CYBLE-222005-00 [CYPRESS]
Telecom Circuit, 1-Func, SMT-22;型号: | CYBLE-222005-00 |
厂家: | CYPRESS |
描述: | Telecom Circuit, 1-Func, SMT-22 电信 电信集成电路 |
文件: | 总38页 (文件大小:802K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CYBLE-222005-00
EZ-BLE™ PRoC™ Module
EZ-BLE™ PRoC™ Module
■ Low power mode support
General Description
❐ Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
❐ Hibernate: 150 nA with SRAM retention
❐ Stop: 60 nA with XRES wakeup
The Cypress CYBLE-222005-00 is a fully certified and qualified
module supporting Bluetooth Low Energy (BLE) wireless
communication. The CYBLE-222005-00 is a turnkey solution
and includes onboard crystal oscillators, chip antenna, passive
components, and Cypress PRoC™ BLE. Refer to the
CYBL1XX7X datasheet for additional details on the capabilities
of the PRoC BLE device used on this module.
Functional Capabilities
■ Up to 15 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ration (SNR) and liquid tolerance
■ 12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
The CYBLE-222005-00 supports a number of peripheral
functions (ADC, timers, counters, PWM) and serial
communication protocols (I2C, UART, SPI) through its
programmable architecture. The CYBLE-222005-00 includes a
royalty-free BLE stack compatible with Bluetooth 4.1 and
provides up to 16 GPIOs in a small 10 × 10 × 1.80 mm package.
■ Two serial communication blocks (SCBs) supporting I2C
(master/slave), SPI (master/slave), or UART
■ Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
The CYBLE-222005-00 is a complete solution and an ideal fit for
applications requiring BLE wireless connectivity.
■ Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
■ I2S master interface
Module Description
■ Module size: 10.0 mm ×10.0 mm × 1.80 mm (with shield)
■ Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
■ Drop-in compatible with CYBLE-022001-00 and includes
additional VREF input
■ Switches between Central and Peripheral roles on-the-go
■ 256-KB flash memory, 32-KB SRAM memory
■ Standard Bluetooth Low Energy profiles and services for
interoperability
■ Up to 16 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digial, or strong output
■ Custom profile and service for specific use cases
■ Bluetooth 4.1 qualified single-mode module
❐ QDID: 79920
❐ Declaration ID: D029884
Benefits
The CYBLE-222005-00 module is provided as a turnkey
solution, including all necessary hardware required to use BLE
communication standards.
■ Certified to FCC, IC, MIC, KC, and CE regulations
❐ FCC ID: WAP2005
❐ IC ID: 7922A-2005
■ Proven, qualified, and certified hardware design ready to use
❐ MIC ID: 203-JN0495
❐ KC ID: MSIP-CRM-Cyp-2005
■ Small footprint (10 × 10 mm × 1.80 mm), perfect for space
constrained applications
■ Industrial temperature range: –40 °C to +85 °C
■ Reprogrammable architecture
■ 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
■ Fully certified module eliminates the time needed for design,
development and certification processes
■ Watchdog timer with dedicated internal low-speed oscillator
(ILO)
■ Bluetooth SIG qualified with QDID and Declaration ID
(D029647)
■ Two-pin SWD for programming
■ Flexible communication protocol support
Power Consumption
■ PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
■ TX output power: –18 dbm to +3 dbm
■ Received signal strength indicator (RSSI) with 1-dB resolution
■ TX current consumption of 15.6 mA (radio only, 0 dbm)
■ RX current consumption of 16.4 mA (radio only)
Cypress Semiconductor Corporation
Document Number: 002-00214 Rev. *G
198 Champion Court
San Jose, CA 95134-1709
408-943-2600
Revised December 22, 2017
CYBLE-222005-00
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.
■ Overview: EZ-BLE Module Portfolio, Module Roadmap
■ EZ-BLE PRoC Product Overview
■ Knowledge Base Articles
❐ KBA04069 - Pin Mapping Differences Between the
EZ-BLE™ PRoC™ Evaluation Board
(CYBLE-222005-EVAL) and the BLE Pioneer Kit
(CY8CKIT-042-BLE)
❐ KBA97095 - EZ-BLE™ Module Placement
❐ KBA210559 - RF Regulatory Certifications for EZ-BLE™
PRoC™ Module CYBLE-222005-00 - KBA210559
■ PRoC BLE Silicon Datasheet
■ Application notes: Cypress offers a number of BLE application
notes covering a broad range of topics, from basic to advanced
level. Recommended application notes for getting started with
EZ-BLE modules are:
❐ AN96841 - Getting Started with EZ-BLE Module
❐ AN94020 - Getting Started with PRoC BLE
❐ KBA213976 -FAQ for BLE and Regulatory Certifications with
EZ-BLE modules
❐ AN97060 - PSoC® 4 BLE and PRoC™ BLE - Over-The-Air
❐ KBA210802 - Queries on BLE Qualification and Declaration
Processes
(OTA) Device Firmware Upgrade (DFU) Guide
❐ AN91162 - Creating a BLE Custom Profile
❐ AN91184 - PSoC 4 BLE - Designing BLE Applications
■ Development Kits:
❐ CYBLE-222005-EVAL, CYBLE-222005-00EvaluationBoard
❐ CY8CKIT-042-BLE, Bluetooth® Low Energy (BLE) Pioneer
❐ AN92584 - Designing for Low Power and Estimating Battery
Life for BLE Applications
Kit
❐ AN85951 - PSoC® 4 CapSense® Design Guide
❐ CY8CKIT-002, PSoC® MiniProg3 Program and Debug Kit
❐ AN95089 - PSoC® 4/PRoC™ BLE Crystal Oscillator Selec-
■ Test and Debug Tools:
tion and Tuning Techniques
❐ CYSmart, Bluetooth® LE Test and Debug Tool (Windows)
❐ AN91445 - Antenna Design and RF Layout Guidelines
■ Technical Reference Manual (TRM):
❐ PRoC® BLE Technical Reference Manual
❐ CYSmart Mobile, Bluetooth® LE Test and Debug Tool
(Android/iOS Mobile App)
Two Easy-To-Use Design Environments to Get You Started Quickly
®
PSoC Creator™ Integrated Design Environment (IDE)
PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and
debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 BLE, PRoC BLE and EZ-BLE module systems with no code size limitations. PSoC
peripherals are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified,
production-ready PSoC Components™.
PSoC Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop into a design and
configure to suit a broad array of application requirements.
Blutooth Low Energy Component
The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you
quickly design BLE applications. The Component incorporates a Bluetooth Core Specification v4.1 compliant BLE protocol stack and
provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy Sub-System (BLESS)
hardware via the stack.
EZ-Serial™ BLE Firmware Platform
The EZ-Serial Firmware Platform provides a simple way to access the most common hardware and communication features needed
in BLE applications. EZ-Serial implements an intuitive API protocol over the UART interface and exposes various status and control
signals through the module’s GPIOs, making it easy to add BLE functionality quickly to existing designs.
Use a simple serial terminal and evaluation kit to begin development without requiring an IDE. Refer to the EZ-Serial webpage for
User Manuals and instructions for getting started as well as detailed reference materials.
EZ-BLE modules are pre-flashed with the EZ-Serial Firmware Platform. If you do not have EZ-Serial pre-loaded on your module, you
can download each EZ-BLE module’s firmware images on the EZ-Serial webpage.
Technical Support
■ Frequently Asked Questions (FAQs): Learn more about our BLE ECO System.
■ Forum: See if your question is already answered by fellow developers on the PSoC 4 BLE and PRoC BLE forums.
■ Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,
you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt.
Document Number: 002-00214 Rev. *G
Page 2 of 38
CYBLE-222005-00
Contents
Overview............................................................................ 4
Module Description...................................................... 4
Pad Connection Interface ................................................ 6
Recommended Host PCB Layout ................................... 7
Digital and Analog Capabilities and Connections......... 9
Power Supply Connections and Recommended External
Components.................................................................... 10
Connection Options................................................... 10
External Component Recommendation .................... 10
Critical Components List ........................................... 12
Antenna Design......................................................... 12
Electrical Specification .................................................. 13
GPIO ......................................................................... 15
XRES......................................................................... 17
Digital Peripherals ..................................................... 19
Serial Communication ............................................... 21
Memory ..................................................................... 22
System Resources .................................................... 22
Environmental Specifications ....................................... 28
Environmental Compliance ....................................... 28
RF Certification.......................................................... 28
Safety Certification .................................................... 28
Environmental Conditions ......................................... 28
ESD and EMI Protection ........................................... 28
Regulatory Information.................................................. 29
FCC........................................................................... 29
Industry Canada (IC) Certification............................. 30
European R&TTE Declaration of Conformity ............ 30
MIC Japan................................................................. 31
KC Korea................................................................... 31
Packaging........................................................................ 32
Ordering Information...................................................... 34
Part Numbering Convention...................................... 34
Acronyms........................................................................ 35
Document Conventions ................................................. 35
Units of Measure ....................................................... 35
Document History Page................................................. 36
Sales, Solutions, and Legal Information ...................... 38
Worldwide Sales and Design Support .......................38
Products.................................................................... 38
PSoC® Solutions ...................................................... 38
Cypress Developer Community................................. 38
Technical Support ..................................................... 38
Document Number: 002-00214 Rev. *G
Page 3 of 38
CYBLE-222005-00
Overview
Module Description
The CYBLE-222005-00 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs
should be held within the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
Dimension Item
Specification
Length (X) 10.00 ± 0.15 mm
Width (Y) 10.00 ± 0.15 mm
Length (X) 7.00 ± 0.15 mm
Width (Y) 5.00 ± 0.15 mm
Module dimensions
Antenna location dimensions
PCB thickness
Height (H) 0.50 ± 0.10 mm
Height (H) 1.10 ± 0.10 mm
Shield height
Maximum component height
Height (H) 1.30-mm typical (chip antenna)
Total module thickness (bottom of module to highest component) Height (H) 1.80-mm typical
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-222005-00.
