CY7C1046BN-15VCT [CYPRESS]

Standard SRAM, 1MX4, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32;
CY7C1046BN-15VCT
型号: CY7C1046BN-15VCT
厂家: CYPRESS    CYPRESS
描述:

Standard SRAM, 1MX4, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32

静态存储器 光电二极管 内存集成电路
文件: 总9页 (文件大小:275K)
中文:  中文翻译
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CY7C1046BN  
1M x 4 Static RAM  
You write to the device by taking Chip Enable (CE) and Write  
Enable (WE) inputs LOW. Data on the four IO pins (IO0  
Features  
• Low active power  
through IO3) is then written into the location specified on the  
address pins (A0 through A19).  
— 825 mW (max)  
• Low CMOS standby power  
You read from the device by taking Chip Enable (CE) and  
Output Enable (OE) LOW while forcing Write Enable (WE)  
HIGH. Under these conditions, the contents of the memory  
location specified by the address pins appears on the IO pins.  
— 44 mW (max)  
• 2.0V data retention (400 μW at 2.0V retention)  
• Automatic power down when deselected  
• TTL-compatible inputs and outputs  
• Easy memory expansion with CE and OE features  
• Available in non Pb-free 400 mil wide 32-pin SOJ package  
The four input and output pins (IO0 through IO3) are placed in  
a high impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or when the write  
operation is active (CE LOW, and WE LOW).  
Functional Description  
The CY7C1046BN is available in a standard 400-mil-wide  
32-pin SOJ package with center power and ground (revolu-  
tionary) pinout.  
The CY7C1046BN is a high performance CMOS static RAM  
organized as 1,048,576 words by 4 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and tri-state drivers.  
Logic Block Diagram  
Pin Configuration  
SOJ  
TOP VIEW  
A
A
32  
31  
30  
29  
1
2
3
4
5
6
A
0
1
19  
A
A
A
A
18  
17  
16  
15  
A
2
A
A
3
4
INPUT BUFFER  
A
1
0
28  
27  
A
CE  
OE  
A
2
IO  
26  
25  
IO  
GND  
7
8
IO  
0
3
0
A
3
V
CC  
A
4
24  
23  
GND  
IO  
1
WE  
9
10  
11  
V
A
CC  
IO  
IO  
IO  
5
1
2
3
1M x 4  
IO  
A
2
6
ARRAY  
22  
21  
20  
A
A
7
14  
A
A
8
A
5
12  
13  
14  
15  
16  
13  
A
9
A
A
12  
6
A
10  
19  
18  
17  
A
7
A
11  
A
A
8
10  
A
9
NC  
POWER  
DOWN  
COLUMN  
DECODER  
CE  
WE  
1046B–1  
1046B–2  
OE  
Selection Guide  
7C1046BN-15  
Maximum Access Time (ns)  
15  
150  
8
Maximum Operating Current (mA)  
Maximum CMOS Standby Current (mA)  
Cypress Semiconductor Corporation  
Document #: 001-11924 Rev. **  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 30, 2006  
CY7C1046BN  
Current into Outputs (LOW)......................................... 20 mA  
Maximum Ratings  
Static Discharge Voltage............................................>2001V  
(in accordance with MIL-STD-883, Method 3015)  
Exceeding maximum ratings may impair the useful life of the  
device. User guidelines are not tested.  
