CY8C22113_04 [CYPRESS]
PSoC⑩ Mixed Signal Array; 的PSoC ™混合信号阵列
| 型号： | CY8C22113_04 |
| 厂家： | 
CYPRESS |
| 描述： | PSoC⑩ Mixed Signal Array |
| 文件： | 总36页 (文件大小：755K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PSoC™ Mixed Signal Array
Final Data Sheet
CY8C22113 and CY8C22213
Features
■
Powerful Harvard Architecture Processor
■
■
Precision, Programmable Clocking
■
Additional System Resources
❐
I2C Slave, Master, and Multi-Master to
❐
❐
❐
❐
M8C Processor Speeds to 24 MHz
Low Power at High Speed
3.0 to 5.25 V Operating Voltage
Industrial Temperature Range: -40°C to +85°C
❐
❐
Internal ±2.5% 24/48 MHz Oscillator
High-Accuracy 24 MHz with Optional 32.768
kHz Crystal and PLL
400 kHz
❐
❐
❐
❐
Watchdog and Sleep Timers
User-Configurable Low Voltage Detection
Integrated Supervisory Circuit
❐
❐
Optional External Oscillator, up to 24 MHz
Internal Oscillator for Watchdog and Sleep
■
Advanced Peripherals (PSoC Blocks)
On-Chip Precision Voltage Reference
Flexible On-Chip Memory
❐
3 Rail-to-Rail Analog PSoC Blocks Provide:
- Up to 14-Bit ADCs
❐
2K Bytes Flash Program Storage 50,000
Erase/Write Cycles
■
Complete Development Tools
❐
Free Development Software
(PSoC™ Designer)
- Up to 9-Bit DACs
❐
❐
❐
❐
❐
256 Bytes SRAM Data Storage
In-System Serial Programming (ISSP)
Partial Flash Updates
Flexible Protection Modes
EEPROM Emulation in Flash
- Programmable Gain Amplifiers
- Programmable Filters and Comparators
4 Digital PSoC Blocks Provide:
- 8- to 32-Bit Timers, Counters, and PWMs
- CRC and PRS Modules
❐
Full-Featured, In-Circuit Emulator and
Programmer
❐
❐
❐
❐
Full Speed Emulation
Complex Breakpoint Structure
128K Bytes Trace Memory
■
Programmable Pin Configurations
- Full-Duplex UART
- SPI Masters or Slaves
- Connectable to all GPIO Pins
❐
❐
25 mA Sink on all GPIO
Pull up, Pull down, High Z, Strong, or Open
Drain Drive Modes on all GPIO
Up to 8 Analog Inputs on GPIO
One 30 mA Analog Outputs on GPIO
Configurable Interrupt on all GPIO
❐
Complex Peripherals by Combining Blocks
❐
❐
❐
Analog
Port 0
Drivers
PSoC™ Functional Overview
Port 1
PSoC CORE
The PSoC™ family consists of many Mixed Signal Array with
On-Chip Controller devices. These devices are designed to
replace multiple traditional MCU-based system components
with one, low cost single-chip programmable device. PSoC
devices include configurable blocks of analog and digital logic,
as well as programmable interconnects. This architecture
allows the user to create customized peripheral configurations
that match the requirements of each individual application.
Additionally, a fast CPU, Flash program memory, SRAM data
memory, and configurable IO are included in a range of conve-
nient pinouts and packages.
SYSTEM BUS
Global Digital Interconnect
Global Analog Interconnect
SRAM
256 Bytes
SROM
Flash 2K
Sleep and
Watchdog
CPU Core (M8C)
Interrupt
Controller
Multiple Clock Sources
(Includes IMO, ILO, PLL, and ECO)
The PSoC architecture, as illustrated on the left, is comprised of
four main areas: PSoC Core, Digital System, Analog System,
and System Resources. Configurable global busing allows all
the device resources to be combined into a complete custom
system. The PSoC CY8C22x13 family can have up to two IO
ports that connect to the global digital and analog interconnects,
providing access to 4 digital blocks and 3 analog blocks.
DIGITAL SYSTEM
ANALOG SYSTEM
Analog
Ref
Analog
Block
Array
Digital
Block Array
(1 Row,
4 Blocks)
Analog
Input
Muxing
(1 Column,
3 Blocks)
The PSoC Core
The PSoC Core is a powerful engine that supports a rich fea-
ture set. The core includes a CPU, memory, clocks, and config-
urable GPIO (General Purpose IO).
POR and LVD
System Resets
Internal
Voltage
Ref.
Digital
Clocks
Decimator
I2C
The M8C CPU core is a powerful processor with speeds up to
24 MHz, providing a four MIPS 8-bit Harvard architecture micro-
SYSTEM RESOURCES
June 2004
© Cypress MicroSystems, Inc. 2004 — Document No. 38-12009 Rev. *E
1
CY8C22x13 Final Data Sheet
PSoC™ Overview
processor. The CPU utilizes an interrupt controller with 10 vec-
tors, to simplify programming of real time embedded events.
Program execution is timed and protected using the included
Sleep and Watch Dog Timers (WDT).
Digital peripheral configurations include those listed below.
■ PWMs (8 to 32 bit)
■ PWMs with Dead band (8 to 32 bit)
■ Counters (8 to 32 bit)
Memory encompasses 2 KB of Flash for program storage, 256
bytes of SRAM for data storage, and up to 2 KB of EEPROM
emulated using the Flash. Program Flash utilizes four protec-
tion levels on blocks of 64 bytes, allowing customized software
IP protection.
■ Timers (8 to 32 bit)
■ UART 8-bit with selectable parity (up to 1)
■ SPI master and slave (up to 1)
■ I2C slave and master (1 available as a System Resource)
■ Cyclical Redundancy Checker/Generator (8 to 32 bit)
■ IrDA (up to 1)
The PSoC device incorporates flexible internal clock genera-
tors, including a 24 MHz IMO (internal main oscillator) accurate
to 2.5% over temperature and voltage. The 24 MHz IMO can
also be doubled to 48 MHz for use by the digital system. A low
power 32 kHz ILO (internal low speed oscillator) is provided for
the Sleep timer and WDT. If crystal accuracy is desired, the
ECO (32.768 kHz external crystal oscillator) is available for use
as a Real Time Clock (RTC) and can optionally generate a crys-
tal-accurate 24 MHz system clock using a PLL. The clocks,
together with programmable clock dividers (as a System
Resource), provide the flexibility to integrate almost any timing
requirement into the PSoC device.
■ Pseudo Random Sequence Generators (8 to 32 bit)
The digital blocks can be connected to any GPIO through a
series of global buses that can route any signal to any pin. The
buses also allow for signal multiplexing and for performing logic
operations. This configurability frees your designs from the con-
straints of a fixed peripheral controller.
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows you the opti-
mum choice of system resources for your application. Family
resources are shown in the table titled “PSoC Device Charac-
teristics” on page 3.
PSoC GPIOs provide connection to the CPU, digital and analog
resources of the device. Each pin’s drive mode may be selected
from eight options, allowing great flexibility in external interfac-
ing. Every pin also has the capability to generate a system inter-
rupt on high level, low level, and change from last read.
The Analog System
The Analog System is composed of 3 configurable blocks, each
comprised of an opamp circuit allowing the creation of complex
analog signal flows. Analog peripherals are very flexible and
can be customized to support specific application requirements.
Some of the more common PSoC analog functions (most avail-
able as user modules) are listed below.
The Digital System
The Digital System is composed of 4 digital PSoC blocks. Each
block is an 8-bit resource that can be used alone or combined
with other blocks to form 8, 16, 24, and 32-bit peripherals, which
are called user module references.
■ Analog-to-digital converters (one with 6- to 14-bit resolution,
selectable as Incremental, Delta Sigma, and SAR)
Port 1
Port 0
■ Filters (two pole band-pass, low-pass, and notch)
■ Amplifiers (one with selectable gain to 48x)
■ Comparators (one with 16 selectable thresholds)
■ DACs (one with 6- to 9-bit resolution)
To System Bus
Digital Clocks
From Core
To Analog
System
■ Multiplying DACs (one with 6- to 9-bit resolution)
DIGITAL SYSTEM
■ High current output drivers (one with 30 mA drive as a Core
Digital PSoC Block Array
Resource)
■ 1.3V reference (as a System Resource)
■ Many other topologies possible
Row 0
8
4
8
8
8
DBB00
DBB01
DCB02 DCB03
4
GIE[7:0]
GIO[7:0]
GOE[7:0]
GOO[7:0]
Global Digital
Interconnect
Digital System Block Diagram
June 3, 2004
Document No. 38-12009 Rev. *E
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CY8C22x13 Final Data Sheet
PSoC™ Overview
Analog blocks are provided in columns of three, which includes
one CT (Continuous Time) and two SC (Switched Capacitor)
blocks. The number of blocks is dependant on the device family
which is detailed in the table titled “PSoC Device Characteris-
tics” on page 3.
