LM1114-5.0A3B-0-TB-G [CYSTEKEC]
Low Dropout CMOS Voltage Regulators;
| 型号： | LM1114-5.0A3B-0-TB-G |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | Low Dropout CMOS Voltage Regulators |
| 文件： | 总11页 (文件大小：321K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 1/11
CYStech Electronics Corp.
Low Dropout CMOS Voltage Regulators
LM1114
Features
Applications
● Maximum output current 300mA
● Highly accurate : output voltage+/-2%
● Low power consumption
●Battery powered equipment
●Palmtops
●Portable cameras and video recorders
●Reference voltage sources
● Small input/output differential:
0.36V typ at 300mA(Vout= 3.3V)
0.3V typ at 300mA(Vout=5V)
●Pb-free lead plating and halogen-free package
Product Description
The LM1114 series is a group of positive voltage output, three-pin regulators, that provide a high
current even when the input/output voltage differential is small. Low power consumption and high
accuracy is achieved through CMOS and programmable fuse technologies.
The LM1114 consists of a high-precision voltage reference, an error correction circuit, and a current
limited output driver. Transient response to load variations is improved in comparison to the existing
ones.
Absolute Maximum Ratings
Parameter
Symbol
Vin
Iout
Ratings
-0.3~+12
500
Units
V
mA
Input Voltage
Output Current
Continuous Total Power
Dissipation
TO-92
SOT-89
500
500
mW
PD
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
-40〜+125
-65〜+150
℃
℃
Pin Configuration
TO-92
SOT-89
1
2
3
1
2
3
Vss
Vin
Vout
Vss Vin Vout
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 2/11
CYStech Electronics Corp.
Block Diagram
VIN
VOUT
Current
Limit
Voltage
Reference
VSS
Typical Application Circuit
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 3/11
CYStech Electronics Corp.
Ordering Information
Device
Output Voltage
3.3V
Package
Shipping
Tape & Box / 2K
TO-92
LM1114-3.3 A3B-0-TB- G
(Pb-free lead plating and halogen-free package)
SOT-89
Tape & Reel / 1K
LM1114-3.3 M3B-0-T2- G
LM1114-5.0 A3B-0-TB- G
LM1114-5.0 M3B-0-T2- G
3.3V
5.0V
5.0V
(Pb-free lead plating and halogen-free package)
TO-92
Tape & Box / 2K
Tape & Reel / 1K
(Pb-free lead plating and halogen-free package)
SOT-89
(Pb-free lead plating and halogen-free package)
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T2 :1000 pcs/tape & reel, 7” reel ; TB : 2000 pcs/ tape & box
Product rank, zero for no rank products
Product name
Electrical Characteristics @Ta=25℃, CIN=1μF(tantalum), COUT=1μF(tantalum),
unless otherwise noted
LM1114-3.3
Parameter
Conditions
Min
Typ
Max
3.366
55
Units
V
Circuit
Output Voltage
Line Regulation
Io=40mA,Vin=4.3V
Io=1mA, 5.5V<Vin<12V
Io=40mA,4.3V<Vin<10V
Vin=5V, 0.1mA<Io<100mA
Vin=5V, 0.1mA<Io<300mA
Vin=4V
3.234
3.300
1
-
-
-
mV
mV
mV
mV
μA
ꢂꢃꢁ
1
-
60
1
Load Regulation
-
-
20
1
-
-
50
1
ꢀꢁ
ꢁ
Supply Current
Current Limit
-
9
50
Vin=7V
300
-
-
Io=80mA
-
-
0.1
0.2
0.36
0.3
0.4
0.6
V
V
V
1
1
1
Dropout Voltage
Io=160mA
Io=300mA
-
LM1114-5.0
Parameter
Conditions
Min
Typ
Max
5.100
60
Units
V
Circuit
Output Voltage
Line Regulation
Io=40mA,Vin=6.0V
Io=1mA, 5.5V<Vin<12V
Io=40mA, 6V<Vin<10V
Vin=7V, 0.1mA<Io<100mA
Vin=7V, 0.1mA<Io<300mA
Vin=6.0V
4.900
5.000
1
-
-
-
mV
mV
mV
mV
μA
ꢂꢃꢁ
1
-
55
1
Load Regulation
-
-
-
40
1
-
60
1
ꢀꢁ
Supply Current
Current Limit
-
16
-
50
ꢁ
Vin=7V
300
-
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 4/11
CYStech Electronics Corp.
