CY8C21634B-24LTXI [CYPRESS]
Multifunction Peripheral, CMOS, 5 X 5 MM 1.00 MM HEIGHT, LEAD FREE, MO-220, QFN-32;
| 型号： | CY8C21634B-24LTXI |
| 厂家： | 
CYPRESS |
| 描述： | Multifunction Peripheral, CMOS, 5 X 5 MM 1.00 MM HEIGHT, LEAD FREE, MO-220, QFN-32 |
| 文件： | 总47页 (文件大小：1307K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
PSoC® Programmable System-on-Chip™
■ SmartSense™ Auto-Tuning user module:
❐ SmartSense Auto-Tuning is easy to use and provides robust
noise immunity.
❐ SmartSense tunes your CapSense system automatically at
power up and monitors the system in real time to maintain
optimum performance.
❐ SmartSense significantly reduces design cycle time by
eliminating the tuning process from prototype to mass
production.
Features
■ Powerful Harvard-architecture processor
❐ M8C processor speeds up to 24 MHz
❐ Low power at high speed
❐ Operating voltage: 2.4 V to 5.25 V
❐ Operating voltages down to 1.0 V using on-chip switch mode
pump (SMP)
❐ Industrial temperature range: –40 °C to +85 °C
■ Advanced peripherals (PSoC® blocks)
❐ Four analog Type E PSoC blocks provide:
• Two comparators with digital-to-analog converter (DAC)
references
❐ SmartSense allows maximum production flexibility by
compensating for variations caused by using multiple
manufacturing sites and vendors.
■ Versatile analog mux
❐ Common internal analog bus
• Single or dual 10-bit 28 channel analog-to-digital
converters (ADC)
❐ Simultaneous connection of I/O combinations
❐ Capacitive sensing application capability
❐ Four digital PSoC blocks provide:
• 8- to 32-bit timers, counters, and pulse width modulators
(PWMs)
• Cyclical redundancy check (CRC) and pseudo random
sequence (PRS) modules
■ Additional system resources
❐ I2C master, slave, and multi-master to 400 kHz
❐ Watchdog and sleep timers
❐ User-configurable low-voltage detection (LVD)
❐ Integrated supervisory circuit
❐ On-chip precision voltage reference
• Full-duplex universal asynchronous receiver transmitter
(UART), serial peripheral interface (SPI) master or slave
• Connectable to all general purpose I/O (GPIO) pins
❐ Complex peripherals by combining blocks
Logic Block Diagram
■ Flexible on-chip memory
❐ 8 KB flash program storage 50,000 erase/write cycles
❐ 512 bytes static random access memory (SRAM) data
storage
❐ In-system serial programming (ISSP)
❐ Partial flash updates
❐ Flexible protection modes
❐ EEPROM emulation in flash
■ Complete development tools
❐ Free development software
(PSoC Designer™)
❐ Full-featured, in-circuit emulator (ICE) and programmer
❐ Full-speed emulation
❐ Complex breakpoint structure
❐ 128-KB trace memory
■ Precision, programmable clocking
❐ Internal ±2.5% 24- / 48-MHz main oscillator
❐ Internal oscillator for watchdog and sleep
■ Programmable pin configurations
❐ 25-mA sink, 10-mA source on all GPIOs
❐ Pull-up, pull-down, high Z, strong, or open-drain drive modes
on all GPIOs
❐ Up to eight analog inputs on GPIOs
❐ Configurable interrupt on all GPIOs
Cypress Semiconductor Corporation
Document Number: 001-67345 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised May 13, 2011
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Contents
Features............................................................................. 1
Logic Block Diagram........................................................ 1
Contents............................................................................ 2
PSoC Functional Overview.............................................. 3
The PSoC Core........................................................... 3
The Digital System ...................................................... 3
The Analog System..................................................... 4
Additional System Resources ..................................... 4
PSoC Device Characteristics ...................................... 5
Getting Started.................................................................. 5
Application Notes ........................................................ 5
Development Kits ........................................................ 5
Training ....................................................................... 5
CYPros Consultants.................................................... 5
Solutions Library.......................................................... 5
Technical Support ....................................................... 5
Development Tools .......................................................... 6
PSoC Designer Software Subsystems........................ 6
Designing with PSoC Designer....................................... 7
Select User Modules ................................................... 7
Configure User Modules.............................................. 7
Organize and Connect ................................................ 7
Generate, Verify, and Debug....................................... 7
SmartSense................................................................. 7
Pin Information ................................................................. 8
16-Pin Part Pinout ....................................................... 8
20-Pin Part Pinout ....................................................... 9
28-Pin Part Pinout ..................................................... 10
32-Pin Part Pinout ..................................................... 11
56-Pin Part Pinout ..................................................... 13
Register Reference......................................................... 15
Register Conventions................................................ 15
Register Mapping Tables .......................................... 15
Electrical Specifications ................................................ 18
Absolute Maximum Ratings....................................... 18
Operating Temperature............................................. 19
DC Electrical Characteristics..................................... 19
AC Electrical Characteristics..................................... 25
Packaging Information................................................... 33
Thermal Impedances................................................. 36
Solder Reflow Peak Temperature ............................. 36
Development Tool Selection ......................................... 37
Software .................................................................... 37
Development Kits ...................................................... 37
Evaluation Tools........................................................ 37
Device Programmers................................................. 38
Accessories (Emulation and Programming).............. 38
Ordering Information...................................................... 39
Ordering Code Definitions......................................... 40
Acronyms........................................................................ 41
Reference Documents.................................................... 41
Document Conventions ................................................. 42
Units of Measure ....................................................... 42
Numeric Conventions................................................ 42
Glossary .......................................................................... 42
Document History Page................................................. 47
.......................................................................................... 47
Sales, Solutions, and Legal Information ...................... 47
Worldwide Sales and Design Support....................... 47
Products.................................................................... 47
PSoC Solutions......................................................... 47
Document Number: 001-67345 Rev. *A
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PSoC Functional Overview
The PSoC family consists of many devices with on-chip
controllers. These devices are designed to replace multiple
traditional MCU-based system components with one low-cost
single-chip programmable component. A PSoC device includes
configurable blocks of analog and digital logic, and
programmable interconnect. This architecture makes it possible
for you to create customized peripheral configurations, to match
the requirements of each individual application. Additionally, a
fast central processing unit (CPU), flash program memory,
SRAM data memory, and configurable I/O are included in a
range of convenient pinouts.
The Digital System
The digital system consists of four digital PSoC blocks. Each
block is an 8-bit resource that is used alone or combined with
other blocks to form 8-, 16-, 24-, and 32-bit peripherals, which
are called user modules. Digital peripheral configurations
include:
■ PWMs (8- to 32-bit)
■ PWMs with dead band (8- to 32-bit)
■ Counters (8- to 32-bit)
The PSoC architecture, shown in Figure 1, consists of four main
areas: the core, the system resources, the digital system, and
the analog system. Configurable global bus resources allow
combining all of the device resources into a complete custom
system. Each CY8C21x34B PSoC device includes four digital
blocks and four analog blocks. Depending on the PSoC
package, up to 28 GPIOs are also included. The GPIOs provide
access to the global digital and analog interconnects.
■ Timers (8- to 32-bit)
■ UART 8- with selectable parity
■ Serial peripheral interface (SPI) master and slave
■ I2C slave and multi-master
■ CRC/generator (8-bit)
■ IrDA
The PSoC Core
■ PRS generators (8-bit to 32-bit)
The PSoC core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and internal main
oscillator (IMO) and internal low speed oscillator (ILO). The CPU
core, called the M8C, is a powerful processor with speeds up to
24 MHz. The M8C is a four-million instructions per second
(MIPS) 8-bit Harvard-architecture microprocessor.
The digital blocks are connected to any GPIO through a series
of global buses that can route any signal to any pin. The buses
also allow for signal multiplexing and for performing logic
operations. This configurability frees your designs from the
constraints of a fixed peripheral controller.
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows the optimum
choice of system resources for your application. Family
resources are shown in Table 1 on page 5.
System resources provide these additional capabilities:
■ Digital clocks for increased flexibility
■ I2C functionality to implement an I2C master and slave
Figure 1. Digital System Block Diagram
■ An internal voltage reference, multi-master, that provides an
absolute value of 1.3 V to a number of PSoC subsystems
Port 3
Port 1
Port 2
Port 0
■ A SMP that generates normal operating voltages from a single
battery cell
Digital Clocks
From Core
To Analog
System
To System Bus
■ Various system resets supported by the M8C
The digital system consists of an array of digital PSoC blocks that
may be configured into any number of digital peripherals. The
digital blocks are connected to the GPIOs through a series of
global buses. These buses can route any signal to any pin,
freeing designs from the constraints of a fixed peripheral
controller.
DIGITAL SYSTEM
Digital PSoC Block Array
Row 0
4
4
The analog system consists of four analog PSoC blocks,
supporting comparators, and analog-to-digital conversion up to
10 bits of precision.
DBB00
DBB01 DCB02 DCB03
8
8
8
8
GIE[7:0]
GIO[7:0]
GOE[7:0]
GOO[7:0]
Global Digital
Interconnect
Document Number: 001-67345 Rev. *A
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The Analog Multiplexer System
The Analog System
The analog mux bus can connect to every GPIO pin. Pins may
be connected to the bus individually or in any combination. The
bus also connects to the analog system for analysis with
comparators and analog-to-digital converters. An additional 8:1
analog input multiplexer provides a second path to bring Port 0
pins to the analog array.
The analog system consists of four configurable blocks that allow
for the creation of complex analog signal flows. Analog
peripherals are very flexible and can be customized to support
specific application requirements. Some of the common PSoC
analog functions for this device (most available as user modules)
are:
Switch-control logic enables selected pins to precharge
continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
■ ADCs (single or dual, with 8-bit or 10-bit resolution)
■ Pin-to-pin comparator
■ Single-ended comparators (up to two) with absolute (1.3 V)
reference or 8-bit DAC reference
■ Track pad, finger sensing
■ 1.3-V reference (as a system resource)
■ Chip-wide mux that allows analog input from any I/O pin
■ Crosspoint connection between any I/O pin combinations
In most PSoC devices, analog blocks are provided in columns of
three, which includes one continuous time (CT) and two switched
capacitor (SC) blocks. The CY8C21x34B devices provide limited
functionality Type E analog blocks. Each column contains one
CT Type E block and one SC Type E block. Refer to the PSoC
Technical Reference Manual for detailed information on the
CY8C21x34B’s Type E analog blocks.
Additional System Resources
System resources, some of which are listed in the previous
sections, provide additional capability useful to complete
systems. Additional resources include a switch-mode pump,
low-voltage detection, and power-on-reset (POR).
Figure 2. Analog System Block Diagram
■ Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks may be routed
to both the digital and analog systems. Additional clocks can
be generated using digital PSoC blocks as clock dividers.
Array Input
■ The I2C module provides 100- and 400-kHz communication
over two wires. Slave, master, and multi-master modes are all
supported.
Configuration
■ LVD interrupts can signal the application of falling voltage
levels, while the advanced POR circuit eliminates the need for
a system supervisor.
ACI0[1:0]
ACI1[1:0]
■ An internal 1.3-V reference provides an absolute reference for
the analog system, including ADCs and DACs.
All I/O
X
X
■ An integrated switch-mode pump generates normal operating
voltages from a single 1.2-V battery cell, providing a low cost
boost converter.
ACOL1MUX
X
X
Analog Mux Bus
■ Versatile analog multiplexer system.
X
Array
ACE00
ACE01
ASE11
ASE10
Document Number: 001-67345 Rev. *A
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PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 4
analog blocks. Table 1 lists the resources available for specific PSoC device groups. The PSoC device covered by this datasheet is
highlighted in Table 1.
