MB39C811QN [CYPRESS]
Ultra Low Power Buck PMIC Solar/Vibrations Energy Harvesting;
| 型号： | MB39C811QN |
| 厂家： | 
CYPRESS |
| 描述： | Ultra Low Power Buck PMIC Solar/Vibrations Energy Harvesting 集成电源管理电路 |
| 文件： | 总36页 (文件大小：2519K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ultra Low Power Buck PMIC
Solar/Vibrations Energy Harvesting
The MB39C811 is the high efficient buck (Power Management) DC/DC converter IC which adopts the all-wave bridge
rectifier using the low-dissipation and the comparator system. It achieves the energy harvest solution for the energy
source of the high output impedance such as the piezoelectric transducer.
It is possible to select from eight preset output voltages and supply up to 100 mA of the output current.
Features
Quiescent current (No load, Output in regulation):
Output current: Up to 100mA
Protection functions
1.5µA
Quiescent current (VIN = 2.5V UVLO): 550nA
Integrated Low Loss Full-Wave Bridge Rectifier
VIN input voltage range: 2.6V to 23V
Shunt for input protection: VIN ≥ 21V, Up to 100mA
Pull-down
Over current limit
Preset output voltage: 1.5V, 1.8V, 2.5V, 3.3V, 3.6V,
I/O power-good detection signal output
4.1V, 4.5V, 5.0V
Applications
Light energy harvesting
Wireless HVAC sensor
Piezoelectric energy harvesting
Electro-Mechanical energy harvesting
Stand-alone nano-power buck regulator
Online Design Simulation
Easy DesignSim
This product supports the web-based design simulation tool.
It can easily select external components and can display useful information.
Please access from the following URL.
http://cypress.transim.com/login.aspx
Cypress Semiconductor Corporation
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Document Number: 002-08401 Rev *A
Revised February 22, 2016
MB39C811
Contents
1.
2.
3.
4.
5.
6.
6.1
6.2
6.3
7.
7.1
7.2
7.3
8.
Pin Assignments................................................................................................................................................... 3
Pin Descriptions.................................................................................................................................................... 4
Block Diagram....................................................................................................................................................... 5
Absolute Maximum Ratings................................................................................................................................. 6
Recommended Operating Conditions................................................................................................................. 7
Electrical Characteristics ..................................................................................................................................... 8
DC Characteristics ............................................................................................................................................... 8
Characteristics of Built-in Bridge Rectification Circuit........................................................................................... 9
AC Characteristics (Input/Output Power-Good).................................................................................................... 9
Function............................................................................................................................................................... 10
Operational Summary ........................................................................................................................................ 10
Start-Up/Shut-Down Sequences ........................................................................................................................ 11
Function Descriptions......................................................................................................................................... 11
Typical Application Circuits............................................................................................................................... 13
Application Notes................................................................................................................................................ 15
9.
10. Typical Characteristics....................................................................................................................................... 19
11. Layout for Printed Circuit Board........................................................................................................................ 25
12. Usage Precaution................................................................................................................................................ 26
13. Ordering Information .......................................................................................................................................... 26
14. Marking ................................................................................................................................................................ 26
15. Product Labels.................................................................................................................................................... 27
16. Recommended Mounting Conditions................................................................................................................ 30
17. PackageDimensions ........................................................................................................................................... 32
18. Major Changes .................................................................................................................................................... 33
Document History........................................................................................................................................................ 35
Document Number: 002-08401 Rev *A
Page 2 of 36
MB39C811
1.
Pin Assignments
Figure 1. Pin Assignments
(TOP VIEW)
40
39
38
37
36
35
34
33
32
31
１
30
29
28
27
26
25
24
23
22
21
N.C.
GND
VB
2
N.C.
3
N.C.
VOUT
IPGOOD
OPGOOD
GND
4
N.C.
5
VIN
6
LX
7
PGND
S0
8
N.C.
S1
9
S2
GND
10
N.C.
GND
11
12
13
14
15
16
17
18
19
20
(QFN_40PIN)
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MB39C811
2.
Pin Descriptions
Table 1. Pin Descriptions.
Pin
Name
Pin No.
I/O
Description
1 to 4
5
N.C.
-
-
Non connection pins (Leavethese pins open)
DC power supply input pin
DC/DC output pin
VIN
LX
6
O
-
7
PGND
N.C.
PGND pin
8
-
Non connection pin (Leavethis pin open)
GND pin
9
GND
-
10,11
12
N.C.
-
Non connection pins (Leavethese pins open)
Bridge Rectifier1 AC input pin 1
Bridge Rectifier1 DC output pin
Bridge Rectifier1 AC input pin 2
GND pin
AC1_1
DCOUT1
AC1_2
DCGND1
DCGND2
AC2_2
DCOUT2
AC2_1
N.C.
I
13
O
I
14
15
-
16
-
GND pin
17
I
Bridge Rectifier2 AC input pin 2
Bridge Rectifier2 DC output pin
Bridge Rectifier2 AC input pin 1
Non connection pin (Leavethis pin open)
GND pin
18
O
I
19
20
-
21
GND
-
22
S2
I
Output voltage select pin 2
Output voltage select pin 1
Output voltage select pin 0
GND pin
23
S1
I
24
S0
I
25
GND
-
26
OPGOOD
IPGOOD
VOUT
VB
O
O
I
Output power-good output pin
Input power-good output pin
Output voltage feedback pin
Internal circuit power supply pin
GND pin
27
28
29
O
-
30
GND
31 to 40
N.C.
-
Non connection pins (Leavethese pins open)
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MB39C811
3.
Block Diagram
Figure 2. Block Diagram
C1
CVIN
AC1_1
SHUNT
DCGND1
AC1_2
AC2_1
L1
LX
VOUT
CONTROL
C2
CVOUT
DCGND2
AC2_2
PGND
VOUT
ERR
CMP
3
S2,S1,S0
VOUT
CTL
VIN
BGR
IPGOOD
UVLO
VB
OPGOOD
VB REG.
C3
PGOOD
CVB
UVLO_VB
Document Number: 002-08401 Rev *A
Page 5 of 36
MB39C811
4.
Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings
Rating
Parameter
Symbol
VVINMAX
Condition
VIN pin
Unit
Min
Max
+24
VIN pin input voltage
VIN pin input slew rate
VIN pin input current
-0.3
V
SRMAX
IINMAX
VIN pin (VIN≥7V)
VIN pin
-
-
0.25
100
V/ms
mA
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
LX pin
AC pin input voltage
VACMAX
-0.3
+24
50
V
AC pin input current
LX pin input voltage
IPVMAX
VLXMAX
-
mA
V
-0.3
-0.3
+24
VVB + 0.3
(≤+7.0)
+7.0
S0 pin, S1 pin, S2 pin
V
Input voltage
VVINPUTMAX
VOUT pin
Ta≤ +25°C
-
-0.3
-
V
Power dissipation
PD
2500
mW
°C
Storage temperature
TSTG
VESDH
-55
+125
Human Body Model
(100pF, 5kΩ)
ESD voltage 1
-900
+2000
V
VESDM
VCDM
Machine Model (200pF,
0Ω)
ESD voltage 2
ESD voltage3
-150
+150
V
V
Charged Device Model
-1000
+1000
Figure 3. Power Dissipation - Operating Ambient Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
100
Temperature [℃]
WARNING:
−
Semiconductor devices may be permanently damaged by application of stress (including, without limitation,
voltage, current or temperature) in excess of absolute maximum ratings.Do not exceed any of these ratings.
Document Number: 002-08401 Rev *A
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MB39C811
5.
Recommended Operating Conditions
Table 3. Recommended operating conditions
Value
Typ
Parameter
Symbol
Condition
VIN pin
Unit
Min
2.6
Max
23
VIN pin input voltage
VVIN
-
V
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
S0 pin, S1 pin, S2 pin
VOUT pin
AC pin input voltage
VPV
-
-
23
V
VSI
VFB
Ta
0
-
-
-
VVB
5.5
V
Input voltage
0
V
Operating ambient temperature
-
-40
+85
°C
WARNING:
−
The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is operated
under these conditions.
−
−
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device and could
result in device failure.
−
No warranty is made with respect to any use, operating conditions or combinations not represented on this data
sheet. If you are considering application under any conditions other than listed herein, please contact sales
representatives beforehand.
Document Number: 002-08401 Rev *A
Page 7 of 36
MB39C811
6.
Electrical Characteristics
6.1
DC Characteristics
Table 4. DC Characteristics
(Ta = -40°C to +85°C, VVIN = 7.0V, L1 = 22µH, C2 = 47µF)
Value
Typ
550
1.5
Parameter
Symbol
Condition
Unit
Min
-
Max
VVIN = 2.5V (UVLO), Ta = +25°C
VVIN = 4.5V (sleep mode), Ta = +25°C
VVIN = 18V (sleep mode), Ta =+25°C
S2 = L, S1 = L, S0 = L, IOUT = 1mA
S2 = L, S1 = L, S0 = H, IOUT = 1mA
S2 = L, S1 = H, S0 = L, IOUT = 1mA
S2 = L, S1 = H, S0 = H, IOUT = 1mA
S2 = H, S1 = L, S0 = L, IOUT = 1mA
S2 = H, S1 = L, S0 = H, IOUT = 1mA
S2 = H, S1 = H, S0 = L, IOUT = 1mA
S2 = H, S1 = H, S0 = H, IOUT = 1mA
-
775
nA
µA
µA
V
Quiescent current
IVIN
-
2.25
-
1.9
2.85
1.457
1.748
2.428
3.214
3.506
3.993
4.383
4.870
200
1.5
1.544
1.852
2.573
3.386
3.694
4.207
4.617
5.130
400
1.8
V
2.5
V
3.3
V
Preset output voltage
VVOUT
3.6
V
4.1
V
4.5
V
5.0
V
Peak switching current
Maximum Output
current
IPEAK
250
mA
Ta = +25°C
IOUTMAX
100*
-
-
mA
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
S2 = L, S1 = H, S0 = L
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
S2 = L, S1 = H, S0 = L
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
IVIN = 1mA
3.8
4.0
5.2
7.2
4.2
V
UVLO release voltage
(Input power-good
detectionvoltage)
VUVLOH
4.94
6.84
5.46
7.56
V
V
2.6
3.8
5.7
2.8
4.0
6.0
3.0
4.2
6.3
V
V
V
UVLO detection
voltage
VUVLOL
(Input power-good
resetvoltage)
VIN pin shunt voltage
VIN pin shunt current
Output power-good
detectionvoltage
(Rising)
VSHUNT
ISHUNT
19
21
-
23
-
V
-
100
mA
To preset voltage ratio
VVOUT≥3.3V[2]
VOPGH
VOPGL
VVB
90
65.5
-
94
70
98
74.5
-
%
%
V
Output power-good
resetvoltage (Falling)
Power supply output
voltage forinternal
circuit
To preset voltage ratio
VVIN = 6V to 20V
5.0[1]
[1]: This parameter is not be specified. This should be used as a reference to support designing the circuits.
Document Number: 002-08401 Rev *A
Page 8 of 36
MB39C811
[2]: Please contact the department in charge if use this output power-good function under the conditions of
VVOUT≤2.5V.
