CY7C1049CV33-12VXI [CYPRESS]

4-Mbit (512K x 8) Static RAM; 4兆位( 512K ×8)静态RAM
CY7C1049CV33-12VXI
型号: CY7C1049CV33-12VXI
厂家: CYPRESS    CYPRESS
描述:

4-Mbit (512K x 8) Static RAM
4兆位( 512K ×8)静态RAM

存储 内存集成电路 静态存储器 光电二极管
文件: 总11页 (文件大小:207K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY7C1049CV33  
4-Mbit (512K x 8) Static RAM  
Features  
Functional Description[1]  
• Temperature Ranges  
The CY7C1049CV33 is a high-performance CMOS Static  
RAM organized as 524,288 words by 8 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and three-state drivers.  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O  
pins (I/O0 through I/O7) is then written into the location  
specified on the address pins (A0 through A18).  
— Commercial: 0°C to 70°C  
— Industrial: –40°C to 85°C  
— Automotive: –40°C to 125°C  
• High speed  
— tAA = 10 ns  
• Low active power  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
— 324 mW (max.)  
• 2.0V data retention  
• Automatic power-down when deselected  
• TTL-compatible inputs and outputs  
• Easy memory expansion with CE and OE features  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a Write  
operation (CE LOW, and WE LOW).  
The CY7C1049CV33 is available in standard 400-mil-wide  
36-pin SOJ package and 44-pin TSOP II package with center  
power and ground (revolutionary) pinout.  
Logic Block Diagram  
Pin Configuration  
SOJ  
Top View  
TSOP II  
Top View  
A0  
A1  
36  
35  
34  
33  
1
NC  
A18  
A17  
A16  
A15  
44  
1
NC  
NC  
NC  
NC  
NC  
A18  
A17  
A16  
A15  
OE  
I/O  
2
3
4
43  
42  
41  
40  
39  
38  
2
3
4
5
6
A2  
A
0
A
A3  
A4  
1
2
A
32  
5
I/O  
0
A3  
A4  
CE  
I/O0  
I/O1  
VCC  
INPUT BUFFER  
31  
30  
29  
28  
6
OE  
I/O7  
I/O6  
7
A
37  
36  
35  
34  
33  
7
8
9
10  
11  
12  
13  
0
CE  
I/O  
8
I/O  
I/O  
1
A
1
9
0
7
A
2
10  
11  
12  
13  
I/O  
I/O  
GND  
1
6
SS  
2
A
3
V
V
CC  
27  
26  
25  
A
GND  
I/O2  
I/O3  
WE  
VCC  
I/O5  
I/O4  
A14  
A13  
A12  
4
V
V
SS  
CC  
A
6
5
I/O  
I/O  
I/O  
I/O  
3
4
5
512K x 8  
ARRAY  
32  
I/O  
I/O  
2
5
A
31  
30  
29  
28  
I/O  
4
A14  
A13  
I/O  
14  
15  
16  
17  
18  
19  
20  
21  
22  
3
A
7
24  
23  
22  
21  
20  
WE  
A5  
A6  
A
8
9
A
A5  
A6  
A7  
A8  
A9  
14  
15  
16  
17  
18  
A12  
A
10  
27  
26  
25  
A
11  
A
7
A11  
A10  
NC  
A
A
8
10  
6
7
POWER  
DOWN  
A
NC  
NC  
9
COLUMN  
DECODER  
CE  
NC  
NC  
24  
23  
19  
NC  
I/O  
WE  
OE  
Notes:  
1. For guidelines on SRAM system design, please refer to the System Design Guidelines Cypress application note, available on the internet at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05006 Rev. *E  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised March 29, 2005  
CY7C1049CV33  
Selection Guide  
-8  
8
-10  
10  
90  
100  
-
-12  
12  
85  
95  
-
-15  
15  
80  
90  
95  
10  
15  
-20  
20  
80  
90  
-
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Commercial  
Industrial  
100  
110  
-
mA  
mA  
mA  
mA  
mA  
Automotive  
Maximum CMOS Standby Current Commercial / Industrial  
10  
-
10  
-
10  
-
10  
-
Automotive  
Shaded areas contain advance information.  
Pin Definitions  
36-SOJ  
44 TSOP-II  
Pin Name Pin Number Pin Number  
I/O Type  
Description  
Address Inputs used to select one of the address locations.  