Table 1. PSoC Device Characteristics
PSoC Part
Number
Digital
I/O
Digital
Rows
Digital
Blocks
Analog
Inputs
Analog
Analog
Analog
SRAM
Size
Flash
Size
SmartSense
Enabled
Outputs Columns Blocks
CY8C29x66
CY8C28xxx
up to 64
up to 44
4
16
up to 12
up to 44
4
4
12
2 K
1 K
32 K
16 K
–
–
up to 3
up to 12
up to 4
up to 6
up to
12 + 4
[1]
CY8C27x43
CY8C24x94
CY8C24x23A
CY8C23x33
CY8C22x45
CY8C21x45
CY8C21x34
CY8C21x34B
CY8C21x23
CY8C20x34
CY8C20xx6A
up to 44
up to 56
up to 24
up to 26
up to 38
up to 24
up to 28
up to 28
up to 16
up to 28
up to 36
2
1
1
1
2
1
1
1
1
0
0
8
4
4
4
8
4
4
4
4
0
0
up to 12
up to 48
up to 12
up to 12
up to 38
up to 24
up to 28
up to 28
4
2
2
2
0
0
0
0
0
0
0
4
2
2
2
4
4
2
2
2
0
0
12
6
256
1 K
256
256
1 K
512
512
512
256
512
16 K
16 K
4 K
–
–
–
–
–
–
–
Y
–
–
Y
6
4
8 K
[1]
6
16 K
8 K
[1]
6
[1]
4
8 K
[1]
4
8 K
[1]
up to
8
4
4 K
[1,2]
up to 28
up to 36
3
8 K
[1,2]
3
up to
2 K
up to
32 K
Getting Started
For in-depth information, along with detailed programming
CYPros Consultants
details, see the PSoC® Technical Reference Manual.
Certified PSoC consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC consultant go to the CYPros Consultants web site.
For up-to-date ordering, packaging, and electrical specification
information, see the latest PSoC device datasheets on the web.
Application Notes
Solutions Library
Cypress application notes are an excellent introduction to the
wide variety of possible PSoC designs.
Visit our growing library of solution focused designs. Here you
can find various application designs that include firmware and
hardware design files that enable you to complete your designs
quickly.
Development Kits
PSoC Development Kits are available online from and through a
growing number of regional and global distributors, which
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and
Newark.
Technical Support
Technical support – including a searchable Knowledge Base
articles and technical forums – is also available online. If you
cannot find an answer to your question, call our Technical
Support hotline at 1-800-541-4736.
Training
Free PSoC technical training (on demand, webinars, and
workshops), which is available online via www.cypress.com,
covers a wide variety of topics and skill levels to assist you in
your designs.
Notes
1. Limited analog functionality.
®
2. Two analog blocks and one CapSense .
Document Number: 001-67345 Rev. *A
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Development Tools
PSoC Designer™ is the revolutionary integrated design
Code Generation Tools
environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
The code generation tools work seamlessly within the
PSoC Designer interface and have been tested with a full range
of debugging tools. You can develop your design in C, assembly,
or a combination of the two.
Assemblers. The assemblers allow you to merge assembly
code seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and are
linked with other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all of the features of C, tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
■ Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■ Extensive user module catalog
■ Integrated source-code editor (C and assembly)
■ Free C compiler with no size restrictions or time limits
■ Built-in debugger
Debugger
PSoC Designer has a debug environment that provides
hardware in-circuit emulation, allowing you to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow you to read and program and
read and write data memory, and read and write I/O registers.
You can read and write CPU registers, set and clear breakpoints,
and provide program run, halt, and step control. The debugger
also allows you to create a trace buffer of registers and memory
locations of interest.
■ In-circuit emulation
■ Built-in support for communication interfaces:
2
❐ Hardware and software I C slaves and masters
❐ Full-speed USB 2.0
❐ Up to four full-duplex universal asynchronous
receiver/transmitters (UARTs), SPI master and slave, and
wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
Online Help System
The online help system displays online, context-sensitive help.
Designed for procedural and quick reference, each functional
subsystem has its own context-sensitive help. This system also
provides tutorials and links to FAQs and an online support Forum
to aid the designer.
PSoC Designer Software Subsystems
Design Entry
In the chip-level view, choose a base device to work with. Then
select different onboard analog and digital components that use
the PSoC blocks, which are called user modules. Examples of
user modules are ADCs, DACs, amplifiers, and filters. Configure
the user modules for your chosen application and connect them
to each other and to the proper pins. Then generate your project.
This prepopulates your project with APIs and libraries that you
can use to program your application.
In-Circuit Emulator
A low-cost, high-functionality in-circuit emulator (ICE) is
available for development support. This hardware can program
single devices.
The emulator consists of a base unit that connects to the PC
using a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full-speed
(24 MHz) operation.
The tool also supports easy development of multiple configura-
tions and dynamic reconfiguration. Dynamic reconfiguration
makes it possible to change configurations at run time. In
essence, this allows you to use more than 100 percent of PSoC's
resources for an application.
Document Number: 001-67345 Rev. *A
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Designing with PSoC Designer
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
The PSoC development process is summarized in four steps:
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, you perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides application programming interfaces
(APIs) with high-level functions to control and respond to
hardware events at run-time and interrupt service routines that
you can adapt as needed.
1. Select User Modules.
2. Configure User Modules.
3. Organize and Connect.
4. Generate, Verify, and Debug.
A complete code development environment allows you to
develop and customize your applications in either C, assembly
language, or both.
The last step in the development process takes place inside
PSoC Designer’s debugger (access by clicking the Connect
icon). PSoC Designer downloads the HEX image to the ICE
where it runs at full speed. PSoC Designer debugging
capabilities rival those of systems costing many times more. In
addition to traditional single-step, run-to-breakpoint, and
watch-variable features, the debug interface provides a large
trace buffer and allows you to define complex breakpoint events.
These include monitoring address and data bus values, memory
locations, and external signals.
Select User Modules
PSoC Designer provides a library of prebuilt, pretested hardware
peripheral components called “user modules.” User modules
make selecting and implementing peripheral devices, both
analog and digital, simple.
Configure User Modules
Each user module that you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a PWM
User Module configures one or more digital PSoC blocks, one
for each 8 bits of resolution. The user module parameters permit
you to establish the pulse width and duty cycle. Configure the
parameters and properties to correspond to your chosen
application. Enter values directly or by selecting values from
drop-down menus. All the user modules are documented in
datasheets that may be viewed directly in PSoC Designer or on
the Cypress website. These user module datasheets explain the
internal operation of the user module and provide performance
specifications. Each datasheet describes the use of each user
module parameter, and other information you may need to
successfully implement your design.
SmartSense
A key differentiation between the current offering of CY8C21x34
and CY8C21x34B, is the addition of the SmartSense user
module in the ‘B’ version.
SmartSense is an innovative solution from Cypress that
eliminates the manual tuning process from CapSense
applications. This solution is easy to use and provides robust
noise immunity. It is the only auto-tuning solution that
establishes, monitors and maintains all required tuning
parameters. SmartSense allows engineers to go from
prototyping to mass production without re-tuning for
manufacturing variations in PCB and/or overlay material
properties.
Organize and Connect
You build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. You perform the
selection, configuration, and routing so that you have complete
control over all on-chip resources.
Document Number: 001-67345 Rev. *A
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Pin Information
The CY8C21x34B PSoC device is available in a variety of packages which are listed in the following tables. Every port pin (labeled
with a “P”) is capable of Digital I/O and connection to the common analog bus. However, V , V , SMP, and XRES are not capable
SS DD
of Digital I/O.
16-Pin Part Pinout
Figure 3. CY8C21234B 16-Pin PSoC Device
A, I, M, P0[7]
A, I, M, P0[5]
A, I, M, P0[3]
A, I, M, P0[1]
SMP
VDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
P0[6], A, I, M
P0[4], A, I, M
P0[2], A, I, M
P0[0], A, I, M
P1[4], EXTCLK, M
P1[2], M
SOIC
VSS
M, I2C SCL, P1[1]
VSS
P1[0], I2C SDA, M
Table 2. Pin Definitions – CY8C21234B 16-Pin (SOIC)
Type
Pin No.
Name
Description
Digital
I/O
Analog
I, M
1
P0[7]
Analog column mux input
Analog column mux input
2
I/O
I, M
I, M
I, M
P0[5]
P0[3]
P0[1]
SMP
3
I/O
Analog column mux input, integrating input
Analog column mux input, integrating input
Switch-mode pump (SMP) connection to required external components
Ground connection
4
I/O
5
Power
Power
I/O
6
V
SS
2
[3]
7
M
P1[1]
I C serial clock (SCL), ISSP-SCLK
8
Power
I/O
V
Ground connection
SS
2
[3]
9
M
P1[0]
P1[2]
P1[4]
P0[0]
P0[2]
P0[4]
P0[6]
I C serial data (SDA), ISSP-SDATA
10
11
12
13
14
15
16
I/O
M
I/O
M
Optional external clock input (EXTCLK)
Analog column mux input
Analog column mux input
Analog column mux input
Analog column mux input
Supply voltage
I/O
I, M
I, M
I, M
I, M
I/O
I/O
I/O
Power
V
DD
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Note
3. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 001-67345 Rev. *A
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20-Pin Part Pinout
Figure 4. CY8C21334B 20-Pin PSoC Device
A, I, M, P0[7]
A, I, M, P0[5]
A, I, M, P0[3]
A, I, M, P0[1]
VSS
VDD
20
19
18
17
16
15
14
13
12
11
1
2
P0[6], A, I, M
P0[4], A, I, M
P0[2], A, I, M
P0[0], A, I, M
XRES
3
4
5
SSOP
M, I2C SCL, P1[7]
M, I2C SDA, P1[5]
M, P1[3]
6
P1[6], M
7
P1[4], EXTCLK, M
P1[2], M
8
M, I2C SCL, P1[1]
VSS
9
P1[0], I2C SDA, M
10
Table 3. Pin Definitions – CY8C21334B 20-Pin (SSOP)
Type
Pin No.
Name
Description
Digital
I/O
Analog
I, M
1
P0[7]
P0[5]
P0[3]
P0[1]
Analog column mux input
Analog column mux input
2
I/O
I, M
I, M
I, M
3
I/O
Analog column mux input, integrating input
Analog column mux input, integrating input
Ground connection
4
I/O
5
Power
I/O
V
SS
2
6
M
M
M
M
P1[7]
P1[5]
P1[3]
P1[1]
I C SCL
2
7
I/O
I C SDA
8
I/O
2
[4]
9
I/O
I C SCL, ISSP-SCLK
10
11
12
13
14
15
16
17
18
19
20
Power
I/O
V
Ground connection.
SS
2
[4]
M
M
M
M
P1[0]
P1[2]
P1[4]
P1[6]
XRES
P0[0]
P0[2]
P0[4]
P0[6]
I C SDA, ISSP-SDATA
I/O
I/O
Optional external clock input (EXTCLK)
I/O
Input
I/O
Active high external reset with internal pull-down
Analog column mux input
Analog column mux input
Analog column mux input
Analog column mux input
Supply voltage
I, M
I, M
I, M
I, M
I/O
I/O
I/O
Power
V
DD
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Note
4. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 001-67345 Rev. *A
Page 9 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
28-Pin Part Pinout
Figure 5. CY8C21534B 28-Pin PSoC Device
A, I, M, P0[7]
A, I, M, P0[5]
A, I, M, P0[3]
A, I, M, P0[1]
M, P2[7]
VDD
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
P0[6], A, I, M
P0[4], A, I, M
P0[2], A, I, M
P0[0], A, I, M
P2[6], M
3
4
5
M, P2[5]
6
M, P2[3]
P2[4], M
7
SSOP
M, P2[1]
P2[2], M
8
VSS
P2[0], M
9
M, I2C SCL, P1[7]
M, I2C SDA, P1[5]
M, P1[3]
XRES
10
11
12
13
14
P1[6], M
P1[4], EXTCLK, M
P1[2], M
M, I2C SCL, P1[1]
VSS
P1[0], I2C SDA, M
Table 4. Pin Definitions – CY8C21534B 28-Pin (SSOP)
Type
Pin No.