Additional System Resources
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems. Addi-
tional resources include a decimator, low voltage detection, and
power on reset. Brief statements describing the merits of each
system resource are presented below.
P0[7]
P0[5]
P0[6]
P0[4]
■ Digital clock dividers provide three customizable clock fre-
quencies for use in applications. The clocks can be routed to
both the digital and analog systems. Additional clocks can be
generated using digital PSoC blocks as clock dividers.
P0[3]
P0[1]
P0[2]
P0[0]
■ The decimator provides a custom hardware filter for digital
signal processing applications including the creation of Delta
Sigma ADCs.
■ The I2C module provides 100 and 400 kHz communication
over two wires. Slave, master, and multi-master modes are
all supported.
■ Low Voltage Detection (LVD) interrupts can signal the appli-
cation of falling voltage levels, while the advanced POR
(Power On Reset) circuit eliminates the need for a system
supervisor.
■ An internal 1.3 voltage reference provides an absolute refer-
ence for the analog system, including ADCs and DACs.
Array Input Configuration
PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and
analog systems can have 16, 8, or 4 digital blocks and 12, 6, or
3 analog blocks. The following table lists the resources
available for specific PSoC device groups.
ACI0[1:0]
ACI1[1:0]
Block Array
PSoC Device Characteristics
ACB01
ASD11
ASC21
PSoC Part
Number
up to
64
CY8C29x66
CY8C27x66
CY8C27x43
CY8C24x23
CY8C22x13
4
2
2
1
1
16
8
12
12
12
12
8
4
4
4
2
1
4
4
4
2
1
12
12
12
6
up to
44
up to
44
Analog Reference
8
up to
24
Interface to
Digital System
Reference
Generators
RefHi
RefLo
AGND
AGNDIn
RefIn
Bandgap
4
up to
16
4
3
M8C Interface (Address Bus, Data Bus, Etc.)
Analog System Block Diagram
June 3, 2004
Document No. 38-12009 Rev. *E
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CY8C22x13 Final Data Sheet
PSoC™ Overview
Getting Started
Development Tools
The Cypress MicroSystems PSoC Designer is a Microsoft®
Windows-based, integrated development environment for the
Programmable System-on-Chip (PSoC) devices. The PSoC
Designer IDE and application runs on Windows 98, Windows
NT 4.0, Windows 2000, Windows Millennium (Me), or Windows
XP. (Reference the PSoC Designer Functional Flow diagram
below.)
The quickest path to understanding the PSoC silicon is by read-
ing this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an over-
view of the PSoC integrated circuit and presents specific pin,
register, and electrical specifications. For in-depth information,
along with detailed programming information, reference the
PSoC™ Mixed Signal Array Technical Reference Manual.
For up-to-date Ordering, Packaging, and Electrical Specification
information, reference the latest PSoC device data sheets on
the web at http://www.cypress.com/psoc.
PSoC Designer helps the customer to select an operating con-
figuration for the PSoC, write application code that uses the
PSoC, and debug the application. This system provides design
database management by project, an integrated debugger with
In-Circuit Emulator, in-system programming support, and the
CYASM macro assembler for the CPUs.
Development Kits
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
at http://www.onfulfillment.com/cypressstore/ contains develop-
ment kits, C compilers, and all accessories for PSoC develop-
ment. Click on PSoC (Programmable System-on-Chip) to view
a current list of available items.
PSoC Designer also supports a high-level C language compiler
developed specifically for the devices in the family.
Context
Sensitive
Help
Graphical Designer
PSoCTM
Designer
Interface
Tele-Training
Free PSoC "Tele-training" is available for beginners and taught
by a live marketing or application engineer over the phone. Five
training classes are available to accelerate the learning curve
including introduction, designing, debugging, advanced design,
advanced analog, as well as application-specific classes cover-
ing topics like PSoC and the LIN bus. For days and times of the
tele-training, see http://www.cypress.com/support/training.cfm.
Importable
Design
Database
PSoC
Configuration
Sheet
Device
Database
Consultants
PSoCTM
Designer
Core
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant, go to the following Cypress support web site:
http://www.cypress.com/support/cypros.cfm.
Application
Database
Manufacturing
Information
File
Engine
Project
Database
Technical Support
User
Modules
Library
PSoC application engineers take pride in fast and accurate
response. They can be reached with a 4-hour guaranteed
response at http://www.cypress.com/support/login.cfm.
Application Notes
A long list of application notes will assist you in every aspect of
your design effort. To locate the PSoC application notes, go to
http://www.cypress.com/design/results.cfm.
Emulation
Pod
In-Circuit
Emulator
Device
Programmer
PSoC Designer Subsystems
June 3, 2004
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CY8C22x13 Final Data Sheet
PSoC™ Overview
Debugger
PSoC Designer Software Subsystems
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing the designer to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow the designer to read and
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear break-
points, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Device Editor
The Device Editor subsystem allows the user to select different
onboard analog and digital components called user modules
using the PSoC blocks. Examples of user modules are ADCs,
DACs, Amplifiers, and Filters.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic configu-
ration allows for changing configurations at run time.
Online Help System
PSoC Designer sets up power-on initialization tables for
selected PSoC block configurations and creates source code
for an application framework. The framework contains software
to operate the selected components and, if the project uses
more than one operating configuration, contains routines to
switch between different sets of PSoC block configurations at
run time. PSoC Designer can print out a configuration sheet for
a given project configuration for use during application pro-
gramming in conjunction with the Device Data Sheet. Once the
framework is generated, the user can add application-specific
code to flesh out the framework. It’s also possible to change the
selected components and regenerate the framework.
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
Hardware Tools
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is avail-
able for development support. This hardware has the capability
to program single devices.
Design Browser
The Design Browser allows users to select and import precon-
figured designs into the user’s project. Users can easily browse
a catalog of preconfigured designs to facilitate time-to-design.
Examples provided in the tools include a 300-baud modem, LIN
Bus master and slave, fan controller, and magnetic card reader.
The emulator consists of a base unit that connects to the PC by
way of the parallel or USB port. The base unit is universal and
will operate with all PSoC devices. Emulation pods for each
device family are available separately. The emulation pod takes
the place of the PSoC device in the target board and performs
full speed (24 MHz) operation.
Application Editor
In the Application Editor you can edit your C language and
Assembly language source code. You can also assemble, com-
pile, link, and build.
Assembler. The macro assembler allows the assembly code
to be merged seamlessly with C code. The link libraries auto-
matically use absolute addressing or can be compiled in relative
mode, and linked with other software modules to get absolute
addressing.
C Language Compiler. A C language compiler is available
that supports Cypress MicroSystems’ PSoC family devices.
Even if you have never worked in the C language before, the
product quickly allows you to create complete C programs for
the PSoC family devices.
The embedded, optimizing C compiler provides all the features
of C tailored to the PSoC architecture. It comes complete with
embedded libraries providing port and bus operations, standard
keypad and display support, and extended math functionality.
PSoC Development Tool Kit
June 3, 2004
Document No. 38-12009 Rev. *E
5
CY8C22x13 Final Data Sheet
PSoC™ Overview
the device to your specification and provides the high-level user
module API functions.
User Modules and the PSoC
Development Process
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture
a unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
Each block has several registers that determine its function and
connectivity to other blocks, multiplexers, buses, and to the IO
pins. Iterative development cycles permit you to adapt the hard-
ware as well as the software. This substantially lowers the risk
of having to select a different part to meet the final design
requirements.
Device Editor
Placement
User
Module
Selection
Source
Code
Generator
and
Parameter
-ization
Generate
Application
Application Editor
Source
Code
Editor
Project
Manager
Build
Manager
To speed the development process, the PSoC Designer Inte-
grated Development Environment (IDE) provides a library of
pre-built, pre-tested hardware peripheral functions, called “User
Modules.” User modules make selecting and implementing
peripheral devices simple, and come in analog, digital, and
mixed signal varieties. The standard User Module library con-
tains over 50 common peripherals such as ADCs, DACs Tim-
ers, Counters, UARTs, and other not-so common peripherals
such as DTMF Generators and Bi-Quad analog filter sections.
Build
All
Debugger
Each user module establishes the basic register settings that
implement the selected function. It also provides parameters
that allow you to tailor its precise configuration to your particular
application. For example, a Pulse Width Modulator User Mod-
ule configures one or more digital PSoC blocks, one for each 8
bits of resolution. The user module parameters permit you to
establish the pulse width and duty cycle. User modules also
provide tested software to cut your development time. The user
module application programming interface (API) provides high-
level functions to control and respond to hardware events at
run-time. The API also provides optional interrupt service rou-
tines that you can adapt as needed.
