CY7C1049CV33-12ZXI [ROCHESTER]
512KX8 STANDARD SRAM, 12ns, PDSO44, LEAD FREE, TSOP2-44;型号: | CY7C1049CV33-12ZXI |
厂家: | Rochester Electronics |
描述: | 512KX8 STANDARD SRAM, 12ns, PDSO44, LEAD FREE, TSOP2-44 静态存储器 光电二极管 内存集成电路 |
文件: | 总12页 (文件大小:890K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CY7C1049CV33
4-Mbit (512K x 8) Static RAM
Features
Functional Description[1]
• Temperature Ranges
The CY7C1049CV33 is a high-performance CMOS Static
RAM organized as 524,288 words by 8 bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE), an
active LOW Output Enable (OE), and three-state drivers.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O
pins (I/O0 through I/O7) is then written into the location
specified on the address pins (A0 through A18).
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
• High speed
— tAA = 10 ns
• Low active power
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing Write
Enable (WE) HIGH. Under these conditions, the contents of
the memory location specified by the address pins will appear
on the I/O pins.
— 324 mW (max.)
• 2.0V data retention
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Easy memory expansion with CE and OE features
The eight input/output pins (I/O0 through I/O7) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), or during a Write
operation (CE LOW, and WE LOW).
The CY7C1049CV33 is available in standard 400-mil-wide
36-pin SOJ package and 44-pin TSOP II package with center
power and ground (revolutionary) pinout.
Logic Block Diagram
Pin Configuration
SOJ
Top View
TSOP II
Top View
A0
A1
36
35
34
33
1
NC
A18
A17
A16
A15
44
1
NC
NC
NC
NC
NC
A18
A17
A16
A15
OE
I/O
2
3
4
43
42
41
40
39
38
2
3
4
5
6
A2
A
0
A
A3
A4
1
2
A
32
5
I/O
0
A3
A4
CE
I/O0
I/O1
VCC
INPUT BUFFER
31
30
29
28
6
OE
I/O7
I/O6
7
A
37
36
35
34
33
7
8
9
10
11
12
13
0
CE
I/O
8
I/O
I/O
1
A
1
9
0
7
A
2
10
11
12
13
I/O
I/O
GND
1
6
SS
2
A
3
V
V
CC
27
26
25
A
GND
I/O2
I/O3
WE
VCC
I/O5
I/O4
A14
A13
A12
4
V
V
SS
CC
A
6
5
I/O
I/O
I/O
I/O
3
4
5
512K x 8
ARRAY
32
I/O
I/O
2
5
A
31
30
29
28
I/O
4
A14
A13
I/O
14
15
16
17
18
19
20
21
22
3
A
7
24
23
22
21
20
WE
A5
A6
A
8
9
A
A5
A6
A7
A8
A9
14
15
16
17
18
A12
A
10
27
26
25
A
11
A
7
A11
A10
NC
A
A
8
10
6
7
POWER
DOWN
A
NC
NC
9
COLUMN
DECODER
CE
NC
NC
24
23
19
NC
I/O
WE
OE
Notes:
1. For guidelines on SRAM system design, please refer to the System Design Guidelines Cypress application note, available on the internet at www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05006 Rev. *E
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised March 29, 2005
CY7C1049CV33
Selection Guide
-8
8
-10
10
90
100
-
-12
12
85
95
-
-15
15
80
90
95
10
15
-20
20
80
90
-
Unit
ns
Maximum Access Time
Maximum Operating Current
Commercial
Industrial
100
110
-
mA
mA
mA
mA
mA
Automotive
Maximum CMOS Standby Current Commercial / Industrial
10
-
10
-
10
-
10
-
Automotive
Shaded areas contain advance information.
Pin Definitions
36-SOJ
44 TSOP-II
Pin Name Pin Number Pin Number
I/O Type
Description
Address Inputs used to select one of the address locations.