Name
Description
Digital
I/O
Analog
I, M
1
2
3
4
5
6
7
8
9
P0[7]
Analog column mux input
I/O
I, M
I, M
I, M
M
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
Analog column mux input and column output
I/O
Analog column mux input and column output, integrating input
Analog column mux input, integrating input
I/O
I/O
I/O
M
I/O
I, M
I, M
Direct switched capacitor block input
Direct switched capacitor block input
Ground connection
I/O
Power
I/O
V
SS
2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
M
M
M
M
P1[7]
P1[5]
P1[3]
P1[1]
I C SCL
2
I/O
I C SDA
I/O
2
[5]
I/O
I C SCL, ISSP-SCLK
Power
I/O
V
Ground connection
SS
2
[5]
M
M
M
M
P1[0]
P1[2]
P1[4]
P1[6]
XRES
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
I C SDA, ISSP-SDATA
I/O
I/O
Optional external clock input (EXTCLK)
I/O
Input
I/O
Active high external reset with internal pull-down
Direct switched capacitor block input
I, M
I, M
M
I/O
Direct switched capacitor block input
I/O
I/O
M
I/O
I, M
I, M
I, M
I, M
Analog column mux input
Analog column mux input
Analog column mux input
Analog column mux input
Supply voltage
I/O
I/O
I/O
Power
V
DD
LEGEND A: Analog, I: Input, O = Output, and M = Analog Mux Input.
Note
5. These are the ISSP pins, which are not high Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 001-67345 Rev. *A
Page 10 of 47
[+] Feedback
CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
32-Pin Part Pinout
Figure 6. CY8C21434B 32-Pin PSoC Device
Figure 7. CY8C21634B 32-Pin PSoC Device
Figure 8. CY8C21434B 32-Pin Sawn PSoC Device Sawn
Figure 9. CY8C21634B 32-Pin Sawn PSoC Device
A, I, M, P0[1]
M, P2[7]
M, P2[5]
M, P2[3]
M, P2[1]
M, P3[3]
1
2
3
4
5
6
7
8
P0[0], A, I, M
A, I, M, P0[1]
24
1
2
3
4
5
6
7
8
P0[0], A, I, M
24
M, P2[7]
M, P2[5]
M, P2[3]
M, P2[1]
SMP
23 P2[6], M
22 P2[4], M
P2[2], M
21
23 P2[6], M
22 P2[4], M
P2[2], M
21
QFN
(Top View)
QFN
(Top View)
20 P2[0], M
20 P2[0], M
P3[2], M
19
P3[2], M
19
M, P3[1]
M, I2C SCL, P1[7]
Vss
18 P3[0], M
17 XRES
18 P3[0], M
17 XRES
M, I2C SCL, P1[7]
Document Number: 001-67345 Rev. *A
Page 11 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
[6]
Table 5. Pin Definitions - CY8C21434B/CY8C21634B 32-Pin (QFN)
Type
Analog
I, M
Pin No.
Name
P0[1]
Description
Analog column mux input, integrating input
Digital
I/O
1
2
I/O
M
M
M
M
M
P2[7]
P2[5]
P2[3]
P2[1]
P3[3]
SMP
P3[1]
3
I/O
4
I/O
5
I/O
6
I/O
In CY8C21434B part
6
Power
I/O
SMP connection to required external components in CY8C21634B part
In CY8C21434B part
7
M
7
Power
I/O
V
Ground connection in CY8C21634B part
SS
2
8
M
M
M
M
P1[7]
P1[5]
P1[3]
P1[1]
I C SCL
2
9
I/O
I C SDA
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
I/O
2
[7]
I/O
I C SCL, ISSP-SCLK
Power
I/O
V
Ground connection
SS
2
[7]
M
M
M
M
P1[0]
P1[2]
P1[4]
P1[6]
XRES
P3[0]
P3[2]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
I C SDA, ISSP-SDATA
I/O
I/O
Optional external clock input (EXTCLK)
I/O
Input
I/O
Active high external reset with internal pull-down
M
I/O
M
I/O
M
I/O
M
I/O
M
I/O
M
I/O
I, M
I, M
I, M
I, M
Analog column mux input
Analog column mux input
Analog column mux input
Analog column mux input
Supply voltage
I/O
I/O
I/O
Power
I/O
V
DD
I, M
I, M
I, M
P0[7]
P0[5]
P0[3]
Analog column mux input
Analog column mux input
Analog column mux input, integrating input
Ground connection
I/O
I/O
Power
V
SS
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Notes
6. The center pad on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
7. These are the ISSP pins, which are not high Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 001-67345 Rev. *A
Page 12 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
56-Pin Part Pinout
The 56-Pin SSOP part is for the CY8C21001 on-chip debug (OCD) PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
Figure 10. CY8C21001 56-Pin PSoC Device
Vss
56
55
Vdd
1
2
AI, P0[7]
AI, P0[5]
AI, P0[3]
P0[6], AI
P0[4], AI
P0[2], AI
3
4
5
6
54
53
AI, P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
NC
P0[0], AI
P2[6]
52
51
P2[4]
P2[2]
P2[0]
NC
7
8
9
50
49
48
10
47
46
45
44
43
42
41
40
39
38
37
36
35
34
NC
NC
NC
NC
11
12
13
P3[2]
P3[0]
CCLK
HCLK
XRES
NC
OCDE
OCDO
SMP
14
SSOP
15
16
17
Vss
Vss
NC
NC
NC
18
19
20
P3[3]
P3[1]
NC
NC
NC
21
22
23
NC
P1[6]
I2C SCL, P1[7]
P1[4], EXTCLK
P1[2]
I2C SDA, P1[5]
24
25
33
32
NC
P1[3]
P1[0], I2C
NC
SDA, SDATA
26
27
28
31
30
SCLK, I2C SCL, P1[1]
Vss
NC
29
Table 6. Pin Definitions – CY8C21001 56-Pin (SSOP)
Type
Pin No.
Pin Name
Description
Digital
Power
Analog
1
V
Ground connection
SS
2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
P0[7]
Analog column mux input
3
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
NC
Analog column mux input and column output
Analog column mux input and column output
Analog column mux input
4
5
6
7
8
I
I
Direct switched capacitor block input
Direct switched capacitor block input
No connection
9
10
11
12
13
14
15
16
17
18
19
NC
No connection
NC
No connection
NC
No connection
OCD
OCD
Power
Power
Power
I/O
OCDE
OCDO
SMP
OCD even data I/O
OCD odd data output
SMP connection to required external components
Ground connection
V
V
SS
Ground connection
SS
P3[3]
Document Number: 001-67345 Rev. *A
Page 13 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Table 6. Pin Definitions – CY8C21001 56-Pin (SSOP) (continued)
Type
Pin No.
20
Pin Name
Description
Digital
Analog
I/O
P3[1]
NC
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
No connection
No connection
NC
2
I/O
I/O
P1[7]
P1[5]
NC
I C SCL
2
I C SDA
No connection
I/O
I/O
P1[3]
P1[1]
I
FMTEST
2
[8]
I C SCL, ISSP-SCLK
Ground connection
No connection
Power
V
SS
NC
NC
No connection
2
[8]
I/O
I/O
I/O
I/O
P1[0]
P1[2]
P1[4]
P1[6]
NC
I C SDA, ISSP-SDATA
V
FMTEST
Optional external clock input (EXTCLK)
No connection
NC
No connection
NC
No connection
NC
No connection
NC
No connection
NC
No connection
Input
OCD
OCD
I/O
XRES
HCLK
CCLK
P3[0]
P3[2]
NC
Active high external reset with internal pull-down
OCD high-speed clock output
OCD CPU clock output
I/O
No connection
No connection
NC
I/O
I
I
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
I/O
I/O
I/O
I/O
I
I
I
I
Analog column mux input
I/O
Analog column mux input and column output
Analog column mux input and column output
Analog column mux input
I/O
I/O
Power
V
Supply voltage
DD
LEGEND: A = Analog, I = Input, O = Output, and OCD = On-Chip Debug.
Note
8. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 001-67345 Rev. *A
Page 14 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Register Reference
This chapter lists the registers of the CY8C21x34B PSoC device. For detailed register information, see the PSoC Technical Reference
Manual.
Register Conventions
The register conventions specific to this section are listed in Table 7.
Table 7. Register Conventions
Convention
Description
Read register or bit(s)
R
W
L
Write register or bit(s)
Logical register or bit(s)
Clearable register or bit(s)
Access is bit specific
C
#
Register Mapping Tables
The PSoC device has a total register address space of 512 bytes. The register space is referred to as I/O space and is divided into
two banks, Bank 0 and Bank 1. The XOI bit in the Flag register (CPU_F) determines which bank the user is currently in. When the
XOI bit is set to 1, the user is in Bank 1.
Note In the following register mapping tables, blank fields are reserved and must not be accessed.
Document Number: 001-67345 Rev. *A
Page 15 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Table 8. Register Map 0 Table: User Space
Name
PRT0DR
Addr (0,Hex) Access
Name
Addr (0,Hex) Access
40
Name
ASE10CR0
Addr (0,Hex) Access
Name
Addr (0,Hex) Access
C0
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
RW
PRT0IE
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
ASE11CR0
RW
PRT1GS
PRT1DM2
PRT2DR
PRT2IE
PRT2GS
PRT2DM2
PRT3DR
PRT3IE
PRT3GS
PRT3DM2
CUR_PP
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
RW
RW
STK_PP
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
IDX_PP
RW
RW
RW
RW
#
MVR_PP
MVW_PP
I2C_CFG
I2C_SCR
I2C_DR
RW
#
I2C_MSCR
INT_CLR0
INT_CLR1
RW
RW
INT_CLR3
INT_MSK3
RW
RW
DBB00DR0
DBB00DR1
DBB00DR2
DBB00CR0
DBB01DR0
DBB01DR1
DBB01DR2
DBB01CR0
DCB02DR0
DCB02DR1
DCB02DR2
DCB02CR0
DCB03DR0
DCB03DR1
DCB03DR2
DCB03CR0
#
AMX_IN
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
RW
RW
RW
INT_MSK0
INT_MSK1
INT_VC
RW
RW
RC
W
W
RW
#
AMUXCFG
PWM_CR
RES_WDT
#
CMP_CR0
CMP_CR1
#
W
RW
#
RW
DEC_CR0
DEC_CR1
RW
RW
#
ADC0_CR
ADC1_CR
#
#
W
RW
#
#
TMP_DR0
TMP_DR1
TMP_DR2
TMP_DR3
RW
RW
RW
RW
W
RW
#
RDI0RI
RW
RW
RW
RW
RW
RW
RW
RDI0SYN
RDI0IS
ACE00CR1
ACE00CR2
RW
RW
RDI0LT0
RDI0LT1
RDI0RO0
RDI0RO1
ACE01CR1
ACE01CR2
RW
RW
CPU_F
RL
DAC_D
RW
#
CPU_SCR1
CPU_SCR0
#
Blank fields are reserved and must not be accessed.
# Access is bit specific.
Document Number: 001-67345 Rev. *A
Page 16 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Table 9. Register Map 1 Table: Configuration Space
Name
PRT0DM0
Addr (1,Hex) Access
Name
Addr (1,Hex) Access
Name
ASE10CR0
Addr (1,Hex) Access
Name
Addr (1,Hex) Access
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
RW
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
PRT2DM0
PRT2DM1
PRT2IC0
PRT2IC1
PRT3DM0
PRT3DM1
PRT3IC0
PRT3IC1
ASE11CR0
RW
GDI_O_IN
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
RW
RW
RW
RW
GDI_E_IN
GDI_O_OU
GDI_E_OU
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
MUX_CR0
MUX_CR1
MUX_CR2
MUX_CR3
RW
RW
RW
RW
OSC_GO_EN
OSC_CR4
OSC_CR3
OSC_CR0
OSC_CR1
OSC_CR2
VLT_CR
RW
RW
RW
RW
RW
RW
RW
R
DBB00FN
DBB00IN
DBB00OU
RW
RW
RW
CLK_CR0
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
RW
RW
RW
RW
RW
CLK_CR1
ABF_CR0
AMD_CR0
CMP_GO_EN
DBB01FN
DBB01IN
DBB01OU
RW
RW
RW
VLT_CMP
ADC0_TR
ADC1_TR
RW
RW
AMD_CR1
ALT_CR0
RW
RW
DCB02FN
DCB02IN
DCB02OU
RW
RW
RW
IMO_TR
ILO_TR
BDG_TR
ECO_TR
W
W
RW
W
CLK_CR3
TMP_DR0
TMP_DR1
TMP_DR2
TMP_DR3
RW
RW
RW
RW
RW
DCB03FN
DCB03IN
DCB03OU
RW
RW
RW
RDI0RI
RW
RW
RW
RW
RW
RW
RW
RDI0SYN
RDI0IS
ACE00CR1
ACE00CR2
RW
RW
RDI0LT0
RDI0LT1
RDI0RO0
RDI0RO1
ACE01CR1
ACE01CR2
RW
RW
CPU_F
RL
FLS_PR1
RW
DAC_CR
RW
#
CPU_SCR1
CPU_SCR0
#
Blank fields are reserved and must not be accessed.