Document Number: 002-00214 Rev. *G
Page 4 of 38
CYBLE-222005-00
Figure 1. Module Mechanical Drawing
Top View (View from Top)
Side View
Bottom View (Seen from Bottom)
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see “Recommended Host PCB Layout” on page 7.
Document Number: 002-00214 Rev. *G
Page 5 of 38
CYBLE-222005-00
Pad Connection Interface
As shown in the bottom view of Figure 1 on page 5, the CYBLE-222005-00 connects to the host board via solder pads on the back
of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-222005-00 module.
Table 2. Solder Pad Connection Description
Name Connections Connection Type
SP 22 Solder Pads
Pad Length Dimension
Pad Width Dimension
Pad Pitch
0.71 mm
0.41 mm
0.76 mm
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the chip antenna located at the far corner.
This placement minimizes the additional recommended keep out area stated in item 2. Refer to AN96841 for module placement
best practices.
2. To maximize RF performance, the area immediately around the Cypress BLE module chip antenna should contain an additional
keep out area, where no grounding or signal traces are contained. The keep out area applies to all layers of the host board. The
recommended dimensions of the host PCB keep out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep Out Area Around the CYBLE-222005-00 Chip Antenna
Host PCB Keep Out Area Around Chip Antenna
Document Number: 002-00214 Rev. *G
Page 6 of 38
CYBLE-222005-00
Recommended Host PCB Layout
Figure 4, Figure 5, Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the
CYBLE-222005-00. Dimensions are in millimeters unless otherwise noted. Pad length of 0.91 mm (0.455 mm from center of the pad
on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using
either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.
Figure 4. Host Layout Pattern for CYBLE-222005-00
Figure 5. Module Pad Location from Origin
Top View (Seen on Host PCB)
Top View (Seen on Host PCB)
Document Number: 002-00214 Rev. *G
Page 7 of 38
CYBLE-222005-00
Table 3 provides the center location for each solder pad on the CYBLE-222005-00. All dimensions are referenced to the center of the
solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3. Module Solder Pad Location
Figure 6. Solder Pad Reference Location
Solder Pad
(Center of Pad)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
1
2
(0.26, 1.64)
(0.26, 2.41)
(0.26, 3.17)
(0.26, 3.93)
(0.26, 4.69)
(0.26, 5.45)
(0.81, 9.74)
(1.57, 9.74)
(2.34, 9.74)
(3.10, 9.74)
(3.86, 9.74)
(4.62, 9.74)
(5.38, 9.74)
(6.15, 9.74)
(6.91, 9.74)
(7.67, 9.74)
(8.43, 9.74)
(9.19, 9.74)
(9.75, 8.50)
(9.75, 7.74)
(9.75, 6.98)
(9.75, 6.22)
(10.24, 64.57)
(10.24, 94.88)
3
(10.24, 124.80)
(10.24, 154.72)
(10.24, 184.65)
(10.24, 214.57)
(31.89, 383.46)
(61.81, 383.46)
(92.13, 383.46)
(122.05, 383.46)
(151.97, 383.46)
(181.89, 383.46)
(211.81, 383.46)
(242.13, 383.46)
(272.05, 383.46)
(301.97, 383.46)
(331.89, 383.46)
(361.81, 383.46)
(383.86, 334.65)
(383.86, 304.72)
(383.86, 274.80)
(383.86, 244.88)
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Top View (Seen on Host PCB)
Document Number: 002-00214 Rev. *G
Page 8 of 38
CYBLE-222005-00
Digital and Analog Capabilities and Connections
Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on
CYBLE-222005-00, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each
connection is configurable for a single option shown with a ✓.
Table 4. Solder Pad Connection Definitions
SolderPad Device
Cap-
Sense
WCO ECO
OUT OUT
UART
SPI
I2C
TCPWM[2,3]
LCD
SWD
GPIO
Number
Port Pin
1
2
GND[4]
Ground Connection
P4.1[5] ✓(SCB1_CTS) ✓(SCB1_MISO)
✓(TCPWM0_N) ✓(Sensor/
✓
✓
CTANK
)
3
4
5
6
7
8
P5.1
P5.0
VDDR
✓(SCB1_TX) ✓(SCB1_SCLK) ✓(SCB1_SCL) ✓(TCPWM3_N)
✓(SCB1_RX) ✓(SCB1_SS0) ✓(SCB1_SDA) ✓(TCPWM3_P)
✓
✓
✓
✓
✓
✓
✓
✓
Radio Power Supply (1.9V to 5.5V)
[6]
VREF
P1.6
P0.7
Voltage Reference Input (Optional)
✓(SCB0_RTS) ✓(SCB0_SS0)
✓(SCB0_CTS) ✓(SCB0_SCLK)
✓(TCPWM) ✓(Sensor)
✓(TCPWM)
✓
✓
✓
✓
✓
✓
(SWDCLK)
9
P0.4
P0.5
GND
P0.6
✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM)
✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM)
Ground Connection
✓
✓
✓
✓
✓
✓
10
11
12
✓(SCB0_RTS) ✓(SCB0_SS0)
✓(TCPWM)
✓
✓
✓
✓
(SWDIO)
✓
✓
13
14
15
16
17
18
19
20
21
22
P1.7
VDD
✓(SCB0_CTS) ✓(SCB0_SCLK)
✓(TCPWM) ✓(Sensor)
Digital Power Supply Input (1.71 to 5.5V)
External Reset Hardware Connection Input
XRES
P3.5
P3.4
P3.7
P1.4
P1.5
P3.6
✓(SCB1_TX)
✓(SCB1_RX)
✓(SCB1_CTS)
✓(SCB1_SCL) ✓(TCPWM)
✓(SCB1_SDA) ✓(TCPWM)
✓(TCPWM)
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM)
✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM)
✓(SCB1_RTS)
✓(TCPWM)
P4.0[7] ✓(SCB1_RTS) ✓(SCB1_MOSI)
✓(TCPWM0_P) ✓(CMOD)
Notes
2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
3. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either positive
or negative polarity. TCPWM connections on ports 4 and 5 are direct and can only be used with the specified TCPWM block and polarity specified above.
4. The main board needs to connect both GND connections (Pad 1 and Pad 10) on the module to the common ground of the system.
5. When using the capacitive sensing functionality, Pad 2 (P4.1) can be connected to a C
capacitor (located off of Cypress BLE Module). C
should be used
TANK
Tank
if implementing a shield layer on the capacitive sensor. If used, this capacitor should be placed as close to the module as possible.
6. Analog block functionality is augmented for the user with the external V input. The internal bandgap may be bypassed with a 1-µF to 10-µF capacitor.
REF
7. When using the capacitive sensing functionality, Pad 22 (P4.0) must be connected to a C
capacitor (located off of Cypress BLE Module). The value of this
MOD
capacitor is 2.2 nF and should be placed as close to the module as possible.
2
2
8. If the I S feature is used in the design, the I S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator
Document Number: 002-00214 Rev. *G
Page 9 of 38
CYBLE-222005-00
Power Supply Connections and Recommended External Components
Power Connections
External Component Recommendation
The CYBLE-222005-00 contains two power supply connections,
VDD and VDDR. The VDD connection supplies power for both
digital and analog device operation. The VDDR connection
supplies power for the device radio.
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
VDD accepts a supply range of 1.71 V to 5.5 V. VDDR accepts
a supply range of 1.9 V to 5.5 V. These specifications can be
found in Table 9. The maximum power supply ripple for both
power connections on the module is 100 mV, as shown in
Table 7.
Figure 7 details the recommended host schematic options for a
single supply scenario. The use of one or two ferrite beads will
depend on the specific application and configuration of the
CYBLE-222005-00.
Figure 8 details the recommended host schematic for an
independent supply scenario.