A0–A18 1–5,14–18, 3–7,16–20,
20–24,32–35 26–30,38–41
I/O0–I/O7 7,8,11,12,25, 9,10,13,14,
Input
Input/Output Bidirectional Data I/O lines. Used as input or output lines
26,29,30
31,32,35,36
depending on operation
NC[2]
19,36
1,2,21,22,23, No Connect No Connects. This pin is not connected to the die
24,25,42,43,
44
WE
CE
OE
13
6
15
8
Input/Control Write Enable Input, active LOW. When selected LOW, a WRITE is
conducted. When selected HIGH, a READ is conducted.
Input/Control Chip Enable Input, active LOW. When LOW, selects the chip. When
HIGH, deselects the chip.
31
37
Input/Control Output Enable, active LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins are allowed to behave as outputs. When
deasserted HIGH, I/O pins are three-stated, and act as input data
pins.
VSS, GND
10,28
9,27
12,34
11,33
Ground
Ground for the device. Should be connected to ground of the
system.
VCC
Power Supply Power Supply inputs to the device.
Notes:
2. NC pins are not connected on the die.
Document #: 38-05006 Rev. *E
Page 2 of 11
CY7C1049CV33
Input Voltage[3] ...................................... –0.5V to VCC + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Operating Range
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
VCC
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on VCC to Relative GND[3]–0.5V to +4.6VDC
3.3V ± 0.3V
–40°C to +85°C
–40°C to +125°C
Automotive
Voltage Applied to Outputs
in High-Z State[3] ....................................–0.5V to VCC + 0.5V
Electrical Characteristics Over the Operating Range
-8
-10
-12
Parameter
VOH
Description
Test Conditions
Min. Max. Min. Max. Min. Max. Unit
Output HIGH Voltage VCC = Min.; IOH = –4.0 mA
Output LOW Voltage VCC = Min.,; IOL = 8.0 mA
Input HIGH Voltage
2.4
2.4
2.4
V
V
V
VOL
0.4
0.4
0.4
VIH
2.0
VCC
2.0
VCC
2.0
VCC
+ 0.3
+ 0.3
+ 0.3
VIL
IIX
Input LOW Voltage[3]
–0.3
–1
0.8
+1
+1
–0.3
–1
0.8
+1
+1
–0.3
–1
0.8
+1
+1
V
Input Load Current
GND < VI < VCC
Com’l/Ind’l
Com’l/Ind’l
µA
µA
IOZ
Output Leakage
Current
GND < VOUT < VCC
Output Disabled
,
–1
–1
–1
ICC
VCC Operating
Supply Current
VCC = Max.,
f = fMAX = 1/tRC
Com’l
100
110
40
90
100
40
85
95
40
mA
mA
mA
Ind’l
ISB1
Automatic CE
Max. VCC, CE > VIH;
Com’l/Ind’l
Power-down Current
—TTL Inputs
V
IN > VIH or
VIN < VIL, f = fMAX
ISB2
Automatic CE
Max. VCC
,
Com’l/Ind’l
10
10
10
mA
Power-down Current CE > VCC – 0.3V,
—CMOS Inputs IN > VCC – 0.3V,
or VIN < 0.3V, f = 0
V
Electrical Characteristics Over the Operating Range
-15
-20
Parameter
VOH
Description
Test Conditions
Min.
Max.
Min.
2.4
Max.
Unit
V
Output HIGH Voltage VCC = Min.; IOH = –4.0 mA
2.4
VOL
VIH
VIL
IIX
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage[3]
Input Load Current
VCC = Min.,; IOL = 8.0 mA
0.4
0.4
V
2.0 VCC + 0.3 2.0 VCC + 0.3
V
–0.3
–1
0.8
+1
–0.3
–1
-
0.8
+1
-
V
GND < VI < VCC
Com’l / Ind’l
µA
µA
µA
µA
mA
mA
mA
Automotive
Com’l / Ind’l
Automotive
Com’l
–20
–1
+20
+1
IOZ
Output Leakage
Current
GND < VOUT < VCC
Output Disabled
,
–1
-
+1
-
–20
+20
80
ICC
VCC Operating
Supply Current
VCC = Max.,
f = fMAX = 1/tRC
80
90
-
Ind’l
90
Automotive
95
Note:
3. V (min.) = –2.0V and V (max) = V + 0.5V for pulse durations of less than 20 ns.
IL
IH
CC
Document #: 38-05006 Rev. *E
Page 3 of 11
CY7C1049CV33
Electrical Characteristics Over the Operating Range (continued)
-15
-20
Parameter
ISB1
Description
Automatic CE
Power-down Current
—TTL Inputs
Test Conditions
Max. VCC, CE > VIH; Com’l / Ind’l
Min.