Latch-Up Current.....................................................>200 mA  
Storage Temperature .................................65°C to +150°C  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Operating Range  
Supply Voltage on VCC Relative to GND[1] .... –0.5V to +7.0V  
Ambient  
Range  
VCC  
Temperature[2]  
DC Voltage Applied to Outputs  
in High-Z State[1] ....................................–0.5V to VCC + 0.5V  
Commercial  
0°C to +70°C  
4.5V–5.5V  
DC Input Voltage[1].................................–0.5V to VCC + 0.5V  
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Test Conditions  
7C1046BN-15  
Min  
Max  
Unit  
VOH  
VOL  
VIH  
VIL  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
VCC = Min, IOH = –4.0 mA  
VCC = Min, IOL = 8.0 mA  
2.4  
V
V
0.4  
VCC + 0.3  
0.8  
2.2  
–0.3  
–1  
V
Input LOW Voltage[1]  
V
IIX  
Input Load Current  
GND < VI < VCC  
+1  
mA  
mA  
mA  
mA  
IOZ  
ICC  
ISB1  
Output Leakage Current  
VCC Operating Supply Current  
GND < VOUT < VCC, Output Disabled  
VCC = Max, f = fMAX = 1/tRC  
–1  
+1  
150  
Automatic CE Power Down  
Current – TTL Inputs  
Max VCC, CE > VIH, VIN > VIH or  
VIN < VIL, f = fMAX  
20  
ISB2  
Automatic CE Power Down  
Current – CMOS Inputs  
Max VCC, CE > VCC – 0.3V,  
VIN > VCC – 0.3V, or VIN < 0.3V, f = 0  
8
mA  
Capacitance[3]  
Parameter  
Description  
Input Capacitance  
IO Capacitance  
Test Conditions  
Max  
Unit  
pF  
CIN  
TA = 25°C, f = 1 MHz,  
VCC = 5.0V  
6
6
COUT  
pF  
Notes  
1.  
V (min) = –2.0V for pulse durations of less than 20 ns.  
IL  
2. T is the “Instant On” case temperature.  
A
3. Tested initially and after any design or process changes that may affect these parameters.  
Document #: 001-11924 Rev. **  
Page 2 of 9  
CY7C1046BN  
AC Test Loads and Waveforms  
ALL INPUT PULSES  
90%  
10%  
Ω
R1 481Ω  
R1 481  
Vcc  
5V  
5V  
OUTPUT  
90%VCC  
10%VCC  
OUTPUT  
GND  
R2  
R2  
255Ω  
30 pF  
5 pF  
255 Ω  
INCLUDING  
JIG AND  
SCOPE  
INCLUDING  
JIG AND  
SCOPE  
Rise Time:1 V/ns  
Fall Time:1 V/ns  
1046B–4  
(b)  
1046B–3  
(a)  
THÉ  
VENIN EQUIVALENT  
Equivalent to:  
167Ω  
1.73V  
OUTPUT  
Switching Characteristics (over the operating range)[4]  
7C1046BN-15  
Parameter  
READ CYCLE  
tpower  
tRC  
Description  
Min  
Max  
Unit  
VCC(typ) to the First Access[5]  
1
μs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Read Cycle Time  
15  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low-Z[7]  
15  
tOHA  
3
tACE  
15  
7
tDOE  
tLZOE  
0
3
0
tHZOE  
tLZCE  
tHZCE  
tPU  
OE HIGH to High-Z[6, 7]  
CE LOW to Low-Z[7]  
7
7
CE HIGH to High-Z[6, 7]  
CE LOW to Power Up  
CE HIGH to Power Down  
tPD  
15  
Notes  
4. Test conditions are based on signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the  
specified I /I and 30-pF load capacitance.  
OL OH  
5. This part has a voltage regulator which steps down the voltage from 5V to 3.3V internally. t  
initially before a Read or Write operation can be initiated.  
is the time that the power needs to be supplied above V (typ)  
CC  
POWER  
6.  
t
, t  
, and t  
are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.  