The power supply ramp rate of VDD must be equal to or greater
than that of VDDR.
The recommended ferrite bead value is 330 , 100 MHz. (Murata
BLM21PG331SN1D).
Connection Options
Two connection options are available for any application:
1. Single supply: Connect VDD and VDDR to the same supply.
2. Independent supply: Power VDD and VDDR separately.
Figure 7. Recommended Host Schematic Options for a Single Supply Option
Two Ferrite Bead Option (Seen from Bottom)
Single Ferrite Bead Option (Seen from Bottom)
Figure 8. Recommended Host Schematic for an Independent Supply Option
Independent Power Supply Option (Seen from Bottom)
Document Number: 002-00214 Rev. *G
Page 10 of 38
CYBLE-222005-00
The CYBLE-222005-00 schematic is shown in Figure 9.
Figure 9. CYBLE-222005-00 Schematic Diagram
Document Number: 002-00214 Rev. *G
Page 11 of 38
CYBLE-222005-00
Critical Components List
Table 5 details the critical components used in the CYBLE-222005-00 module.
Table 5. Critical Component List
Component
Reference Designator
Description
Silicon
Crystal
Crystal
Antenna
U1
Y1
Y2
E1
76-pin WLCSP Programmable Radio-on-Chip (PRoC) with BLE
24.000 MHz, 10PF
32.768 kHz, 12.5PF
2.4–2.5 GHz chip antenna
Antenna Design
Table 6 details the chip antenna used in the CYBLE-222005-00 module. The specifications listed are according to the vendor’s
datasheet. The Cypress module performance improves many of these characteristics. For more information, see Table 8.
Table 6. Chip Antenna Specifications
Item
Chip Antenna Manufacturer
Chip Antenna Part Number
Frequency Range
Peak Gain
Description
Johanson Technology Inc.
2450AT18B100
2400–2500 MHz
0.5 dBi typical
Average Gain
–0.5-dBi typical
Return Loss
9.5-dB minimum
Document Number: 002-00214 Rev. *G
Page 12 of 38
CYBLE-222005-00
Electrical Specification
Table 7 details the absolute maximum electrical characteristics for the Cypress BLE module.
Table 7. CYBLE-222005-00 Absolute Maximum Ratings
Parameter
VDDD_ABS
Description
Min
–0.5
–0.5
Typ
–
Max
6
Units
Details/Conditions
Analog, digital, or radio supply relative to VSS
V
V
Absolute maximum
(VSSD = VSSA
)
VCCD_ABS
Direct digital core voltage input relative to VSSD
–
1.95
Absolute maximum
3.0-V supply
Maximum power supply ripple for VDD and VDDR
input voltage
VDDD_RIPPLE
–
–
100
mV Ripple frequency of 100 kHz
to 750 kHz
VGPIO_ABS
IGPIO_ABS
GPIO voltage
–0.5
–25
–
–
VDD +0.5
25
V
Absolute maximum
Maximum current per GPIO
mA Absolute maximum
GPIO injection current: Maximum for VIH > VDD
and minimum for VIL < VSS
Absolute maximum current
injected per pin
IGPIO_injection
LU
–0.5
–
0.5
mA
Pin current for latch up
–200
200
mA
–
Table 8 details the RF characteristics for the Cypress BLE module.
Table 8. CYBLE-222005-00 RF Performance Characteristics
Parameter
RFO
Description
RF output power on ANT
Min
Typ
Max
Units
Details/Conditions
Configurable via register
settings
–18
0
3
dBm
Guaranteed by design
simulation
RXS
RF receive sensitivity on ANT
–
–87
–
dBm
FR
Module frequency range
Peak gain
2400
–
2480
MHz
dBi
dBi
dB
–
–
–
–
GP
–
–
–
0.5
–
–
–
GAvg
RL
Average gain
–0.5
–10.5
Return loss
Table 9 through Table 47 list the module level electrical characteristics for the CYBLE-222005-00. All specifications are valid for
–40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted.
Table 9. CYBLE-222005-00 DC Specifications
Parameter
VDD1
Description
Power supply input voltage
Min
Typ
Max
Units
Details/Conditions
1.8
–
5.5
V
With regulator enabled
Internally unregulated
supply
VDD2
Power supply input voltage unregulated
1.71
1.8
1.89
V
VDDR1
VDDR2
Radio supply voltage (radio on)
Radio supply voltage (radio off)
1.9
–
–
5.5
5.5
V
V
–
–
1.71
Active Mode, VDD = 1.71 V to 5.5 V
T = 25 °C,
IDD3
IDD4
IDD5
IDD6
IDD7
Execute from flash; CPU at 3 MHz
–
–
–
–
–
1.7
–
–
–
–
–
–
mA
VDD = 3.3 V
Execute from flash; CPU at 3 MHz
Execute from flash; CPU at 6 MHz
Execute from flash; CPU at 6 MHz
Execute from flash; CPU at 12 MHz
mA T = –40 °C to 85 °C
T = 25 °C,
mA
2.5
–
VDD = 3.3 V
mA T = –40 °C to 85 °C
T = 25 °C,
mA
4
VDD = 3.3 V
Document Number: 002-00214 Rev. *G
Page 13 of 38
CYBLE-222005-00
Table 9. CYBLE-222005-00 DC Specifications (continued)
Parameter
IDD8
Description
Min
Typ
Max
Units
Details/Conditions
Execute from flash; CPU at 12 MHz
–
–
–
mA T = –40 °C to 85 °C
T = 25 °C,
mA
IDD9
Execute from flash; CPU at 24 MHz
Execute from flash; CPU at 24 MHz
Execute from flash; CPU at 48 MHz
Execute from flash; CPU at 48 MHz
–
–
–
–
7.1
–
–
–
–
–
V
DD = 3.3 V
IDD10
IDD11
IDD12
mA T = –40 °C to 85 °C
T = 25 °C,
mA
13.4
–
VDD = 3.3 V
mA T = –40 °C to 85 °C
Sleep Mode, VDD = 1.8 V to 5.5 V
IDD13 IMO on
Sleep Mode, VDD and VDDR = 1.9 V to 5.5 V
IDD14 ECO on
Deep-Sleep Mode, VDD = 1.8 V to 3.6 V
T = 25 °C, VDD = 3.3 V,
mA
–
–
–
–
–
–
SYSCLK = 3 MHz
T = 25 °C, VDD = 3.3 V,
mA
SYSCLK = 3 MHz
T = 25 °C,
µA
IDD15
IDD16
IDD17
IDD18
WDT with WCO on
WDT with WCO on
WDT with WCO on
WDT with WCO on
–
–
–
–
1.5
–
–
–
–
–
VDD = 3.3 V
µA T = –40 °C to 85 °C
T = 25 °C,
µA
–
VDD = 5 V
–
µA T = –40 °C to 85 °C
Deep-Sleep Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)
IDD19
IDD20
WDT with WCO on
WDT with WCO on
–
–
–
–
–
–
µA T = 25 °C
µA T = –40 °C to 85 °C
Hibernate Mode, VDD = 1.8 V to 3.6 V
T = 25 °C,
nA
IDD27
IDD28
GPIO and reset active
–
–
150
–
–
–
VDD = 3.3 V
GPIO and reset active
nA T = –40 °C to 85 °C
Hibernate Mode, VDD = 3.6 V to 5.5 V
T = 25 °C,
nA
IDD29
GPIO and reset active
–
–
–
–
–
–
VDD = 5 V
IDD30
GPIO and reset active
nA T = –40 °C to 85 °C
Stop Mode, VDD = 1.8 V to 3.6 V
T = 25 °C,
nA
IDD33
Stop-mode current (VDD
)
–
20
–
V
DD = 3.3 V
T = 25 °C,
DDR = 3.3 V
IDD34
IDD35
IDD36
Stop-mode current (VDDR
)
)
–
–
–
40
–
–-
–
nA
V
Stop-mode current (VDD
)
nA T = –40 °C to 85 °C
T = –40 °C to 85 °C,
nA
Stop-mode current (VDDR
–
–
VDDR = 1.9 V to 3.6 V
Stop Mode, VDD = 3.6 V to 5.5 V
IDD37 Stop-mode current (VDD
T = 25 °C,
nA
)
–
–
–
–
–
–
V
DD = 5 V
T = 25 °C,
DDR = 5 V
IDD38
IDD39
IDD40
Stop-mode current (VDDR
)
)
nA
V
Stop-mode current (VDD
)
–
–
–
–
–
–
nA T = –40 °C to 85 °C
nA T = –40 °C to 85 °C
Stop-mode current (VDDR
Document Number: 002-00214 Rev. *G
Page 14 of 38
CYBLE-222005-00
Table 10. AC Specifications
Parameter
Description
Min
DC
–
Typ
–
Max
48
–
Units
Details/Conditions
FCPU
CPU frequency
MHz 1.71 V VDD 5.5 V
TSLEEP
Wakeup from Sleep mode
0
µs
Guaranteed by characterization
24-MHz IMO. Guaranteed by
characterization
TDEEPSLEEP
Wakeup from Deep-Sleep mode
–
–
25
µs
THIBERNATE
TSTOP
Wakeup from Hibernate mode
Wakeup from Stop mode
–
–
–
–
2
2
ms
ms
Guaranteed by characterization
XRES wakeup
GPIO
Table 11. GPIO DC Specifications
Parameter
Description
Min
Typ
–
Max
Units
V
Details/Conditions
Input voltage HIGH threshold
LVTTL input, VDD < 2.7 V
LVTTL input, VDD >= 2.7 V
Input voltage LOW threshold
LVTTL input, VDD < 2.7 V
LVTTL input, VDD >= 2.7 V
Output voltage HIGH level
Output voltage HIGH level
Output voltage LOW level
Output voltage LOW level
Output voltage LOW level
Pull-up resistor
0.7 × VDD
–
CMOS input
[9]
VIH
0.7 × VDD
–
–
V
–
2.0
–
–
V
–
–
–
0.3× VDD
V
CMOS input
VIL
–
–
–
0.3× VDD
V
–
–
0.8
–
V
–
VDD –0.6
–
V
IOH = 4 mA at 3.3-V VDD
VOH
V
DD –0.5
–
–
V
IOH = 1 mA at 1.8-V VDD
–
–
–
0.6
0.6
0.4
8.5
8.5
2
V
IOL = 8 mA at 3.3-V VDD
VOL
–
V
IOL = 4 mA at 1.8-V VDD
–
–
V
IOL = 3 mA at 3.3-V VDD
RPULLUP
RPULLDOWN
IIL
3.5
3.5
–
5.6
5.6
–
k
k
nA
nA
pF
mV
1
–
Pull-down resistor
–
Input leakage current (absolute value)
Input leakage on CTBm input pins
Input capacitance
25 °C, VDD = 3.3 V
IIL_CTBM
CIN
VHYSTTL
VHYSCMOS
–
–
4
–
–
–
7
–
Input hysteresis LVTTL
25
40
–
–
VDD > 2.7 V
–
Input hysteresis CMOS
0.05 × VDD
–
Current through protection diode to
VDD/VSS
IDIODE
–
–
–
100
200
µA
–
–
Maximum total source or sink chip
current
ITOT_GPIO
–
mA
Note
9.