6.2
Characteristics of Built-in Bridge Rectification Circuit
Table 5. Characteristics of Built-in Bridge Rectification Circuit
(Ta = +25°C)
Value
Parameter
Symbol
Condition
IF = 10µA
Unit
mV
Min
150
Typ
Max
450
Forward bias voltage
Forward direction current
Reverse bias leak current
Break down voltage
VF
IF
280
-
-
-
50
20
-
mA
nA
V
IR
VR = 18V
IR = 1µA
-
-
VBREAK
VSHUNT
25
6.3
AC Characteristics (Input/Output Power-Good)
Table 6. AC Characteristics
(Ta = +25°C, VOUT = 3.3V)
Value
Typ
Parameter
Symbol
Condition
Unit
Min
Max
Input power-good detection delay time
(Rising)
tIPGH
SRVIN = 0.1V/ms
SRVIN = 0.1V/ms
-
1
-
ms
Input power-good reset delay time (Falling)
Input power-good undefined time
tIPGL
tIPGX
-
-
1
1
-
ms
ms
OPGOOD rising
IOUT = 0mA,
L1 = 22μH,
3
Output power-good detection delay time
(Rising)
tOPGH
tOPGL
-
-
1
1
-
-
ms
ms
C2 = 47μF,
IOUT = 1mA,
Output power-good reset delay time (Falling)
C2 = 47μF
Figure 4. AC characteristics
VUVLOH
VUVLOL
VIN
VOPGH
VOPGL
VOUT
tIPGH
IPGOOD
tIPGL
tIPGX
OPGOOD
tOPGH
tOPGL
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MB39C811
7.
Function
7.1
Operational Summary
Bridge Rectifier
The A/C voltage which is input to the AC1_1 and AC1_2 pins or the AC2_1 and AC2_2 pins is all-wave rectified at the
bridge rectifier of the low-dissipation diode. The bridge rectifier output is output from the DCOUT1 pin and the
DCOUT2 pin. By connecting those outputs to the VIN pin, the electric charge is accumulated to the capacitor and it is
used as the energy condenser of the buck converter.
Power Supply for Internal Circuit
When the VIN pin voltage is 3.5V or lower, the power supply is supplied from the VIN pin to the internal circuit directly.
If the VIN pin is over 3.5V, the internal regulator is activated and the power supply is supplied from the internal
regulator to the internal circuit. Therefore, the stable output voltage is maintained in the wide input voltage range 2.6 V
to 23V.
DC/DC Start-Up/Shut-Down
When the VIN pin voltage is over the release voltage VUVLOH for the under voltage lockout protection circuit (UVLO),
the converter circuit is enabled and the electric charge is supplied from the input capacitor to the output capacitor.
When the VIN pin voltage is below the UVLO detection voltage VUVLOL, the converter is disabled. The 12V hysteresis
between the release voltage and the detection voltage for UVLO prevents the converter from noise or frequent
ON/OFF which is caused by the VIN pin voltage-drop during start-up.
Sleep/Auto Active Control
When the feedback voltage VFB for the converter reaches the determinate voltage, the sleep state to stop the
switching operation starts and that can reduce the consumption power from the internal circuit. When the VOUT voltage
is below the threshold value, the VOUT voltage is maintained to the rated value by making the converter active again.
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Page 10 of 36
MB39C811
7.2
Start-Up/Shut-Down Sequences
Figure 5. Timing Chart
AC1_1,
AC1_2
or
AC2_1,
AC2_2
VSHUNT
Charge
Voltage
VVB
VIN
VUVLOH
VUVLOL
VVB
Internal
Regulator
Start-up
VB
UVLO
Rising
UVLO
Falling
UVLO
(internal signal)
UVLO
Falling
DC/DC
Enable
LX
active
Transfer Charge
to the Output
VOPGH
VOPGL
sleep
VOUT
Output
IPGOOD
Rest
IPGOOD
IPGOOD
OPGOOD
Output
OPGOOD
Reset
OPGOOD
7.3
Function Descriptions
Output Voltage Setting and Under Voltage Lockout Protection (UVLO) Function
It is possible to select the output voltage from eight kinds of presets using the S2, S1 and S0 pins.
Also, the under voltage lockout protection circuit is provided to prevent IC's malfunction by the transient state or the
instant drop during the VIN pin voltage activation, system destroy and deterioration, and it is set as follows according
to the preset voltage. When the VIN pin exceeds the release voltage for the UVLO circuit, the system is recovered.
Table 7. Output Voltage Setting and Under Voltage Lockout Protection (UVLO) Function
Under voltage lockout protection (UVLO) -Typ-
S2
S1
S0
VOUT[V]
Detection voltage
Release voltage
(Falling) VUVLOL [V]
(Rising) VUVLOH [V]
L
L
L
L
L
H
L
1.5
1.8
2.5
3.3
3.6
4.1
4.5
5.0
2.8
4.0
6.0
4.0
5.2
7.2
L
H
H
L
L
H
L
H
H
H
H
L
H
L
H
H
H
Document Number: 002-08401 Rev *A
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MB39C811
Input/output power-good signal output
When the VIN pin input voltage is equal to the release voltage VUVLOH for UVLO or more, the output for the
IPGOOD pin is set to the “H” level as the input power-good. When the VIN pin input voltage is equal to the detection
voltage VUVLOL for UVLO or less, the output for the IPGOOD pin is reset to the “L” level. The IPGOOD output is
enabled only when the following output power-good signal output OPGOOD is “H” level.
The output power-good signal OPGOOD is set to the “H” level when the feedback voltage VFB for the VOUT pin is
equal to the detection voltage VOPGH or more. When the feedback voltage VFB is equal to the reset voltage VOPGL
or less, the output for the OPGOOD pin is reset to the “L” level.
Table 8. Input Power-Good Signal Output (IPGOOD)
OPGOOD
UVLO
IPGOOD
L
Don’t care
L
H
H
L
L
H
H
Table 9. Output Power-Good Signal Output (OPGOOD)
VFB
OPGOOD
≤ VOPGL
L
≥ VOPGH
(VVOUT ≥ 3.3V) [1]
H
[1]:Please contact the department in charge if use this output power-good function under the conditions of
VVOUT≤2.5V.
Figure 6. Input/Output Power-Good Signal Output
Logic
High
Logic
Low
VOPGL
VOPGH
VOUT
Input Over Voltage Protection
If the voltage exceeding VSHUNT (Typ : 21V) is input to the VIN pin, the input level is clamped enabling the over
voltage protection circuit. The flowing current is ISHUNT (Min 100mA) during clamp.
Over Current Protection
If the output current for the LX pin reaches the over current detection level IPEAK, the circuit is protected by
controlling the peak value for the inductor current setting the main side FET to the OFF state.
Document Number: 002-08401 Rev *A
Page 12 of 36
MB39C811
8.