HZOE HZCE  
HZWE  
7. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
Document #: 001-11924 Rev. **  
Page 3 of 9  
CY7C1046BN  
Switching Characteristics (over the operating range)[4] (continued)  
7C1046BN-15  
Parameter  
Description  
Min  
Max  
Unit  
WRITE CYCLE[8, 9]  
tWC  
tSCE  
tAW  
Write Cycle Time  
CE LOW to Write End  
15  
10  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Setup to Write End  
Address Hold from Write End  
Address Setup to Write Start  
WE Pulse Width  
tHA  
tSA  
0
tPWE  
tSD  
10  
8
Data Setup to Write End  
Data Hold from Write End  
WE HIGH to Low-Z[7]  
tHD  
0
tLZWE  
tHZWE  
3
WE LOW to High-Z[6, 7]  
7
Data Retention Characteristics (over the operating range)  
Parameter  
VDR  
Description  
VCC for Data Retention  
Conditions[10]  
Min  
Max  
Unit  
2.0  
V
ICCDR  
Data Retention Current  
Com’l  
VCC = VDR = 2.0V,  
CE > VCC – 0.3V  
VIN > VCC – 0.3V or VIN < 0.3V  
200  
μA  
ns  
μs  
[3]  
tCDR  
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
tR  
200  
Data Retention Waveform  
DATA RETENTION MODE  
> 2V  
3.0V  
3.0V  
V
VCC  
CE  
DR  
t
t
R
CDR  
1046B–5  
Notes  
8. The internal memory write time is defined by the overlap of CELOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of these signals  
can terminate the write. The input data setup and hold timing must be referenced to the leading edge of the signal that terminates the write.  
9. The minimum write cycle time for write cycle 3 (WE controlled, OE LOW) is the sum of t  
and t  
.
HZWE  
SD  
10. No input may exceed V + 0.5V.  
CC  
Document #: 001-11924 Rev. **  
Page 4 of 9  
CY7C1046BN  
Switching Waveforms  
Read Cycle 1[11, 12]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
1046B–6  
Read Cycle 2 (OE controlled)[12, 13]  
ADDRESS  
CE  
t
RC  
t
ACE  
OE  
t
HZOE  
t
DOE  
t
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
ICC  
V
t
PU  
CC  
50%  
50%  
SUPPLY  
CURRENT  
ISB  
1046B–7  
Notes  
11. Device is continuously selected. OE, CE = V .  
IL  
12. WE is HIGH for read cycle.  
13. Address valid before or similar to CE transition LOW.  
Document #: 001-11924 Rev. **  
Page 5 of 9  
CY7C1046BN  
Switching Waveforms (continued)  
Write Cycle 1 (CE controlled)[14, 15]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
SCE  
t
t
HA  
AW  
t
PWE  
WE  
t
t
HD  
SD  
DATA VALID  
DATA IO  
1046B–8  
Write Cycle 2 (WE controlled, OE HIGH during write)[14, 15]  
t
WC  
ADDRESS  
t
SCE  
CE  
t
t
HA  
AW  
t
t
PWE  
SA  
WE  
OE  
t
t
SD  
HD  
DATA VALID  
DATA IO  
IN  
NOTE 16  
t
HZOE  
1046B–9  
Notes  
14. Data IO is high impedance if OE = V  
.
IH  
15. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state.  
16. During this period the IOs are in the output state and input signals must not be applied.  
Document #: 001-11924 Rev. **  
Page 6 of 9  
CY7C1046BN  
Switching Waveforms (continued)  
Write Cycle 3 (WE controlled, OE LOW)[15]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
t
HD  
SD  
NOTE 16  
DATA VALID  
DATA IO  
t
t
LZWE  
HZWE  
1046B–10  
Ordering Information  
Speed  
(ns)  
Package  
Diagram  
Operating  
Range  
Package Type  
Ordering Code  
15  
CY7C1046BN-15VC  
51-85033  
32-Pin (400-Mil) Molded SOJ  
Commercial  
Document #: 001-11924 Rev. **  
Page 7 of 9  
CY7C1046BN  
Package Diagram  
Figure 1. 32-pin (400-Mil) Molded SOJ, 51-85033  
51-85033-*B  
All products and company names mentioned in this document may be the trademarks of their respective holders.  
Document #: 001-11924 Rev. **  
Page 8 of 9  
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
CY7C1046BN  
Document History Page  
Document Title: CY7C1046BN 1M x 4 Static RAM  
Document Number: 001-11924  
Orig. of  
Change  
REV.  
ECN NO. Issue Date  
Description of Change  
**  
610496  
See ECN NXR  
New data sheet  
Document #: 001-11924 Rev. **  
Page 9 of 9  

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