V
must not exceed V + 0.2 V.
IH DD
Document Number: 002-00214 Rev. *G
Page 15 of 38
CYBLE-222005-00
Table 12. GPIO AC Specifications
Parameter Description
TRISEF
Min
2
Typ
–
Max
12
Units
ns
Details/Conditions
3.3-V VDDD, CLOAD = 25 pF
3.3-V VDDD, CLOAD = 25 pF
3.3-V VDDD, CLOAD = 25 pF
3.3-V VDDD, CLOAD = 25 pF
Rise time in Fast-Strong mode
Fall time in Fast-Strong mode
Rise time in Slow-Strong mode
Fall time in Slow-Strong mode
TFALLF
TRISES
TFALLS
2
–
12
ns
10
10
–
60
ns
–
60
ns
GPIO FOUT; 3.3 V VDD 5.5 V
90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT1
FGPIOUT2
FGPIOUT3
FGPIOUT4
FGPIOIN
–
–
–
–
–
–
–
–
–
–
33
16.7
7
MHz
MHz
MHz
MHz
Fast-Strong mode
GPIO FOUT; 1.7 VVDD 3.3 V
Fast-Strong mode
90/10%, 25-pF load, 60/40 duty
cycle
GPIO FOUT; 3.3 V VDD 5.5 V
Slow-Strong mode
90/10%, 25-pF load, 60/40 duty
cycle
GPIO FOUT; 1.7 V VDD 3.3 V
Slow-Strong mode
90/10%, 25-pF load, 60/40 duty
cycle
3.5
48
GPIO input operating frequency
1.71 V VDD 5.5 V
MHz 90/10% VIO
Table 13. OVT GPIO DC Specifications (P5_0 and P5_1 Only)
Parameter
Description
Min
–
Typ
–
Max
10
Units
µA
Details/Conditions
Input leakage (absolute value).
IIL
VOL
25°C, VDD = 0 V, VIH = 3.0 V
IOL = 20 mA, VDD > 2.9 V
V
IH > VDD
Output voltage LOW level
–
–
0.4
V
Table 14. OVT GPIO AC Specifications (P5_0 and P5_1 Only)
Parameter
TRISE_OVFS
TFALL_OVFS
Description
Min
1.5
1.5
Typ
–
Max
12
Units
ns
Details/Conditions
Output rise time in Fast-Strong mode
Output fall time in Fast-Strong mode
25-pF load, 10%–90%, VDD=3.3 V
25-pF load, 10%–90%, VDD=3.3 V
–
12
ns
25-pF load, 10%-90%,
VDD = 3.3 V
TRISESS
TFALLSS
FGPIOUT1
FGPIOUT2
Output rise time in Slow-Strong mode
Output fall time in Slow-Strong mode
10
10
–
–
–
–
–
60
60
24
16
ns
ns
25-pF load, 10%-90%,
VDD = 3.3 V
GPIO FOUT; 3.3 V VDD 5.5 V
Fast-Strong mode
90/10%, 25-pF load, 60/40 duty
cycle
MHz
MHz
GPIO FOUT; 1.71 V VDD 3.3 V
Fast-Strong mode
90/10%, 25-pF load, 60/40 duty
cycle
–
Document Number: 002-00214 Rev. *G
Page 16 of 38
CYBLE-222005-00
XRES
Table 15. XRES DC Specifications
Parameter
VIH
Description
Min
Typ
–
Max
Units
V
Details/Conditions
Input voltage HIGH threshold
Input voltage LOW threshold
Pull-up resistor
0.7 × VDDD
–
CMOS input
CMOS input
VIL
–
3.5
–
–
0.3 × VDDD
V
RPULLUP
CIN
5.6
3
8.5
–
k
pF
–
–
–
Input capacitance
VHYSXRES
Input voltage hysteresis
Current through protection diode to
–
100
–
mV
IDIODE
–
–
100
µA
–
VDD/VSS
Table 16. XRES AC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
TRESETWIDTH Reset pulse width
1
–
–
µs
–
SAR ADC
Table 17. SAR ADC DC Specifications
Parameter
A_RES
Description
Min
Typ
–
Max
12
6
Units
Details/Conditions
Resolution
–
–
–
bits
A_CHNIS_S
A-CHNKS_D
Number of channels - single-ended
Number of channels - differential
–
6 full-speed[10]
–
3
Diff inputs use
neighboring I/O[10]
A-MONO
Monotonicity
Gain error
–
–
–
–
–
Yes
A_GAINERR
±0.1
%
With external
reference
A_OFFSET
Input offset voltage
–
–
2
mV
Measured with 1-V
VREF
A_ISAR
Current consumption
–
VSS
VSS
–
–
–
–
–
–
–
1
VDDA
VDDA
2.2
mA
V
A_VINS
Input voltage range - single-ended
Input voltage range - differential
Input resistance
A_VIND
V
A_INRES
A_INCAP
VREFSAR
k
pF
%
Input capacitance
–
10
Trimmed internal reference to SAR
–1
1
Percentage of Vbg
(1.024 V)
Table 18. SAR ADC AC Specifications
Parameter Description
A_PSRR
Details/
Min
Typ
Max
Units
Conditions
Power-supply rejection ratio
70
–
–
dB
Measured at 1-V
reference
A_CMRR
A_SAMP
Fsarintref
Common-mode rejection ratio
Sample rate
66
–
–
–
–
–
1
dB
Msps
SAR operating speed without external ref.
bypass
–
100
Ksps 12-bit resolution
Note
10. A maximum of six single-ended ADC Channels can be accomplished only if the AMUX Buses are not being used for other functionality (such as CapSense).
If the AMUX Buses are being used for other functionality, then the maximum number of single-ended ADC channels is four. Similarly, if the AMUX Buses are
being used for other functionality, then the maximum number of differential ADC channels is two.
