CSMA5819 [CYSTEKEC]

1.0Amp. Surface Mount Schottky Barrier Diodes; 1.0Amp 。表面贴装肖特基势垒二极管
CSMA5819
型号: CSMA5819
厂家: CYSTECH ELECTONICS CORP.    CYSTECH ELECTONICS CORP.
描述:

1.0Amp. Surface Mount Schottky Barrier Diodes
1.0Amp 。表面贴装肖特基势垒二极管

二极管
文件: 总3页 (文件大小:139K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : C331SA  
Issued Date : 2003.04.10  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 1/3  
1.0Amp. Surface Mount Schottky Barrier Diodes  
CSMA581XSA Series  
Features  
For surface mounted applications.  
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications  
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0  
Low leakage current  
High surge capability  
High temperature soldering: 250°C/10 seconds at terminals  
Exceeds environmental standards of MIL-S-19500/228  
Mechanical Data  
Case: SMA/DO-214AC molded plastic.  
Terminals: Solder plated, solderable per MIL-STD-750 method 2026  
Polarity: Indicated by cathode band.  
Packaging: 12mm tape per EIA STD RS-481.  
Weight: 0.05 gram, 0.0015 ounce  
Maximum Ratings and Electrical Characteristics  
(Rating at 25°C ambient temperature unless otherwise specified. )  
Type  
CSMA CSMA CSMA  
5817 5818 5819  
Parameter  
Conditions  
Symbol  
Units  
min  
typ  
30  
21  
30  
max  
Repetitive peak reverse  
voltage  
VRRM  
VRMS  
VR  
20  
40  
V
V
V
Maximum RMS voltage  
Maximum DC blocking  
voltage  
14  
28  
20  
40  
Maximum instantaneous  
forward voltage  
IF=3A (Note 1)  
VF  
IO  
0.475 0.500 0.525  
V
A
A
Maximum average forward  
rectified current  
1
8.3ms single half sine wave superimposed  
on rated load(JEDEC method)  
VR=VRRM,TA=25 (Note 1)  
Peak forward surge current  
IFSM  
30  
0.5  
10  
mA  
mA  
Maximum DC reverse  
current  
IR  
VR=VRRM,TA=100 (Note 1)  
Maximum thermal  
Junction to ambient(Note 2)  
Rth,JA  
80  
/w  
resistance  
Diode junction capacitance f=1MHz and applied 4V reverse voltage  
Storage temperature  
CJ  
Tstg  
TJ  
130  
-55~+150  
-55~+125  
pF  
Operating temperature  
Notes: 1.Pulse test, pulse width=300μsec, 2% duty cycle  
2.Mounted on PCB with 5.0mm² (0.013mm thickness) copper pad area.  
CSMA581XSA  
CYStek Product Specification  
Spec. No. : C331SA  
Issued Date : 2003.04.10  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 2/3  
Characteristic Curves  
Maximum Non-Repetitive Forward Surge Current  
Forward Current Derating Curve  
35  
30  
25  
20  
15  
10  
5
1.2  
1
Tj=25℃, 8.3ms Single  
Half Sine Wave  
JEDEC method  
0.8  
0.6  
0.4  
0.2  
0
0
0
50  
100  
150  
1
10  
100  
Number of Cycles at 60Hz  
Ambient Temperature---TA(℃)  
Forward Current vs Forward Voltage  
Junction Capacitance vs Reverse Voltage  
100  
350  
300  
250  
200  
150  
100  
50  
CSMA5817  
10  
1
CSMA5818-5819  
Tj=25℃, Pulse  
width=300μs  
1% Duty cycle  
0.1  
0.01  
0
0.1  
0.3  
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
0.01  
0.1  
1
10  
100  
Forward Voltage---VF(V)  
Reverse Voltage---VR(V)  
Reverse Leakage Current vs Reverse Voltage  
100  
10  
Tj=75℃  
Tj=25℃  
1
0.1  
0.01  
0
20  
40  
60  
80  
100 120 140  
Reverse Voltage---VR(V)  
CSMA581XSA  
CYStek Product Specification  
Spec. No. : C331SA  
Issued Date : 2003.04.10  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 3/3  
SMA/DO-214AC Dimension  
Marking Code:  
C
A
CSMA5817 CSMA5818 CSMA5819  
Device  
Code  
SK12  
SK13  
SK14  
B
D
SMA Plastic Surface  
Mounted Package  
E
CYStek Package Code:SA  
G
F
*:Typical  
Inches  
Millimeters  
Inches  
Millimeters  
DIM  
DIM  
Min.  
Max.  
0.185  
0.110  
Min.  
4.4  
Max.  
4.8  
Min.  
Max.  
Min.  
1.5  
Max.  
1.7  
A
B
C
D
0.177  
0.094  
E
F
G
-
0.060  
0.067  
2.4  
2.8  
0.04(typ)  
1.0(typ)  
1.0(typ)  
0.012(typ)  
0.3(typ)  
0.04(typ)  
0.150  
0.165  
3.8  
4.2  
-
-
-
-
Notes : 1.Controlling dimension : millimeters.  
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
CYStek reserves the right to make changes to its products without notice.  
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
CSMA581XSA  
CYStek Product Specification  

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