# Access is bit specific.
Document Number: 001-67345 Rev. *A
Page 17 of 47
[+] Feedback
CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C21x34B PSoC device. For up-to-date electrical specifica-
tions, visit the Cypress web site at http://www.cypress.com.
Specifications are valid for –40 °C ≤ T ≤ 85 °C and T ≤ 100 °C as specified, except where noted.
A
J
Refer to Table 21 on page 25 for the electrical specifications for the IMO using SLIMO mode.
Figure 14. IMO Frequency Trim Options
Figure 11. Voltage versus CPU Frequency
5.25
4.75
5.25
4.75
SLIMO
SLIMO
Mode=1
Mode=0
3.60
3.00
2.40
SLIMO
SLIMO
Mode=1
Mode=0
3.00
2.40
SLIMO
SLIMO
Mode=1 Mode=1
93 kHz
12 MHz
CPU Frequency
24 MHz
3 MHz
93 kHz
6 MHz
12 MHz
24 MHz
IMO Frequency
Absolute Maximum Ratings
Symbol
Description
Min
Typ
Max
Units
Notes
T
Storage temperature
–55
25
+100
°C
Higher storage temperatures
reduce data retention time.
Recommended storage
STG
temperature is +25 °C ± 25 °C.
Extended duration storage
temperatures above 65 °C
degrade reliability.
T
Bake temperature
Bake time
–
125
–
See
package
label
°C
BAKETEMP
BAKETIME
t
See
package
label
72
Hours
T
Ambient temperature with power applied
–40
–
–
–
–
–
–
–
+85
°C
V
A
V
V
V
Supply voltage on V relative to V
SS
–0.5
+6.0
DD
IO
DD
DC input voltage
V
V
– 0.5
– 0.5
V
V
+ 0.5
+ 0.5
V
SS
SS
DD
DD
DC voltage applied to tri-state
Maximum current into any port pin
Electrostatic discharge voltage
Latch-up current
V
IOZ
MIO
I
–25
+50
mA
V
ESD
LU
2000
–
–
Human body model ESD.
200
mA
Document Number: 001-67345 Rev. *A
Page 18 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Operating Temperature
Symbol
Description
Min
–40
–40
Typ
–
Max
+85
Units
°C
Notes
T
Ambient temperature
Junction temperature
A
T
–
+100
°C
The temperature rise from ambient to
junction is package specific. SeeTable
34 on page 36. You must limit the
power consumption tocomply with this
requirement.
J
DC Electrical Characteristics
DC Chip-Level Specifications
Table 10 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters
A
A
A
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 10. DC Chip-level Specifications
Symbol
Description
Supply voltage
Min
2.40
–
Typ
–
Max
5.25
4
Units
V
Notes
V
See Table 18 on page 23
DD
I
I
I
Supply current, IMO = 24 MHz
3
mA
Conditions are V = 5.0 V,
DD
T = 25 °C, CPU = 3 MHz,
48 MHz disabled. VC1 = 1.5 MHz,
VC2 = 93.75 kHz, VC3 = 0.366 kHz
DD
A
Supply current, IMO = 6 MHz using
SLIMO mode.
–
–
1.2
1.1
2
mA
mA
Conditions are V = 3.3 V,
DD
T = 25 °C, CPU = 3 MHz, clock
doubler disabled. VC1 = 375 kHz,
VC2 = 23.4 kHz, VC3 = 0.091 kHz
DD3
A
Supply current, IMO = 6 MHz using
SLIMO mode.
1.5
Conditions are V = 2.55 V,
DD
T = 25 °C, CPU = 3 MHz, clock
doubler disabled. VC1 = 375 kHz,
VC2 = 23.4 kHz, VC3 = 0.091 kHz
DD27
A
I
I
Sleep (mode) current with POR, LVD,
sleep timer, WDT, and internal slow
oscillator active. Mid temperature range.
–
–
2.6
2.8
4
5
µA
µA
V
V
= 2.55 V, 0 °C ≤ T ≤ 40 °C
SB27
DD
A
Sleep (mode) current with POR, LVD,
Sleep Timer, WDT, and internal slow
oscillator active.
= 3.3 V, –40 °C ≤ T ≤ 85 °C
SB
DD
A
V
V
Reference voltage (Bandgap)
Reference voltage (Bandgap)
Analog ground
1.28
1.16
1.30
1.30
1.32
1.33
V
V
V
Trimmed for appropriate V
DD
REF
DD
DD
V
= 3.0 V to 5.25 V
Trimmed for appropriate V
= 2.4 V to 3.0 V
REF27
V
DD
AGND
V
– 0.003
V
V
+ 0.003
REF
REF
REF
Document Number: 001-67345 Rev. *A
Page 19 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
DC General-Purpose I/O Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively.
A
A
A
Typical parameters are measured at 5 V, 3.3 V, and 2.7 V at 25 °C and are for design guidance only.
Table 11. 5-V and 3.3-V DC GPIO Specifications
Symbol
Description
Min
4
Typ
5.6
5.6
–
Max
Units
kΩ
Notes
R
Pull-up resistor
8
8
–
PU
PD
OH
R
Pull-down resistor
High output level
4
kΩ
V
V
– 1.0
V
I
= 10 mA, V = 4.75 to 5.25 V
OH DD
DD
(8 total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])
V
Low output level
–
–
0.75
V
I
= 25 mA, V = 4.75 to 5.25 V
OL
OL DD
(8 total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5]))
I
I
High level source current
Low level sink current
10
25
–
–
–
–
mA
mA
V
= V – 1.0 V, see the limitations
OH DD
OH
of the total current in the note for V
OH
V
= 0.75 V, see the limitations of the
OL
OL
total current in the note for V
OL
V
V
V
Input low level
–
2.1
–
–
–
0.8
V
V
V
V
= 3.0 to 5.25
= 3.0 to 5.25
IL
IH
H
DD
DD
Input high level
Input hysteresis
60
1
–
–
mV
nA
pF
I
Input leakage (absolute value)
Capacitive load on pins as input
–
Gross tested to 1 µA
IL
C
–
3.5
10
Package and pin dependent
Temp = 25 °C
IN
C
Capacitive load on pins as output
–
3.5
10
pF
Package and pin dependent
Temp = 25 °C
OUT
Table 12. 2.7-V DC GPIO Specifications
Symbol Description
Min
4
Typ
5.6
5.6
–
Max
Units
kΩ
kΩ
Notes
R
Pull-up resistor
8
8
–
PU
PD
OH
R
Pull-down resistor
High output level
4
V
V
– 0.4
V
I
= 2.5 mA (6.25 Typ), V = 2.4 to
OH DD
3.0 V (16 mA maximum, 50 mA Typ
combined I budget)
DD
OH
V
Low output level
–
–
–
–
0.75
–
V
I
= 10 mA, V = 2.4 to 3.0 V (90 mA
OL
OL DD
maximum combined I budget)
OL
I
I
High level source current
Low level sink current
2.5
10
mA
mA
V
= V – 0.4 V, see the limitations
OH DD
OH
of the total current in the note for V
OH
–
V
= 0.75 V, see the limitations of the
OL
OL
total current in the note for V
OL
V
V
V
Input low level
–
2.0
–
–
–
0.75
–
V
V
V
V
= 2.4 to 3.0
= 2.4 to 3.0
IL
IH
H
DD
DD
Input high level
Input hysteresis
90
1
–
mV
nA
pF
I
Input leakage (absolute value)
Capacitive load on pins as input
–
–
Gross tested to 1 µA
IL
C
–
3.5
10
Package and pin dependent
Temp = 25 °C
IN
C
Capacitive load on pins as output
–
3.5
10
pF
Package and pin dependent
Temp = 25 °C
OUT
Document Number: 001-67345 Rev. *A
Page 20 of 47
[+] Feedback
CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
DC Operational Amplifier Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively.
A
A
A
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 13. 5-V DC Operational Amplifier Specifications
Symbol
Description
Min
–
Typ
2.5
10
Max
15
–
Units
mV
Notes
V
Input offset voltage (absolute value)
Average input offset voltage drift
OSOA
TCV
–
µV/°C
pA
OSOA
I
I
Input leakage current (Port 0 analog pins 7-to-1)
Input leakage current (Port 0, Pin 0 analog pin)
Input capacitance (Port 0 analog pins)
–
200
50
–
Gross tested to 1 µA
Gross tested to 1 µA
EBOA
EBOA00
–
–
nA
C
–
4.5
9.5
pF
Package and pin dependent.
Temp = 25 °C
INOA
V
Common mode voltage range
0.0
–
V
– 1.0
DD
V
CMOA
G
Open loop gain
–
–
80
10
–
dB
µA
OLOA
I
Amplifier supply current
30
SOA
Table 14. 3.3-V DC Operational Amplifier Specifications
Symbol
Description
Min
–
Typ
2.5
10
Max
15
–
Units
mV
Notes
V
Input offset voltage (absolute value)
Average input offset voltage drift
OSOA
TCV
–
µV/°C
pA
OSOA
I
I
Input leakage current (Port 0 analog pins)
Input leakage current (Port 0, Pin 0 analog pin)
Input capacitance (Port 0 analog pins)
–
200
50
–
Gross tested to 1 µA
Gross tested to 1 µA
EBOA
EBOA00
–
–
nA
C
–
4.5
9.5
pF
Package and pin dependent.
Temp = 25 °C
INOA
V
Common mode voltage range
Open loop gain
0
–
–
–
V
– 1.0
DD
V
CMOA
G
80
10
–
dB
µA
OLOA
I
Amplifier supply current
30
SOA
Table 15. 2.7-V DC Operational Amplifier Specifications
Symbol
Description
Min
–
Typ
2.5
10
Max
15
–
Units
mV
Notes
V
Input offset voltage (absolute value)
Average input offset voltage drift
OSOA
TCV
–
µV/°C
pA
OSOA
I
I
Input leakage current (Port 0 analog pins)
Input leakage current (Port 0, Pin 0 analog pin)
Input capacitance (Port 0 analog pins)
–
200
50
–
Gross tested to 1 µA
Gross tested to 1 µA
EBOA
EBOA00
–
–
nA
C
–
4.5
9.5
pF
Package and pin dependent.
Temp = 25 °C
INOA
V
Common mode voltage range
Open loop gain
0
–
–
–
V
– 1.0
DD
V
CMOA
G
80
10
–
dB
µA
OLOA
I
Amplifier supply current
30
SOA
Document Number: 001-67345 Rev. *A
Page 21 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
DC Switch Mode Pump Specifications
Table 16 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters
A
A
A
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Figure 12. Basic Switch Mode Pump Circuit
D1
Vdd
VPUMP
L1
SMP
Vss
+
C1
VBAT
Battery
PSoC
Table 16. DC Switch Mode Pump (SMP) Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
V
V
V
5 V output voltage from pump
4.75
3.00
2.45
5.0
5.25
V
V
V
Configured as in Note 9
PUMP5V
Average, neglecting ripple
SMP trip voltage is set to 5.0 V
3.3 V output voltage from pump
2.6 V output voltage from pump
Available output current
3.25
2.55
3.60
2.80
Configured as in Note 9
Average, neglecting ripple.
SMP trip voltage is set to 3.25 V
PUMP3V
PUMP2V
PUMP
Configured as in Note 9
Average, neglecting ripple.