A0–A18 1–5,14–18, 3–7,16–20,  
20–24,32–35 26–30,38–41  
I/O0–I/O7 7,8,11,12,25, 9,10,13,14,  
Input  
Input/Output Bidirectional Data I/O lines. Used as input or output lines  
26,29,30  
31,32,35,36  
depending on operation  
NC[2]  
19,36  
1,2,21,22,23, No Connect No Connects. This pin is not connected to the die  
24,25,42,43,  
44  
WE  
CE  
OE  
13  
6
15  
8
Input/Control Write Enable Input, active LOW. When selected LOW, a WRITE is  
conducted. When selected HIGH, a READ is conducted.  
Input/Control Chip Enable Input, active LOW. When LOW, selects the chip. When  
HIGH, deselects the chip.  
31  
37  
Input/Control Output Enable, active LOW. Controls the direction of the I/O pins.  
When LOW, the I/O pins are allowed to behave as outputs. When  
deasserted HIGH, I/O pins are three-stated, and act as input data  
pins.  
VSS, GND  
10,28  
9,27  
12,34  
11,33  
Ground  
Ground for the device. Should be connected to ground of the  
system.  
VCC  
Power Supply Power Supply inputs to the device.  
Notes:  
2. NC pins are not connected on the die.  
Document #: 38-05006 Rev. *E  
Page 2 of 11  
CY7C1049CV33  
Input Voltage[3] ...................................... –0.5V to VCC + 0.5V  
Current into Outputs (LOW)......................................... 20 mA  
Operating Range  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Storage Temperature .................................65°C to +150°C  
Range  
Commercial  
Industrial  
Ambient Temperature  
0°C to +70°C  
VCC  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Supply Voltage on VCC to Relative GND[3]–0.5V to +4.6VDC  
3.3V ± 0.3V  
–40°C to +85°C  
–40°C to +125°C  
Automotive  
Voltage Applied to Outputs  
in High-Z State[3] ....................................–0.5V to VCC + 0.5V  
Electrical Characteristics Over the Operating Range  
-8  
-10  
-12  
Parameter  
VOH  
Description  
Test Conditions  
Min. Max. Min. Max. Min. Max. Unit  
Output HIGH Voltage VCC = Min.; IOH = –4.0 mA  
Output LOW Voltage VCC = Min.,; IOL = 8.0 mA  
Input HIGH Voltage  
2.4  
2.4  
2.4  
V
V
V
VOL  
0.4  
0.4  
0.4  
VIH  
2.0  
VCC  
2.0  
VCC  
2.0  
VCC  
+ 0.3  
+ 0.3  
+ 0.3  
VIL  
IIX  
Input LOW Voltage[3]  
–0.3  
–1  
0.8  
+1  
+1  
–0.3  
–1  
0.8  
+1  
+1  
–0.3  
–1  
0.8  
+1  
+1  
V
Input Load Current  
GND < VI < VCC  
Com’l/Ind’l  
Com’l/Ind’l  
µA  
µA  
IOZ  
Output Leakage  
Current  
GND < VOUT < VCC  
Output Disabled  
,
–1  
–1  
–1  
ICC  
VCC Operating  
Supply Current  
VCC = Max.,  
f = fMAX = 1/tRC  
Com’l  
100  
110  
40  
90  
100  
40  
85  
95  
40  
mA  
mA  
mA  
Ind’l  
ISB1  
Automatic CE  
Max. VCC, CE > VIH;  
Com’l/Ind’l  
Power-down Current  
—TTL Inputs  
V
IN > VIH or  
VIN < VIL, f = fMAX  
ISB2  
Automatic CE  
Max. VCC  
,
Com’l/Ind’l  
10  
10  
10  
mA  
Power-down Current CE > VCC – 0.3V,  
—CMOS Inputs IN > VCC – 0.3V,  
or VIN < 0.3V, f = 0  
V
Electrical Characteristics Over the Operating Range  
-15  
-20  
Parameter  
VOH  
Description  
Test Conditions  
Min.  
Max.  
Min.  
2.4  
Max.  
