive  
CY7C1021CV26-15VXE  
CY7C1021CV26-15ZSXE  
44-pin (400-Mil) Molded SOJ (Pb-Free)  
44-lead TSOP Type II (Pb-Free)  
Document #: 38-05589 Rev. *A  
Page 7 of 9  
CY7C1021CV26  
Package Diagrams  
44-pin TSOP II Z44  
51-85087-*A  
44-Lead (400-Mil) Molded SOJ V34  
51-85082-*B  
All products and company names mentioned in this document are the trademarks of their respective holders.  
Document #: 38-05589 Rev. *A  
Page 8 of 9  
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
CY7C1021CV26  
Document History Page  
Document Title: CY7C1021CV26 1-Mbit (64K x 16) Static RAM  
Document Number: 38-05589  
Orig. of  
REV.  
**  
ECN NO. Issue Date Change  
Description of Change  
New datasheet for Automotive  
Added Lead-Free Product Information  
Included the 44-Lead (400-Mil) Molded SOJ V34 Package  
238454  
335861  
See ECN  
See ECN  
RKF  
SYT  
*A  
Document #: 38-05589 Rev. *A  
Page 9 of 9  

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