Typical Application Circuits
Figure 7. Application Circuit For Photovoltaic Energy Harvester
PV
AC1_1
DCGND1
DCOUT1
VIN
AC1_2
VB
C3
C1
4.7uF
10uF
L1
22uH
VOUT
LX
VOUT
C2
47uF
S2
S1
S0
IPGOOD
OPGOOD
Output voltage
select
GND
PGND
Figure 8. Application circuit for vibration energy harvester
AC2_1
DCGND2
DCOUT2
VIN
PZ1
AC2_2
VB
C3
4.7uF
C1
10uF
L1
22uH
VOUT
LX
VOUT
C2
47uF
S2
S1
S0
IPGOOD
OPGOOD
Output voltage
select
GND
PGND
Document Number: 002-08401 Rev *A
Page 13 of 36
MB39C811
Figure 9. Voltage doubler rectification circuit for vibration harvester
C4
10uF
PZ1
AC1_1
D
2
D
D
1
C5
D
DCGND1
DCOUT1
VIN
10uF
AC1_2
VB
C3
4.7uF
L1
22uH
VOUT
LX
VOUT
C2
47uF
S2
S1
S0
IPGOOD
OPGOOD
Output voltage
select
GND
PGND
Operation of the double voltage rectifier circuit rectifying an AC input voltage
When the AC1_1 input voltage is positive, the capacitor C4 charges up through the diode DD1, and when the AC1_1
input voltage is negative, the capacitor C5 charges up through the diode DD2. Each capacitor takes on a charge of
the positive peak of the AC input. The output voltage at the VIN pin is the series total of C4+C5.
Table 10. Parts list
Part number
Value
10μF[1]
Description
C1
Capacitor
C2
C3
C4
C5
L1
47μF[1]
Capacitor
Capacitor
Capacitor
Capacitor
Inductor
4.7μF
10μF[1]
10μF[1]
10μH to 22μH
[1]: Adjust the values according to the source supply ability and the load power.
Document Number: 002-08401 Rev *A
Page 14 of 36
MB39C811
9.
Application Notes
Inductor
The MB39C811 is optimized to work with an inductor in the range of 10µH to 22µH. Also, since the peak switching
current is up to 400mA, select an inductor with a DC current rating greater than 400mA.
Table 11. Manufactures of Recommended Inductors
Part number
Value
Manufacture
LPS5030-223ML
22μH
Coilcraft, Inc.
VLF403215MT-220M
22μH
TDK Corporation
Harvester (Photovoltaic Power Generator)
In case of photovoltaic energy harvesting, such as solar or light energy harvesting, use a solar cell with high
open-circuit voltage which must be higher than the UVLO release voltage. Electric power obtained from light or solar
is increased in proportion to the ambient illuminance.
There are silicone-based solar cells and organic-based solar cells about photovoltaic power
generators.Silicone-based solar cells are single crystal silicon solar cell, polycrystalline silicon solar cell, and
amorphous silicon solar cell. Organic-based solar cells are dye-sensitized solar cell (DSC), and organic thin film solar
cell. Crystal silicon and polycrystalline silicon solar cells have high energy conversion efficiency. Amorphous silicon
solar cells are lightweight, flexible, and produced at low cost. Dye-sensitized solar cells are composed by sensitizing
dye and electrolytes, and are low-cost solar cell. Organic thin film solar cells are lightweight, flexible, and easily
manufactured.
Table 12. Manufactures Of Photovoltaic Harvesters
Part number/Series name
BCS4630B9
Amorton
Type
Manufacture
TDK Corporation
Panasonic Corporation
Film amorphous silicon solar cells
Amorphous silicon solar cells
Harvester (Vibration Power Generator,Piezoelectric Generator)
Vibration power generators produce AC power by vibration. For AC to DC rectification, the MB39C811 integrates two
bridge rectifiers. Electric power obtained from a vibration power generator depends on frequency of vibration and
usage of the generator. Although, vibration generators produce high voltage, the shunt circuit protects from higher
voltage than 21V.
There are electromagnetic induction generators and piezoelectric generators about vibration harvesters. The
electromagnetic induction generator is consists of coil and magnet. The piezoelectric generators are made from
plastics or ceramics. Plastic-based piezoelectric generators made from polyvinylidene fluoride are lightweight, flexible.
Ceramic-based piezoelectric generators are made from barium titanate or leas zirconate titanate ceramics.
Table 13. Manufactures of Vibration Harvesters
Part number
EH12, EH13, EH15
Type
Manufacture
Electromagnetic induction
Star Micronics Co., Ltd.
Document Number: 002-08401 Rev *A
Page 15 of 36
MB39C811
Sizing of Input and Output Capacitors
Energy from harvester should be stored on the Cin and Cout to operate the application block. If the size of these
capacitors were too big, it would take too much time to charge energy into these capacitors, and the system cannot be
operated frequently. On the other hand, if these capacitors were too small, enough energy cannot be stored on these
capacitors for the application block. The sizing of the Cin and Cout is important.
Common capacitors are layered ceramic capacitor, electrolytic capacitor, electric double layered capacitor, and so on.
Electrostatic capacitance of layered ceramic capacitors is relatively small. However, layered ceramic capacitors are
small and have high voltage resistance characteristic. Electrolytic capacitors have high electrostatic capacitance from
µF order to mF order. The size of capacitor becomes large in proportion to the size of capacitance. Electric double
layered capacitors have high electrostatic capacitance around 0.5F to 1F, but have low voltage resistance
characteristics around 3V to 5V. Be very careful with a voltage resistance characteristic. Also, leak current, equivalent
series resistance (ESR), and temperature characteristic are criteria for selecting,
Table 14. Manufactures Of Capacitors
Part number/Series name
Type, Capacitance
EDLC, 500mF
Manufacture
EDLC351420-501-2F-50
EDLC082520-500-1F-81
EDLC041720-050-2F-52
Gold capacitor
EDLC, 50mF
EDLC, 5mF
EDLC
TDK Corporation
Panasonic Corporation
First of all, apply the following equation and calculate energy consumption for an application from voltage, current, and
time during an operation.