Document Number: 002-00214 Rev. *G
Page 17 of 38
CYBLE-222005-00
Table 18. SAR ADC AC Specifications (continued)
Details/
Parameter
A_SNR
Description
Min
Typ
Max
Units
Conditions
Signal-to-noise ratio (SNR)
65
–
–
–
–
–
dB
FIN = 10 kHz
A_BW
A_INL
Input bandwidth without aliasing
A_SAMP/2
2
kHz
Integral nonlinearity. VDD = 1.71 V to 5.5 V,
1 Msps
–1.7
LSB VREF = 1 V to VDD
LSB VREF = 1.71 V to VDD
LSB VREF = 1 V to VDD
LSB VREF = 1 V to VDD
LSB VREF = 1.71 V to VDD
LSB VREF = 1 V to VDD
A_INL
A_INL
A_dnl
Integral nonlinearity. VDDD = 1.71 V to 3.6 V,
1 Msps
–1.5
–1.5
–1
–
–
–
–
–
–
1.7
1.7
2.2
2
Integral nonlinearity. VDD = 1.71 V to 5.5 V,
500 Ksps
Differential nonlinearity. VDD = 1.71 V to
5.5 V, 1 Msps
A_DNL
A_DNL
Differential nonlinearity. VDD = 1.71 V to
3.6 V, 1 Msps
–1
Differential nonlinearity. VDD = 1.71 V to
5.5 V, 500 Ksps
–1
2.2
–65
A_THD
Total harmonic distortion
–
dB
FIN = 10 kHz
CSD
CSD Block Specifications
Details/
Conditions
Parameter
Description
Min
Typ
Max
Units
VCSD
Voltage range of operation
1.71
–
5.5
V
IDAC1
IDAC1
IDAC2
IDAC2
SNR
DNL for 8-bit resolution
INL for 8-bit resolution
–1
–3
–1
–3
5
–
–
–
–
–
1
3
1
3
–
LSB
LSB
LSB
LSB
Ratio
DNL for 7-bit resolution
INL for 7-bit resolution
Capacitance range of
9 pF to 35 pF, 0.1-pF
sensitivity. Radio is not
operating during the
scan
Ratio of counts of finger to noise
IDAC1_CRT1
IDAC1_CRT2
IDAC2_CRT1
IDAC2_CRT2
Output current of IDAC1 (8 bits) in High
range
–
–
–
–
612
306
305
153
–
–
–
–
µA
µA
µA
µA
Output current of IDAC1 (8 bits) in Low
range
Output current of IDAC2 (7 bits) in High
range
Output current of IDAC2 (7 bits) in Low
range
Document Number: 002-00214 Rev. *G
Page 18 of 38
CYBLE-222005-00
Digital Peripherals
Timer
Table 19. Timer DC Specifications
Parameter
ITIM1
ITIM2
ITIM3
Description
Min
–
Typ
–
Max
42
Units
Details/Conditions
16-bit timer
Block current consumption at 3 MHz
Block current consumption at 12 MHz
Block current consumption at 48 MHz
µA
µA
µA
–
–
–
–
130
535
16-bit timer
16-bit timer
Table 20. Timer AC Specifications
Parameter Description
TTIMFREQ
Min
FCLK
Typ
–
Max
48
Units
MHz
Details/Conditions
Operating frequency
TCAPWINT
Capture pulse width (internal)
Capture pulse width (external)
Timer resolution
2 × TCLK
2 × TCLK
TCLK
–
–
–
–
–
–
–
–
–
–
–
–
–
–
ns
ns
ns
ns
ns
ns
ns
TCAPWEXT
TTIMRES
TTENWIDINT
TTENWIDEXT
TTIMRESWINT
TTIMRESEXT
Enable pulse width (internal)
Enable pulse width (external)
Reset pulse width (internal)
Reset pulse width (external)
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
Counter
Table 21. Counter DC Specifications
Parameter Description
ICTR1
ICTR2
ICTR3
Min
–
Typ
–
Max
42
Units
µA
Details/Conditions
16-bit counter
Block current consumption at 3 MHz
Block current consumption at 12 MHz
Block current consumption at 48 MHz
–
–
–
–
130
535
µA
16-bit counter
16-bit counter
µA
Table 22. Counter AC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
TCTRFREQ
Operating frequency
FCLK
–
48
MHz
TCTRPWINT
TCTRPWEXT
TCTRES
Capture pulse width (internal)
Capture pulse width (external)
Counter Resolution
2 × TCLK
2 × TCLK
TCLK
–
–
–
–
–
–
–
–
–
–
–
–
–
–
ns
ns
ns
ns
ns
ns
ns
TCENWIDINT
TCENWIDEXT
TCTRRESWINT
Enable pulse width (internal)
Enable pulse width (external)
Reset pulse width (internal)
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
TCTRRESWEXT Reset pulse width (external)
Pulse Width Modulation (PWM)
Table 23. PWM DC Specifications
Parameter
IPWM1
IPWM2
IPWM3
Description
Min
–
Typ
–
Max
42
Units
µA
Details/Conditions
16-bit PWM
Block current consumption at 3 MHz
Block current consumption at 12 MHz
Block current consumption at 48 MHz
–
–
130
535
µA
16-bit PWM
–
–
µA
16-bit PWM
Document Number: 002-00214 Rev. *G
Page 19 of 38
CYBLE-222005-00
Table 24. PWM AC Specifications
Parameter Description
TPWMFREQ
TPWMPWINT
TPWMEXT
Min
Typ
–
Max
48
–
Units
Details/Conditions
Operating frequency
FCLK
MHz
ns
Pulse width (internal)
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
–
Pulse width (external)
–
–
ns
TPWMKILLINT
TPWMKILLEXT
TPWMEINT
Kill pulse width (internal)
Kill pulse width (external)
Enable pulse width (internal)
Enable pulse width (external)
Reset pulse width (internal)
Reset pulse width (external)
–
–
ns
–
–
ns
–
–
ns
TPWMENEXT
TPWMRESWINT
TPWMRESWEXT
–
–
ns
–
–
ns
–
–
ns
LCD Direct Drive
Table 25. LCD Direct Drive DC Specifications
Spec ID Parameter Description
SID228 ILCDLOW
Min
Typ
Max
Units Details/Conditions
Operating current in low-power mode
–
17.5
–
µA 16 × 4 small segment
display at 50 Hz
SID229
CLCDCAP
LCD capacitance per segment/common
driver
–
500
5000
pF
SID230
SID231
LCDOFFSET
ILCDOP1
Long-term segment offset
–
–
20
2
–
–
mV
LCD system operating current
VBIAS = 5 V
mA 32 × 4 segments.
50 Hz at 25 °C
SID232
ILCDOP2
LCD system operating current
VBIAS = 3.3 V
–
2
–
mA 32 × 4 segments
50 Hz at 25 °C
Table 26. LCD Direct Drive AC Specifications
Spec ID Parameter Description
SID233 FLCD LCD frame rate
Min
Typ
Max
Units
Details/Conditions
10
50
150
Hz
Document Number: 002-00214 Rev. *G
Page 20 of 38
CYBLE-222005-00
Serial Communication
Table 27. Fixed I2C DC Specifications
Parameter
II2C1
Description
Min
–
Typ Max Units
Details/Conditions
50
155
390
1.4
Block current consumption at 100 kHz
Block current consumption at 400 kHz
Block current consumption at 1 Mbps
I2C enabled in Deep-Sleep mode
–
–
–
–
µA
µA
µA
µA
–
–
–
–
II2C2
II2C3
II2C4
–
–
–
Table 28. Fixed I2C AC Specifications
Parameter Description
FI2C1
Min
Typ Max Units
Details/Conditions
Bit rate
–
–
400
kHz
Table 29. Fixed UART DC Specifications
Parameter
IUART1
Description
Min
–
Typ
–
Max Units
Details/Conditions
Block current consumption at 100 kbps
Block current consumption at 1000 kbps
55
µA
µA
–
–
IUART2
–
–
312
Table 30. Fixed UART AC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
FUART
Bit rate
–
–
1
Mbps
–
Table 31. Fixed SPI DC Specifications
Parameter Description
ISPI1
ISPI2
ISPI3
Min
–
Typ
Max Units
Details/Conditions
Block current consumption at 1 Mbps
Block current consumption at 4 Mbps
Block current consumption at 8 Mbps
–
–
–
360
560
600
µA
µA
µA
–
–
–
–
–
Table 32. Fixed SPI AC Specifications
Parameter Description
FSPI SPI operating frequency (master; 6x over sampling)
Min
Typ
Max
Units
Details/Conditions
–
–
8
MHz
–
Table 33. Fixed SPI Master Mode AC Specifications
Parameter
TDMO
Description
Min
Typ
Max Units
Details/Conditions
MOSI valid after SCLK driving edge
–
–
18
ns
–
MISO valid before SCLK capturing edge Full clock,
late MISO sampling used
Full clock, late MISO
sampling
TDSI
20
0
–
–
–
ns
Referred to Slave capturing
edge
THMO
Previous MOSI data hold time
–
ns
Table 34. Fixed SPI Slave Mode AC Specifications
Parameter
TDMI
Description
Min Typ
Max
Units
Details/Conditions
MOSI valid before SCLK capturing edge
MISO valid after SCLK driving edge
40
–
–
–
–
ns
TDSO
42 + 3 × TCPU ns
MISO Valid after SCLK driving edge in
external clock mode. VDD < 3.0 V
TDSO_ext
–
–
50
ns
THSO
Previous MISO data hold time
0
–
–
–
–
ns
ns
TSSELSCK
SSEL valid to first SCK valid edge
100
Document Number: 002-00214 Rev. *G
Page 21 of 38
CYBLE-222005-00
Memory
Table 35. Flash DC Specifications
Parameter
VPE
Description
Min
1.71
2
Typ
–
Max
5.5
–
Units
Details/Conditions
–
Erase and program voltage
V
TWS48
TWS32
TWS16
Number of Wait states at 32–48 MHz
Number of Wait states at 16–32 MHz
Number of Wait states for 0–16 MHz
–
CPU execution from flash
CPU execution from flash
CPU execution from flash
1
–
–
0
–
–
Table 36. Flash AC Specifications
Parameter
Description
Min
Typ
–
Max
20
13
7
Units
Details/Conditions
[11]
TROWWRITE
Row (block) write time (erase and program)
Row erase time
–
–
ms Row (block) = 256 bytes
[11]
TROWERASE
–
ms
ms
–
–
–
–
–
–
–
[11]
TROWPROGRAM
Row program time after erase
Bulk erase time (256 KB)
–
–
[11]
TBULKERASE
–
–
35
25
–
ms
[11]
TDEVPROG
Total device program time
–
–
seconds
cycles
years
years
FEND
FRET
FRET2
Flash endurance
100 K
20
10
–
Flash retention. TA 55 °C, 100 K P/E cycles
Flash retention. TA 85 °C, 10 K P/E cycles
–
–
–
–
System Resources
Power-on-Reset (POR)
Table 37. POR DC Specifications
Parameter
Description
Min
0.80
0.75
15
Typ
–
Max
1.45
1.40
200
Units
V
Details/Conditions
VRISEIPOR
VFALLIPOR
VIPORHYST
Rising trip voltage
–
–
–
Falling trip voltage
Hysteresis
–
V
–
mV
Table 38. POR AC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
Precision power-on reset (PPOR) response
time in Active and Sleep modes
TPPOR_TR
–
–
1
µs
–
Table 39. Brown-Out Detect
Parameter
Description
Min
1.64
1.4
Typ
–
Max
–
Units
Details/Conditions
VFALLPPOR
VFALLDPSLP
BOD trip voltage in Active and Sleep modes
BOD trip voltage in Deep Sleep
V
V
–
–
–
–
Table 40. Hibernate Reset
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
VHBRTRIP
BOD trip voltage in Hibernate
1.1
–
–
V
–
Note
11. It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash operations will be interrupted and cannot be relied on to have
completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make
certain that these are not inadvertently activated.