Max.
40
Min.
Max.
40
Unit
mA
V
IN > VIH or
IN < VIL, f = fMAX
Automotive
45
-
mA
V
ISB2
Automatic CE
Power-down Current
—CMOS Inputs
Max. VCC
,
Com’l/Ind’l
Automotive
10
15
10
-
mA
mA
CE > VCC – 0.3V,
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
Thermal Resistance[4]
36-pin SOJ 36-pin SOJ 44-TSOP-II 44-TSOP-II
(Non Pb-Free) (Pb-Free) (Non Pb-Free) (Pb-Free) Unit
Parameter
Description
Test Conditions
ΘJA
Thermal Resistance
(Junction to Ambient) standard test methods
Test conditions follow
46.51
46.51
41.66
41.66
°C/W
and procedures for
ΘJC
Thermal Resistance
18.8
18.8
10.56
10.56
°C/W
measuring thermal
(Junction to Case)
impedance, per EIA /
JESD51.
Capacitance[4]
Parameter
Description
Input Capacitance
I/O Capacitance
Test Conditions
Max.
Unit
CIN
TA = 25°C, f = 1 MHz,
CC = 3.3V
8
8
pF
pF
V
COUT
AC Test Loads and Waveforms[5]
12-, 15-, 20-ns devices:
8-, 10-ns devices:
R 317Ω
Z = 50Ω
3.3V
OUTPUT
30 pF
OUTPUT
50Ω
30 pF*
R2
351Ω
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
1.5V
(a)
(b)
High-Z characteristics:
R 317Ω
ALL INPUT PULSES
3.3V
3.0V
90%
10%
90%
10%
OUTPUT
R2
351Ω
5 pF
GND
(c)
(d)
Fall Time: 1 V/ns
Rise Time: 1 V/ns
Notes:
4. Tested initially and after any design or process changes that may affect these parameters.
5. AC characteristics (except High-Z) for all 8-ns and 10-ns parts are tested using the load conditions shown in Figure (a). All other speeds are tested using the
Thevenin load shown in Figure (b). High-Z characteristics are tested for all speeds using the test load shown in Figure (d).
Document #: 38-05006 Rev. *E
Page 4 of 11
CY7C1049CV33
AC Switching Characteristics Over the Operating Range [6]
-8
-10
-12
Parameter
Description
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Read Cycle
[7]
tpower
VCC(typical) to the first access
Read Cycle Time
1
8
1
1
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tRC
10
12
tAA
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
OE LOW to Low-Z
OE HIGH to High-Z[8, 9]
CE LOW to Low-Z[9]
CE HIGH to High-Z[8, 9]
CE LOW to Power-up
CE HIGH to Power-down
8
10
12
tOHA
tACE
tDOE
tLZOE
tHZOE
tLZCE
tHZCE
tPU
3
3
3
8
4
10
5
12
6
0
3
0
0
3
0
0
3
0
4
4
8
5
5
6
6
tPD
10
12
Write Cycle[10, 11]
tWC
tSCE
tAW
Write Cycle Time
8
6
6
0
0
6
4
0
3
10
7
12
8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CE LOW to Write End
Address Set-up to Write End
Address Hold from Write End
Address Set-up to Write Start
WE Pulse Width
7
8
tHA
0
0
tSA
0
0
tPWE
tSD
7
8
Data Set-up to Write End
Data Hold from Write End
WE HIGH to Low-Z[9]
5
6
tHD
0
0
tLZWE
tHZWE
3
3
WE LOW to High-Z[8, 9]
4
5
6
Shaded areas contain advance information.
AC Switching Characteristics Over the Operating Range [6]
-15
-20
Parameter
Description
Min.
Max.
Min.
Max.