Event &
Breakpoint
Manager
Interface
to ICE
Storage
Inspector
User Modules and Development Process Flow Chart
The next step is to write your main program, and any sub-rou-
tines using PSoC Designer’s Application Editor subsystem.
The Application Editor includes a Project Manager that allows
you to open the project source code files (including all gener-
ated code files) from a hierarchal view. The source code editor
provides syntax coloring and advanced edit features for both C
and assembly language. File search capabilities include simple
string searches and recursive “grep-style” patterns. A single
mouse click invokes the Build Manager. It employs a profes-
sional-strength “makefile” system to automatically analyze all
file dependencies and run the compiler and assembler as nec-
essary. Project-level options control optimization strategies
used by the compiler and linker. Syntax errors are displayed in
a console window. Double clicking the error message takes you
directly to the offending line of source code. When all is correct,
the linker builds a ROM file image suitable for programming.
The API functions are documented in user module data sheets
that are viewed directly in the PSoC Designer IDE. These data
sheets explain the internal operation of the user module and
provide performance specifications. Each data sheet describes
the use of each user module parameter and documents the set-
ting of each register controlled by the user module.
The development process starts when you open a new project
and bring up the Device Editor, a pictorial environment (GUI) for
configuring the hardware. You pick the user modules you need
for your project and map them onto the PSoC blocks with point-
and-click simplicity. Next, you build signal chains by intercon-
necting user modules to each other and the IO pins. At this
stage, you also configure the clock source connections and
enter parameter values directly or by selecting values from
drop-down menus. When you are ready to test the hardware
configuration or move on to developing code for the project, you
perform the “Generate Application” step. This causes PSoC
Designer to generate source code that automatically configures
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger down-
loads the ROM image to the In-Circuit Emulator (ICE) where it
runs at full speed. Debugger capabilities rival those of systems
costing many times more. In addition to traditional single-step,
run-to-breakpoint and watch-variable features, the Debugger
provides a large trace buffer and allows you define complex
breakpoint events that include monitoring address and data bus
values, memory locations and external signals.
June 3, 2004
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CY8C22x13 Final Data Sheet
PSoC™ Overview
Document Conventions
Table of Contents
For an in depth discussion and more information on your PSoC
device, obtain the PSoC Mixed Signal Array Technical Refer-
ence Manual. This document encompasses and is organized
into the following chapters and sections.
Acronyms Used
The following table lists the acronyms that are used in this doc-
ument.
1.
Pin Information ............................................................. 8
Acronym
AC
Description
alternating current
1.1 Pinouts ................................................................... 8
1.1.1 8-Pin Part Pinout ...................................... 8
1.1.2 20-Pin Part Pinout ..................................... 8
1.1.3 32-Pin Part Pinout ..................................... 9
ADC
API
analog-to-digital converter
application programming interface
central processing unit
continuous time
CPU
CT
2.
3.
Register Reference ..................................................... 10
DAC
DC
digital-to-analog converter
direct current
2.1 Register Conventions ........................................... 10
2.1.1 Abbreviations Used .................................. 10
2.2 Register Mapping Tables ..................................... 10
EEPROM
FSR
GPIO
IO
electrically erasable programmable read-only memory
full scale range
Electrical Specifications ............................................ 13
general purpose IO
3.1 Absolute Maximum Ratings ............................... 14
3.2 Operating Temperature ...................................... 14
3.3 DC Electrical Characteristics ................................ 15
3.3.1 DC Chip-Level Specifications ................... 15
3.3.2 DC General Purpose IO Specifications .... 15
3.3.3 DC Operational Amplifier Specifications ... 16
3.3.4 DC Analog Output Buffer Specifications ... 18
3.3.5 DC Analog Reference Specifications ....... 19
3.3.6 DC Analog PSoC Block Specifications ..... 19
3.3.7 DC POR and LVD Specifications ............. 20
3.3.8 DC Programming Specifications ............... 21
3.4 AC Electrical Characteristics ................................ 22
3.4.1 AC Chip-Level Specifications ................... 22
3.4.2 AC General Purpose IO Specifications .... 24
3.4.3 AC Operational Amplifier Specifications ... 25
3.4.4 AC Digital Block Specifications ................. 27
3.4.5 AC Analog Output Buffer Specifications ... 28
3.4.6 AC External Clock Specifications ............. 29
3.4.7 AC Programming Specifications ............... 29
3.4.8 AC I2C Specifications ............................... 30
input/output
IPOR
LSb
imprecise power on reset
least-significant bit
LVD
low voltage detect
MSb
PC
most-significant bit
program counter
POR
PPOR
PSoC™
PWM
RAM
ROM
SC
power on reset
precision power on reset
Programmable System-on-Chip
pulse width modulator
random access memory
read only memory
switched capacitor
SMP
switch mode pump
Units of Measure
A units of measure table is located in the Electrical Specifica-
tions section. Table 3-1 on page 13 lists all the abbreviations
used to measure the PSoC devices.
4.
Packaging Information ............................................... 31
4.1 Packaging Dimensions ......................................... 31
4.2 Thermal Impedances .......................................... 34
4.3 Capacitance on Crystal Pins ............................... 34
Numeric Naming
5.
6.
Ordering Information .................................................. 35
Hexidecimal numbers are represented with all letters in upper-
case with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’ or ‘b’ are decimal.
5.1 Ordering Code Definitions ................................... 35
Sales and Company Information ............................... 36
6.1 Revision History .................................................. 36
6.2 Copyrights ............................................................ 36
June 3, 2004
Document No. 38-12009 Rev. *E
7
1. Pin Information
This chapter describes, lists, and illustrates the CY8C22x13 PSoC device pins and pinout configurations.
1.1
Pinouts
The CY8C22x13 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port
pin (labeled with a “P”) is capable of Digital IO. However, Vss, Vdd, SMP, and XRES are not capable of Digital IO.
1.1.1
8-Pin Part Pinout
Table 1-1. 8-Pin Part Pinout (PDIP, SOIC)
Type
CY8C22113 8-Pin PSoC Device
Pin
No.
Pin
Name
Description
Digital Analog
1
2
3
4
5
IO
IO
IO
IO
I
P0[5]
Analog column mux input and column output.
Analog column mux input.
AIO, P0[5]
AI, P0[3]
Vdd
1
2
3
8
7
P0[3]
P1[1]
Vss
PDIP
P0[4], AI
Crystal Input (XTALin), I2C Serial Clock (SCL)
Ground connection.
SOIC
I2C SCL, XTALin, P1[1]
Vss
P0[2], AI
6
5
Power
P1[0], XTALout, I2C SDA
4
IO
P1[0]
Crystal Output (XTALout), I2C Serial Data
(SDA)
6
7
8
IO
IO
I
I
P0[2]
P0[4]
Vdd
Analog column mux input.
Analog column mux input.
Supply voltage.
Power
LEGEND: A = Analog, I = Input, and O = Output.
1.1.2
20-Pin Part Pinout
Table 1-2. 20-Pin Part Pinout (PDIP, SSOP, SOIC)
Type
CY8C22213 20-Pin PSoC Device
Pin
No.
Pin
Name
Description
Digital Analog
1
IO
IO
IO
IO
I
IO
I
P0[7]
P0[5]
P0[3]
P0[1]
Vss
Analog column mux input.
Analog column mux input and column output.
Analog column mux input.
Analog column mux input.
Ground connection.
AI, P0[7]
AIO, P0[5]
Vdd
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
2
P0[6], AI
3
AI, P0[3]
P0[4], AI
P0[2], AI
4
I
AI, P0[1]
PDIP
SSOP
SOIC
5
Power
Power
Vss
P0[0], AI
6
IO
IO
IO
IO
P1[7]
P1[5]
P1[3]
P1[1]
Vss
I2C Serial Clock (SCL)
I2C SCL, P1[7]
I2C SDA, P1[5]
P1[3]
XRES
7
I2C Serial Data (SDA)
P1[6]
P1[4], EXTCLK
P1[2]
8
I2C SCL, XTALin, P1[1]
Vss
9
Crystal Input (XTALin), I2C Serial Clock (SCL)
Ground connection.
P1[0], XTALout, I2C SDA
10
10
11
IO
IO
P1[0]
Crystal Output (XTALout), I2C Serial Data
(SDA)
12
P1[2]
13
14
15
IO
IO
P1[4]
P1[6]
XRES
Optional External Clock Input (EXTCLK)
Input
Active high external reset with internal pull
down.