The energy stored on a capacitor is calculated by the following equation.
Since the energy in a capacitor is proportional to the square of the voltage, it is energetically advantageous for the
buck DC/DC converter to make the Cin larger.
An example of an application using the power gating by the OPGOOD signal is shown in the Figure 10. The Cin and
the Cout are sized so as to satisfy the following equation. The η, the efficiency of the MB39C811, is determined from
the current of application and the graph shown in Figure 12, Efficiency vs IOUT.
dECin and dECout are the available energies for the application.
Document Number: 002-08401 Rev *A
Page 16 of 36
MB39C811
Figure 10. Application example using the power gating by the OPGOOD signal
OPGOOD
VIN
Cin
VOUT
Power
Gating
Appli.
Cout
MB39C811
Harvester
VUVLOH
VUVLOL
VVOUT
VOPGL
0V
0V
Efficiency(η)
Available Energy
+
Total Energy
VUVLOH : UVLO release voltage
VUVLOL : UVLO detection voltage
VVOUT : Preset output voltage
VUVLOL : Output power-good reset voltage
Before calculating the initial charging time (TInitial[s]), calculate the total energy (ECin and ECout) stored on both Cin and
Cout.
A PHarvester[W] is a power generation capability of a harvester. An initial charging time (TInitial[s]) is calculated by the
following equation.
A repeat charging time (TRepeat[s]) is calculated by the following equation. The TRepeat[s] become shorter than the
TInitial[s].
Additionally, waiting for a period of time after the OPGOOD signal goes high can store more energy on the capacitor
Cin Figure 11.
Document Number: 002-08401 Rev *A
Page 17 of 36
MB39C811
Figure 11. Waiting for a Period of Time after the OPGOOD Signal goes High
OPGOOD
Light
VIN
Cin
VOUT
Power
Gating
Open circuit
voltage of
solar cell
Appli.
Wait after
OPGOOD
was High.
Solar
Cell
Cout
MB39C811
VUVLOL
0V
VVOUT
VOPGL
0V
Available Energy
+
Total Energy
VVOUT : Preset output voltage
VUVLOL : Output power-good reset voltage
VUVLOL : UVLO detection voltage
For more information about the energy calculation, refer to the APPLICATION NOTE, Energy Calculation For
Energy Harvesting.
Document Number: 002-08401 Rev *A
Page 18 of 36
MB39C811
10.
Typical Characteristics
Figure 12. Typical characteristics of DC/DC Converter
Line Regulation: VOUT vs VIN
Line Regulation: VOUT vs VIN
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 22µH
IOUT = 100mA, L = 22µH
IOUT = 100mA, L = 22µH
3.34
3.32
3.30
3.28
5.02
5.00
4.98
4.96
1.54
1.52
1.50
1.48
Preset output voltage = 3.3V
Preset output voltage = 5.0V
Preset output voltage = 1.5V
1.46
1.44
3.26
3.24
4.94
4.92
6
8
10
12
14
16
18
6
8
10
12
14
16
18
6
8
10
12
14
16
18
VIN [V]
VIN [V]
VIN [V]
Load Regulation: VOUT vs IOUT
Load Regulation: VOUT vs IOUT
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 22µH
VIN = 7.0V, L = 22µH
VIN = 7.0V, L = 22µH
1.54
1.52
1.50
1.48
3.34
3.32
3.30
3.28
5.02
5.00
4.98
4.96
Preset output voltage = 1.5V
Preset output voltage = 3.3V
Preset output voltage = 5.0V
1.46
1.44
3.26
3.24
4.94
4.92
10µ
100µ
1m
10m
100m
10µ
100µ
1m
10m
100m
10µ
100µ
1m
10m
100m
IOUT [A]
IOUT [A]
IOUT [A]
Efficiency vs IOUT
Efficiency in VOUT=3.3V vs VIN
VIN = 7.0V, L = 22µH
Efficiency in IOUT=100mA vs VIN
100
90
80
70
60
50
40
30
20
L = 22µH
IOUT = 100mA, L = 22µH
100
Preset output voltage = 5.0V
100
90
80
70
60
50
40
30
20
Preset output voltage = 3.3V
IOUT = 100mA
Preset output voltage = 5.0V
90
80
70
60
50
40
30
20
IOUT = 30mA
IOUT = 1mA
IOUT = 100µA
Preset output voltage = 3.3V
Preset output voltage = 1.5V
Preset output voltage = 3.3V
Preset output voltage = 1.5V
IOUT = 10µA
10
0
10
0
10
0
IOUT = 1µA
1µ
10µ
100µ
1m
10m 100m
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
IOUT [A]
VIN [V]
VIN [V]
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Page 19 of 36
MB39C811
Line Regulation: VOUT vs VIN
Line Regulation: VOUT vs VIN
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 10µH
IOUT = 100mA, L = 10µH
IOUT = 100mA, L = 10µH
1.54
1.52
1.50
1.48
3.38
3.36
3.34
3.32
5.02
5.00
4.98
4.96
Preset output voltage = 1.5V
Preset output voltage = 3.3V
Preset output voltage = 5.0V
1.46
1.44
3.30
3.28
4.94
4.92
6
8
10
12
14
16
18
6
8
10
12
14
16
18
6
8
10
12
14
16
18
VIN [V]
VIN [V]
VIN [V]
Load Regulation: VOUT vs IOUT
Load Regulation: VOUT vs IOUT
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 10µH
VIN = 7.0V, L = 10µH
5.02
5.00
4.98
4.96
VIN = 7.0V, L = 10µH
3.34
3.32
3.30
3.28
1.54
1.52
1.50
1.48
Preset output voltage = 5.0V
Preset output voltage = 3.3V
Preset output voltage = 1.5V
4.94
4.92
3.26
3.24
1.46
1.44
10µ
100µ
1m
10m
100m
10µ
100µ
1m
10m
100m
10µ
100µ
1m
10m
100m
IOUT [A]
IOUT [A]
IOUT [A]
Efficiency vs IOUT
Efficiency in VOUT=3.3V vs VIN
VIN = 7.0V, L = 10µH
Efficiency in IOUT=100mA vs VIN
L = 10µH
100
90
80
70
60
50
40
30
20
IOUT = 100mA, L = 10µH
100
90
80
70
60
50
40
30
20
Preset output voltage = 5.0V
100
90
80
70
60
50
40
30
20
Preset output voltage = 3.3V
IOUT = 100mA
Preset output voltage = 5.0V
IOUT = 30mA
IOUT = 1mA
IOUT = 100µA
Preset output voltage = 3.3V
Preset output voltage = 1.5V
Preset output voltage = 3.3V
Preset output voltage = 1.5V
IOUT = 10µA
10
0
10
0
10
0
IOUT = 1µA
1µ
10µ
100µ
1m
10m 100m
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
IOUT [A]
VIN [V]
VIN [V]
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Page 20 of 36
MB39C811
IVIN in Start-up vs VIN
IVIN in Sleep mode vs Temp.
