BTB1236AK3 [CYSTEKEC]

Silicon PNP Epitaxial Planar Transistor;


型号：	BTB1236AK3
厂家：	CYSTECH ELECTONICS CORP.
描述：	Silicon PNP Epitaxial Planar Transistor
文件：	总6页 (文件大小：230K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec. No. : C854K3

Issued Date : 2012.10.08

Revised Date :

CYStech Electronics Corp.

Page No. : 1/6

Silicon PNP Epitaxial Planar Transistor

BTB1236AK3

Description

• High BV_CEO

• High current capability

• Pb-free lead plating package

Symbol

Outline

TO-92L

BTB1236AK3

B：Base

C：Collector

E：Emitter

Absolute Maximum Ratings (Ta=25°C)

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current (DC)

Collector Current (Pulse)

Base Current

Symbol

VCBO

VCEO

VEBO

Limits

Unit

-180

-160

-7

-1.5

-3

ICP

0.5

Collector Power Dissipation

Junction Temperature

Storage Temperature

900

150

-55~+150

°C

Tstg

BTB1236AK3

CYStek Product Specification

Spec. No. : C854K3

Issued Date : 2012.10.08

Revised Date :

CYStech Electronics Corp.

Page No. : 2/6

Characteristics

(Ta=25°C)

Symbol

BV_CBO

Min. Typ.

Max.

Unit

Test Conditions

I =-50 A, I =0

-180

-1

-0.3

-0.6

-0.75

320

µA

BV_CEO

BV_EBO

I_CBO

-160

I_C=-1mA, I_B=0

I =-50 A, I =0

-7

V_CB=-160V, I_E=0

V_EB=-5V, I_C=0

I_C=-500mA, I_B=-50mA

I_C=-1A, I_B=-100mA

V_CE=-5V, I_C=-5mA

V_CE=-5V, I_C=-200mA

V_CE=-5V, I_C=-500mA

V_CE=-5V, I_C=-150mA

V_CB=-10V, I_E=0, f=1MHz

I_EBO

*V_CE(sat)

*V_BE(on)

h_FE1

h_FE2

f_T

Cob

-0.45

100

180

MHz

*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%

Classification Of h_FE1

Rank

160~320

Range

100~200

Ordering Information

Device

HFE rank

Package

Shipping

TO-92L

(Pb-free lead plating)

TO-92L

(Pb-free lead plating)

TO-92L

(Pb-free lead plating)

TO-92L

(Pb-free lead plating)

BTB1236AK3-O-BK-S

500 pcs / bag, 10 bags/box, 10 boxes/carton

BTB1236AK3-Y-BK-S

BTB1236AK3-O-TB-S

BTB1236AK3-Y-TB-S

500 pcs / bag, 10 bags/box, 10 boxes/carton

2000 pcs / Tape & Box

BTB1236AK3

CYStek Product Specification

Spec. No. : C854K3

Issued Date : 2012.10.08

Revised Date :

CYStech Electronics Corp.

Page No. : 3/6

Typical Characteristics

Current Gain vs Collector Current

Saturation Voltage vs Collector Current

1000

100

1000

100

VCE=5V

VCESAT@IC=50IB

VCE=2V

VCE=1V

VCESAT@IC=10IB

100

1000

10000

100

1000

10000

Collector Current---IC(mA)

On Voltage vs Collector Current

Saturation Voltage vs Collector Current

VBESAT@IC=10IB

1000

VBESAT@IC=50IB

100

1000

10000

100

1000

10000

Collector Current---IC(mA)

Power Derating Curve

Capacitance vs Reverse-biased Voltage

1000

100

1000

900

800

700

600

500

400

300

200

100

150

200

0.1

100

Reverse-biased Voltage---VR(V)

Ambient Temperature---TA(℃)

BTB1236AK3

CYStek Product Specification

Spec. No. : C854K3

Issued Date : 2012.10.08

Revised Date :

CYStech Electronics Corp.

Page No. : 4/6

TO-92L Taping Outline

Millimeters

Max.

5.10

8.20

4.10

0.50

0.78

13.00

12.90

6.65

2.80

1.00

19.00

6.50

9.50

1.00

21.00

16.50

DIM

Item

Min.

F1, F2

△h

Component body width

Component body height

Component body thickness

Lead wire diameter

Lead wire diameter 1

Pitch of component

4.70

7.80

3.70

0.40

0.62

12.40

12.50

6.05

2.20

-1.00

17.50

5.50

8.50

19.00

15.50

2.50

3.80

0.35

0.15

3.55

-1.00

Feed hole pitch

Hole center to component center

Lead to lead distance

Component alignment, F-R

Tape width

Hole down tape width

Hole position

Hole down tape position

Height of component from tape center

Lead wire clinch height

Lead wire (tape portion)

Feed hole diameter

4.20

0.45

0.25

4.15

1.00

Taped lead thickness

Carrier tape thickness

Position of hole

△P

Component alignment

BTB1236AK3

CYStek Product Specification

Spec. No. : C854K3

Issued Date : 2012.10.08

Revised Date :

CYStech Electronics Corp.

Page No. : 5/6

Recommended wave soldering condition

Product

Peak Temperature

Soldering Time

5 +1/-1 seconds

Pb-free devices

260 +0/-5 °C

Recommended temperature profile for IR reflow

Profile feature

Average ramp-up rate

(Tsmax to Tp)

Sn-Pb eutectic Assembly

Pb-free Assembly

3°C/second max.

Preheat

−Temperature Min(T^Smin)

−Temperature Max(T^Smax)

−Time(ts min to ts max)

100°C

150°C

60-120 seconds

150°C

200°C

60-180 seconds

Time maintained above:

−Temperature (TL)

− Time (tL)

183°C

60-150 seconds

240 +0/-5 °C

217°C

60-150 seconds

260 +0/-5 °C

Peak Temperature(TP)

Time within 5°C of actual peak

temperature(tp)

10-30 seconds

20-40 seconds

Ramp down rate

6°C/second max.

6 minutes max.

8 minutes max.

Time 25 °C to peak temperature

Note : All temperatures refer to topside of the package, measured on the package body surface.

BTB1236AK3

CYStek Product Specification

Spec. No. : C854K3

Issued Date : 2012.10.08

Revised Date :

CYStech Electronics Corp.

Page No. : 6/6

TO-92L Dimension

Marking:

Product Name

B1236

Date Code: Year+Month

Year: 7→2007, 8→2008

Month: 1→1, 2→2, ‧‧‧,

9→9, A→10, B→11, C→12

□□

Style: Pin 1.Emitter 2.Collector 3.Base

3-Lead TO-92L Plastic Package

CYStek Package Code: K3

*: Typical

Millimeters

Inches

DIM

Millimeters

Min.

Inches

*0.05

DIM

Min.

Max.

4.100

1.580

0.550

0.800

0.450

5.100

Min.

0.307

Max.

0.323

Min.

Max.

0.146

0.050

0.014

0.024

0.014

0.185

0.157

0.161

0.062

0.022

0.031

0.018

0.201

3.700

1.280

0.350

0.600

0.350

4.700

4.000

7.800

8.200

*1.270

0.096

0.543

0.104

0.559

0.063

0.012

2.440

13.800

2.640

14.200

1.600

0.300

0.000

Notes: 1.Controlling dimension: millimeters.

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

BTB1236AK3

CYStek Product Specification

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