16
17
18
19
20
IO
IO
IO
IO
I
I
I
I
P0[0]
P0[2]
P0[4]
P0[6]
Vdd
Analog column mux input.
Analog column mux input.
Analog column mux input.
Analog column mux input.
Supply voltage.
Power
LEGEND: A = Analog, I = Input, and O = Output.
June 2004
Document No. 38-12009 Rev. *E
8
CY8C22x13 Final Data Sheet
1. Pin Information
1.1.3
32-Pin Part Pinout
Table 1-3. 32-Pin Part Pinout (MLF*)
Type
CY8C22213 PSoC Device
Pin
No.
Pin
Name
Description
Digital Analog
1
NC
No connection. Do not use.
No connection. Do not use.
No connection. Do not use.
No connection. Do not use.
Ground connection.
2
NC
3
NC
4
NC
5
Power
Power
IO
Vss
NC
1
2
3
4
5
6
7
8
P0[2], AI
P0[0], AI
NC
24
23
22
6
Vss
Ground connection.
NC
7
P1[7]
P1[5]
NC
I2C Serial Clock (SCL)
I2C Serial Data (SDA)
NC
NC
Vss
8
IO
21 NC
20 NC
MLF
(Top View)
9
No connection. Do not use.
Vss
NC
19
18
10
11
12
13
IO
P1[3]
P1[1]
Vss
I2C SCL, P1[7]
I2C SDA, P1[5]
XRES
IO
Crystal Input (XTALin), I2C Serial Clock (SCL)
Ground connection.
17 P1[6]
Power
IO
P1[0]
Crystal Output (XTALout), I2C Serial Data
(SDA)
14
15
16
17
18
IO
IO
P1[2]
P1[4]
NC
Optional External Clock Input (EXTCLK)
No connection. Do not use.
IO
P1[6]
XRES
Input
Active high external reset with internal pull
down.
19
20
21
22
23
24
25
26
27
28
29
30
31
32
NC
No connection. Do not use.
No connection. Do not use.
No connection. Do not use.
No connection. Do not use.
Analog column mux input.
Analog column mux input.
No connection. Do not use.
Analog column mux input.
Analog column mux input.
Supply voltage.
NC
NC
NC
IO
IO
I
I
P0[0]
P0[2]
NC
IO
IO
I
I
P0[4]
P0[6]
Vdd
Power
IO
IO
IO
IO
I
IO
I
P0[7]
P0[5]
P0[3]
P0[1]
Analog column mux input.
Analog column mux input and column output.
Analog column mux input.
Analog column mux input.
I
LEGEND: A = Analog, I = Input, and O = Output.
* The MLF package has a center pad that must be connected to the same ground
as the Vss pin.
June 3, 2004
Document No. 38-12009 Rev. *E
9
2. Register Reference
This chapter lists the registers of the CY8C22x13 PSoC device by way of mapping tables, in offset order. For detailed register infor-
mation, reference the PSoC™ Mixed Signal Array Technical Reference Manual.
2.1
Register Conventions
2.2
Register Mapping Tables
The PSoC device has a total register address space of 512
bytes. The register space is also referred to as IO space and is
broken into two parts. The XOI bit in the Flag register deter-
mines which bank the user is currently in. When the XOI bit is
set, the user is said to be in the “extended” address space or
the “configuration” registers.
2.1.1
Abbreviations Used
The register conventions specific to this section are listed in the
following table.
Convention
Description
Read and write register or bit(s)
Read register or bit(s)
Note In the following register mapping tables, blank fields are
Reserved and should not be accessed.
RW
R
W
L
Write register or bit(s)
Logical register or bit(s)
Clearable register or bit(s)
Access is bit specific
C
#
May 2004
© Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E
10
CY8C22x13 Final Data Sheet
2. Register Reference
Register Map Bank 0 Table: User Space
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
RW
RW
RW
RW
RW
RW
RW
RW
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
RW
RW
RW
RW
PRT1GS
PRT1DM2
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
ASC21CR0
ASC21CR1
ASC21CR2
ASC21CR3
RW
RW
RW
RW
I2C_CFG
I2C_SCR
I2C_DR
I2C_MSCR
INT_CLR0
INT_CLR1
RW
#
RW
#
RW
RW
INT_CLR3
INT_MSK3
RW
RW
DBB00DR0
DBB00DR1
DBB00DR2
DBB00CR0
DBB01DR0
DBB01DR1
DBB01DR2
DBB01CR0
DCB02DR0
DCB02DR1
DCB02DR2
DCB02CR0
DCB03DR0
DCB03DR1
DCB03DR2
DCB03CR0
#
AMX_IN
RW
INT_MSK0
INT_MSK1
INT_VC
RES_WDT
DEC_DH
DEC_DL
RW
RW
RC
W
RC
RC
RW
RW
W
RW
#
ARF_CR
CMP_CR0
ASY_CR
CMP_CR1
RW
#
#
#
W
RW
#
RW
DEC_CR0
DEC_CR1
#
W
RW
#
#
W
RW
#
RDI0RI
RDI0SYN
RDI0IS
RDI0LT0
RDIOLT1
RDI0RO0
RDI0RO1
RW
RW
RW
RW
RW
RW
RW
F1
F2
F3
F4
F5
F6
F7
F8
ACB01CR3
ACB01CR0
ACB01CR1
ACB01CR2
RW
RW
RW
RW
CPU_F
RL
F9
FA
FB
FC
FD
FE
FF
CPU_SCR1
CPU_SCR0
#
#
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
June 3, 2004
Document No. 38-12009 Rev. *E
11
CY8C22x13 Final Data Sheet
2. Register Reference
Register Map Bank 1 Table: Configuration Space
PRT0DM0
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
RW
RW
RW
RW
RW
RW
RW
RW
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
RW
RW
RW
RW
GDI_O_IN
GDI_E_IN
GDI_O_OU
GDI_E_OU
RW
RW
RW
RW
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
ASC21CR0
ASC21CR1
ASC21CR2
ASC21CR3
RW
RW
RW
RW
OSC_GO_EN DD
RW
RW
RW
RW
RW
RW
RW
R
OSC_CR4
OSC_CR3
OSC_CR0
OSC_CR1
OSC_CR2
VLT_CR
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
DBB00FN
DBB00IN
DBB00OU
RW
RW
RW
CLK_CR0
CLK_CR1
ABF_CR0
RW
RW
RW
DBB01FN
DBB01IN
DBB01OU
RW
RW
RW
VLT_CMP
AMD_CR1
ALT_CR0
RW
RW
DCB02FN
DCB02IN
DCB02OU
RW
RW
RW
IMO_TR
ILO_TR
BDG_TR
ECO_TR
W
W
RW
W
DCB03FN
DCB03IN
DCB03OU
RW
RW
RW
RDI0RI
RDI0SYN
RDI0IS
RDI0LT0
RDIOLT1
RDI0RO0
RDI0RO1
RW
RW
RW
RW
RW
RW
RW
ACB01CR3
ACB01CR0
ACB01CR1
ACB01CR2
RW
RW
RW
RW
CPU_F
RL
CPU_SCR1
CPU_SCR0
#
#
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
June 3, 2004
Document No. 38-12009 Rev. *E
12
3. Electrical Specifications
This chapter presents the DC and AC electrical specifications of the CY8C22x13 PSoC device. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by referencing the web at http://www.cypress.com/psoc.
Specifications are valid for -40oC ≤ T ≤ 85oC and T ≤ 100oC as specified, except where noted. Specifications for devices running
A
J
at greater than 12 MHz are valid for -40oC ≤ T ≤ 70oC and T ≤ 82oC.
A
J
5.25
4.75
3.00
93 kHz
12 MHz
24 MHz
CPU Frequency
Figure 3-1. Voltage versus Operating Frequency
The following table lists the units of measure that are used in this chapter.