IVIN in Sleep mode vs VIN
IOUT = 0A, L = 22µH
IOUT = 0A, L = 22µH
3.0
2.5
2.0
1.5
1.0
IOUT = 0A, L = 22µH
3.0
2.5
2.0
1.5
1.0
3.0
2.5
2.0
1.5
1.0
Preset output voltage = 3.3V
Preset output voltage = 1.5V
Preset output voltage = 3.3V
VIN=18V (Sleep mode)
VUVLOH
85oC
25oC
－40oC
VIN=4.5V (Sleep mode)
VIN=2.5V
85oC
0.5
0.0
25oC
0.5
0.0
0.5
0.0
－40oC
0
1
2
3
4
5
6
-40
-20
0
20
40
60
80 90
0
2
4
6
8
10 12 14 16 18
VIN [V]
Temp. [oC]
VIN [V]
VUVLOH vs Temp.
VUVLOL vs Temp.
VIN = 7.0V, L = 22µH
8
7
6
5
4
3
VIN = 7.0V, L = 22µH
VSHUNT vs Temp.
8
7
6
5
4
IVIN = 1mA, IOUT = 0A, L = 22µH
24
23
22
21
Preset output voltage = 1.5V
Preset output voltage = 5.0V
Preset output voltage = 5.0V
Preset output voltage = 3.3V
Preset output voltage = 1.5V
Preset output voltage = 3.3V
Preset output voltage = 1.5V
20
19
3
2
2
-40
-20
0
20
40
60
80 90
-40
-20
0
20
40
60
80 90
-40
-20
0
20
40
60
80 90
Temp. [oC]
Temp. [oC]
Temp. [oC]
IPEAK vs Temp.
On-Resistance of PMOS/NMOS
2.6 vs Temp.
VIN = 7.0V, L = 22µH
290
280
270
260
250
Preset output voltage = 1.5V
2.4
2.2
2.0
NMOS
1.8
Preset output voltage = 3.3V
Preset output voltage = 5.0V
1.6
PMOS
1.4
240
230
1.2
-40
-40
-20
0
20
40
60
80 90
-20
0
20
40
60
80 85
Temp. [oC]
Temp. [oC]
Document Number: 002-08401 Rev *A
Page 21 of 36
MB39C811
Figure 13. Typical Characteristics of Bridge Rectifier
Bridge Rectifier
Diode in Bridge Rectifier
1 IF vs VF
Diode in Bridge Rectifier
1m IR vs VR
Frequency Characteristics
0.5
0.4
0.3
0.2
In applying 1.64Vp-p to AC1_1/AC1_2
100m
100µ
85oC
10m
1m
-40oC
25oC
10µ
1µ
100µ
10µ
1µ
85oC
25oC
85oC
100n
10n
1n
25oC
-40oC
100n
10n
1n
-40oC
0.1
0.0
100p
10p
100p
10p
10
100
1k
10k 100k 1M 10M 100M
Freq. [Hz]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
10
20
30
40
50
60
70
Forward Voltage: VF [V]
Reverse Voltage: VR [V]
Figure 14. DC/DC Converter Sudden Load Change
Load Change Waveforms
VIN = 5.0V, L = 22µH, IOUT = 5mA and 65mA
Preset output voltage = 3.3V
VOUT
20mV/DIV
17.2mV
IOUT
50mA/DIV
200µs/DIV
Document Number: 002-08401 Rev *A
Page 22 of 36
MB39C811
Figure 15. Switching Waveforms of DC/DC Converter
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 1mA
VIN = 7.0V, L = 22µH, IOUT = 1mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
100µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 30mA
VIN = 7.0V, L = 22µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
5µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 100mA
VIN = 7.0V, L = 22µH, IOUT = 100mA
Presetoutput voltage = 3.3V
Preset output voltage = 3.3V
VOUT
50mV/DIV
VOUT
50mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
5µs/DIV
10µs/DIV
Document Number: 002-08401 Rev *A
Page 23 of 36
MB39C811
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 1mA
VIN = 7.0V, L = 10µH, IOUT = 1mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
100µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 30mA
VIN = 7.0V, L = 10µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
5µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 30mA
VIN = 7.0V, L = 10µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
50mV/DIV
VOUT
50mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
5µs/DIV
10µs/DIV
Document Number: 002-08401 Rev *A
Page 24 of 36
MB39C811
11.
Layout for Printed Circuit Board
Note the points listed below in layout design
Place the switching parts[1] on top layer, and avoid connecting each other through through-holes.
Make the through-holes connecting the ground plane close to the GND pins of the switching parts[1]
Be very careful about the current loop consisting of the input capacitor CVIN, the VIN pin of IC, and the PGND pin.
Place and connect these parts as close as possible to make the current loop small.
The output capacitor CVOUT and the inductor L are placed adjacent to each other.
Place the bypass capacitor CVB close to VB pin, and make the through-holes connecting the ground plane close to
the GND pin of the bypass capacitor CVB.
Draw the feedback wiring pattern from the VOUT pin to the output capacitor CVOUT pin. The wiring connected to
the VOUT pin is very sensitive to noise so that the wiring should keep away from the switching parts[1]. Especially,
be very careful about the leaked magnetic flux from the inductor L, even the back side of the inductor L.
