UL62H1616A20 [CYPRESS]

SRAM,;
UL62H1616A20
型号: UL62H1616A20
厂家: CYPRESS    CYPRESS
描述:

SRAM,

静态存储器
文件: 总9页 (文件大小:94K)
中文:  中文翻译
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Preliminary  
UL62H1616B  
Low Voltage Automotive Fast 64K x 16 SRAM  
Features  
Description  
F 65536 x 16 bit static CMOS RAM  
F 15 and 20 ns Access Time  
F Common data inputs and  
data outputs  
F Three-state outputs  
F Standby current < 50 µA at 125°C - Word Read  
F Power supply voltage 2.5 V  
F Operating temperature range  
K-Type:-40 °C to 85 °C  
The UL62H1616B is a static RAM  
G. If LB = L the data lower byte will  
be available at the outputs DQ0-  
DQ7, on UB = L the data upper  
byte appear at the outputs DQ8-  
DQ15. After the address change,  
the data outputs go High-Z until the  
new information is available. The  
data outputs have no preferred  
state. The Read cycle is finished by  
the falling edge of W, or by the  
rising edge of E, respectively.  
Data retention is guaranteed down  
to 2 V. With the exception of E, all  
inputs consist of NOR gates, so  
that no pull-up/pull-down resistors  
are required.  
manufactured using a CMOS pro-  
cess technology with the following  
operating modes:  
- Lower / Upper Byte Read  
- Lower / Upper Byte Write  
- Word Write  
- Standby  
- Data Retention  
The memory array is based on a  
6-Transistor cell.  
The circuit is activated by the fal-  
ling edge of E. The address and  
control inputs open simultaneously.  
According to the information of W  
and G, the data inputs, or outputs,  
are active. During the active state  
E = L and W = H each address  
change leads to a new Read cycle.  
In a Read cycle, the data outputs  
are activated by the falling edge of  
A-Type:-40 °C to 125 °C  
F CECC 90000 Quality Standard  
F ESD protection > 2000 V  
(MIL STD 883C M3015.7)  
F Latch-up immunity >100 mA  
F Package: SOP44 (525 mil)  
Pin Configuration  
Pin Description  
A5  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A4  
A3  
A6  
A7  
G
2
A2  
3
A1  
4
UB  
A0  
5
LB  
E
6
Signal Name Signal Description  
DQ15  
DQ14  
DQ13  
DQ12  
VSS  
DQ0  
DQ1  
DQ2  
DQ3  
VCC  
VSS  
DQ4  
DQ5  
DQ6  
DQ7  
W
7
A0 - A15  
Address Inputs  
8
9
DQ0 - DQ15  
Data In/Out  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
Chip Enable  
E
Output Enable  
Write Enable  
G
SOP  
VCC  
W
DQ11  
DQ10  
UB  
LB  
Upper Byte Enable  
Lower Byte Enable  
Power Supply Voltage  
Ground  
DQ9  
DQ8  
VCC  
VSS  
n.c.  
n.c.  
A8  
A15  
A14  
A13  
A12  
n.c.  
A9  
not connected  
A10  
A11  
n.c.  
Top View  
November 01, 2001  
1
UL62H1616B  
Preliminary  
Block Diagram  
A7  
DQ0  
DQ1  
A8  
A9  
A4  
A11  
A12  
A13  
A14  
A15  
Memory Cell  
Array  
DQ2  
DQ3  
DQ4  
512 Rows x  
128 x 16 Columns  
DQ5  
DQ6  
DQ7  
A0  
A1  
A2  
DQ8  
DQ9  
DQ10  
A3  
A10  
A5  
Sense Amplifier/  
Write Control Logic  
A6  
DQ11  
DQ12  
DQ13  
Address  
Change  
Detector  
Clock  
Generator  
DQ14  
DQ15  
Truth Table  
VCC  
VSS  
E
W
G UB LB  
Operating Mode  
E
W
G
LB  
UB  
DQ0-DQ7  
DQ8-DQ15  
Standby/not selected  
H
*
*
*
*
High-Z  
High-Z  
High-Z  
L
L
H
*
H
*
*
H
*
H
Internal Read  
High-Z  
Lower Byte Read  
Upper Byte Read  
Word Read  
L
L
L
L
L
L
H
H
H
L
L
L
L
*
L
H
L
H
L
L
H
L
L
Data Outputs Low-Z  
High-Z  
High-Z  
Data Outputs Low-Z  
Data Outputs Low-Z Data Outputs Low-Z  
Lower Byte Write  
Upper Byte Write  
Word Write  
L
Data Inputs High-Z  
High-Z  
High-Z  
L
*
H
L
Data Inputs High-Z  
Data Inputs High-Z  
L
*
Data Inputs High-Z  
H or L  
*
Characteristics  
All voltages are referenced to VSS = 0 V (ground).  