Table 3-1: Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
oC
dB
degree Celsius
µW
micro watts
decibels
mA
ms
mV
nA
ns
milli-ampere
milli-second
milli-volts
fF
femto farad
hertz
Hz
KB
1024 bytes
1024 bits
nano ampere
nanosecond
nanovolts
Kbit
kHz
kΩ
kilohertz
nV
Ω
kilohm
ohm
MHz
MΩ
µA
megahertz
megaohm
micro ampere
micro farad
micro henry
microsecond
micro volts
pA
pF
pp
ppm
ps
pico ampere
pico farad
peak-to-peak
parts per million
picosecond
µF
µH
µs
sps
σ
samples per second
sigma: one standard deviation
volts
µV
µVrms
micro volts root-mean-square
V
June 2004
Document No. 38-12009 Rev. *E
13
CY8C22x13 Final Data Sheet
3. Electrical Specifications
3.1
Absolute Maximum Ratings
Table 3-2. Absolute Maximum Ratings
Symbol
Description
Min
-55
Typ
Max
+100
Units
oC
Notes
TSTG
Storage Temperature
–
–
Higher storage temperatures will reduce data
retention time.
oC
V
TA
Ambient Temperature with Power Applied
-40
+85
Vdd
VIO
Supply Voltage on Vdd Relative to Vss
DC Input Voltage
-0.5
–
–
+6.0
Vss - 0.5
Vdd + 0.5
V
–
DC Voltage Applied to Tri-state
Vss - 0.5
-25
–
–
Vdd + 0.5
+50
V
IMIO
Maximum Current into any Port Pin
mA
IMAIO
Maximum Current into any Port Pin Configured as Analog
Driver
-50
–
+50
mA
–
–
Static Discharge Voltage
Latch-up Current
2000
–
–
–
–
V
200
mA
3.2
Operating Temperature
Table 3-3. Operating Temperature
Symbol
TA
TJ
Description
Min
Typ
Max
Units
Notes
oC
oC
Ambient Temperature
Junction Temperature
-40
–
–
+85
-40
+100
The temperature rise from ambient to junction is
package specific. See “Thermal Impedances”
on page 34. The user must limit the power con-
sumption to comply with this requirement.
June 3, 2004
Document No. 38-12009 Rev. *E
14
CY8C22x13 Final Data Sheet
3. Electrical Specifications
3.3
DC Electrical Characteristics
3.3.1
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-4. DC Chip-Level Specifications
Symbol
Vdd
Description
Min
3.00
Typ
Max
5.25
Units
Notes
Supply Voltage
Supply Current
–
5
V
Conditions are Vdd = 5.0V, 25 oC, CPU = 3
MHz, 48 MHz disabled. VC1 = 1.5 MHz, VC2 =
93.75 kHz, VC3 = 93.75 kHz.
IDD
–
8
mA
Conditions are Vdd = 3.3V, TA = 25 oC, CPU = 3
IDD3
Supply Current
–
3.3
6.0
mA
MHz, 48 MHz = Disabled, VC1 = 1.5 MHz, VC2
= 93.75 kHz, VC3 = 93.75 kHz.
ISB
Sleep (Mode) Current with POR, LVD, Sleep Timer, and
WDT.a
–
–
–
3
4
4
6.5
25
µA
µA
µA
Conditions are with internal slow speed oscilla-
tor, Vdd = 3.3V, -40 oC <= TA <= 55 oC.
ISBH
Sleep (Mode) Current with POR, LVD, Sleep Timer, and
WDT at high temperature.a
Conditions are with internal slow speed oscilla-
tor, Vdd = 3.3V, 55 oC < TA <= 85 oC.
ISBXTL
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and external crystal.a
7.5
Conditions are with properly loaded, 1 µW max,
32.768 kHz crystal. Vdd = 3.3V, -40 oC <= TA <=
55 oC.
ISBXTLH
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and external crystal at high temperature.a
–
5
26
µA
Conditions are with properly loaded, 1 µW max,
32.768 kHz crystal. Vdd = 3.3V, 55 oC < TA <=
85 oC.
VREF
Reference Voltage (Bandgap)
1.275
1.3
1.325
V
Trimmed for appropriate Vdd.
a. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar functions
enabled.
3.3.2
DC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-5. DC GPIO Specifications
Symbol
Description
Min
Typ
5.6
Max
Units
kΩ
Notes
RPU
Pull up Resistor
4
4
8
8
–
RPD
VOH
Pull down Resistor
High Output Level
5.6
–
kΩ
Vdd - 1.0
V
IOH = 10 mA, Vdd = 4.75 to 5.25V (80 mA max-
imum combined IOH budget)
VOL
Low Output Level
–
–
0.75
0.8
V
IOL = 25 mA, Vdd = 4.75 to 5.25V (150 mA
maximum combined IOL budget)
VIL
Input Low Level
Input High Level
Input Hysterisis
–
–
V
Vdd = 3.0 to 5.25
Vdd = 3.0 to 5.25
VIH
VH
2.1
–
–
V
60
1
–
mV
nA
pF
pF
IIL
Input Leakage (Absolute Value)
Capacitive Load on Pins as Input
Capacitive Load on Pins as Output
–
–
Gross tested to 1 µA.
Package and pin dependent. Temp = 25oC.
Package and pin dependent. Temp = 25oC.
CIN
COUT
–
3.5
3.5
10
10
–
June 3, 2004
Document No. 38-12009 Rev. *E
15
CY8C22x13 Final Data Sheet
3. Electrical Specifications
3.3.3
DC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC
blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at
25°C and are for design guidance only.
Table 3-6. 5V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Min
Typ
1.6
Max
Units
mV
Notes
Input Offset Voltage (absolute value) Low Power
Input Offset Voltage (absolute value) Mid Power
Input Offset Voltage (absolute value) High Power
Average Input Offset Voltage Drift
–
–
–
–
10
8
1.3
1.2
7.0
mV
mV
7.5
µV/oC
TCVOSOA
IEBOA
35.0
Input Leakage Current (Port 0 Analog Pins)
Input Capacitance (Port 0 Analog Pins)
Common Mode Voltage Range
–
–
20
–
pA
Gross tested to 1 µA.
Package and pin dependent. Temp = 25oC.
CINOA
4.5
9.5
pF
V
VCMOA
0.0
0.5
–
–
Vdd
The common-mode input voltage range is mea-
sured through an analog output buffer. The
specification includes the limitations imposed
by the characteristics of the analog output
buffer.
Common Mode Voltage Range (high power or high
opamp bias)
Vdd - 0.5
GOLOA
Open Loop Gain
–
–
dB
Specification is applicable at high power. For all
other bias modes (except high power, high
opamp bias), minimum is 60 dB.
Power = Low
60
60
80
Power = Medium
Power = High
VOHIGHOA
VOLOWOA
ISOA
High Output Voltage Swing (worst case internal load)
Power = Low
Vdd - 0.2
Vdd - 0.2
Vdd - 0.5
–
–
–
–
–
–
V
V
V
Power = Medium
Power = High
Low Output Voltage Swing (worst case internal load)
Power = Low
–
–
–
–
–
–
0.2
0.2
0.5
V
V
V
Power = Medium
Power = High
Supply Current (including associated AGND buffer)
Power = Low
–
150
300
600
1200
2400
4600
–
200
400
800
1600
3200
6400
–
µA
µA
µA
µA
µA
µA
dB
Power = Low, Opamp Bias = High
Power = Medium
–
–
Power = Medium, Opamp Bias = High
Power = High
–
–
Power = High, Opamp Bias = High
Supply Voltage Rejection Ratio
–
PSRROA
60
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3. Electrical Specifications
Table 3-7. 3.3V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Min
Typ
1.65
Max
Units
mV
Notes
Input Offset Voltage (absolute value) Low Power
Input Offset Voltage (absolute value) Mid Power
High Power is 5 Volt Only
–
–
10
8
1.32
mV
µV/oC
TCVOSOA
IEBOA
Average Input Offset Voltage Drift
Input Leakage Current (Port 0 Analog Pins)
Input Capacitance (Port 0 Analog Pins)
Common Mode Voltage Range
–
7.0
20
4.5
–
35.0
–
–
pA
Gross tested to 1 µA.
Package and pin dependent. Temp = 25oC.
CINOA
–
9.5
pF
V
VCMOA
0.2
Vdd - 0.2
The common-mode input voltage range is
measured through an analog output buffer.
The specification includes the limitations
imposed by the characteristics of the analog
output buffer.
GOLOA
Open Loop Gain
Power = Low
–
–
dB
Specification is applicable at high power. For
all other bias modes (except high power, high
opamp bias), minimum is 60 dB.