Document Number: 002-00214 Rev. *G
Page 22 of 38
CYBLE-222005-00
Voltage Monitors (LVD)
Table 41. Voltage Monitor DC Specifications
Parameter
VLVI1
Description
Min
1.71
1.76
1.85
1.95
2.05
2.15
2.24
2.34
2.44
2.54
2.63
2.73
2.83
2.93
3.12
4.39
–
Typ
1.75
1.80
1.90
2.00
2.10
2.20
2.30
2.40
2.50
2.60
2.70
2.80
2.90
3.00
3.20
4.50
–
Max
1.79
1.85
1.95
2.05
2.15
2.26
2.36
2.46
2.56
2.67
2.77
2.87
2.97
3.08
3.28
4.61
100
Units
V
Details/Conditions
LVI_A/D_SEL[3:0] = 0000b
LVI_A/D_SEL[3:0] = 0001b
LVI_A/D_SEL[3:0] = 0010b
LVI_A/D_SEL[3:0] = 0011b
LVI_A/D_SEL[3:0] = 0100b
LVI_A/D_SEL[3:0] = 0101b
LVI_A/D_SEL[3:0] = 0110b
LVI_A/D_SEL[3:0] = 0111b
LVI_A/D_SEL[3:0] = 1000b
LVI_A/D_SEL[3:0] = 1001b
LVI_A/D_SEL[3:0] = 1010b
LVI_A/D_SEL[3:0] = 1011b
LVI_A/D_SEL[3:0] = 1100b
LVI_A/D_SEL[3:0] = 1101b
LVI_A/D_SEL[3:0] = 1110b
LVI_A/D_SEL[3:0] = 1111b
Block current
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
VLVI2
V
VLVI3
V
VLVI4
V
VLVI5
V
VLVI6
V
VLVI7
V
VLVI8
V
VLVI9
V
VLVI10
VLVI11
VLVI12
VLVI13
VLVI14
VLVI15
VLVI16
LVI_IDD
V
V
V
V
V
V
V
µA
Table 42. Voltage Monitor AC Specifications
Parameter
TMONTRIP
Description
Min
Typ
Max
Units
Details/Conditions
Voltage monitor trip time
–
–
1
µs
–
SWD Interface
Table 43. SWD Interface Specifications
Parameter
F_SWDCLK1
F_SWDCLK2
Description
3.3 V VDD 5.5 V
1.71 V VDD 3.3 V
Min
Typ
–
Max
Units
MHz
MHz
ns
Details/Conditions
–
14
SWDCLK 1/3 CPU clock frequency
–
–
7
SWDCLK 1/3 CPU clock frequency
T_SWDI_SETUP T = 1/f SWDCLK
T_SWDI_HOLD T = 1/f SWDCLK
0.25 × T
–
–
–
–
–
–
0.25 × T
–
–
0.5 × T
–
ns
T_SWDO_VALID T = 1/f SWDCLK
T_SWDO_HOLD T = 1/f SWDCLK
–
1
–
ns
–
ns
Document Number: 002-00214 Rev. *G
Page 23 of 38
CYBLE-222005-00
Internal Main Oscillator
Table 44. IMO DC Specifications
Parameter
IIMO1
Description
Min
–
Typ
–
Max
1000
325
225
180
150
Units
µA
Details/Conditions
IMO operating current at 48 MHz
IMO operating current at 24 MHz
IMO operating current at 12 MHz
IMO operating current at 6 MHz
IMO operating current at 3 MHz
–
–
–
–
–
IIMO2
IIMO3
IIMO4
IIMO5
–
–
µA
–
–
µA
–
–
µA
–
–
µA
Table 45. IMO AC Specifications
Parameter Description
FIMOTOL3
FIMOTOL3
Min
–
Typ
–
Max
±2
–
Units
%
Details/Conditions
Frequency variation from 3 to 48 MHz
IMO startup time
With API-called calibration
–
–
12
µs
Internal Low-Speed Oscillator
Table 46. ILO DC Specifications
Parameter
IILO2
Description
ILO operating current at 32 kHz
Min
Typ
Max
Units
Details/Conditions
–
0.3
1.05
µA
–
Table 47. ILO AC Specifications
Parameter Description
TSTARTILO1
FILOTRIM1
Min
–
Typ
–
Max
2
Units
ms
Details/Conditions
ILO startup time
–
–
32-kHz trimmed frequency
15
32
50
kHz
Table 48. Recommended ECO Trim Value
Parameter
Description
24-MHz trim value
(firmware configuration)
Value
Details/Conditions
Recommended trim value that needs to be loaded to register
CY_SYS_XTAL_BLERD_BB_XO_CAPTRIM_REG
ECOTRIM
0x0000A0A0
BLE Subsystem
Table 49. BLE Subsystem
Details/
Conditions
Parameter
Description
Min
Typ
Max
Units
RF Receiver Specification
RXS, IDLE
RX sensitivity with idle transmitter
–
–
–89
–91
–
–
dBm
dBm
RX sensitivity with idle transmitter
excluding Balun loss
Guaranteed by design
simulation
RXS, DIRTY
RX sensitivity with dirty transmitter
–
–87
–91
–70
–
dBm
dBm
RF-PHY Specification
(RCV-LE/CA/01/C)
RXS, HIGHGAIN
RX sensitivity in high-gain mode with idle
transmitter
–
PRXMAX
CI1
Maximum input power
–10
–
–1
9
–
dBm
dB
RF-PHY Specification
(RCV-LE/CA/06/C)
Cochannel interference,
Wanted signal at –67 dBm and Interferer
at FRX
21
RF-PHY Specification
(RCV-LE/CA/03/C)
Document Number: 002-00214 Rev. *G
Page 24 of 38
CYBLE-222005-00
Table 49. BLE Subsystem (continued)
Parameter Description
Details/
Conditions
Min
Typ
Max
Units
CI2
CI3
CI4
CI5
CI3
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±1 MHz
–
3
15
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±2 MHz
–
–
–29
–39
–20
–30
–27
–27
–27
–27
–
–
–
dB
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±3 MHz
RF-PHY Specification
(RCV-LE/CA/03/C)
Adjacent channel interference
Wanted Signal at –67 dBm and Interferer
–
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
at Image frequency (FIMAGE
)
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at Image frequency (FIMAGE ± 1 MHz)
–
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
OBB1
OBB2
OBB3
OBB4
IMD
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 30–2000 MHz
–30
–35
–35
–30
–50
–
–
dBm
dBm
dBm
dBm
dBm
dBm
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2003–2399 MHz
–
RF-PHY Specification
(RCV-LE/CA/04/C)
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2484–2997 MHz
–
RF-PHY Specification
(RCV-LE/CA/04/C)
Out-of-band blocking,
Wanted signal a –67 dBm and Interferer
at F = 3000–12750 MHz
–
RF-PHY Specification
(RCV-LE/CA/04/C)
Intermodulation performance
Wanted signal at –64 dBm and 1-Mbps
BLE, third, fourth, and fifth offset channel
–
RF-PHY Specification
(RCV-LE/CA/05/C)
RXSE1
RXSE2
Receiver spurious emission
30 MHz to 1.0 GHz
–
–57
–47
100-kHz measurement
bandwidth
ETSI EN300 328 V1.8.1
Receiver spurious emission
1.0 GHz to 12.75 GHz
–
–
1-MHz measurement
bandwidth
ETSI EN300 328 V1.8.1
RF Transmitter Specifications
TXP, ACC
RF power accuracy
–
–
–
–
±1
20
0
–
–
–
–
dB
dB
TXP, RANGE
TXP, 0dBm
TXP, MAX
RF power control range
Output power, 0-dB Gain setting (PA7)
dBm
dBm
Output power, maximum power setting
(PA10)
3
TXP, MIN
F2AVG
Output power, minimum power setting
(PA1)
–
–18
–
–
–
dBm
kHz
Average frequency deviation for
10101010 pattern
185
RF-PHY Specification
(TRM-LE/CA/05/C)
Document Number: 002-00214 Rev. *G
Page 25 of 38
CYBLE-222005-00
Table 49. BLE Subsystem (continued)
Parameter Description
F1AVG
Details/
Min
225
0.8
–150
–50
–20
–20
–
Typ
250
–
Max
275
–
Units
Conditions
Average frequency deviation for
11110000 pattern
kHz
RF-PHY Specification
(TRM-LE/CA/05/C)
EO
Eye opening = F2AVG/F1AVG
RF-PHY Specification
(TRM-LE/CA/05/C)
FTX, ACC
FTX, MAXDR
FTX, INITDR
FTX, DR
IBSE1
Frequency accuracy
–
150
50
kHz
kHz
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
Maximum frequency drift
Initial frequency drift
–
RF-PHY Specification
(TRM-LE/CA/06/C)
–
20
RF-PHY Specification
(TRM-LE/CA/06/C)
Maximum drift rate
–
20
kHz/
50 µs
RF-PHY Specification
(TRM-LE/CA/06/C)
In-band spurious emission at 2-MHz
offset
–
–20
-30
-55.5
-41.5
dBm
dBm
dBm
dBm
RF-PHY Specification
(TRM-LE/CA/03/C)
IBSE2
In-band spurious emission at 3-MHz
offset
–
–
RF-PHY Specification
(TRM-LE/CA/03/C)
TXSE1
Transmitter spurious emissions
(average), <1.0 GHz
–
–
FCC-15.247
TXSE2
Transmitter spurious emissions
(average), >1.0 GHz
–
–
FCC-15.247
RF Current Specifications
IRX
Receive current in normal mode
–
–
–
–
–
–
–
18.7
16.4
21.5
20
–
–
–
–
–
–
–
mA
mA
mA
mA
mA
mA
mA
IRX_RF