All characteristics are valid in the power supply voltage range and in the operating temperature range specified.  
Dynamic measurements are based on a rise and fall time of 5 ns, measured between 10 % and 90 % of VI, as well as  
input levels of VIL = 0 V and VIH = 2.5 V. The timing reference level of all input and output signals is 1.2 V,  
with the exception of the tdis-times and ten-times, in which cases transition is measured ±200 mV from steady-state voltage.  
Maximum Ratings  
Symbol  
Min.  
Max.  
Unit  
Power Supply Voltage  
Input Voltage  
VCC  
VI  
-0.3  
-0.3  
-0.3  
-
3.6  
VCC + 0.3  
VCC + 0.3  
1
V
V
Output Voltage  
VO  
PD  
Ta  
V
Power Dissipation  
Operating Temperature  
W
°C  
K-Type  
A-Type  
-40  
-40  
85  
125  
Storage Temperature  
Tstg  
-65  
150  
°C  
Output Short-Circuit Current  
at VCC = 2.5 V and VO = 0 V**  
| IOS  
|
100  
mA  
**Not more than 1 output should be shorted at the same time. Duration of the short circuit should not exceed 30 s.  
2
November 01, 2001  
Preliminary  
UL62H1616B  
Recommended  
Operating Conditions  
Symbol  
VCC  
Conditions  
Min.  
2.3  
Max.  
2.7  
Unit  
V
Power Supply Voltage  
Input Low Voltage*  
VIL  
-0.2  
2.0  
0.6  
V
Input High Voltage  
VIH  
VCC + 0.2  
V
*
-2 V at Pulse Width 10 ns  
Electrical Characteristics  
Symbol  
Conditions  
Min.  
Max.  
Unit  
Supply Current - Operating Mode  
ICC(OP)  
VCC  
VIL  
VIH  
tcW  
tcW  
tcW  
= 2.7 V  
= 0.6 V  
= 2.0 V  
= 35 ns  
= 55 ns  
= 60 ns  
90  
70  
60  
mA  
mA  
mA  
Supply Current - Standby Mode  
(CMOS level)  
ICC(SB)  
VCC  
VE  
= 2.7 V  
= VCC - 0.2 V  
50  
µA  
Supply Current - Standby Mode  
(LVTTL level)  
ICC(SB)1  
VCC  
VE  
= 2.7 V  
= 2.0 V  
K-Type  
A-Type  
10  
20  
mA  
mA  
Output High Voltage  
Output Low Voltage  
VOH  
VOL  
VCC  
IOH  
VCC  
IOL  
= 2.3 V  
= -0.5 mA  
= 2.3 V  
2.0  
V
V
0.4  
2
= 0.5 mA  
Input High Leakage Current  
Input Low Leakage Current  
IIH  
IIL  
VCC  
VIH  
VCC  
VIL  
= 2.7 V  
= 2.7 V  
= 2.7 V  
µA  
µA  
-2  
=
0 V  
Output High Current  
Output Low Current  
IOH  
IOL  
VCC  
VOH  
VCC  
VOL  
= 2.3 V  
= 2.0 V  
= 2.3 V  
= 0.4 V  
-0.5  
mA  
mA  
0.5  
Output Leakage Current  
High at Three-State Outputs  
IOHZ  
IOLZ  
VCC  
VOH  
VCC  
VOL  
= 2.7 V  
= 2.7 V  
= 2.7 V  
2
µA  
µA  
Low at Three-State Outputs  
-2  
=
0 V  
November 01, 2001  
3
UL62H1616B  
Preliminary  
Symbol  
15  
20  
Switching Characteristics  
Read Cycle  
Unit  
Min.  
Max.  
Min.  
Max.  