60
60
80
Power = Medium
Power = High
VOHIGHOA
VOLOWOA
ISOA
High Output Voltage Swing (worst case internal load)
Power = Low
Vdd - 0.2
Vdd - 0.2
Vdd - 0.2
–
–
–
–
–
–
V
V
V
Power = Medium
Power = High is 5V only
Low Output Voltage Swing (worst case internal load)
Power = Low
–
–
–
–
–
–
0.2
0.2
0.2
V
V
V
Power = Medium
Power = High
Supply Current (including associated AGND buffer)
Power = Low
–
–
–
–
–
–
150
200
µA
µA
µA
µA
µA
µA
Power = Low, Opamp Bias = High
Power = Medium
300
400
600
800
Power = Medium, Opamp Bias = High
Power = High
1200
2400
4600
1600
3200
6400
Power = High, Opamp Bias = High
PSRROA
Supply Voltage Rejection Ratio
50
–
–
dB
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3. Electrical Specifications
3.3.4
DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-8. 5V DC Analog Output Buffer Specifications
Symbol
VOSOB
Description
Min
Typ
Max
Units
mV
Notes
Input Offset Voltage (Absolute Value)
–
3
12
–
TCVOSOB
VCMOB
Average Input Offset Voltage Drift
Common-Mode Input Voltage Range
–
+6
–
µV/°C
0.5
Vdd - 1.0
V
ROUTOB
Output Resistance
Power = Low
–
–
1
1
–
–
Ω
Ω
Power = High
VOHIGHOB
High Output Voltage Swing (Load = 32 ohms to Vdd/2)
Power = Low
0.5 x Vdd + 1.1
0.5 x Vdd + 1.1
–
–
–
–
V
V
Power = High
VOLOWOB
Low Output Voltage Swing (Load = 32 ohms to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd - 1.3
0.5 x Vdd - 1.3
V
V
ISOB
Supply Current Including Bias Cell (No Load)
Power = Low
–
1.1
2.6
–
5.1
8.8
–
mA
mA
dB
Power = High
–
PSRROB
Supply Voltage Rejection Ratio
60
Table 3-9. 3.3V DC Analog Output Buffer Specifications
Symbol
VOSOB
Description
Min
Typ
Max
Units
Notes
Input Offset Voltage (Absolute Value)
–
3
12
mV
µV/°C
V
TCVOSOB
VCMOB
Average Input Offset Voltage Drift
Common-Mode Input Voltage Range
–
+6
-
–
0.5
Vdd - 1.0
ROUTOB
Output Resistance
Power = Low
–
–
1
1
–
–
Ω
Ω
Power = High
VOHIGHOB
High Output Voltage Swing (Load = 1K ohms to Vdd/2)
Power = Low
Power = High
0.5 x Vdd + 1.0
0.5 x Vdd + 1.0
–
–
–
–
V
V
VOLOWOB
Low Output Voltage Swing (Load = 1K ohms to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd - 1.0
0.5 x Vdd - 1.0
V
V
ISOB
Supply Current Including Bias Cell (No Load)
Power = Low
0.8
2.0
–
2.0
4.3
–
mA
mA
dB
Power = High
–
PSRROB
Supply Voltage Rejection Ratio
50
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3. Electrical Specifications
3.3.5
DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to
the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control
register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block.
Table 3-10. 5V DC Analog Reference Specifications
Symbol
Description
Min
Typ
Max
Units
AGND = Vdd/2a
–
Vdd/2 - 0.043
Vdd/2 - 0.025
Vdd/2 + 0.003
V
CT Block Power = High
a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 2%.
Table 3-11. 3.3V DC Analog Reference Specifications
Symbol
Description
Min
Typ
Max
Units
AGND = Vdd/2a
–
Vdd/2 - 0.037
Vdd/2 - 0.020
Vdd/2 + 0.002
V
CT Block Power = High
a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 2%
3.3.6
DC Analog PSoC Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-12. DC Analog PSoC Block Specifications
Symbol
RCT
CSC
Description
Min
Typ
12.24
80
Max
Units
kΩ
fF
Notes
Resistor Unit Value (Continuous Time)
–
–
–
–
Capacitor Unit Value (Switch Cap)
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3. Electrical Specifications
3.3.7
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the PSoC Mixed Signal Array Technical
Reference Manual for more information on the VLT_CR register.
Table 3-13. DC POR and LVD Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
Vdd Value for PPOR Trip (positive ramp)
PORLEV[1:0] = 00b
VPPOR0R
VPPOR1R
VPPOR2R
2.908
V
V
V
PORLEV[1:0] = 01b
–
–
4.394
4.548
–
–
PORLEV[1:0] = 10b
Vdd Value for PPOR Trip (negative ramp)
PORLEV[1:0] = 00b
VPPOR0
VPPOR1
VPPOR2
2.816
4.394
4.548
V
V
V
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
PPOR Hysteresis
VPH0
VPH1
VPH2
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
–
–
–
92
0
–
–
–
mV
mV
mV
0
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
V
2.863
2.963
3.070
3.920
4.393
4.550
4.632
4.718
2.921
3.023
3.133
4.00
2.979a
3.083
3.196
4.080
4.573
V
V
V
V
V
V
V
V
4.483
4.643
4.727
4.814
4.736b
4.822
4.910
a. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply.
b. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
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3. Electrical Specifications
3.3.8
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-14. DC Programming Specifications
Symbol
IDDP
Description
Min
Typ
Max
Units
mA
Notes
Supply Current During Programming or Verify
–
5
–
–
–
25
0.8
–
VILP
VIHP
IILP
Input Low Voltage During Programming or Verify
Input High Voltage During Programming or Verify
–
V
2.2
–
V
Input Current when Applying Vilp to P1[0] or P1[1] During
Programming or Verify
0.2
mA
Driving internal pull-down resistor.
Driving internal pull-down resistor.
IIHP
Input Current when Applying Vihp to P1[0] or P1[1] During
Programming or Verify
–
–
1.5
mA
VOLV
VOHV
Output Low Voltage During Programming or Verify
Output High Voltage During Programming or Verify
–
–
–
Vss + 0.75
Vdd
V
V
Vdd - 1.0
FlashENPB
FlashENT
FlashDR
Flash Endurance (per block)
50,000
1,800,000
10
–
–
–
–
–
–
–
Erase/write cycles per block.
Erase/write cycles.
Flash Endurance (total)a
Flash Data Retention
–
Years
a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of
25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (and so forth to limit the total number of cycles to 36x50,000 and that no single block ever
sees more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to
the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
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3. Electrical Specifications
3.4
AC Electrical Characteristics
3.4.1
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-15. AC Chip-Level Specifications
Symbol
FIMO
Description
Min
23.4
Typ
Max
24.6a
Units
MHz
Notes
Internal Main Oscillator Frequency
24
24
12
48
Trimmed. Utilizing factory trim values.
24.6a,b
12.3b,c
49.2a,b,d
FCPU1
FCPU2
F48M
CPU Frequency (5V Nominal)
CPU Frequency (3.3V Nominal)
Digital PSoC Block Frequency
0.93
0.93
0
MHz
MHz
MHz
Refer to the AC Digital Block Specifications
below.
24.6b,e,d
64
F24M
F32K1
F32K2
Digital PSoC Block Frequency
Internal Low Speed Oscillator Frequency
External Crystal Oscillator
0
24
32
MHz
kHz
kHz
15
–
32.768
–
Accuracy is capacitor and crystal dependent.
50% duty cycle.
FPLL
PLL Frequency
–
23.986
–
MHz
Is a multiple (x732) of crystal frequency.
Jitter24M2
TPLLSLEW
24 MHz Period Jitter (PLL)
PLL Lock Time
–
–
–
600
10
ps
0.5
ms
TPLLSLEWS- PLL Lock Time for Low Gain Setting
LOW
0.5
–
50
ms
TOS
External Crystal Oscillator Startup to 1%
–
–
1700
2800
ms
ms
2620
3800f
TOSACC
External Crystal Oscillator Startup to 100 ppm
Jitter32k
TXRST
32 kHz Period Jitter
–
100
–
ns
External Reset Pulse Width
10
–
µs
DC24M
24 MHz Duty Cycle
40
–
50
60
–
%
Step24M
Fout48M
24 MHz Trim Step Size
48 MHz Output Frequency
50
kHz
MHz
49.2a,c
46.8
48.0
Trimmed. Utilizing factory trim values.
Jitter24M1
FMAX
24 MHz Period Jitter (IMO)
–
–
600
–
ps
Maximum frequency of signal on row input or row output.
12.3
–
MHz
TRAMP
Supply Ramp Time
0
–
µs
a. 4.75V < Vdd < 5.25V.
b. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
c. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation at 3.3V.
d. See the individual user module data sheets for information on maximum frequencies for user modules.
e. 3.0V < 5.25V.
f. The crystal oscillator frequency is within 100 ppm of its final value by the end of the T
period. Correct operation assumes a properly loaded 1 uW maximum drive level
osacc
o
o
32.768 kHz crystal. 3.0V ≤ Vdd ≤ 5.5V, -40 C ≤ T ≤ 85 C.