Unit
Read Cycle
[7]
tpower
VCC(typical) to the first access
Read Cycle Time
1
1
µs
ns
ns
ns
ns
ns
tRC
15
20
tAA
Address to Data Valid
15
3
20
3
tOHA
tACE
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
15
7
20
8
tDOE
Notes:
6. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V.
7. t
8. t
gives the minimum amount of time that the power supply should be at stable, typical V values until the first memory access can be performed.
POWER
CC
, t
, and t
are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
HZOE HZCE
HZWE
9. At any given temperature and voltage condition, t
is less than t
, t
is less than t
, and t
is less than t
for any given device.
HZCE
LZCE HZOE
LZOE
HZWE
LZWE
10. The internal Write time of the memory is defined by the overlap of CELOW, and WE LOW. CE and WE must be LOW to initiate a Write, and the transition of either
of these signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the Write.
11. The minimum Write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of t
and t
.
SD
HZWE
Document #: 38-05006 Rev. *E
Page 5 of 11
CY7C1049CV33
AC Switching Characteristics Over the Operating Range (continued)[6]
-15
-20
Parameter
tLZOE
tHZOE
tLZCE
Description
Min.
Max.
7
Min.
Max.
8
Unit
ns
OE LOW to Low-Z
0
0
OE HIGH to High-Z[8, 9]
CE LOW to Low-Z[9]
CE HIGH to High-Z[8, 9]
CE LOW to Power-up
CE HIGH to Power-down
ns
3
0
3
0
ns
tHZCE
tPU
7
8
ns
ns
tPD
15
20
ns
Write Cycle[10, 11]
tWC
tSCE
tAW
Write Cycle Time
15
10
10
0
20
10
10
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CE LOW to Write End
Address Set-up to Write End
Address Hold from Write End
Address Set-up to Write Start
WE Pulse Width
tHA
tSA
0
0
tPWE
tSD
10
7
10
8
Data Set-up to Write End
Data Hold from Write End
WE HIGH to Low-Z[9]
tHD
0
0
tLZWE
tHZWE
3
3
WE LOW to High-Z[8, 9]
7
8
Switching Waveforms
Read Cycle No. 1[12, 13]
t
RC
ADDRESS
t
AA
t
OHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Notes:
12. Device is continuously selected. OE, CE = V .
IL
13. WE is HIGH for Read cycle.
Document #: 38-05006 Rev. *E
Page 6 of 11
CY7C1049CV33
Switching Waveforms (continued)
Read Cycle No. 2 (OE Controlled)[13, 14]
ADDRESS
CE
t
RC
t
ACE
OE
t
HZOE
t
DOE
t
HZCE
t
LZOE
HIGH
IMPEDANCE
HIGH IMPEDANCE
DATA OUT
DATA VALID
t
LZCE
t
PD
ICC
t
PU
VCC
SUPPLY
CURRENT
50%
50%
ISB
Write Cycle No. 1(WE Controlled, OE HIGH During Write)[15, 16]
t
WC
ADDRESS
CE
t
SCE
t
t
HA
AW
t
t
PWE
SA
WE
OE
t
t
SD
HD
DATA VALID
DATA I/O
IN
NOTE 17
t
HZOE
Notes:
14. Address valid prior to or coincident with CE transition LOW.
15. Data I/O is high-impedance if OE = V
.