Unit  
V
Output HIGH Voltage VCC = Min.; IOH = –4.0 mA  
2.4  
VOL  
VIH  
VIL  
IIX  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage[3]  
Input Load Current  
VCC = Min.,; IOL = 8.0 mA  
0.4  
0.4  
V
2.0 VCC + 0.3 2.0 VCC + 0.3  
V
–0.3  
–1  
0.8  
+1  
–0.3  
–1  
-
0.8  
+1  
-
V
GND < VI < VCC  
Com’l / Ind’l  
µA  
µA  
µA  
µA  
mA  
mA  
mA  
Automotive  
Com’l / Ind’l  
Automotive  
Com’l  
–20  
–1  
+20  
+1  
IOZ  
Output Leakage  
Current  
GND < VOUT < VCC  
Output Disabled  
,
–1  
-
+1  
-
–20  
+20  
80  
ICC  
VCC Operating  
Supply Current  
VCC = Max.,  
f = fMAX = 1/tRC  
80  
90  
-
Ind’l  
90  
Automotive  
95  
Note:  
3. V (min.) = –2.0V and V (max) = V + 0.5V for pulse durations of less than 20 ns.  
IL  
IH  
CC  
Document #: 38-05006 Rev. *E  
Page 3 of 11  
CY7C1049CV33  
Electrical Characteristics Over the Operating Range (continued)  
-15  
-20  
Parameter  
ISB1  
Description  
Automatic CE  
Power-down Current  
—TTL Inputs  
Test Conditions  
Max. VCC, CE > VIH; Com’l / Ind’l  
Min.  
Max.  
40  
Min.  
Max.  
40  
Unit  
mA  
V
IN > VIH or  
IN < VIL, f = fMAX  
Automotive  
45  
-
mA  
V
ISB2  
Automatic CE  
Power-down Current  
—CMOS Inputs  
Max. VCC  
,
Com’l/Ind’l  
Automotive  
10  
15  
10  
-
mA  
mA  
CE > VCC – 0.3V,  
VIN > VCC – 0.3V,  
or VIN < 0.3V, f = 0  
Thermal Resistance[4]  
36-pin SOJ 36-pin SOJ 44-TSOP-II 44-TSOP-II  
(Non Pb-Free) (Pb-Free) (Non Pb-Free) (Pb-Free) Unit  
Parameter  
Description  
Test Conditions  
ΘJA  
Thermal Resistance  
(Junction to Ambient) standard test methods  
Test conditions follow  
46.51  
46.51  
41.66  
41.66  
°C/W  
and procedures for  
ΘJC  
Thermal Resistance  
18.8  
18.8  
10.56  
10.56  
°C/W  
measuring thermal  
(Junction to Case)  
impedance, per EIA /  
JESD51.  
Capacitance[4]  
Parameter  
Description  
Input Capacitance  
I/O Capacitance  
Test Conditions  
Max.  
Unit  
CIN  
TA = 25°C, f = 1 MHz,  
CC = 3.3V  
8
8
pF  
pF  
V
COUT  
AC Test Loads and Waveforms[5]  
12-, 15-, 20-ns devices:  
8-, 10-ns devices:  
R 317  
Z = 50  
3.3V  
OUTPUT  
30 pF  
OUTPUT  
50Ω  
30 pF*  
R2  
351Ω  
* CAPACITIVE LOAD CONSISTS  
OF ALL COMPONENTS OF THE  
TEST ENVIRONMENT  
1.5V  
(a)  
(b)  
High-Z characteristics:  
R 317Ω  
ALL INPUT PULSES  
3.3V  
3.0V  
90%  
10%  
90%  
10%  
OUTPUT  
R2  
351Ω  
5 pF  
GND  
(c)  
(d)  
Fall Time: 1 V/ns  
Rise Time: 1 V/ns  
Notes:  
4. Tested initially and after any design or process changes that may affect these parameters.  
5. AC characteristics (except High-Z) for all 8-ns and 10-ns parts are tested using the load conditions shown in Figure (a). All other speeds are tested using the  
Thevenin load shown in Figure (b). High-Z characteristics are tested for all speeds using the test load shown in Figure (d).  
Document #: 38-05006 Rev. *E  
Page 4 of 11  
CY7C1049CV33  
AC Switching Characteristics Over the Operating Range [6]  
-8  
-10  
-12  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
Read Cycle  
[7]  
tpower  
VCC(typical) to the first access  
Read Cycle Time  
1
8
1
1
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRC  
10  
12  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low-Z  
OE HIGH to High-Z[8, 9]  
CE LOW to Low-Z[9]  
CE HIGH to High-Z[8, 9]  
CE LOW to Power-up  
CE HIGH to Power-down  
8
10  
12  
tOHA  
tACE  
tDOE  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tPU  
3
3
3
8
4
10  
5
12  
6
0
3
0
0
3
0
0
3
0
4
4
8
5
5
6
6
tPD  
10  
12  
Write Cycle[10, 11]  
tWC  
tSCE  
tAW  
Write Cycle Time  
8
6
6
0
0
6
4
0
3
10  
7
12  
8
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-up to Write End  
Address Hold from Write End  
Address Set-up to Write Start  
WE Pulse Width  
7
8
tHA  
0
0
tSA  
0
0
tPWE  
tSD  
7
8
Data Set-up to Write End  
Data Hold from Write End  
WE HIGH to Low-Z[9]  
5
6
tHD  
0
0
tLZWE  
tHZWE  
3
3
WE LOW to High-Z[8, 9]  
4
5
6
Shaded areas contain advance information.  