SMP trip voltage is set to 2.55 V
I
Configured as in Note 9
V
V
V
= 1.8 V, V
= 1.5 V, V
= 1.3 V, V
= 5.0 V
= 3.25 V
= 2.55 V
5
8
8
–
–
–
–
–
–
mA
mA
mA
SMP trip voltage is set to 5.0 V
SMP trip voltage is set to 3.25 V
SMP trip voltage is set to 2.55 V
BAT
BAT
BAT
PUMP
PUMP
PUMP
V
V
V
V
Input voltage range from battery
1.8
1.0
1.0
1.2
–
–
–
–
5.0
3.3
2.8
–
V
V
V
V
Configured as in Note 9
BAT5V
SMP trip voltage is set to 5.0 V
Input voltage range from battery
Configured as in Note 9
SMP trip voltage is set to 3.25 V
BAT3V
Input voltage range from battery
Configured as in Note 9
SMP trip voltage is set to 2.55 V
BAT2V
Minimum input voltage from battery to start pump
Configured as in Note 9
BATSTART
0 °C ≤ T ≤ 100. 1.25 V at
A
T = –40 °C
A
ΔV
ΔV
Line regulation (over Vi range)
Load regulation
–
–
5
5
–
–
%V
Configured as in Note 9
PUMP_Line
PUMP_Load
O
V
is the “V Value for PUMP Trip”
O
DD
specified by the VM[2:0] setting in
the DC POR and LVD Specification,
Table 18 on page 23
%V
Configured as in Note 9
O
V
is the “V Value for PUMP Trip”
O
DD
specified by the VM[2:0] setting in
the DC POR and LVD Specification,
Table 18 on page 23
Note
9. L1 = 2 mH inductor, C1 = 10 mF capacitor, D1 = Schottky diode. See Figure 12.
Document Number: 001-67345 Rev. *A
Page 22 of 47
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CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Table 16. DC Switch Mode Pump (SMP) Specifications (continued)
Symbol
Description
Min
Typ
Max
Units
Notes
ΔV
Output voltage ripple (depends on cap/load)
–
100
–
mVpp Configured as in Note 9
Load is 5 mA
PUMP_Ripple
E
E
Efficiency
Efficiency
35
35
50
80
–
–
%
Configured as in Note 9
Load is 5 mA. SMP trip voltage is set
to 3.25 V
3
2
%
For I load = 1mA, V
= 2.55 V,
PUMP
V
= 1.3 V,
BAT
10 µH inductor, 1 µF capacitor, and
Schottky diode
F
Switching frequency
Switching duty cycle
–
–
1.3
50
–
–
MHz
%
PUMP
DC
PUMP
DC Analog Mux Bus Specifications
Table 17 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters
A
A
A
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 17. DC Analog Mux Bus Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
2.4 V ≤ V ≤ 2.7 V
R
R
Switch resistance to common analog bus
–
–
400
800
Ω
V
≥ 2.7 V
DD
SW
DD
Resistance of initialization switch to V
–
–
800
Ω
VDD
DD
DC POR and LVD Specifications
Table 18 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters
A
A
A
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 18. DC POR and LVD Specifications
Symbol
Description
value for PPOR trip
Min
Typ
Max
Units
Notes
V
V
must be greater than or equal to
DD
DD
V
V
V
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
–
–
–
2.36
2.82
4.55
2.40
2.95
4.70
V
V
V
2.5 V during startup, the reset from
the XRES pin, or reset from
watchdog
PPOR0
PPOR1
PPOR2
V
value for LVD trip
DD
[10]
[11]
V
V
V
V
V
V
V
V
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
2.40
2.85
2.95
3.06
4.37
4.50
4.62
4.71
2.45
2.92
3.02
3.13
4.48
4.64
4.73
4.81
2.51
2.99
V
V
V
V
V
V
V
V
LVD0
LVD1
LVD2
LVD3
LVD4
LVD5
LVD6
LVD7
3.09
3.20
4.55
4.75
4.83
4.95
V
value for pump trip
DD
[12]
V
V
V
V
V
V
V
V
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
2.45
2.96
3.03
3.18
4.54
4.62
4.71
4.89
2.55
3.02
3.10
3.25
4.64
4.73
4.82
5.00
2.62
V
V
V
V
V
V
V
V
PUMP0
PUMP1
PUMP2
PUMP3
PUMP4
PUMP5
PUMP6
PUMP7
3.09
3.16
[13]
3.32
4.74
4.83
4.92
5.12
Notes
10. Always greater than 50 mV above VPPOR (PORLEV = 00) for falling supply.
11. Always greater than 50 mV above VPPOR (PORLEV = 01) for falling supply.
12. Always greater than 50 mV above VLVD0
13. Always greater than 50 mV above VLVD3
.
.
Document Number: 001-67345 Rev. *A
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DC Programming Specifications
Table 19 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters
A
A
A
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 19. DC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
V
V
V
V
V
for programming and erase
4.5
5
5.5
V
This specification applies to the
functional requirements of external
programmer tools
DDP
DD
Low V for verify
2.4
5.1
2.7
2.5
5.2
2.6
5.3
V
V
V
This specification applies to the
functional requirements of external
programmer tools
DDLV
DDHV
DD
High V for verify
This specification applies to the
functional requirements of external
programmer tools
DD
Supply voltage for flash write operation
5.25
This specification applies to this
device when it is executing internal
flash writes
DDIWRITE
I
Supply current during programming or verify
Input low voltage during programming or verify
–
–
5
–
–
25
0.8
–
mA
V
DDP
V
V
ILP
Input high voltage during programming or
verify
2.2
V
IHP
I
I
Input current when applying V to P1[0] or
–
–
–
–
–
–
–
0.2
1.5
mA
mA
V
Driving internal pull-down resistor
Driving internal pull-down resistor
ILP
IHP
ILP
P1[1] during programming or verify
Input current when applying V
to P1[0] or
IHP
P1[1] during programming or verify
V
V
Output low voltage during programming or
verify
V
+ 0.75
OLV
SS
Output high voltage during programming or
verify
V
– 1.0
V
V
OHV
DD
DD
[14]
Flash
Flash
Flash
Flash endurance (per block)
50,000
–
–
–
–
–
–
–
–
Erase/write cycles per block
Erase/write cycles
ENPB
ENT
DR
[15]
Flash endurance (total)
1,800,000
10
Flash data retention
Years
DC I2C Specifications
Table 20 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters
A
A
A
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
[16]
Table 20. DC I2C Specifications
Symbol
Description
Min
Typ
–
Max
Units
Notes
V
V
Input low level
Input high level
–
–
0.3 × V
V
V
V
2.4 V ≤ V ≤ 3.6 V
ILI2C
DD
DD
–
0.25 × V
–
4.75 V ≤ V ≤ 5.25 V
DD
DD
0.7 × V
–
2.4 V ≤ V ≤ 5.25 V
IHI2C
DD
DD
Notes
14. The 50,000 cycle flash endurance per block is only guaranteed if the flash is operating within one voltage range. Voltage ranges are 2.4 V to 3.0 V, 3.0 V to 3.6 V,
and 4.75 V to 5.25 V.
15. A maximum of 36 × 50,000 block endurance cycles is allowed. This may be balanced between operations on 36 × 1 blocks of 50,000 maximum cycles each, 36×2
blocks of 25,000 maximum cycles each, or 36 × 4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36 × 50,000 and ensure that no
single block ever sees more than 50,000 cycles). For the full industrial range, you must employ a temperature sensor user module (FlashTemp) and feed the result
to the temperature argument before writing. Refer to the Flash APIs application note AN2015 (Design Aids - Reading and Writing PSoC® Flash) for more information.
16. All GPIO meet the DC GPIO VIL and VIH specifications found in the DC GPIO Specifications sections. The I2C GPIO pins also meet the above specs.
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AC Electrical Characteristics
AC Chip-Level Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively.
A
A
A
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 21. 5-V and 3.3-V AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
[17,18]
F
F
F
IMO frequency for 24 MHz
23.4
24
24.6
MHz Trimmed for 5 V or 3.3 V
operation using factory trim
values. See Figure 14 on
IMO24
page 18. SLIMO mode = 0
[17,18]
[17]
IMO frequency for 6 MHz
5.5
6
6.5
MHz Trimmed for 5 V or 3.3 V
operation using factory trim
values. See Figure 14 on
IMO6
CPU1
page 18. SLIMO mode = 1
CPU frequency (5 V nominal)
CPU frequency (3.3 V nominal)
0.091
24
24.6
MHz 24 MHz only for
SLIMO mode = 0
[18]
F
F
0.091
0
12
48
12.3
MHz SLIMO mode = 0
CPU2
BLK5
0
[17,19]
Digital PSoC block frequency (5 V nominal)
49.2
MHz Refer to AC Digital Block
Specifications on page 28
[19]
F
F
F
Digital PSoC block frequency (3.3 V nominal)
ILO frequency
0
15
5
24
32
–
24.6
MHz
kHz
BLK33
32K1
64
ILO untrimmed frequency
100
kHz
After a reset and before the
M8C starts to run, the ILO is
not trimmed. See the system
resets section of the PSoC
Technical Reference Manual
for details on this timing
32K_U
t
External reset pulse width
24 MHz duty cycle
10
40
–
50
–
60
80
–
μs
%
XRST
DC24M
DC
ILO duty cycle
20
50
%
ILO
Step24M
Fout48M
24 MHz trim step size
48 MHz output frequency
–
50
kHz
[17,18]
46.8
48.0
49.2
MHz Trimmed. Using factory trim
values
F
Maximum frequency of signal on row input or
row output.
–
–
–
–
–
12.3
250
100
MHz
MAX
SR
Power supply slew rate
V/ms
ms
V
slew rate during
POWER_UP
POWERUP
DD
power-up
t
Time from end of POR to CPU executing code
16
Power-up from 0 V. See the
System Resets section of the
PSoC Technical Reference
Manual
[20]
t
24-MHz IMO cycle-to-cycle jitter (RMS)
–
–
200
300
700
900
ps
ps
jit_IMO
24-MHz IMO long term N cycle-to-cycle jitter
N = 32
[20]
(RMS)
[20]
24-MHz IMO period jitter (RMS)
–
100
400
ps
Notes
17. 4.75 V < VDD < 5.25 V.
18. 3.0 V < VDD < 3.6 V. See application note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation
at 3.3 V.
19. See the individual user module datasheets for information on maximum frequencies for user modules.
20. Refer to Cypress Jitter Specifications Application Note AN5054 “Understanding Datasheet Jitter Specifications for Cypress Timing Products” at
www.cypress.com under Application Notes for more information.
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Table 22. 2.7-V AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
0
[21,22]
F
F
IMO frequency for 12 MHz
11.5
12
12.7
MHz Trimmed for 2.7 V operation
using factory trim values. See
Figure 14 on page 18. SLIMO
mode = 1
IMO12
[21,22]
IMO frequency for 6 MHz
5.5
6
6.5
MHz Trimmed for 2.7 V operation
using factory trim values. See
Figure 14 on page 18. SLIMO
mode = 1
IMO6
[21]
F
F
CPU frequency (2.7 V nominal)
0.093
0
3
3.15
MHz 12 MHz only for
SLIMO mode = 0
CPU1
[21,22]
Digital PSoC block frequency (2.7 V nominal)
12
12.5
MHz Refer to AC Digital Block
Specifications on page 28
BLK27
F
F
ILO frequency
8
5
32
–
96
kHz
32K1
ILO untrimmed frequency
100
kHz
After a reset and before the
M8C starts to run, the ILO is
not trimmed. See the System
Resets section of the PSoC
Technical Reference Manual
for details on this timing
32K_U
t
External reset pulse width
IILO duty cycle
10
20
–
–
50
–
–
µs
%
XRST
DC
80
ILO
F
Maximum frequency of signal on row input or
row output.
12.3
MHz
MAX
SR
Power supply slew rate
–
–
–
250
100
V/ms
ms
V
slew rate during
POWER_UP
DD
power-up
t
Time from end of POR to CPU executing code
16
Power-up from 0 V. See the
System Resets section of the
PSoC Technical Reference
Manual.
POWERUP
[23]
t
12 MHz IMO cycle-to-cycle jitter (RMS)
–
–
400
600
1000
1300
ps
ps
jit_IMO
12 MHz IMO long term N cycle-to-cycle jitter
N = 32
[23]
(RMS)
[23]
12 MHz IMO period jitter (RMS)
–
100
500
ps
Note
21. 2.4 V < VDD < 3.0 V.
22. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” available at http://www.cypress.com for information on
maximum frequency for user modules.
23. Refer to Cypress Jitter Specifications Application Note AN5054 “Understanding Datasheet Jitter Specifications for Cypress Timing Products” at
www.cypress.com under Application Notes for more information.