Radio receive current in normal mode
Receive current in high-gain mode
TX current at 3-dBm setting (PA10)
TX current at 0-dBm setting (PA7)
Radio TX current at 0 dBm setting (PA7)
Measured at VDDR
IRX, HIGHGAIN
ITX, 3dBm
ITX, 0dBm
ITX_RF, 0dBm
ITX_RF, 0dBm
16.5
15.6
14.2
Measured at VDDR
Radio TX current at 0 dBm excluding
Balun loss
Guaranteed by design
simulation
ITX,-3dBm
TX current at –3-dBm setting (PA4)
TX current at –6-dBm setting (PA3)
TX current at –12-dBm setting (PA2)
TX current at –18-dBm setting (PA1)
–
–
–
–
–
15.5
14.5
13.2
12.5
17.1
–
–
–
–
–
mA
mA
mA
mA
µA
ITX,-6dBm
ITX,-12dBm
ITX,-18dBm
Iavg_1sec, 0dBm
Average current at 1-second BLE
connection interval
TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU exchange
Iavg_4sec, 0dBm
Average current at 4-second BLE
connection interval
–
6.1
–
µA
TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU exchange
General RF Specifications
FREQ
RF operating frequency
2400
–
2482
MHz
Document Number: 002-00214 Rev. *G
Page 26 of 38
CYBLE-222005-00
Table 49. BLE Subsystem (continued)
Parameter Description
CHBW
Details/
Conditions
Min
Typ
Max
Units
Channel spacing
–
–
–
–
2
–
MHz
kbps
µs
DR
On-air data rate
1000
120
75
–
IDLE2TX
BLE.IDLE to BLE. TX transition time
BLE.IDLE to BLE. RX transition time
140
120
IDLE2RX
µs
RSSI Specifications
RSSI, ACC
RSSI, RES
RSSI, PER
RSSI accuracy
–
–
–
±5
1
–
–
–
dB
dB
µs
RSSI resolution
RSSI sample period
6
Document Number: 002-00214 Rev. *G
Page 27 of 38
CYBLE-222005-00
Environmental Specifications
Environmental Compliance
This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF)
directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
RF Certification
The CYBLE-222005-00 module is certified under the following RF certification standards:
■ FCC: WAP2005
■ CE
■ IC: 7922A-2005
■ MIC: 203-JN0495
■ KC: MSIP-CRM-Cyp-2005
Safety Certification
The CYBLE-222005-00 module complies with the following regulations:
■ Underwriters Laboratories, Inc. (UL) - Filing E331901
■ CSA
■ TUV
Environmental Conditions
Table 50 describes the operating and storage conditions for the Cypress BLE module.
Table 50. Environmental Conditions for CYBLE-222005-00
Description
Minimum Specification
Maximum Specification
85 °C
Operating temperature
-40 °C
5%
Operating humidity (relative, non-condensation)
Thermal ramp rate
85%
–
3 °C/minute
85 °C
Storage temperature
–40 °C
–
Storage temperature and humidity
85 ° C at 85%
ESD: Module integrated into system
Components[12]
15-kV Air
2.2-kV Contact
–
ESD and EMI Protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure
near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.
Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Note
12. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM.
Document Number: 002-00214 Rev. *G
Page 28 of 38
CYBLE-222005-00
Regulatory Information
FCC
FCC NOTICE:
The device CYBLE-222005-00, including the antenna 2450AT18B100 from Johanson Technology, complies with Part 15 of the FCC
Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must
accept any interference received, including interference that may cause undesired operation.
CAUTION:
The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by
Cypress Semiconductor may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,ê may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
■ Reorient or relocate the receiving antenna.
■ Increase the separation between the equipment and receiver.
■ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
■ Consult the dealer or an experienced radio/TV technician for help
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible
label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well
as the FCC Notice above. The FCC identifier is FCC ID: WAP2005.
In any case the end product must be labeled exterior with "Contains FCC ID: WAP2005"
ANTENNA WARNING:
This device is tested with a standard SMA connector and with the antennas listed below. When integrated in the OEMs product, these
fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the
following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions.
RF EXPOSURE:
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved
antenna in the previous.
The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennas
in Table 6 on page 12, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal
instructions about the integrated radio module is not allowed.
The radiated output power of CYBLE-222005-00 with the chip antenna mounted (FCC ID: WAP2005) is far below the FCC radio
frequency exposure limits. Nevertheless, use CYBLE-222005-00 in such a manner that minimizes the potential for human contact
during normal operation.
End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with
transmitter operating conditions for satisfying RF exposure compliance.
Document Number: 002-00214 Rev. *G
Page 29 of 38
CYBLE-222005-00
Industry Canada (IC) Certification
CYBLE-222005-00 is licensed to meet the regulatory requirements of Industry Canada (IC), License: IC: 7922A-2005
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure
compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from
www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Table 6 on page 12, having a maximum gain of 0.5 dBi. Antennas
not included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this device. The required antenna
impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
IC NOTICE:
The device CYBLE-222005-00 including the antenna 2450AT18B100 from Johanson technology, complies with Canada RSS-GEN
Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-GEN. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference
received, including interference that may cause undesired operation.
IC RADIATION EXPOSURE STATEMENT FOR CANADA
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1)
this device may not cause interference, and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter
tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible label
on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the IC
Notice above. The IC identifier is 7922A-2005. In any case, the end product must be labeled in its exterior with "Contains IC:
7922A-2005".
European R&TTE Declaration of Conformity
Hereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-222005-00 complies with the essential requirements and
other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the
Directive 1999/5/EC, the end-customer equipment should be labeled as follows:
All versions of the CYBLE-222005-00 in the specified reference design can be used in the following countries: Austria, Belgium,
Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxem-
bourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway.