AC Switching Characteristics Over the Operating Range [6]  
-15  
-20  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
Read Cycle  
[7]  
tpower  
VCC(typical) to the first access  
Read Cycle Time  
1
1
µs  
ns  
ns  
ns  
ns  
ns  
tRC  
15  
20  
tAA  
Address to Data Valid  
15  
3
20  
3
tOHA  
tACE  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
15  
7
20  
8
tDOE  
Notes:  
6. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V.  
7. t  
8. t  
gives the minimum amount of time that the power supply should be at stable, typical V values until the first memory access can be performed.  
POWER  
CC  
, t  
, and t  
are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.  
HZOE HZCE  
HZWE  
9. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
10. The internal Write time of the memory is defined by the overlap of CELOW, and WE LOW. CE and WE must be LOW to initiate a Write, and the transition of either  
of these signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the Write.  
11. The minimum Write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of t  
and t  
.
SD  
HZWE  
Document #: 38-05006 Rev. *E  
Page 5 of 11  
CY7C1049CV33  
AC Switching Characteristics Over the Operating Range (continued)[6]  
-15  
-20  
Parameter  
tLZOE  
tHZOE  
tLZCE  
Description  
Min.  
Max.  
7
Min.  
Max.  
8
Unit  
ns  
OE LOW to Low-Z  
0
0
OE HIGH to High-Z[8, 9]  
CE LOW to Low-Z[9]  
CE HIGH to High-Z[8, 9]  
CE LOW to Power-up  
CE HIGH to Power-down  
ns  
3
0
3
0
ns  
tHZCE  
tPU  
7
8
ns  
ns  
tPD  
15  
20  
ns  
Write Cycle[10, 11]  
tWC  
tSCE  
tAW  
Write Cycle Time  
15  
10  
10  
0
20  
10  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-up to Write End  
Address Hold from Write End  
Address Set-up to Write Start  
WE Pulse Width  
tHA  
tSA  
0
0
tPWE  
tSD  
10  
7
10  
8
Data Set-up to Write End  
Data Hold from Write End  
WE HIGH to Low-Z[9]  
tHD  
0
0
tLZWE  
tHZWE  
3
3
WE LOW to High-Z[8, 9]  
7
8
Switching Waveforms  
Read Cycle No. 1[12, 13]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Notes:  
12. Device is continuously selected. OE, CE = V .  
IL  
13. WE is HIGH for Read cycle.  
Document #: 38-05006 Rev. *E  
Page 6 of 11  
CY7C1049CV33  
Switching Waveforms (continued)  
Read Cycle No. 2 (OE Controlled)[13, 14]  
ADDRESS  
CE  
t
RC  
t
ACE  
OE  
t
HZOE  
t
DOE  
t
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
ICC  
t
PU  
VCC  
SUPPLY  
CURRENT  
50%  
50%  
ISB  
Write Cycle No. 1(WE Controlled, OE HIGH During Write)[15, 16]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
t
PWE  
SA  
WE  
OE  
t
t
SD  
HD  
DATA VALID  
DATA I/O  
IN  
NOTE 17  
t
HZOE  
Notes:  
14. Address valid prior to or coincident with CE transition LOW.  
15. Data I/O is high-impedance if OE = V  
.
IH  
16. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.  