Document Number: 001-67345 Rev. *A
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AC General Purpose I/O Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively.
A
A
A
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 23. 5-V and 3.3-V AC GPIO Specifications
Symbol
Description
GPIO operating frequency
Min
0
Typ
–
Max
12
18
18
–
Units
Notes
F
MHz Normal strong mode
GPIO
TRiseF
TFallF
TRiseS
TFallS
Rise time, normal strong mode, Cload = 50 pF
Fall time, normal strong mode, Cload = 50 pF
Rise time, slow strong mode, Cload = 50 pF
Fall time, slow strong mode, Cload = 50 pF
3
–
ns
ns
ns
ns
V
V
V
V
= 4.5 to 5.25 V, 10% to 90%
= 4.5 to 5.25 V, 10% to 90%
= 3 to 5.25 V, 10% to 90%
= 3 to 5.25 V, 10% to 90%
DD
DD
DD
DD
2
–
7
27
22
7
–
Table 24. 2.7 V AC GPIO Specifications
Symbol
Description
GPIO operating frequency
Min
0
Typ
–
Max
3
Units
Notes
F
MHz Normal strong mode
GPIO
TRiseF
TFallF
TRiseS
TFallS
Rise time, normal strong mode, Cload = 50 pF
Fall time, normal strong mode, Cload = 50 pF
Rise time, slow strong mode, Cload = 50 pF
Fall time, slow strong mode, Cload = 50 pF
6
–
50
ns
ns
ns
ns
V
V
V
V
= 2.4 to 3.0 V, 10% to 90%
= 2.4 to 3.0 V, 10% to 90%
= 2.4 to 3.0 V, 10% to 90%
= 2.4 to 3.0 V, 10% to 90%
DD
DD
DD
DD
6
–
50
18
18
40
40
120
120
Figure 13. GPIO Timing Diagram
90%
GPIO
Pin
Output
Voltage
10%
TRiseF
TRiseS
TFallF
TFallS
AC Operational Amplifier Specifications
Table 25 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters
A
A
A
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 25. AC Operational Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
2.4 V < V < 3.0 V
T
Comparator mode response time, 50 mV
overdrive
–
–
100
200
ns
ns
V
≥ 3.0 V
DD
COMP
CC
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AC Digital Block Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively.
A
A
A
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 26. 5-V and 3.3-V AC Digital Block Specifications
Function
Description
Min
Typ
Max
Unit
Notes
All functions Block input clock frequency
V
V
≥ 4.75 V
–
–
–
–
49.2
24.6
MHz
MHz
DD
< 4.75 V
DD
Timer
Input clock frequency
No capture, V ≥ 4.75 V
–
–
–
–
–
–
–
49.2
24.6
24.6
–
MHz
MHz
MHz
ns
DD
No capture, V < 4.75 V
DD
With capture
[24]
Capture pulse width
Input clock frequency
50
Counter
Dead Band
No enable input, V ≥ 4.75 V
–
–
–
–
–
–
–
49.2
24.6
24.6
–
MHz
MHz
MHz
ns
DD
No enable input, V < 4.75 V
DD
With enable input
Enable input pulse width
Kill pulse width
[24]
50
Asynchronous restart mode
Synchronous restart mode
Disable mode
20
–
–
–
–
–
–
ns
ns
ns
[24]
50
50
[24]
Input clock frequency
V
≥ 4.75 V
–
–
–
49.2
24.6
MHz
MHz
DD
V
< 4.75 V
–
DD
CRCPRS
(PRS
Input clock frequency
V
V
≥ 4.75 V
–
–
–
–
–
–
49.2
24.6
24.6
MHz
MHz
MHz
DD
DD
Mode)
< 4.75 V
CRCPRS
(CRC
Mode)
Input clock frequency
SPIM
Input clock frequency
–
–
–
8.2
MHz
The SPI serial clock (SCLK) frequency is equal to
the input clock frequency divided by 2.
SPIS
Input clock (SCLK) frequency
–
–
4.1
–
MHz
ns
The input clock is the SPI SCLK in SPIS mode.
[24]
Width of SS_negated between
transmissions
50
Transmitter
Receiver
Input clock frequency
The baud rate is equal to the input clock frequency
divided by 8.
V
V
V
≥ 4.75 V, 2 stop bits
≥ 4.75 V, 1 stop bit
< 4.75 V
–
–
–
–
–
–
49.2
24.6
24.6
MHz
MHz
MHz
DD
DD
DD
Input clock frequency
The baud rate is equal to the input clock frequency
divided by 8.
V
V
V
≥ 4.75 V, 2 stop bits
–
–
–
–
–
–
49.2
24.6
24.6
MHz
MHz
MHz
DD
DD
DD
≥ 4.75 V, 1 stop bit
< 4.75 V
Note
24. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
Document Number: 001-67345 Rev. *A
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Table 27. 2.7-V AC Digital Block Specifications
Function
Description
Min
Typ
Max
Units
Notes
All
functions
Block input clock frequency
–
–
12.7
MHz
2.4 V < V < 3.0 V
DD
[25]
Timer
Capture pulse width
100
–
–
–
–
–
–
ns
Input clock frequency, with or without capture
Enable input pulse width
Input clock frequency, no enable input
Input clock frequency, enable input
Kill pulse width:
–
100
–
12.7
–
MHz
ns
Counter
12.7
12.7
MHz
MHz
–
Dead Band
Asynchronous restart mode
Synchronous restart mode
Disable mode
20
100
100
–
–
–
–
–
–
–
–
ns
ns
–
ns
Input clock frequency
12.7
12.7
MHz
MHz
CRCPRS
(PRS Mode)
Input clock frequency
–
CRCPRS
Input clock frequency
Input clock frequency
–
–
–
–
12.7
6.35
MHz
MHz
(CRC Mode)
SPIM
The SPI serial clock (SCLK)
frequency is equal to the input
clock frequency divided by 2.
SPIS
Input clock (SCLK) frequency
Width of SS_ Negated between transmissions
Input clock frequency
–
100
–
–
–
–
4.1
–
MHz
ns
Transmitter
Receiver
12.7
MHz
The baud rate is equal to the input
clock frequency divided by 8.
Input clock frequency
–
–
12.7
MHz
The baud rate is equal to the input
clock frequency divided by 8.
AC External Clock Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ T ≤ 85 °C, or 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters are measured at 5 V,
A
A
3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 28. 5-V AC External Clock Specifications
Symbol
Description
Min
Typ
–
Max
24.6
5300
–
Units
MHz
ns
Notes
F
–
–
–
Frequency
High period
Low period
0.093
20.6
20.6
150
OSCEXT
–
–
ns
Power-up IMO to switch
–
–
µs
Note
25. 100 ns minimum input pulse width is based on the input synchronizers running at 12 MHz (84 ns nominal period).
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Table 29. 3.3-V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
F
F
Frequency with CPU clock divide by 1
0.093
–
12.3
MHz Maximum CPU frequency is 12 MHz
at 3.3 V. With the CPU clock divider
set to 1, the external clock must
adhere to the maximum frequency
and duty cycle requirements
OSCEXT
Frequency with CPU clock divide by 2 or
greater
0.186
–
24.6
MHz If the frequency of the external clock
is greater than 12 MHz, the CPU clock
divider must be set to 2 or greater. In
this case, the CPU clock divider
ensures that the fifty percent duty
cycle requirement is met
OSCEXT
–
–
–
High period with CPU clock divide by 1
Low period with CPU clock divide by 1
Power-up IMO to switch
41.7
41.7
150
–
–
–
5300
ns
ns
µs
–
–
Table 30. 2.7-V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
0
F
F
Frequency with CPU clock divide by 1
0.093
–
3.08
MHz Maximum CPU frequency is 3 MHz at
2.7 V. With the CPU clock divider set
to 1, the external clock must adhere to
the maximum frequency and duty
cycle requirements
OSCEXT
Frequency with CPU clock divide
by 2 or greater
0.186
–
6.35
MHz If the frequency of the external clock
is greater than 3 MHz, the CPU clock
divider must be set to 2 or greater. In
this case, the CPU clock divider
ensures that the fifty percent duty
cycle requirement is met
OSCEXT
–
–
–
High period with CPU clock divide by 1
Low period with CPU clock divide by 1
Power-up IMO to switch
160
160
150
–
–
–
5300
ns
ns
µs
–
–
Document Number: 001-67345 Rev. *A
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AC Programming Specifications
Table 31 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ T ≤ 85 °C, or 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, respectively. Typical parameters are measured at 5 V, 3.3 V, or 2.7 V
A
A
at 25 °C and are for design guidance only.
Table 31. AC Programming Specifications
Symbol
Description
Rise time of SCLK
Fall time of SCLK
Min
1
Typ
–
Max
20
20
–
Units
ns
Notes
T
T
T
T
F
T
T
T
T
T
T
RSCLK
1
–
ns
FSCLK
Data setup time to falling edge of SCLK
Data hold time from falling edge of SCLK
Frequency of SCLK
40
40
0
–
ns
SSCLK
–
–
ns
HSCLK
SCLK
–
8
MHz
ms
ms
ns
Flash erase time (block)
–
10
40
–
–
ERASEB
WRITE
Flash block write time
–
–
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
Flash erase time (Bulk)
–
45
50
70
–
3.6 < V
DD
DSCLK
DSCLK3
DSCLK2
ERASEALL
–
–
ns
3.0 ≤ V ≤ 3.6
DD
–
–
ns
2.4 ≤ V ≤ 3.0
DD
–
20
ms
Erase all blocks and protection
fields at once
[26]
T
T
Flash block erase + flash block write time
Flash block erase + flash block write time
–
–
–
–
100
200
ms
ms
0 °C ≤ Tj ≤ 100 °C
–40 °C ≤ Tj ≤ 0 °C
PROGRAM_HOT
PROGRAM_COLD
[26]
2
AC I C Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ T ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ T ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ T ≤ 85 °C, respectively.
A
A
A
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 32. AC Characteristics of the I2C SDA and SCL Pins for VDD ≥ 3.0 V
Standard Mode
Fast Mode
Symbol
Description
SCL clock frequency
Units
Min
0
Max
100
–
Min
Max
400
–
F
T
0
kHz
µs
SCLI2C
Hold time (repeated) start condition. After this
period, the first clock pulse is generated
4.0
0.6
HDSTAI2C
T
T
T
T
T
T
T
T
Low period of the SCL clock
High period of the SCL clock
Setup time for a repeated start condition
Data hold time
4.7
4.0
4.7
0
–
–
–
–
–
–
–
–
1.3
0.6
0.6
0
–
–
µs
µs
µs
µs
ns
µs
µs
ns
LOWI2C
HIGHI2C
SUSTAI2C
HDDATI2C
SUDATI2C
SUSTOI2C
BUFI2C
–
–
[27]
Data setup time
250
4.0
4.7
–
100
–
Setup time for stop condition
Bus free time between a stop and start condition
0.6
1.3
0
–
–
Pulse width of spikes suppressed by the input
filter.
50
SPI2C
Notes
26. For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
Refer to the Flash APIs application note AN2015 (Design Aids - Reading and Writing PSoC® Flash) for more information.
27. A Fast-Mode I2C-bus device may be used in a Standard-Mode I2C-bus system, but it must meet the requirement TSU;DAT ≥ 250 ns. This is automatically the case if
the device does not stretch the LOW period of the SCL signal. If the device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA
line Trmax + TSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-67345 Rev. *A
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Table 33. 2.7-V AC Characteristics of the I2C SDA and SCL Pins (Fast Mode not Supported)
Standard Mode
Fast Mode
Symbol
Description
SCL clock frequency
Units
Min
Max
100
–
Min
–
Max
–
F
T
0
kHz
µs
SCLI2C
Hold time (repeated) start condition. After this
period, the first clock pulse is generated.
4.0
–
–
HDSTAI2C
T
T
T
T
T
T
T
Low period of the SCL clock
High period of the SCL clock
Setup time for a repeated start condition
Data hold time
4.7
4.0
4.7
0
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
µs
µs
µs
µs
ns
µs
µs
LOWI2C
HIGHI2C
SUSTAI2C
HDDATI2C
SUDATI2C
SUSTOI2C
BUFI2C
Data setup time
250
4.0
4.7
Setup time for stop condition
Bus free time between a stop and start
condition
T
Pulse width of spikes are suppressed by the
input filter.