Dropout Voltage
Io=100mA
Io=200mA
Io=300mA
-
-
-
0.1
0.2
0.3
0.3
0.4
0.6
V
V
V
1
1
1
Test Circuits
Circuit 1
Circuit 2
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 5/11
CYStech Electronics Corp.
Characteristic Curves @CIN=1μF(tantalum), COUT=1μF(tantalum)
LM1114-3.3
Output Voltage vs Input Voltage
Input-Output Voltage Differential
400
350
300
250
200
150
100
50
4.0
3.5
3.0
2.5
2.0
1.5
1.0
Iout=1mA
Iout=40mA
Iout=80mA
0
0
50
100
150
200
250
300
0
2
4
6
8
10
12
Iout, Output Current (mA)
Vin, Input Voltage(V)
Supply Current vs Input Voltage
10
9
8
7
6
5
4
3
2
1
0
0
2
4
6
8
10
12
Vin, Input Voltage(V)
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 6/11
CYStech Electronics Corp.
LM1114-5.0
Output Voltage vs Input Voltage
Input-Output Voltage Differential
5.5
5.0
4.5
4.0
3.5
350
300
250
200
150
100
50
Iout=1mA
Iout=40mA
Iout=80mA
0
3.0
0
0
50
100
150
200
250
300
2
4
6
8
10
12
Iout, Output Current (mA)
Vin, Input Voltage(V)
Supply Current vs Input Voltage
18
16
14
12
10
8
6
4
2
0
0
2
4
6
8
10
12
Vin, Input Voltage(V)
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 7/11
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25 °C to peak temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 8/11
CYStech Electronics Corp.
TO-92 Taping Outline
H2AH2A
D2
H2
H2
A
H3
H4 H
L
L1
W1
H1
W
D1
D
F1F2
P
P1
T2
T
T1
P2
Millimeters
DIM
Item
Min.
4.33
3.80
0.36
4.33
2.40
-
15.50
8.50
-
Max.
4.83
4.20
0.53
4.83
2.90
0.3
16.50
9.50
1
A
D
Component body height
Tape Feed Diameter
Lead Diameter
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
-
-
-
-
1
27
21
11
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
L1
P
2.50
12.50
5.95
50.30
-
-
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
P1
P2
T
T1
T2
W
-
0.36
17.50
5.00
253
W1
-
Adhesive Tape Width
20 pcs Pitch
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 9/11
CYStech Electronics Corp.
Reel Dimension for SOT-89
Carrier Tape Dimension
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 10/11
CYStech Electronics Corp.
TO-92 Dimension
α2
α3
Marking:
A
B
1
2
3
LM
1114
□□□□
Device Name
Date Code
Voltage:
1.8V→18
2.5V→25
3.0V→30
3.3V→33
3.6V→36
5.0V→50
C
E
D
H
G
α1
Style: Pin 1.Vss 2.Vin 3.Vout
I
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
F
*: Typical
Inches
Min. Max.
0.1704 0.1902
0.1704 0.1902
Millimeters
Inches
Min. Max.
0.0142 0.0220
Millimeters
DIM
DIM
Min.
4.33
4.33
12.70
0.36
-
Max.
4.83
4.83
-
0.56
*1.27
3.76
Min.
0.36
Max.
0.56
*2.54
*1.27
*5°
A
B
C
D
E
F
G
H
I
α1
α2
α3
-
-
-
-
-
*0.1000
*0.0500
*5°
-
-
-
-
-
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
-
-
*2°
*2°
*2°
3.36
*2°
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 18,2002.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
LM1114M3B/A3B
CYStek Product Specification
Spec. No. : C505M3-A
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 11/11
CYStech Electronics Corp.
SOT-89 Dimension
Marking:
A
2
1
3
1114
□□B□□□
Device Code
H
C
Voltage:
1.8V→18
2.5V →25
3.0V→30
3.3V→33
3.6V→36
5.0V→50
D
B
Date Code
E
I
F
G
Style: Pin 1. Vss 2. Vin 3. Vout
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
*: Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
0.0583 0.0598
0.1165 0.1197
0.0551 0.0630
0.0138 0.0161
Millimeters
DIM
DIM
Min.
Max.
4.60
4.25
1.70
2.60
0.51
Min.
1.48
2.96
1.40
0.35
Max.
1.527
3.04
1.60
0.41
A
B
C
D
E
0.1732 0.1811
0.1594 0.1673
0.0591 0.0663
0.0945 0.1024
0.01417 0.0201
4.40
4.05
1.50
2.40
0.36
F
G
H
I
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
LM1114M3B/A3B
CYStek Product Specification
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