Alt.  
tRC  
tAA  
tACE  
tOE  
IEC  
tcR  
Read Cycle Time  
15  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Access Time to Data Valid  
Chip Enable Access Time to Data Valid  
G LOW to Data Valid  
ta(A)  
15  
15  
7
20  
20  
9
ta(E)  
ta(G)  
ta(B)  
LB, UB LOW to Data Valid  
tB  
7
9
E HIGH to Output in High-Z  
G HIGH to Output in High-Z  
LB, UB HIGH to Output in High-Z  
E LOW to Output in Low-Z  
tHZCE  
tHZOE  
tHZB  
tLZCE  
tLZOE  
tLZB  
tOH  
tdis(E)  
tdis(G)  
tdis(B)  
ten(E)  
ten(G)  
ten(B)  
tv(A)  
7
8
7
8
7
8
4
0
0
3
0
4
0
0
3
0
G LOW to Output in Low-Z  
LB, UB LOW to Output in Low-Z  
Output Hold Time from Address Change  
E LOW to Power-Up Time  
tPU  
E HIGH to Power-Down Time  
tPD  
15  
20  
Symbol  
15  
20  
Switching Characteristics  
Write Cycle  
Unit  
Min.  
15  
10  
10  
0
Max.  
Min.  
20  
12  
12  
0
Max.  
Alt.  
tWC  
IEC  
tcW  
Write Cycle Time  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Write Pulse Width  
tWP  
tw(W)  
tsu(W)  
tsu(A)  
Write Setup Time  
tWP  
Address Setup Time  
tAS  
t
Address Valid to End of Write  
Chip Enable Setup Time  
Byte Enable Setup Time  
Pulse Width Chip Enable to End of Write  
Pulse Width Byte Enable to End of Write  
Data Setup Time  
tAW  
10  
10  
10  
10  
10  
7
12  
12  
12  
12  
12  
9
su(A-WH)  
tCW  
tsu(E)  
tBW  
tsu(B)  
tw(E)  
tCW  
tBW  
tw(B)  
tDS  
tsu(D)  
th(D)  
Data Hold Time  
tDH  
0
0
Address Hold from End of Write  
W LOW to Output in High-Z  
G HIGH to Output in High-Z  
W HIGH to Output in Low-Z  
G LOW to Output in Low-Z  
tAH  
th(A)  
0
0
tHZWE  
tHZOE  
tLZWE  
tLZOE  
tdis(W)  
tdis(G)  
ten(W)  
ten(G)  
7
7
8
8
3
0
3
0
4
November 01, 2001  
Preliminary  
UL62H1616B  
Data Retention Mode  
E - controlled  
VCC  
2.3 V  
VCC(DR) 1.5 V  
2.0 V  
2.0 V  
tsu(DR)  
trec  
Data Retention  
E
0 V  
V
- 0.2 V V  
V  
+ 0.3 V  
CC(DR)  
CC(DR)  
E(DR)  
Data Retention  
Characteristics  
Symbol  
Alt. IEC  
VCC(DR)  
ICC(DR) VCC(DR) = 2 V  
Conditions  
Min. Typ. Max.  
Unit  
Data Retention Supply Voltage  
Data Retention Supply Current  
1.5  
2.7  
30  
V
µA  
VE = VCC(DR) - 0.2 V  
Data Retention Setup Time  
Operating Recovery Time  
tCDR  
tR  
tsu(DR) See Data Retention  
0
ns  
ns  
Waveforms (above)  
trec  
tcR  
Test Configuration for Functional Check  
2.5 V  
A0  
VCC  
A1  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ8  
DQ9  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
A2  
A3  
A4  
A5  
481  
A6  
A7  
A8  
A9  
A10  
A11  
A12  
A13  
A14  
A15  
VIH  
VIL  
VO  
30 pF1)  
E
W
G
LB  
UB  
255  
DQ15  
VSS  
1)  
In measurement of t  
,t  
, t  
, t  
, t  
the capacitance is 5 pF.  
dis(E) dis(W) en(E) en(W) en(G)  
November 01, 2001  
5
UL62H1616B  
Preliminary  
Capacitance  
Conditions  
Symbol  
Min.  
Max.  