–
–
–
–
ns
SPI2C
Figure 14. Definition for Timing for Fast/Standard Mode on the I2C Bus
I2C_SDA
I2C_SCL
TSUDATI2C
THDSTAI2C
TSPI2C
TSUSTAI2C
TBUFI2C
THDDATI2C
THIGHI2C TLOWI2C
TSUSTOI2C
P
S
S
Sr
Repeated START Condition
STOP Condition
START Condition
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Packaging Information
This section shows the packaging specifications for the CY8C21x34B PSoC device with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the emulator pod drawings at http://www.cypress.com.
Figure 15. 16-Pin (150-Mil) SOIC
51-85068 *C
Figure 16. 20-Pin (210-Mil) SSOP
51-85077 *E
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Figure 17. 28-Pin (210-Mil) SSOP
51-85079 *E
Figure 18. 32-Pin QFN ( 5 X 5 X 1.0 MM) LT32B (3.5 X 3.5) EPAD (SAWN)
001-30999 *C
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Figure 19. 32-Pin (5 × 5 × 0.4 mm) QFN (Sawn 1.85 × 2.85) EPAD
0.500
0.064
-0.090
0.25±0.040
0.10 MIN
D
P A
S E D X P E O
E
A B R E L D S O L
0.400
0
0 . 1 8 5 1 ± .
TOP VIEW
0.300 MIN
BOTTOM VIEW
BARE COOPER
NOTES:
1. HATCH AREA IS SOLDERABLE EXPOSED PAD.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
0.064
0.127
3. REFERENCE JEDEC #: MO-220
001-44368 *B
4. MAXIMUM ALLOWABLE METAL IS 0.0508mm
5. PACKAGE WEIGHT: 0.029 grams
Figure 20. 32-Pin Thin Sawn QFN Package
001-48913 *B
Important Note For information on the preferred dimensions for mounting QFN packages, see the Application Notes for Surface
Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages available at http://www.amkor.com.
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Figure 21. 56-Pin (300-Mil) SSOP
51-85062 *D
Thermal Impedances
Table 34. Thermal Impedances per Package
[28]
Package
16-Pin SOIC
Typical θ
Typical θ
JC
JA
123 °C/W
117 °C/W
96 °C/W
27 °C/W
22 °C/W
48 °C/W
55 °C/W
41 °C/W
39 °C/W
15 °C/W
12 °C/W
24 °C/W
20-Pin SSOP
28-Pin SSOP
[29]
32-Pin QFN
32-Pin QFN
5 × 5 mm 0.60 Max
5 × 5 mm 0.93 Max
[29]
56-Pin SSOP
Solder Reflow Peak Temperature
Table 35 lists the maximum solder reflow peak temperatures to achieve good solderability. Thermal ramp rate during preheat should
be 3 °C/s or lower.
Table 35. Solder Reflow Peak Temperature
Package
Maximum Peak Temperature
Time at Maximum Temperature
16-Pin SOIC
260 °C
260 °C
260 °C
260 °C
260 °C
20 s
20 s
20 s
20 s
20 s
20-Pin SSOP
28-Pin SSOP
32-Pin QFN
56-Pin SSOP
Notes
28. TJ = TA + Power × θ
JA
29. To achieve the thermal impedance specified for the QFN package, refer to Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF)
Packages available at http://www.amkor.com.
30. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5 °C with Sn-Pb or 245 ± 5 °C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.
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Development Tool Selection
This section presents the development tools available for all
current PSoC device families including the CY8C21x34B family.
Evaluation Tools
All evaluation tools can be purchased from the Cypress Online
Store.
Software
CY3210-MiniProg1
PSoC Designer™
The CY3210-MiniProg1 kit allows you to program PSoC devices
through the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
through a provided USB 2.0 cable. The kit includes:
At the core of the PSoC development software suite is
PSoC Designer, used to generate PSoC firmware applications.
PSoC Designer is available free of charge at
http://www.cypress.com and includes a free C compiler.
■ MiniProg programming unit
PSoC Programmer
■ MiniEval socket programming and evaluation board
■ 28-Pin CY8C29466-24PXI PDIP PSoC device sample
■ 28-Pin CY8C27443-24PXI PDIP PSoC device sample
■ PSoC Designer software CD
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or operates
directly from PSoC Designer. PSoC Programmer software is
compatible with both PSoC ICE-Cube In-Circuit Emulator and
PSoC MiniProg. PSoC programmer is available free of charge at
http://www.cypress.com.
■ Getting Started guide
■ USB 2.0 cable
Development Kits
All development kits can be purchased from the Cypress Online
Store.
CY3210-PSoCEval1
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of bread-
boarding space to meet all of your evaluation needs. The kit
includes:
CY3215-DK Basic Development Kit
The CY3215-DK is for prototyping and development with
PSoC Designer. This kit supports in-circuit emulation, and the
software interface allows you to run, halt, and single step the
processor, and view the content of specific memory locations.
Advance emulation features also supported through PSoC
Designer. The kit includes:
■ Evaluation board with LCD module
■ MiniProg programming unit
■ Two 28-Pin CY8C29466-24PXI PDIP PSoC device samples
■ PSoC Designer software CD
■ Getting Started guide
■ PSoC Designer software CD
■ ICE-Cube in-circuit emulator
■ ICE Flex-Pod for CY8C29x66 family
■ Cat-5 adapter
■ USB 2.0 cable
■ Mini-Eval programming board
■ 110 ~ 240 V power supply, Euro-Plug adapter
■ iMAGEcraft C compiler
CY3214-PSoCEvalUSB
The CY3214-PSoCEvalUSB evaluation kit features a
development board for the CY8C24794-24LFXI PSoC device.
The board includes both USB and capacitive sensing
development and debugging support. This evaluation board also
includes an LCD module, potentiometer, LEDs, an enunciator
and plenty of breadboarding space to meet all of your evaluation
needs. The kit includes:
■ ISSP cable
■ USB 2.0 cable and Blue Cat-5 cable
■ Two CY8C29466-24PXI 28-PDIP chip samples
■ PSoCEvalUSB board
■ LCD module
■ MIniProg programming unit
■ Mini USB cable
■ PSoC Designer and example projects CD
■ Getting Started guide
■ Wire pack
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Device Programmers
All device programmers can be purchased from the Cypress Online Store.
CY3216 Modular Programmer
CY3207ISSP In-System Serial Programmer (ISSP)
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
Note CY3207ISSP needs special software and is not compatible
with PSoC Programmer. The kit includes:
■ Modular programmer base
■ Three programming module cards
■ MiniProg programming unit
■ PSoC Designer software CD
■ Getting Started guide
■ CY3207 programmer unit
■ PSoC ISSP software CD
■ 110 ~ 240 V power supply, Euro-Plug adapter
■ USB 2.0 cable
■ USB 2.0 cable
Accessories (Emulation and Programming)
Table 36. Emulation and Programming Accessories
[31]
[32]
Part Number
CY8C21234B-24SXI
CY8C21334B-24PVXI
CY8C21534B-24PVXI
Pin Package
16-Pin SOIC
Flex-Pod Kit
CY3250-21X34
CY3250-21X34
CY3250-21X34
Foot Kit
Adapter
CY3250-16SOIC-FK
CY3250-20SSOP-FK
CY3250-28SSOP-FK
Adapters can be found at
http://www.emulation.com.
20-Pin SSOP
28-Pin SSOP
Notes
31. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
32. Foot kit includes surface mount feet that can be soldered to the target PCB.
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Ordering Information
[33]
16-Pin (150-Mil) SOIC
CY8C21x34B-24SXI
CY8C21x34B-24SXIT
8 K
8 K
512 Yes –40 °C to +85 °C
512 Yes –40 °C to +85 °C
4
4
4
4
12 12
12 12
0
0
No
No
[33]
16-Pin (150-Mil) SOIC
(Tape and Reel)
[33]
[33]
20-Pin (210-Mil) SSOP
CY8C21x34B-24PVXI
8 K
512
512
No
No
–40 °C to +85 °C
–40 °C to +85 °C
4
4
4
4
16 16
16 16
0
0
Yes
Yes
20-Pin (210-Mil) SSOP
(Tape and Reel)
CY8C21x34B-24PVXIT 8 K
[33]
[33]
28-Pin (210-Mil) SSOP
CY8C21x34B-24PVXI
8 K
512
512
No
No
–40 °C to +85 °C
–40 °C to +85 °C
4
4
4
4
24 24
24 24
0
0
Yes
Yes
28-Pin (210-Mil) SSOP
(Tape and Reel)
CY8C21x34B-24PVXIT 8 K
[33]
[33]
[33]
[33]
32-Pin (5 × 5 mm 1.00 max)
Sawn QFN
CY8C21x34B-24LTXI
CY8C21x34B-24LTXIT
CY8C21x34B-24LCXI
CY8C21x34B-24LCXIT
8 K
8 K
8 K
8 K
512
512
512
512
No
No
No
No
–40 °C to +85 °C
–40 °C to +85 °C
–40 °C to +85 °C
–40 °C to +85 °C
4
4
4
4
4
4
4
4
28 28
28 28
28 28
28 28
0
0
0
0
Yes
Yes
Yes
Yes
32-Pin (5 × 5 mm 1.00 max)
[34]
Sawn QFN
(Tape and Reel)
32-Pin (5 × 5 mm 0.40 max)
[34]
Sawn QFN
32-Pin (5 × 5 mm 0.40 max)
[34]
Sawn QFN
(Tape and Reel)
[33]
[33]
32-Pin (5 × 5 mm 0.60 max)
Thin Sawn QFN
CY8C21x34B-24LQXI
8 K
512
512
No
No
–40 °C to +85 °C
–40 °C to +85 °C
4
4
4
4
28 28
28 28
0
0
Yes
Yes
32-Pin (5 × 5 mm 0.60 max)
Thin Sawn QFN
CY8C21x34B-24LQXIT 8 K
(Tape and Reel)
[33]
56-Pin OCD SSOP
CY8C21001-24PVXI
8 K
512 Yes –40 °C to +85 °C
4
4
26 26
0
Yes
Note For Die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
Notes
33. All Digital I/O Pins also connect to the common analog mux.
34. Refer to the section 32-Pin Part Pinout on page 11 for pin differences.
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Ordering Code Definitions
CY 8 C 21xxxx-24 xx
Package Type:
Thermal Rating:
C = Commercial
I = Industrial
PX = PDIP Pb-free
SX = SOIC Pb-free
PVX = SSOP Pb-free
E = Extended
LFX/LKX/LTX/LCX/LQX = QFN Pb-free
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress PSoC
Cypress
Company ID: CY =
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Acronyms
Table 37 lists the acronyms that are used in this document.
Table 37. Acronyms Used in this Datasheet
Acronym
AC
Description
alternating current
Acronym
MIPS
OCD
PCB
Description
million instructions per second
on-chip debug
ADC
API
analog-to-digital converter
application programming interface
complementary metal oxide semiconductor
central processing unit
printed circuit board
CMOS
CPU
CRC
CT
PDIP
PGA
plastic dual-in-line package
programmable gain amplifier
phase-locked loop
cyclic redundancy check
continuous time
PLL
POR
power on reset
DAC
DC
digital-to-analog converter
direct current
PPOR
PRS
precision power on reset
pseudo-random sequence
Programmable System-on-Chip
pulse width modulator
quad flat no leads
®
DTMF
ECO
dual-tone multi-frequency
external crystal oscillator
PSoC
PWM
QFN
EEPROM electrically erasable programmable read-only
memory
GPIO
ICE
general purpose I/O
RTC
SAR
real time clock
in-circuit emulator
successive approximation
switched capacitor
IDE
integrated development environment
internal low speed oscillator
internal main oscillator
input/output
SC
ILO
SLIMO
SMP
SOIC
slow IMO
IMO
I/O
switch-mode pump
small-outline integrated circuit
serial peripheral interface
static random access memory
supervisory read only memory
shrink small-outline package
universal asynchronous receiver / transmitter
universal serial bus
TM
IrDA
ISSP
LCD
LED
LPC
LVD
MAC
MCU
infrared data association
in-system serial programming
liquid crystal display
light-emitting diode
SPI
SRAM
SROM
SSOP
UART
USB
low power comparator
low voltage detect
multiply-accumulate
WDT
watchdog timer
microcontroller unit
XRES
external reset
Reference Documents
CY8CPLC20, CY8CLED16P01, CY8C29x66, CY8C27x43, CY8C24x94, CY8C24x23, CY8C24x23A, CY8C22x13, CY8C21x34B,
CY8C21x23, CY7C64215, CY7C603xx, CY8CNP1xx, and CYWUSB6953 PSoC® Programmable System-on-Chip Technical
Reference Manual (TRM) (001-14463)
Design Aids – Reading and Writing PSoC® Flash - AN2015 (001-40459)
Adjusting PSoC® Trims for 3.3 V and 2.7 V Operation – AN2012 (001-17397)
Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 (001-14503)
Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages – available at http://www.amkor.com.