IH
16. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
17. During this period the I/Os are in the output state and input signals should not be applied.
Document #: 38-05006 Rev. *E
Page 7 of 11
CY7C1049CV33
Switching Waveforms (continued)
Write Cycle No. 2 (WE Controlled, OE LOW)[16]
t
WC
ADDRESS
CE
t
SCE
t
t
HA
AW
t
SA
t
PWE
WE
t
t
HD
SD
NOTE 17
DATA I/O
DATA VALID
t
t
LZWE
HZWE
Document #: 38-05006 Rev. *E
Page 8 of 11
CY7C1049CV33
Truth Table
CE
H
L
OE
WE
X
I/O0–I/O7
Mode
Power
X
L
High-Z
Power-down
Read
Standby (ISB
Active (ICC
Active (ICC
Active (ICC
)
H
Data Out
Data In
High-Z
)
L
X
H
L
Write
)
L
H
Selected, Outputs Disabled
)
Ordering Information
Speed
Package
Operating
Range
(ns)
Ordering Code
CY7C1049CV33-10VC
CY7C1049CV33-10ZC
CY7C1049CV33-10VI
CY7C1049CV33-10ZI
CY7C1049CV33-12VC
CY7C1049CV33-12ZC
CY7C1049CV33-12VI
CY7C1049CV33-12ZI
CY7C1049CV33-15VC
CY7C1049CV33-15ZC
CY7C1049CV33-15VI
CY7C1049CV33-15ZI
CY7C1049CV33-15VE
CY7C1049CV33-15ZSE
CY7C1049CV33-20VC
CY7C1049CV33-20VI
CY7C1049CV33-10VXC
CY7C1049CV33-10ZXC
CY7C1049CV33-10VXI
CY7C1049CV33-10ZXI
CY7C1049CV33-12VXC
CY7C1049CV33-12ZXC
CY7C1049CV33-12VXI
CY7C1049CV33-12ZXI
CY7C1049CV33-15VXC
CY7C1049CV33-15ZXC
CY7C1049CV33-15VXI
CY7C1049CV33-15ZXI
CY7C1049CV33-15VXE
CY7C1049CV33-15ZSXE
CY7C1049CV33-20VXC
CY7C1049CV33-20VXI
Name
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
V36
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
Z44
V36
V36
Package Type
36-lead (400-Mil) Molded SOJ
44-pin TSOP II
10
Commercial
36-lead (400-Mil) Molded SOJ
44-pin TSOP II
Industrial
12
15
36-lead (400-Mil) Molded SOJ
44-pin TSOP II
Commercial
Industrial
36-lead (400-Mil) Molded SOJ
44-pin TSOP II
36-lead (400-Mil) Molded SOJ
44-pin TSOP II
Commercial
Industrial
36-lead (400-Mil) Molded SOJ
44-pin TSOP II
36-lead (400-Mil) Molded SOJ
44-pin TSOP II
Automotive
20
10
36-lead (400-Mil) Molded SOJ
36-lead (400-Mil) Molded SOJ
36-lead (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP II (Pb-Free)
Commercial
Industrial
Commercial
36-lead (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP II (Pb-Free)
Industrial
Industrial
12
15
36-lead (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP II (Pb-Free)
Commercial
36-lead (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP II (Pb-Free)
Industrial
Commercial
Industrial
36-lead (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP II (Pb-Free)
36-lead (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP II (Pb-Free)
36-lead (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP II
Automotive
Automotive
Commercial
Industrial
20
36-lead (400-Mil) Molded SOJ (Pb-Free)
36-lead (400-Mil) Molded SOJ (Pb-Free)
Shaded areas contain advance information. Please contact your local Cypress Sales representative for availability of these parts.
Document #: 38-05006 Rev. *E
Page 9 of 11
CY7C1049CV33
Package Diagrams
36-Lead (400-Mil) Molded SOJ V36
51-85090-*B
44-pin TSOP II Z44
51-85087-*A
All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05006 Rev. *E
Page 10 of 11
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
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CY7C1049CV33
Document History Page
Document Title: CY7C1049CV33 4-Mbit (512K x 8) Static RAM
Document Number: 38-05006
Orig. of
REV.
**
ECN NO. Issue Date Change
Description of Change
112569
114091
116479
262949
03/06/02
04/25/02
09/16/02
See ECN
HGK
DFP
CEA
RKF
New data sheet
*A
Changed Tpower unit from ns to µs
*B
Add applications foot note to data sheet, page 1.
*C
Added Automotive Specs
Added ΘJA and ΘJC values on Page #3.
*D
*E
300091
344595
See ECN
See ECN
RKF
SYT
Added -20-ns Speed bin
Added Pb-Free package on page #8
Removed shading for CY7C1049CV33-15ZSXE in the ordering Information
on page 9
Document #: 38-05006 Rev. *E
Page 11 of 11
相关型号:
CY7C1049CV33-15VXCT
Standard SRAM, 512KX8, 15ns, CMOS, PDSO36, 0.400 INCH, LEAD FREE, SOJ-36
CYPRESS
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