17. During this period the I/Os are in the output state and input signals should not be applied.  
Document #: 38-05006 Rev. *E  
Page 7 of 11  
CY7C1049CV33  
Switching Waveforms (continued)  
Write Cycle No. 2 (WE Controlled, OE LOW)[16]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
t
HD  
SD  
NOTE 17  
DATA I/O  
DATA VALID  
t
t
LZWE  
HZWE  
Document #: 38-05006 Rev. *E  
Page 8 of 11  
CY7C1049CV33  
Truth Table  
CE  
H
L
OE  
WE  
X
I/O0–I/O7  
Mode  
Power  
X
L
High-Z  
Power-down  
Read  
Standby (ISB  
Active (ICC  
Active (ICC  
Active (ICC  
)
H
Data Out  
Data In  
High-Z  
)
L
X
H
L
Write  
)
L
H
Selected, Outputs Disabled  
)
Ordering Information  
Speed  
Package  
Operating  
Range  
(ns)  
Ordering Code  
CY7C1049CV33-10VC  
CY7C1049CV33-10ZC  
CY7C1049CV33-10VI  
CY7C1049CV33-10ZI  
CY7C1049CV33-12VC  
CY7C1049CV33-12ZC  
CY7C1049CV33-12VI  
CY7C1049CV33-12ZI  
CY7C1049CV33-15VC  
CY7C1049CV33-15ZC  
CY7C1049CV33-15VI  
CY7C1049CV33-15ZI  
CY7C1049CV33-15VE  
CY7C1049CV33-15ZSE  
CY7C1049CV33-20VC  
CY7C1049CV33-20VI  
CY7C1049CV33-10VXC  
CY7C1049CV33-10ZXC  
CY7C1049CV33-10VXI  
CY7C1049CV33-10ZXI  
CY7C1049CV33-12VXC  
CY7C1049CV33-12ZXC  
CY7C1049CV33-12VXI  
CY7C1049CV33-12ZXI  
CY7C1049CV33-15VXC  
CY7C1049CV33-15ZXC  
CY7C1049CV33-15VXI  
CY7C1049CV33-15ZXI  
CY7C1049CV33-15VXE  
CY7C1049CV33-15ZSXE  
CY7C1049CV33-20VXC  
CY7C1049CV33-20VXI  
Name  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
V36  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
Z44  
V36  
V36  
Package Type  
36-lead (400-Mil) Molded SOJ  
44-pin TSOP II  
10  
Commercial  
36-lead (400-Mil) Molded SOJ  
44-pin TSOP II  
Industrial  
12  
15  
36-lead (400-Mil) Molded SOJ  
44-pin TSOP II  
Commercial  
Industrial  
36-lead (400-Mil) Molded SOJ  
44-pin TSOP II  
36-lead (400-Mil) Molded SOJ  
44-pin TSOP II  
Commercial  
Industrial  
36-lead (400-Mil) Molded SOJ  
44-pin TSOP II  
36-lead (400-Mil) Molded SOJ  
44-pin TSOP II  
Automotive  
20  
10  
36-lead (400-Mil) Molded SOJ  
36-lead (400-Mil) Molded SOJ  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
44-pin TSOP II (Pb-Free)  
Commercial  
Industrial  
Commercial  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
44-pin TSOP II (Pb-Free)  
Industrial  
Industrial  
12  
15  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
44-pin TSOP II (Pb-Free)  
Commercial  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
44-pin TSOP II (Pb-Free)  
Industrial  
Commercial  
Industrial  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
44-pin TSOP II (Pb-Free)  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
44-pin TSOP II (Pb-Free)  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
44-pin TSOP II  
Automotive  
Automotive  
Commercial  
Industrial  
20  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
36-lead (400-Mil) Molded SOJ (Pb-Free)  
Shaded areas contain advance information. Please contact your local Cypress Sales representative for availability of these parts.  
Document #: 38-05006 Rev. *E  
Page 9 of 11  
CY7C1049CV33  
Package Diagrams  
36-Lead (400-Mil) Molded SOJ V36  
51-85090-*B  
44-pin TSOP II Z44  
51-85087-*A  
All products and company names mentioned in this document may be the trademarks of their respective holders.  
Document #: 38-05006 Rev. *E  
Page 10 of 11  
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
CY7C1049CV33  
Document History Page  
Document Title: CY7C1049CV33 4-Mbit (512K x 8) Static RAM  
Document Number: 38-05006  
Orig. of  
REV.  
**  
ECN NO. Issue Date Change  
Description of Change  
112569  
114091  
116479  
262949  
03/06/02  
04/25/02  
09/16/02  
See ECN  
HGK  
DFP  
CEA  
RKF  
New data sheet  
*A  
Changed Tpower unit from ns to µs  
*B  
Add applications foot note to data sheet, page 1.  
*C  
Added Automotive Specs  
Added ΘJA and ΘJC values on Page #3.  
*D  
*E  
300091  
344595  
See ECN  
See ECN  
RKF  
SYT  
Added -20-ns Speed bin  
Added Pb-Free package on page #8  
Removed shading for CY7C1049CV33-15ZSXE in the ordering Information  
on page 9  
Document #: 38-05006 Rev. *E  
Page 11 of 11  

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