Unit  
Input Capacitance  
VCC  
VI  
f
= 2.5 V  
= VSS  
= 1 MHz  
= 25 °C  
CI  
7
7
pF  
Output Capacitance  
Co  
pF  
T
a
All pins not under test must be connected with ground by capacitors.  
IC Code Numbers  
UL62H1616  
S
15  
A
Type  
Access Time  
15 = 15 ns  
Package  
S = SOP44 525 mil  
20 = 20 ns  
Operating Temperature Range  
K = -40 to 85 °C  
A = -40 to 125 °C  
The date of manufacture is given by the last 4 digits of the mark, the first 2 digits indicating the year, and the last 2  
digits the calendar week.  
6
November 01, 2001  
Preliminary  
UL62H1616B  
Read Cycle 1: Ai-controlled (during Read Cycle : E = G = VIL, W = VIH)  
tcR  
Ai  
Address Valid  
ta(A)  
DQi  
Output Data Valid  
Previous Data Valid  
Output  
tv(A)  
Read Cycle 2: G-, E-, LB-, UB-controlled (during Read Cycle: W = VIH)  
tcR  
Ai  
E
Address Valid  
ta(E)  
tsu(A)  
tdis(E)  
ten(E)  
ten(G)  
ten(B)  
tdis(G)  
ta(G)  
G
tdis(B)  
ta(B)  
LB, UB  
DQi  
Output  
High-Z  
tPU  
Output Data Valid  
tPD  
ICC(OP)  
ICC(SB)  
50 %  
50 %  
Write Cycle1: W-controlled  
tcW  
Ai  
E
Address Valid  
tsu(E)  
th(A)  
tsu(B)  
LB, UB  
W
tsu(A-WH)  
tw(W)  
tsu(A)  
tsu(D)  
th(D)  
DQi  
Input  
Input Data Valid  
ten(W)  
tdis(W)  
DQi  
High-Z  
Output  
G
November 01, 2001  
7
UL62H1616B  
Preliminary  
Write Cycle 2: E-controlled  
tcW  
Ai  
E
Address Valid  
tw(E)  
tsu(A)  
th(A)  
tsu(B)  
LB, UB  
W
tsu(W)  
tsu(D)  
th(D)  
DQi  
Input  
Input Data Valid  
High-Z  
tdis(W)  
ten(E)  
DQi  
Output  
tdis(G)  
G
Write Cycle 3: LB-, UB-controlled  
tcW  
Ai  
Address Valid  
tsu(E)  
E
tsu(A)  
th(A)  
tw(B)  
LB, UB  
tsu(W)  
W
th(D)  
tsu(D)  
DQi  
Input  
Input Data Valid  
High-Z  
tdis(W)  
ten  
(B)  
DQi  
Output  
tdis(G)  
G
undefined  
L- to H-level  
H- to L-level  
The information describes the type of component and shall not be considered as assured characteristics.Terms of  
delivery and rights to change design reserved.  
8
November 01, 2001  
Preliminary  
UL62H1616B  
LIFE SUPPORT POLICY  
ZMD products are not designed, intended, or authorized for use as components in systems intended for surgical  
implant into the body, or other applications intended to support or sustain life, or for any other application in which  
the failure of the ZMD product could create a situation where personal injury or death may occur.  
Components used in life-support devices or systems must be expressly authorized by ZMD for such purpose.  
LIMITED WARRANTY  
The information in this document has been carefully checked and is believed to be reliable. However Zentrum  
Mikroelektronik Dresden AG (ZMD) makes no guarantee or warranty concerning the accuracy of said information  
and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it.  
The information in this document describes the type of component and shall not be considered as assured charac-  
teristics.  
ZMD does not guarantee that the use of any information contained herein will not infringe upon the patent, trade-  
mark, copyright, mask work right or other rights of third parties, and no patent or licence is implied hereby. This  
document does not in any way extent ZMD’s warranty on any product beyond that set forth in its standard terms and  
conditions of sale.  
ZMD reserves terms of delivery and reserves the right to make changes in the products or specifications, or both,  
presented in this publication at any time and without notice.  
November 01, 2001  
Zentrum Mikroelektronik Dresden AG  
Grenzstraße 28 D-01109 Dresden P. O. B. 80 01 34 D-01101 Dresden Germany  
Phone: +49 351 8822 306 Fax: +49 351 8822 337 Email: sales@zmd.de http://www.zmd.de  

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