DTA114EN3-0-T1-G [CYSTEKEC]

PNP Digital Transistors (Built-in Resistors);
DTA114EN3-0-T1-G
型号: DTA114EN3-0-T1-G
厂家: CYSTECH ELECTONICS CORP.    CYSTECH ELECTONICS CORP.
描述:

PNP Digital Transistors (Built-in Resistors)

文件: 总6页 (文件大小:295K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : C355N3  
Issued Date : 2003.05.27  
Revised Date :2015.09.18  
Page No. : 1/6  
CYStech Electronics Corp.  
PNP Digital Transistors (Built-in Resistors)  
DTA114EN3  
Features  
Built-in bias resistors enable the configuration of an inverter circuit without connecting external input  
resistors (see equivalent circuit).  
The bias resistors consist of thin-film resistors with complete isolation to allow positive biasing of the  
input. They also have the advantage of almost completely eliminating parasitic effects.  
Only the on/off conditions need to be set for operation, making device design easy.  
Complements the DTC114EN3  
Pb-free lead plating and halogen-free package  
Equivalent Circuit  
Outline  
SOT-23  
DTA114EN3  
R1=10kΩ , R2=10 kΩ  
IN(B) : Base  
OUT(C) : Collector  
GND(E) : Emitter  
Ordering Information  
Device  
Package  
SOT-23  
(Pb-free lead plating and halogen-free package)  
Shipping  
DTA114EN3-0-T1-G  
3000 pcs / tape & reel  
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and  
green compound products  
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel  
Product rank, zero for no rank products  
Product name  
DTA143EN3  
CYStek Product Specification  
Spec. No. : C355N3  
Issued Date : 2003.05.27  
Revised Date :2015.09.18  
Page No. : 2/6  
CYStech Electronics Corp.  
Absolute Maximum Ratings (Ta=25°C)  
Parameter  
Supply Voltage  
Input Voltage  
Symbol  
Limits  
Unit  
VCC  
VIN  
IO  
IO(max)  
Pd  
Tj  
Tstg  
-50  
-40~+10  
-50  
-100  
200  
150  
-55~+150  
V
V
mA  
mA  
mW  
°C  
Output Current  
Power Dissipation  
Junction Temperature  
Storage Temperature  
°C  
Electrical Characteristics (Ta=25°C)  
Parameter  
Input Voltage  
Symbol Min. Typ. Max. Unit  
Test Conditions  
VI(off)  
VI(on)  
VO(on)  
II  
-
-3  
-
-
-
-
-0.5  
-
-0.3  
V
V
V
VCC=-5V, IO=-100μA  
VO=-0.3V, Io=-10mA  
IO/II=-10mA/-0.5mA  
Output Voltage  
Input Current  
-
-
-0.88 mA VI=-5V  
Output Current  
DC Current Gain  
Input Resistance  
Resistance Ratio  
Transition Frequency  
IO(off)  
GI  
R1  
R2/R1  
fT  
-
30  
7
0.8  
-
-
-
-0.5  
-
13  
1.2  
-
μA  
-
kΩ  
-
VCC=-50V, VI=0V  
VO=-5V, IO=-5mA  
-
-
10  
1
250  
MHz VCE=-10V, IC=-5mA, f=100MHz *  
* Transition frequency of the device  
Recommended Soldering Footprint  
DTA143EN3  
CYStek Product Specification  
Spec. No. : C252N3  
Issued Date : 2003.05.27  
Revised Date :2016.06.02  
Page No. : 3/6  
CYStech Electronics Corp.  
Typical Characteristics  
Current Gain vs Output Current  
Output Voltage vs Output Current  
10  
1
1000  
100  
10  
Vo = 5V  
Io / Ii = 20  
0.1  
0.01  
1
10  
Output Current---I (mA)  
100  
0.1  
1
10  
100  
Output Current---I (mA)  
O
O
Output Current vs Input Voltage(OFF characteristics)  
Input Voltage vs Output Current(ON characteristics)  
Vo = 0.3V  
10  
100  
10  
1
V
CC  
= 5 V  
1
0.1  
0.01  
0.1  
0
0.5  
1
1.5  
2
2.5  
3
0.1  
1
10  
100  
Output Current---I (mA)  
Input Voltage---VI(OFF)(V)  
O
Power Derating Curve  
250  
200  
150  
100  
50  
0
0
50  
100  
150  
200  
Ambient Temperature---T (℃)  
A
DTA114EN3  
CYStek Product Specification  
Spec. No. : C252N3  
Issued Date : 2003.05.27  
Revised Date :2016.06.02  
Page No. : 4/6  
CYStech Electronics Corp.  
Reel Dimension  
Carrier Tape Dimension  
DTA114EN3  
CYStek Product Specification  
Spec. No. : C252N3  
Issued Date : 2003.05.27  
Revised Date :2016.06.02  
Page No. : 5/6  
CYStech Electronics Corp.  
Recommended wave soldering condition  
Product  
Peak Temperature  
Soldering Time  
5 +1/-1 seconds  
Pb-free devices  
260 +0/-5 °C  
Recommended temperature profile for IR reflow  
Profile feature  
Average ramp-up rate  
(Tsmax to Tp)  
Sn-Pb eutectic Assembly  
Pb-free Assembly  
3°C/second max.  
3°C/second max.  
Preheat  
Temperature Min(TS min)  
Temperature Max(TS max)  
Time(ts min to ts max)  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
Time maintained above:  
Temperature (TL)  
Time (tL)  
183°C  
60-150 seconds  
240 +0/-5 °C  
217°C  
60-150 seconds  
260 +0/-5 °C  
Peak Temperature(TP)  
Time within 5°C of actual peak  
temperature(tp)  
10-30 seconds  
20-40 seconds  
Ramp down rate  
6°C/second max.  
6°C/second max.  
6 minutes max.  
8 minutes max.  
Time 25 °C to peak temperature  
Note : All temperatures refer to topside of the package, measured on the package body surface.  
DTA114EN3  
CYStek Product Specification  
Spec. No. : C252N3  
Issued Date : 2003.05.27  
Revised Date :2016.06.02  
Page No. : 6/6  
CYStech Electronics Corp.  
SOT-23 Dimension  
Marking:  
Product Code  
6A  
Date Code: Year+Month  
Year: 52015, 62016  
Month: 11, 22,‧‧‧  
99, A10, B11, C12  
3-Lead SOT-23 Plastic  
Surface Mounted Package  
CYStek Package Code: N3  
Style : Pin 1.Base 2.Emitter 3.Collector  
*:Typical  
Inches  
DIM  
Millimeters  
Inches  
Min. Max.  
Millimeters  
DIM  
Min.  
Max.  
Min.  
Max.  
3.04  
1.70  
1.30  
0.50  
2.30  
0.10  
Min.  
Max.  
0.20  
0.67  
1.15  
2.95  
0.65  
0.50  
A
B
C
D
G
H
0.1102 0.1204  
0.0472 0.0669  
0.0335 0.0512  
0.0118 0.0197  
0.0669 0.0910  
0.0000 0.0040  
2.80  
1.20  
0.89  
0.30  
1.70  
0.00  
J
K
L
S
V
0.0032 0.0079  
0.0118 0.0266  
0.0335 0.0453  
0.0830 0.1161  
0.0098 0.0256  
0.0118 0.0197  
0.08  
0.30  
0.85  
2.10  
0.25  
0.30  
L1  
Notes : 1.Controlling dimension : millimeters.  
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material :  
Lead :Pure tin plated.  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
CYStek reserves the right to make changes to its products without notice.  
CYSrek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
DTA114EN3  
CYStek Product Specification  

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