A
PLL
Enable
T
24 MHz
PLLSLEW
FPLL
PLL
Gain
0
Figure 3-2. PLL Lock Timing Diagram
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3. Electrical Specifications
PLL
Enable
T
24 MHz
PLLSLEWLOW
FPLL
PLL
Gain
1
Figure 3-3. PLL Lock for Low Gain Setting Timing Diagram
32K
Select
32 kHz
T
OS
F32K2
Figure 3-4. External Crystal Oscillator Startup Timing Diagram
Jitter24M1
F24M
Figure 3-5. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter32k
F32K2
Figure 3-6. 32 kHz Period Jitter (ECO) Timing Diagram
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3. Electrical Specifications
3.4.2
AC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-16. AC GPIO Specifications
Symbol
FGPIO
Description
GPIO Operating Frequency
Min
Typ
Max
Units
MHz
Notes
0
–
12
TRiseF
TFallF
TRiseS
TFallS
Rise Time, Normal Strong Mode, Cload = 50 pF
Fall Time, Normal Strong Mode, Cload = 50 pF
Rise Time, Slow Strong Mode, Cload = 50 pF
Fall Time, Slow Strong Mode, Cload = 50 pF
3
–
18
18
–
ns
ns
ns
ns
Vdd = 4.5 to 5.25V, 10% - 90%
Vdd = 4.5 to 5.25V, 10% - 90%
Vdd = 3 to 5.25V, 10% - 90%
Vdd = 3 to 5.25V, 10% - 90%
2
–
10
10
27
22
–
90%
10%
GPIO
Pin
TRiseF
TRiseS
TFallF
TFallS
Figure 3-7. GPIO Timing Diagram
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3. Electrical Specifications
3.4.3
AC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Note Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.
Table 3-17. 5V AC Operational Amplifier Specifications
Symbol
TROA
Description
Min
Typ
Max
Units
Notes
Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
load, Unity Gain)
Power = Low
–
–
–
–
–
–
–
3.9
µs
Power = Low, Opamp Bias = High
Power = Medium
µs
µs
µs
µs
µs
Power = Medium, Opamp Bias = High
Power = High
–
0.72
0.62
Power = High, Opamp Bias = High
–
–
TSOA
Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
load, Unity Gain)
Power = Low
–
–
–
–
–
–
5.9
µs
µs
µs
µs
µs
µs
Power = Low, Opamp Bias = High
Power = Medium
Power = Medium, Opamp Bias = High
Power = High
–
–
–
0.92
0.72
Power = High, Opamp Bias = High
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low
SRROA
SRFOA
BWOA
ENOA
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
0.15
V/µs
V/µs
V/µs
V/µs
V/µs
V/µs
Power = Low, Opamp Bias = High
Power = Medium
Power = Medium, Opamp Bias = High
Power = High
1.7
–
–
–
Power = High, Opamp Bias = High
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low
6.5
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
0.01
V/µs
V/µs
V/µs
V/µs
V/µs
V/µs
Power = Low, Opamp Bias = High
Power = Medium
Power = Medium, Opamp Bias = High
Power = High
0.5
–
–
–
Power = High, Opamp Bias = High
Gain Bandwidth Product
4.0
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
Power = Low
0.75
MHz
Power = Low, Opamp Bias = High
Power = Medium
MHz
MHz
Power = Medium, Opamp Bias = High
Power = High
3.1
–
–
MHz
MHz
Power = High, Opamp Bias = High
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
5.4
–
MHz
200
–
nV/rt-Hz
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3. Electrical Specifications
Table 3-18. 3.3V AC Operational Amplifier Specifications
Symbol
TROA
Description
Min
Typ
Max
Units
Notes
Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
load, Unity Gain)
Power = Low
–
–
–
–
–
–
3.92
µs
Power = Low, Opamp Bias = High
Power = Medium
µs
µs
µs
µs
Power = Medium, Opamp Bias = High
Power = High (3.3 Volt High Bias Operation not supported)
–
–
0.72
–
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
–
µs
TSOA
Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
Power = Low
–
–
–
–
–
5.41
µs
µs
µs
µs
µs
Power = Low, Opamp Bias = High
Power = Medium
Power = Medium, Opamp Bias = High
Power = High (3.3 Volt High Bias Operation not supported)
–
–
0.72
–
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
–
µs
SRROA
SRFOA
BWOA
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
0.31
V/µs
V/µs
V/µs
V/µs
V/µs
Power = Low, Opamp Bias = High
Power = Medium
Power = Medium, Opamp Bias = High
Power = High (3.3 Volt High Bias Operation not supported)
2.7
–
–
–
–
–
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
V/µs
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
0.24
V/µs
V/µs
V/µs
V/µs
V/µs
Power = Low, Opamp Bias = High
Power = Medium
Power = Medium, Opamp Bias = High
Power = High (3.3 Volt High Bias Operation not supported)
1.8
–
–
–
–
–
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
V/µs
Gain Bandwidth Product
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
Power = Low
0.67
MHz
MHz
MHz
MHz
MHz
Power = Low, Opamp Bias = High
Power = Medium
Power = Medium, Opamp Bias = High
Power = High (3.3 Volt High Bias Operation not supported)
2.8
–
–
–
–
–
–
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
MHz
ENOA
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
200
nV/rt-Hz
June 3, 2004
Document No. 38-12009 Rev. *E
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CY8C22x13 Final Data Sheet
3. Electrical Specifications
3.4.4
AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-19. AC Digital Block Specifications
Function
Timer
Description
Min
50a
Typ
Max
Units
ns
Notes
Capture Pulse Width
–
–
Maximum Frequency, No Capture
Maximum Frequency, With Capture
Enable Pulse Width
–
–
–
–
–
49.2
24.6
–
MHz
MHz
ns
4.75V < Vdd < 5.25V.
50a
–
Counter
Maximum Frequency, No Enable Input
Maximum Frequency, Enable Input
–
–
49.2
24.6
MHz
MHz
4.75V < Vdd < 5.25V.
–
Dead Band Kill Pulse Width:
Asynchronous Restart Mode
20
–
–
–
–
ns
ns
50a
Synchronous Restart Mode
Disable Mode
50a
–
–
–
ns
Maximum Frequency
–
–
49.2
49.2
MHz
MHz
4.75V < Vdd < 5.25V.
4.75V < Vdd < 5.25V.
CRCPRS
Maximum Input Clock Frequency
–
(PRS Mode)
CRCPRS
Maximum Input Clock Frequency
–
–
24.6
MHz
(CRC Mode)
SPIM
SPIS
Maximum Input Clock Frequency
–
–
–
–
–
8.2
4.1
–
MHz
ns
Maximum Input Clock Frequency
50a
–
Width of SS_ Negated Between Transmissions
ns
Transmitter Maximum Input Clock Frequency
Receiver Maximum Input Clock Frequency
–
16.4
49.2
MHz
MHz
–
16
4.75V < Vdd < 5.25V.
a. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
June 3, 2004
Document No. 38-12009 Rev. *E
27
CY8C22x13 Final Data Sheet
3. Electrical Specifications
3.4.5
AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-20. 5V AC Analog Output Buffer Specifications
Symbol
Description
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Min
Typ
Max
Units
Notes
TROB
–
–
–
–
2.5
µs
Power = High
2.5
µs
TSOB
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
–
–
–
–
2.2
2.2
µs
µs
Power = High
SRROB
SRFOB
BWOB
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
Power = Low
0.65
0.65
–
–
–
–
V/µs
V/µs
Power = High
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
Power = Low
0.65
0.65
–
–
–
–
V/µs
V/µs
Power = High
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
0.8
0.8
–
–
–
–
MHz
MHz
Power = Low
Power = High
BWOB
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
300
300
–
–
–
–
kHz
kHz
Power = Low
Power = High
Table 3-21. 3.3V AC Analog Output Buffer Specifications
Symbol
Description
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Min
Typ
Max
Units
Notes
TROB
–
–
–
–
3.8
3.8
µs
µs
Power = High
TSOB
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
–
–
–
–
2.6
2.6
µs
µs
Power = High
SRROB
SRFOB
BWOB
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
Power = Low
0.5
0.5
–
–
–
–
V/µs
V/µs
Power = High
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
Power = Low
0.5
0.5
–
–
–
–
V/µs
V/µs
Power = High
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
0.7
0.7
–
–
–
–
MHz
MHz
Power = Low
Power = High
BWOB
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
200
200
–
–
–
–
kHz
kHz
Power = Low
Power = High
June 3, 2004
Document No. 38-12009 Rev. *E
28
CY8C22x13 Final Data Sheet
3. Electrical Specifications
3.4.6
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-22. 5V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
24.24
Units
MHz
Notes
FOSCEXT
Frequency
0
–
–
–
–
High Period
Low Period
20.6
20.6
150
–
–
–
–
–
–
ns
ns
µs
Power Up IMO to Switch
Table 3-23. 3.3V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
Frequency with CPU Clock divide by 1a
FOSCEXT
0
0
–
–
12.12
24.24
MHz
MHz
Frequency with CPU Clock divide by 2 or greaterb
High Period with CPU Clock divide by 1
Low Period with CPU Clock divide by 1
Power Up IMO to Switch
FOSCEXT
–
–
–
41.7
41.7
150
–
–
–
–
–
–
ns
ns
µs
a. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements.
b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty per-
cent duty cycle requirement is met.