[1]: Switching parts: IC (MB39C811), Input capacitor (CVIN), Inductor (L), Output capacitor (CVOUT).
Refer to Figure 2.
Figure 16. Example of a Layout Design
feedback wiring pattern
L
through-holes
CVB
VB
VOUT
VIN
LX
PGND
Top Layer
Back Layer
Document Number: 002-08401 Rev *A
Page 25 of 36
MB39C811
12.
Usage Precaution
Do Not Configure the IC Over the Maximum Ratings
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to be normally operated within the recommended usage conditions. Usage outside of
these conditions can have a bad effect on the reliability of the LSI.
Use the Devices within Recommended Operating Conditions
The recommended operating conditions are the recommended values that guarantee the normal operations of LSI.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions and
under the conditions stated for each item.
Printed Circuit Board Ground Lines should be set up with Consideration for Common Impedance
Take Appropriate Measures against Static Electricity
Containers for semiconductor materials should have anti-static protection or be made of conductive material.
After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
Work platforms, tools, and instruments should be properly grounded.
Working personnel should be grounded with resistance of 250 kΩ to 1MΩ in series between body and ground.
Do not apply Negative Voltages
The use of negative voltages below -0.3V may cause the parasitic transistor to be activated on LSI lines, which can
cause malfunctions.
13. Ordering Information
Table 15. Ordering Information
Part number
MB39C811QN
Package
40-pin plastic QFN (LCC-40P-M63)
14. Marking
Figure 17. Marking
MB 3 9 C 8 1 1
E 2
INDEX
Lead free mark
Document Number: 002-08401 Rev *A
Page 26 of 36
MB39C811
15.
Product Labels
Figure 18. Inner Box Label [Q-Pack Label (4 × 8.5 inch)]
Ordering Part Number
(P)+Part No.
Quantity
Mark lot information
Label spec
: Conformable JEDEC
Barcode form : Code 39
Document Number: 002-08401 Rev *A
Page 27 of 36
MB39C811
Figure 19. Al(Aluminum) bag label [2-in-1 label (4 × 8.5 inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Caution
JEDEC MSL, if available.
Document Number: 002-08401 Rev *A
Page 28 of 36
MB39C811
Figure 20. Reel label [Reel label (4 × 2.5 inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Figure 21. Reel label [Dry pack & Reel label (4 × 2.5 inch)]
Document Number: 002-08401 Rev *A
Page 29 of 36
MB39C811
Figure 22. Outer box label [Shopping label (4 × 8.5 inch)]
Quantity
Ordering Part Number : (1P)+Part No.
16. Recommended Mounting Conditions
Table 16. Recommended Mounting Conditions
Items
Method
Contents
IR(Infrared Reflow) / Convection
3 times in succession
Times
Before unpacking
Please use within 2 years after production.
Within 7 days
From unpacking to reflow
Floor life
In case over period of floor
life[1]
Baking with 125°C+/-3°C for 24hrs+2hrs/-0hrs is required. Then
please use within 7 days. (Please remember baking is up to 2 times)
Between 5°C and 30°C and also below 70%RH required.
(It is preferred lower humidity in the required temp range.)
Floor life
condition
[1]: Concerning the Tape & Reel product, please transfer product to heatproof tray and so on when you perform
baking.Also please prevent lead deforming and ESD damage during baking process.
Document Number: 002-08401 Rev *A
Page 30 of 36
MB39C811
Figure 23. Recommended Mounting Conditions
SupplierT ≥ T
p
c
User T ≤ T
p
c
T
c
T
-5°C
c
Supplier t
p
User t
p
Tp
TL
T -5°C
c
tp
tL
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
smax
Preheat Area
T
smin
ts
25
Time 25°C to Peak
Time
Table 17. Recommended Mounting Conditions(J-STD-020D)
(Temperature on the top of the package body is measured.)
260°C Max.
TL to TP: Ramp Up Rate
TS: Preheat & Soak
3°C/s Max.
150 to 200°C, 60 to 120s
260°C Down, within 30s
217°C, 60 to 150s
6°C/s Max.
TP - tP: Peak Temperature
TL – tL: Liquidous Temperature
TP to TL: Ramp Down Rate
Time 25°C to Peak
8min Max.
Document Number: 002-08401 Rev *A
Page 31 of 36
MB39C811
17. PackageDimensions
40-pin plastic QFN
Lead pitch
0.50 mm
Package width ×
package length
6.00 mm × 6.00 mm
Plastic mold
0.90 mm MAX
0.10 g
Sealing method
Mounting height
Weight
(LCC-40P-M63)
40-pin plastic QFN
(LCC-40P-M63)
6.00±0.10
(.236±.004)
4.50±0.10
(.177±.004)
0.25±0.05
(.010±.002)
6.00±0.10
(.236±.004)
4.50±0.10
(.177±.004)
INDEX AREA
0.45
(.017)
1PIN INDEX
R0.20(R.008)
0.50(.020)
(TYP)
0.40±0.05
(.016±.002)
0.035+0.015 (.0014+.0006 )
-0.035
-.0014
(0.20(.008))
0.85±0.05
(.033±.002)
2013 FUJITSU SEMICONDUCTOR LIMITED HMbC40-63Sc-1-1
C
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Document Number: 002-08401 Rev *A
Page 32 of 36
MB39C811
18. Major Changes
Spansion Publication Number: MB39C811_DS405-00013….
Page
Section
Change Results
Preliminary 0.1 [June 14, 2013]
-
-
Initial release
Revision 1.0 [November 18, 2013]
6
7
4.Pin Assignments
5.Pin Descriptions
Changed Pin8 PGND to N.C.
Changed Pin8 PGND to N.C.
