BTA1727M3-0-T2-G [CYSTEKEC]
High Voltage PNP Epitaxial Planar Transistor;
| 型号： | BTA1727M3-0-T2-G |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | High Voltage PNP Epitaxial Planar Transistor |
| 文件： | 总8页 (文件大小：432K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 1/8
High Voltage PNP Epitaxial Planar Transistor
BTA1727M3
Features
High BVCEO
Complementary to BTD2568M3
Pb-free lead plating package
Symbol
Outline
BTA1727M3
SOT-89
B：Base
C：Collector
E：Emitter
B C E
Ordering Information
Device
Package
SOT-89
Shipping
BTA1727M3-0-T2-G
1000 pcs / Tape & Reel
(Pb-free lead plating and halogen-free package)
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T2 :1000 pcs/tape & reel, 7” reel
Product rank, zero for no rank products
Product name
BTA1727M3
CYStek Product Specification
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 2/8
Absolute Maximum Ratings (Ta=25C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Base Current
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
ICP
IB
-400
-400
-6
-300
-1
-200
V
V
V
mA
A
mA
0.6
Power Dissipation
PD
1
2
*1
*2
W
Operating Junction Temperature Range
Storage Temperature Range
Tj
Tstg
-55~+150
-55~+150
C
C
Note : *1 Printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm.
*2 When mounted on a 40*40*0.7mm ceramic board.
Characteristics (Ta=25C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
IC=-100μA, IE=0
IC=-1mA, IB=0
IE=-10μA, IC=0
VCB=-400V, IE=0
BVCBO
BVCEO
BVEBO
ICBO
-400
-400
-6
-
-
-
-
-
-
160
150
120
50
-
-
-
-
-
-
-
-
V
V
V
nA
nA
mV
mV
mV
mV
-
-100
-100
-200
-300
-900
-950
320
-
IEBO
-
-89
-123
-690
-769
-
-
-
-
VEB=-6V, IC=0
*VCE(sat)
*VCE(sat)
*VBE(sat)
*VBE(sat)
*hFE1
*hFE2
*hFE3
fT
IC=-20mA, IB=-2mA
IC=-50mA, IB=-5mA
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
VCE=-10V, IC=-10mA
VCE=-10V, IC=-50mA
VCE=-10V, IC=-100mA
-
-
-
-
-
MHz
pF
VCE=-10V, IC=-10mA, f =100MHz
VCB=-10V, f=1MHz
Cob
10.5
*Pulse Test : Pulse Width 380μs, Duty Cycle2%
BTA1727M3
CYStek Product Specification
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 3/8
Typical Characteristics
Emitter Grounded Output Characteristics
Emitter Grounded Output Characteristics
0.16
0.14
0.12
0.1
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
1mA
5mA
500uA
400uA
300uA
2.5mA
2mA
1.5mA
1mA
0.08
0.06
0.04
0.02
0
200uA
-IB=500uA
-IB=100uA
0
1
2
3
4
5
6
0
1
2
3
4
5
6
-VCE, Collector-to-Emitter Voltage(V)
-VCE, Collector-to-Emitter Voltage(V)
Emitter Grounded Output Characteristics
Emitter Grounded Output Characteristics
0.25
0.2
0.4
20mA
50mA
0.35
0.3
25mA
8mA
6mA
4mA
0.25
0.2
0.15
0.1
10mA
-IB=2mA
0.15
0.1
-IB=5mA
0.05
0
0.05
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
-VCE, Collector-to-Emitter Voltage(V)
-VCE, Collector-to-Emitter Voltage(V)
Current Gain vs Collector Current
Current Gain vs Collector Current
1000
1000
100
10
Ta=125°C
Ta=125°C
-VCE=5V
-VCE=10V
100
10
1
Ta=25°C
Ta=-40°C
Ta=25°C
Ta=-40°C
1
0.1
1
10
100
1000
0.1
1
10
100
1000
-IC, Collector Current(mA)
-IC, Collector Current(mA)
BTA1727M3
CYStek Product Specification
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 4/8
Typical Characteristics(Cont.)
Saturation Voltage vs Collector Current
Saturation Voltage vs Collector Current
10000
1000
100
1000
VCESAT@IC=10IB
VBESAT@IC=10IB
Ta=-40°C
25°C
125°C
100
Ta=125°C
25°C
-40°C
10
1
10
100
1000
0.1
1
10
100
1000
-IC, Collector Current(mA)
-IC, Collector Current(mA)
On Voltage vs Collector Current
Capacitance vs Reverse-biased Voltage
10000
1000
100
10
VBEON@VCE=-10V
Ta=-40°C
25°C
125°C
Cib
1000
Cob
100
100
1
1
10
100
1000
0.1
1
10
100
-IC, Collector Current(mA)
-VR, Reverse-biased Voltage(V)
Cutoff Frequency vs Collector Current
Power Derating Curves
2.5
2
-VCE=10V
See note 2 on page 2
See note 1 on page 2
1.5
1
0.5
0
10
1
10
100
0
50
100
150
200
-IC, Collector Current(mA)
TA, Ambient Temperature(℃)
BTA1727M3
CYStek Product Specification
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 5/8
Recommended soldering footprint
BTA1727M3
CYStek Product Specification
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 6/8
Reel Dimension
Carrier Tape Dimension
BTA1727M3
CYStek Product Specification
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 7/8
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100C
150C
60-120 seconds
150C
200C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183C
60-150 seconds
217C
60-150 seconds
Peak Temperature(TP)
240 +0/-5 C
260 +0/-5 C
Time within 5C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6C/second max.
6C/second max.
6 minutes max.
8 minutes max.
Time 25 C to peak temperature
Note :1. All temperatures refer to topside of the package, measured on the package body surface.
2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care
should be taken to match the coefficients of thermal expansion between components and PCB. If they are
not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the
assembly cools.
BTA1727M3
CYStek Product Specification
Spec. No. : C236M3
Issued Date : 2018.06.29
Revised Date :
CYStech Electronics Corp.
Page No. : 8/8
SOT-89 Dimension
Marking:
A
2
1
3
Device
Code
AP
Date
Code
□□
H
C
D
B
Style: Pin 1. Base 2. Collector 3. Emitter
E
I
F
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
G
*: Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
0.0583 0.0598
0.1165 0.1197
0.0551 0.0630
0.0138 0.0161
Millimeters
DIM
DIM
Min.
4.40
4.05
1.50
2.40
0.36
Max.
4.60
4.25
1.70
2.60
0.51
Min.
1.48
2.96
1.40
0.35
Max.
1.527
3.04
1.60
0.41
A
B
C
D
E
0.1732 0.1811
0.1594 0.1673
0.0591 0.0663
0.0945 0.1024
0.01417 0.0201
F
G
H
I
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA1727M3
CYStek Product Specification
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