3.4.7
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-24. AC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
ns
Notes
TRSCLK
Rise Time of SCLK
Fall Time of SCLK
1
–
20
20
–
TFSCLK
TSSCLK
THSCLK
FSCLK
1
–
ns
Data Set up Time to Falling Edge of SCLK
Data Hold Time from Falling Edge of SCLK
Frequency of SCLK
40
40
0
–
ns
–
–
ns
–
8
MHz
ms
ms
ns
TERASEB Flash Erase Time (Block)
–
15
30
–
–
TWRITE
TDSCLK
Flash Block Write Time
–
–
Data Out Delay from Falling Edge of SCLK
–
45
June 3, 2004
Document No. 38-12009 Rev. *E
29
CY8C22x13 Final Data Sheet
3. Electrical Specifications
2
3.4.8
AC I C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-25. AC Characteristics of the I2C SDA and SCL Pins
Standard Mode
Min Max
100
Fast Mode
Min Max
Symbol
Description
SCL Clock Frequency
Units
kHz
Notes
FSCLI2C
0
0
400
–
THDSTAI2C Hold Time (repeated) START Condition. After this
period, the first clock pulse is generated.
4.0
–
0.6
µs
TLOWI2C
THIGHI2C
LOW Period of the SCL Clock
HIGH Period of the SCL Clock
4.7
4.0
4.7
0
–
–
–
–
–
–
–
–
1.3
0.6
0.6
0
–
µs
µs
µs
µs
ns
µs
µs
ns
–
TSUSTAI2C Set-up Time for a Repeated START Condition
THDDATI2C Data Hold Time
–
–
100a
0.6
TSUDATI2C Data Set-up Time
250
4.0
–
TSUSTOI2C Set-up Time for STOP Condition
–
TBUFI2C
TSPI2C
Bus Free Time Between a STOP and START Condition 4.7
1.3
0
–
Pulse Width of spikes are suppressed by the input fil-
ter.
–
50
a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement t
≥ 250 ns must then be met. This will automatically be
SU;DAT
the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data
bit to the SDA line t
+ t
= 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
rmax SU;DAT
SDA
TSPI2C
TLOWI2C
TSUDATI2C
THDSTAI2C
TBUFI2C
SCL
TSUSTOI2C
TSUSTAI2C
THDDATI2C
THDSTAI2C
THIGHI2C
S
Sr
P
S
Figure 3-8. Definition for Timing for Fast/Standard Mode on the I2C Bus
June 3, 2004
Document No. 38-12009 Rev. *E
30
4. Packaging Information
This chapter illustrates the packaging specifications for the CY8C22x13 PSoC device, along with the thermal impedances for each
package and the typical package capacitance on crystal pins.
4.1
Packaging Dimensions
51-85075 - *A
Figure 4-1. 8-Lead (300-Mil) PDIP
May 2004
© Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E
31
CY8C22x13 Final Data Sheet
4. Packaging Information
51-85066 - *C
Figure 4-2. 8-Lead (150-Mil) SOIC
51-85011 - *A
Figure 4-3. 20-Lead (300-Mil) Molded DIP
June 3, 2004
Document No. 38-12009 Rev. *E
32
CY8C22x13 Final Data Sheet
4. Packaging Information
51-85077 - *C
Figure 4-4. 20-Lead (210-Mil) SSOP
51-85024 - *B
Figure 4-5. 20-Lead (300-Mil) Molded SOIC
Document No. 38-12009 Rev. *E
June 3, 2004
33
CY8C22x13 Final Data Sheet
4. Packaging Information
X = 138 MIL
Y = 138 MIL
32
51-85188 - **
Figure 4-6. 32-Lead (5x5 mm) MLF
4.2
Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
Typical θJA
123 oC/W
*
8 PDIP
185 oC/W
109 oC/W
117 oC/W
81 oC/W
22 oC/W
8 SOIC
20 PDIP
20 SSOP
20 SOIC
32 MLF
* TJ = TA + POWER x θJA
4.3
Capacitance on Crystal Pins
Table 4-2: Typical Package Capacitance on Crystal Pins
Package
8 PDIP
Package Capacitance
2.8 pF
2.0 pF
3.0 pF
2.6 pF
2.5 pF
2.0 pF
8 SOIC
20 PDIP
20 SSOP
20 SOIC
32 MLF
June 3, 2004
Document No. 38-12009 Rev. *E
34
5. Ordering Information
The following table lists the CY8C22x13 PSoC Device family’s key package features and ordering codes.
Table 5-1. CY8C22x13 PSoC Device Family Key Features and Ordering Information
8 Pin (300 Mil) DIP
8 Pin (150 Mil) SOIC
CY8C22113-24PI
CY8C22113-24SI
2
2
256
256
No
No
-40C to +85C
-40C to +85C
4
4
3
3
6
6
4
4
1
1
No
No
8 Pin (150 Mil) SOIC
(Tape and Reel)
CY8C22113-24SIT
2
256
No
-40C to +85C
4
3
6
4
1
No
20 Pin (300 Mil) DIP
CY8C22213-24PI
CY8C22213-24PVI
2
2
256
256
No
No
-40C to +85C
-40C to +85C
4
4
3
3
16
16
8
8
1
1
Yes
Yes
20 Pin (210 Mil) SSOP
20 Pin (210 Mil) SSOP
(Tape and Reel)
CY8C22213-24PVIT
CY8C22213-24SI
CY8C22213-24SIT
CY8C22213-24LFI
2
2
2
2
256
256
256
256
No
No
No
No
-40C to +85C
-40C to +85C
-40C to +85C
-40C to +85C
4
4
4
4
3
3
3
3
16
16
16
16
8
8
8
8
1
1
1
1
Yes
Yes
Yes
Yes
20 Pin (300 Mil) SOIC
20 Pin (300 Mil) SOIC
(Tape and Reel)
32 Pin (5x5 mm) MLF
5.1
Ordering Code Definitions
CY 8 C 22 xxx-SPxx
Package Type:
P = PDIP
S = SOIC
Thermal Rating:
C = Commercial
I = Industrial
PV = SSOP
LF = MLF
E = Extended
A = TQFP
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress MicroSystems
Company ID: CY = Cypress
June 3, 2004
Document No. 38-12009 Rev. *E
35
6. Sales and Company Information
To obtain information about Cypress MicroSystems or PSoC sales and technical support, reference the following information or go to
the section titled “Getting Started” on page 4 in this document.
Cypress MicroSystems
2700 162nd Street SW
Building D
Lynnwood, WA 98037
Phone:
Facsimile:
800.669.0557
425.787.4641
Web Sites: Company Information – http://www.cypress.com
Sales – http://www.cypress.com/aboutus/sales_locations.cfm
Technical Support – http://www.cypress.com/support/login.cfm
6.1
Revision History
Table 6-1. CY8C22x13 Data Sheet Revision History
Document Title:
CY8C22113 and CY8C22213 PSoC Mixed Signal Array Final Data Sheet
Document Number: 38-12009
Revision
**
ECN #
128180
Issue Date
06/30/2003
09/16/2003
10/15/2003
12/05/2003
Origin of Change
New Silicon.
Description of Change
New document – Advanced Data Sheet (two page product brief).
New document – Preliminary Data Sheet (300 page product detail).
Revised document for Silicon Revision A.
*A
*B
*C
129202
130127
131679
NWJ
NWJ
NWJ
Changes to Electrical Specifications section, Miscellaneous changes to I2C, GDI, RDI,
Registers, and Digital Block chapters.
*D
*E
131803
229421
12/22/2003
06/03/2004
NWJ
SFV
Changes to Electrical Specifications and miscellaneous small changes throughout the
data sheet.
New data sheet format and organization. Reference the PSoC Mixed Signal Array Tech-
nical Reference Manual for additional information. Title change.
Distribution: External/Public
Posting: None
6.2
Copyrights
© Cypress MicroSystems, Inc. 2004. All rights reserved. PSoC™ (Programmable System-on-Chip™) are trademarks of Cypress MicroSystems, Inc. All other trademarks
or registered trademarks referenced herein are property of the respective corporations.
The information contained herein is subject to change without notice. Cypress MicroSystems assumes no responsibility for the use of any circuitry other than circuitry
embodied in a Cypress MicroSystems product. Nor does it convey or imply any license under patent or other rights. Cypress MicroSystems does not authorize its products
for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of
Cypress MicroSystems products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Micro-
Systems against all charges. Cypress MicroSystems products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety
applications, unless pursuant to an express written agreement with Cypress MicroSystems.
June 2004
© Cypress MicroSystems, Inc. 2004 — Document No. 38-12009 Rev. *E
36
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