Document Number: 002-00214 Rev. *G
Page 30 of 38
CYBLE-222005-00
MIC Japan
CYBLE-222005-00 is certified as a module with type certification number 203-JN0495. End products that integrate CYBLE-222005-00
do not need additional MIC Japan certification for the end product.
End product can display the certification label of the embedded module.
KC Korea
CYBLE-222005-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2005.
Document Number: 002-00214 Rev. *G
Page 31 of 38
CYBLE-222005-00
Packaging
Table 51. Solder Reflow Peak Temperature
Maximum Time at Peak
Module Part Number
Package
Maximum Peak Temperature
No. of Cycles
Temperature
CYBLE-222005-00
22-pad SMT
260 °C
30 seconds
2
Table 52. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number
Package
MSL
MSL 3
CYBLE-222005-00
22-pad SMT
The CYBLE-222005-00 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the CYBLE-222005-00.
Figure 10. CYBLE-222005-00 Tape Dimensions
Figure 11 details the orientation of the CYBLE-222005-00 in the tape as well as the direction for unreeling.
Figure 11. Component Orientation in Tape and Unreeling Direction
Document Number: 002-00214 Rev. *G
Page 32 of 38
CYBLE-222005-00
Figure 12 details reel dimensions used for the CYBLE-222005-00.
Figure 12. Reel Dimensions
The CYBLE-222005-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The
center-of-mass for the CYBLE-222005-00 is detailed in Figure 13.
Figure 13. CYBLE-222005-00 Center of Mass
Document Number: 002-00214 Rev. *G
Page 33 of 38
CYBLE-222005-00
Ordering Information
Table 53 lists the CYBLE-222005-00 part number and features. Table 54 lists the reel shipment quantities for the CYBLE-222005-00.
Table 53. Ordering Information
CPU
Speed
(MHz)
Flash
Size
(KB)
12-Bit
SAR
ADC
LCD
Drive
Part Number
CapSense
SCB TCPWM
I2S
Package
Packing
CYBLE-222005-00
48
256
Yes
2
4
1 Msps
Yes
Yes
22-SMT
Tape and
Reel
Table 54. Tape and Reel Package Quantity and Minimum Order Amount
Description
Minimum Reel Quantity Maximum Reel Quantity
Comments
Reel Quantity
500
500
500
500
–
Ships in 500 unit reel quantities.
Minimum Order Quantity (MOQ)
Order Increment (OI)
–
The CYBLE-222005-00 is offered in tape and reel packaging. The CYBLE-222005-00 ships with a maximum of 500 units/reel.
Part Numbering Convention
The part numbers are of the form CYBLE-ABCDEF-GH where the fields are defined as follows.
For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales
representative. To locate the nearest Cypress office, visit our website.
U.S. Cypress Headquarters Address
U.S. Cypress Headquarter Contact Info
Cypress website address
198 Champion Court, San Jose, CA 95134
(408) 943-2600
http://www.cypress.com
Document Number: 002-00214 Rev. *G
Page 34 of 38
CYBLE-222005-00
Acronyms
Acronym
Description
BLE
Bluetooth Low Energy
Bluetooth SIG
CE
Bluetooth Special Interest Group
European Conformity
CSA
EMI
Canadian Standards Association
electromagnetic interference
electrostatic discharge
ESD
FCC
GPIO
IC
Federal Communications Commission
general-purpose input/output
Industry Canada
IDE
integrated design environment
Korea Certification
KC
MIC
Ministry of Internal Affairs and Communications (Japan)
printed circuit board
PCB
RX
receive
QDID
SMT
qualification design ID
surface-mount technology; a method for producing electronic circuitry in which the components are placed
directly onto the surface of PCBs
TCPWM
TUV
timer, counter, pulse width modulator (PWM)
Germany: Technischer Überwachungs-Verein (Technical Inspection Association)
transmit
TX
Document Conventions
Units of Measure
Symbol
Unit of Measure
°C
degree Celsius
kilovolt
kV
mA
mm
mV
µA
milliamperes
millimeters
millivolt
microamperes
micrometers
megahertz
gigahertz
µm
MHz
GHz
V
volt
Document Number: 002-00214 Rev. *G
Page 35 of 38
CYBLE-222005-00
Document History Page
Document Title: CYBLE-222005-00 EZ-BLE™ PRoC™ Module
Document Number: 002-00214
Orig. of Submission
Revision
ECN
Description of Change
Change
Date
**
4953407
5060713
DSO
10/08/2015 Preliminary datasheet for CYBLE-222005-00 module.
*A
DSO
01/07/2016 Updated General Description to add reference and link to PRoC BLE silicon
datasheet and include Declaration ID number. .
Added More Information section to the datasheet.
Updated Figure 1, Figure 2, Figure 3, and Figure 4 to improve clarity and viewing.
Added Figure 5 in Recommended Host PCB Layout section to show solder pad
location from module origin.
Updated Table 3 and Figure 6 in Recommended Host PCB Layout section to
provide the location to the center of each solder pad from the origin (in mm and
mils).
Added BLE Subsystem section.
Added French translation for IC Radiation Exposure Statement For Canada in
Industry Canada (IC) Certification section on page 30 in accordance with IC
requirements.
Updated MIC Japan section on page 31 to specify final MIC certification number.
Updated KC Korea section on page 31 to specify final KC certification number.
Added Table 51 and Table 52 on page 32.
*B
*C
5146846
DSO
DSO
02/22/2016 Changed status from “Preliminary” to “Final”.
Update More Information section to add KBA210574 (Certification Test Reports)
to reference list.
Update General Description to include reference and link for QDID.
Updated orientation of module drawings in Figure 1 through Figure 9 and
Figure 13 to match orientation in PSoC Creator.
Updated Table 4 to add additional information with respect to the functional
capabilities for each solder pad.
5421877
09/01/2016 Updated More Information:
Added additional Knowledge Base Article references.
Updated Electrical Specification:
Updated System Resources:
Updated Internal Low-Speed Oscillator:
Updated Table 48 (Updated details in “Value” column corresponding to ECOTRIM
parameter).
Updated Ordering Information:
No change in part numbers.
Added Table 54 (To specify minimum and maximum reel quantities that ship for
orders of the CYBLE-222005-00 module).
Updated to new template.
Completing Sunset Review.
*D
5528433
DSO
11/23/2016 Updated More Information:
Added EZ-Serial™ BLE Firmware Platform section.
Updated Recommended Host PCB Layout:
Updated Figure 4, Figure 5, and Figure 6 captions to specify that these as “Seen
on Host PCB”.
Updated Power Supply Connections and Recommended External Components:
Updated Figure 7 and Figure 8 to specify that these are “Seen from Bottom”.
Updated Digital and Analog Capabilities and Connections:
Updated Table 4:
Updated TCPWM column to add TCPWM capability on Port 2 pins.
Added Footnote 3.
Updated Document History Page:
Remove “,” from Document Title.
Document Number: 002-00214 Rev. *G
Page 36 of 38
CYBLE-222005-00
Document History Page
Document Title: CYBLE-222005-00 EZ-BLE™ PRoC™ Module
Document Number: 002-00214
*E
5553544
DSO
12/14/2016 Updated Electrical Specification:
Updated SAR ADC:
Updated Table 17 to add Note 10 to specify under what conditions the maximum
number of ADC channels can be achieved.
*F
5709580
6002363
GNKK
DSO
04/24/2017 Updated the Cypress logo and copyright information.
12/22/2017 Updated reel dimensions in Figure 10 and Figure 12.
*G
Document Number: 002-00214 Rev. *G
Page 37 of 38
CYBLE-222005-00
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
®
Products
PSoC Solutions
Arm® Cortex® Microcontrollers
cypress.com/arm
cypress.com/automotive
cypress.com/clocks
cypress.com/interface
cypress.com/iot
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU
Automotive
Cypress Developer Community
Clocks & Buffers
Interface
Community | Projects | Video | Blogs | Training | Components
Technical Support
Internet of Things
Memory
cypress.com/support
cypress.com/memory
cypress.com/mcu
Microcontrollers
PSoC
cypress.com/psoc
Power Management ICs
Touch Sensing
USB Controllers
Wireless Connectivity
cypress.com/pmic
cypress.com/touch
cypress.com/usb
cypress.com/wireless
© Cypress Semiconductor Corporation, 2015-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. No computing
device can be absolutely secure. Therefore, despite security measures implemented in Cypress hardware or software products, Cypress does not assume any liability arising out of any security breach,
such as unauthorized access to or use of a Cypress product. In addition, the products described in these materials may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any
liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming
code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this
information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons
systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances
management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device
or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you
shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from
and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 002-00214 Rev. *G
Revised December 22, 2017
Page 38 of 38
相关型号:
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明