Document Number: 001-67345 Rev. *A
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Document Conventions
Units of Measure
Table 38 lists the units of measures.
Table 38. Units of Measure
Symbol
kB
Unit of Measure
Symbol
µH
Unit of Measure
1024 bytes
decibels
microhenry
microsecond
millisecond
nanosecond
picosecond
microvolts
millivolts
dB
µs
°C
degree Celsius
microfarad
femto farad
picofarad
ms
µF
ns
fF
ps
pF
µV
kHz
MHz
rt-Hz
kΩ
kilohertz
mV
mVpp
nV
megahertz
root hertz
kilohm
millivolts peak-to-peak
nanovolts
volts
V
Ω
ohm
µW
W
microwatts
watt
µA
microampere
milliampere
nanoampere
pikoampere
millihenry
mA
nA
mm
ppm
%
millimeter
parts per million
percent
pA
mH
Numeric Conventions
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’).
Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended
lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimals.
Glossary
active high
1. A logic signal having its asserted state as the logic 1 state.
2. A logic signal having the logic 1 state as the higher voltage of the two states.
analog blocks
The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous
time) blocks. These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain
stages, and much more.
analog-to-digital A device that changes an analog signal to a digital signal of corresponding magnitude. Typically,
(ADC)
an ADC converts a voltage to a digital number. The digital-to-analog (DAC) converter performs
the reverse operation.
Application
programming
interface (API)
A series of software routines that comprise an interface between a computer application and
lower level services and functions (for example, user modules and libraries). APIs serve as
building blocks for programmers that create software applications.
asynchronous
A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal.
bandgap
reference
A stable voltage reference design that matches the positive temperature coefficient of VT with
the negative temperature coefficient of VBE, to produce a zero temperature coefficient (ideally)
reference.
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Glossary (continued)
bandwidth
1. The frequency range of a message or information processing system measured in hertz.
2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or
loss); it is sometimes represented more specifically as, for example, full width at half maximum.
bias
1. A systematic deviation of a value from a reference value.
2. The amount by which the average of a set of values departs from a reference value.
3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a
reference level to operate the device.
block
buffer
1. A functional unit that performs a single function, such as an oscillator.
2. A functional unit that may be configured to perform one of several functions, such as a digital
PSoC block or an analog PSoC block.
1. A storage area for data that is used to compensate for a speed difference, when transferring
data from one device to another. Usually refers to an area reserved for IO operations, into
which data is read, or from which data is written.
2. A portion of memory set aside to store data, often before it is sent to an external device or as
it is received from an external device.
3. An amplifier used to lower the output impedance of a system.
bus
1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets
with similar routing patterns.
2. A set of signals performing a common function and carrying similar data. Typically represented
using vector notation; for example, address[7:0].
3. One or more conductors that serve as a common connection for a group of related devices.
clock
The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is
sometimes used to synchronize different logic blocks.
comparator
compiler
An electronic circuit that produces an output voltage or current whenever two input levels simultaneously
satisfy predetermined amplitude requirements.
A program that translates a high level language, such as C, into machine language.
configuration
space
In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to
‘1’.
crystal oscillator An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric
crystal is less sensitive to ambient temperature than other circuit components.
cyclicredundancy A calculation used to detect errors in data communications, typically performed using a linear
check (CRC)
feedback shift register. Similar calculations may be used for a variety of other purposes such as
data compression.
data bus
A bi-directional set of signals used by a computer to convey information from a memory location
to the central processing unit and vice versa. More generally, a set of signals used to convey
data between digital functions.
debugger
A hardware and software system that allows you to analyze the operation of the system
under development. A debugger usually allows the developer to step through the firmware one
step at a time, set break points, and analyze memory.
dead band
A period of time when neither of two or more signals are in their active state or in transition.
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Glossary (continued)
digital blocks
The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC
generator, pseudo-random number generator, or SPI.
digital-to-analog A device that changes a digital signal to an analog signal of corresponding magnitude. The analog-
(DAC)
to-digital (ADC) converter performs the reverse operation.
duty cycle
emulator
The relationship of a clock period high time to its low time, expressed as a percent.
Duplicates (provides an emulation of) the functions of one system with a different system, so that
the second system appears to behave like the first system.
External Reset
(XRES)
An active high signal that is driven into the PSoC device. It causes all operation of the CPU and
blocks to stop and return to a pre-defined state.
Flash
An electrically programmable and erasable, non-volatile technology that provides you the
programmability and data storage of EPROMs, plus in-system erasability. Non-volatile means
that the data is retained when power is OFF.
Flash block
The smallest amount of Flash ROM space that may be programmed at one time and the smallest
amount of Flash space that may be protected. A Flash block holds 64 bytes.
frequency
gain
The number of cycles or events per unit of time, for a periodic function.
The ratio of output current, voltage, or power to input current, voltage, or power, respectively.
Gain is usually expressed in dB.
2
I C
A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). I2C is an
Inter-Integrated Circuit. It is used to connect low-speed peripherals in an embedded system. The
original system was created in the early 1980s as a battery control interface, but it was later used
as a simple internal bus system for building control electronics. I2C uses only two bi-directional
pins, clock and data, both running at +5V and pulled high with resistors. The bus operates at 100
kbits/second in standard mode and 400 kbits/second in fast mode.
ICE
The in-circuit emulator that allows you to test the project in a hardware environment, while
viewing the debugging device activity in a software environment (PSoC Designer).
input/output (I/O) A device that introduces data into or extracts data from a system.
interrupt
A suspension of a process, such as the execution of a computer program, caused by an event
external to that process, and performed in such a way that the process can be resumed.
interrupt service A block of code that normal code execution is diverted to when the M8C receives a hardware
routine (ISR)
interrupt. Many interrupt sources may each exist with its own priority and individual ISR code
block. Each ISR code block ends with the RETI instruction, returning the device to the point in
the program where it left normal program execution.
jitter
1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on
serial data streams.
2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between
successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles.
low-voltagedetect A circuit that senses Vdd and provides an interrupt to the system when Vdd falls below a
(LVD) selected threshold.
Document Number: 001-67345 Rev. *A
Page 44 of 47
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Glossary (continued)
M8C
An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside
a PSoC by interfacing to the Flash, SRAM, and register space.
master device
A device that controls the timing for data exchanges between two devices. Or when devices are
cascaded in width, the master device is the one that controls the timing for data exchanges
between the cascaded devices and an external interface. The controlled device is called the
slave device.
microcontroller
An integrated circuit chip that is designed primarily for control systems and products. In addition
to a CPU, a microcontroller typically includes memory, timing circuits, and IO circuitry. The reason
for this is to permit the realization of a controller with a minimal quantity of chips, thus
achieving maximal possible miniaturization. This in turn, reduces the volume and the cost of
the controller. The microcontroller is normally not used for general-purpose computation as is a
microprocessor.
mixed-signal
modulator
noise
The reference to a circuit containing both analog and digital techniques and components.
A device that imposes a signal on a carrier.
1. A disturbance that affects a signal and that may distort the information carried by the signal.
2. The random variations of one or more characteristics of any entity such as voltage, current, or data.
oscillator
parity
A circuit that may be crystal controlled and is used to generate a clock frequency.
A technique for testing transmitting data. Typically, a binary digit is added to the data to make the
sum of all the digits of the binary data either always even (even parity) or always odd (odd parity).
Phase-locked
loop (PLL)
An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative
to a reference signal.
pinouts
The pin number assignment: the relation between the logical inputs and outputs of the PSoC
device and their physical counterparts in the printed circuit board (PCB) package. Pinouts
involve pin numbers as a link between schematic and PCB design (both being computer generated
files) and may also involve pin names.
port
A group of pins, usually eight.
Power on reset
(POR)
A circuit that forces the PSoC device to reset when the voltage is below a pre-set level. This is
one type of hardware reset.
®
®
PSoC
Cypress Semiconductor’s PSoC is a registered trademark and Programmable System-on-
Chip™ is a trademark of Cypress.
PSoC Designer™ The software for Cypress’ Programmable System-on-Chip technology.
pulse width
An output in the form of duty cycle which varies as a function of the applied measurement
modulator (PWM)
RAM
An acronym for random access memory. A data-storage device from which data can be read out
and new data can be written in.
register
reset
A storage device with a specific capacity, such as a bit or byte.
A means of bringing a system back to a know state. See hardware reset and software reset.
Document Number: 001-67345 Rev. *A
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Glossary (continued)
ROM
serial
An acronym for read only memory. A data-storage device from which data can be read out, but
new data cannot be written in.
1. Pertaining to a process in which all events occur one after the other.
2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or
channel.
settling time
shift register
slave device
The time it takes for an output signal or value to stabilize after the input has changed from one
value to another.
A memory storage device that sequentially shifts a word either left or right to output a stream of
serial data.
A device that allows another device to control the timing for data exchanges between two
devices. Or when devices are cascaded in width, the slave device is the one that allows another
device to control the timing of data exchanges between the cascaded devices and an external
interface. The controlling device is called the master device.
SRAM
SROM
An acronym for static random access memory. A memory device where you can store and
retrieve data at a high rate of speed. The term static is used because, after a value is loaded into an SRAM cell,
it remains unchanged until it is explicitly altered or until power is removed from the device.
An acronym for supervisory read only memory. The SROM holds code that is used to boot the
device, calibrate circuitry, and perform Flash operations. The functions of the SROM may be
accessed in normal user code, operating from Flash.
stop bit
A signal following a character or block that prepares the receiving device to receive the next
character or block.
synchronous
1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal.
2. A system whose operation is synchronized by a clock signal.
tri-state
A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does
not drive any value in the Z state and, in many respects, may be considered to be disconnected
from the rest of the circuit, allowing another output to drive the same net.
UART
A UART or universal asynchronous receiver-transmitter translates between parallel bits of data
and serial bits.
user modules
Pre-build, pre-tested hardware/firmware peripheral functions that take care of managing and
configuring the lower level Analog and Digital PSoC Blocks. User Modules also provide high
level API (Application Programming Interface) for the peripheral function.
user space
The bank 0 space of the register map. The registers in this bank are more likely to be modified
during normal program execution and not just during initialization. Registers in bank 1 are most
likely to be modified only during the initialization phase of the program.
V
V
A name for a power net meaning ‘voltage drain’. The most positive power supply signal. Usually
5 V or 3.3 V.
DD
A name for a power net meaning ‘voltage source’. The most negative power supply signal.
SS
watchdog timer
A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified
period of time.
Document Number: 001-67345 Rev. *A
Page 46 of 47
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CY8C21334B, CY8C21234B
Document History Page
Document Title: CY8C21234B, CY8C21334B, CY8C21434B, CY8C21534B, CY8C21634B PSoC® Programmable
System-on-Chip™
Document Number: 001-67345
Orig. of
Change
Submission
Date
Description of Change
Revision
ECN
**
3169205
3247292
YVA
YVA
02/16/2011 New datasheet
*A
05/11/2011 Updated package diagrams. Post to Web.
Sales, Solutions, and Legal Information
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© Cypress Semiconductor Corporation, 2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any
circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical,
life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical
components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-67345 Rev. *A
Revised May 13, 2011
Page 47 of 47
®
®
PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC and CapSense are registered trademarks of Cypress Semiconductor Corporation.
2
2
2
Purchase of I C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I C Patent Rights to use these components in an I C system, provided
2
that the system conforms to the I C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.
All products and company names mentioned in this document may be the trademarks of their respective holders.
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