Added Max in Power dissipation
Added Figure [Power dissipation]
Changed VIN pin input slew rate
Added VIN pin , Input current
AddedAC pin input current
9
7.Absolute Maximum Rating
Deleted Added VIN pin , Input current
Deleted AC pin input current
Changed values in "Input voltage range"
Deleted Input slew rate
10
8.RecommendedOperatingConditions
Added "IOUT=1mA" in "Preset output voltage" and changed values
Changed "over current protection" to "peak switching current" and values
Changed "Output current" to "Maximum output current" and values
Changed values in "UVLO release voltage"
Changed values in "UVLO detection voltage"
Added new
11
9.1.DC Characteristics
18
22
23
24
25
11.Example
14.OrderingInformation
15.Marking
Added "Table 14-2 EVB OrderingInformation"
Added new
16.Product Label
Added new
17.RecommendedMountingConditions
Added new
Revision 2.0 [August 29, 2014]
9. Electrical Characteristics
Table 9-1 DC characteristics
11
Deleted Input voltage range
11. Typical Application Circuits
Figure 11-3 Voltage doubler rectification circuit
for vibration harvester
18
Added the explanation of the voltage doubler rectification circuit
19 to 21
22 to 26
27
12. Application Notes
Added the “12. Application Notes”
13. Typical Characteristics
14. Layout for Printed Circuit Board
18. Product Label
Updated the “13. Typical Characteristics”
Added the “14. Layout for Printed Circuit Board”
Changed the “18. Product Label”
30 to 32
Revision 3.0
Added descriptions for all N.C. pins in “Table 5-1 Pin descriptions”
“Non connection pin”→“Non connection pin (Leavethis pin open)”
Wiring correction in “Figure 6-1 Block diagram”
Deleted the wire connections between DCGND1, DCGND2 pins and each
bridge rectifier, then added the internal GNDs.
7
5. Pin Descriptions
6. Block Diagram
8
Addedconditions and notes for output power-good detection voltage in
“Table 9-1 DC characteristics”
“To preset voltage ratio”→“To preset voltage ratio VVOUT ≥ 3.3V (*2)”
Addedconditions and notes in “Table 10-3 Output power-good signal output
(OPGOOD)”
9. Electrical Characteristics
9.1 DC characteristics
11
15
10. Function
10.3 Function descriptions
“≥ VOPGH ”→“≥ VOPGH (VVOUT ≥ 3.3V) (*1)”
Document Number: 002-08401 Rev *A
Page 33 of 36
MB39C811
Page
Section
Change Results
Wiring correction in “Figure 11-1 Application circuit for photovoltaic energy
harvester”
17
11. Typical Application Circuits
Deleted the wire connections between DCGND1 pin and the bridge
rectifier, then added the internal GND.
Wiring correction in “Figure 11-2 Application circuit for vibration energy
harvester”
17
18
11. Typical Application Circuits
11. Typical Application Circuits
Deleted the wire connections between DCGND2 pin and the bridge
rectifier, then added the internal GND.
Wiring correction in “Figure 11-3 Voltage doubler rectification circuit for
vibration harvester”
Deleted the wire connections between DCGND1 pin and the bridge
rectifier, then added the internal GND.
Added the “Table 12-1 Manufactures of recommended inductors”
Added the “Table 12-2 Manufactures of photovoltaic harvesters”
Added the “Table 12-3 Manufactures of vibration harvesters”
Added the “Table 12-4 Manufactures of capacitors”
19, 20
12. Application Notes
Inserted the data of 22μH and 10μH together into “Figure 13-1 Typical
characteristics of DC/DC conveter”.
23 to 28
13. Typical Characteristics
Inserted the data of 22μH and 10μH together into “Figure 13-4 Switching
waveforms of DC/DC converter”.
Replaced the line regulation datas of 22μH in “Figure 13-1 Typical
characteristics of DC/DC conveter”
23, 24
31
13. Typical Characteristics
16. Ordering Information
Replaced the load regulation datas of 22μH in “Figure 13-1”
Added the line and load regulation data of 10μH in “Figure 13-1”.
Deleted “Table 16-2 EVB Ordering information”
NOTE: Please see “Document History” about later revised information.
Document Number: 002-08401 Rev *A
Page 34 of 36
MB39C811
Document History
Document Title: MB39C811 Ultra Low Power Buck PMIC Solar/Vibrations Energy Harvesting
Document Number: 002-08401
Orig. of Submission
Revision
ECN
Description of Change
Change
Date
Migrated to Cypress and assigned document number 002-08401.
No change to document contents or format.
**
TAOA
12/05/2014
*A
TAOA
02/22/2016 Updated to Cypress template
5124887
Document Number: 002-08401 Rev *A
Page 35 of 36
MB39C811
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors.
To find the office closest to you, visit us at Cypress Locations.
Products
PSoC® Solutions
Automotive
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Interface
cypress.com/go/automotive
cypress.com/go/clocks
psoc.cypress.com/solutions
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
Cypress Developer Community
cypress.com/go/interface
Lighting & Power Control cypress.com/go/powerpsoc
Community | Forums | Blogs | Video | Training
Technical Support
Memory
cypress.com/go/memory
cypress.com/go/psoc
PSoC
cypress.com/go/support
Touch Sensing
USB Controllers
Wireless/RF
Spansion Products
cypress.com/go/touch
cypress.com/go/usb
cypress.com/go/wireless
cypress.com/spansionproducts
© Cypress Semiconductor Corporation 2014-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress").
This document, including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of
the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any
license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a
written agreement with Cypress governing the use of the Software, then Cypress hereby grants you under its copyright rights in the Software, a personal, non-exclusive,
nontransferable license (without the right to sublicense) (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware
products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and
distributors), solely for use on Cypress hardware product units. Cypress also grants you a personal, non-exclusive, nontransferable, license (without the right to sublicense) under
those claims of Cypress's patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely to the minimum
extent that is necessary for you to exercise your rights under the copyright license granted in the previous sentence. Any other use, reproduction, modification, translation, or
compilation of the Software is prohibited. CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY
SOFTWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the
right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this
document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility
of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress
products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear
installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances
management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any
component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress
is not liable, in whole or in part, and Company shall and hereby does release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of
Cypress products. Company shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or
death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of
Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their
respective owners
Document Number: 002-08401 Rev *A
Page 36 of 36
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