LM1117-5.0L3-0-T3-G [CYSTEKEC]

1A Low Dropout Positive Voltage Regulator;
LM1117-5.0L3-0-T3-G
型号: LM1117-5.0L3-0-T3-G
厂家: CYSTECH ELECTONICS CORP.    CYSTECH ELECTONICS CORP.
描述:

1A Low Dropout Positive Voltage Regulator

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中文:  中文翻译
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Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 1/8  
CYStech Electronics Corp.  
1A Low Dropout Positive Voltage Regulator  
LM1117L3 series  
Features  
Description  
Adjustable or Fixed Output  
Output Current of 1A  
Low Dropout, 1.4V max at 1A Output Current  
Good Noise Rejection  
Output Current Limiting  
Built-in Thermal Shutdown  
Fast Transient Response  
Pb-free lead plating package  
The LM1117 series of positive adjustable and fixed  
regulators are designed to provide 1A with high  
efficiency. All internal circuitry is designed to  
operate down to 1.4V input to output differential.  
The product is specifically designed to provide well-  
regulated supply for low-voltage IC application such  
as high-speed bus termination and low current 3.3V  
logic supply, and other applications such as VGA cards.  
Can operate using MLCCs in the capacitance range  
of 2μF to 10μF  
Applications  
High Efficiency Linear Regulators  
Post Regulators for Switching Supplies  
Adjustable Power Supply  
Typical Application Data  
Fixed Voltage Regulator  
TAB  
VIN>4.75V  
VOUT=3.3V  
3
2
OUT  
IN  
+
GND  
1
C1  
10μF, Tan.  
+
C2  
10μF, Tan. Min  
Notes:  
1)C1 needed if device is far from filter capacitors  
2)C2 minimum value requir ed for stability  
Adjustable Voltage Regulator  
TAB  
VIN>4.75V  
VOUT=3.45V  
3
2
OUT  
IN  
ADJ  
1
R1  
133,1%  
+
C1  
10μF, Tan.  
+
C2  
10μF, Tan. Min  
R2  
232, 1%  
VOUT=VREF×(1+R2/R1)+IADJ×R2  
Notes:  
1)C1 needed if device is far from filter capacitors  
2)C2 minimum value required for stability  
LM1117L3 series  
CYStek Product Specification  
Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 2/8  
CYStech Electronics Corp.  
Package Information  
Pin  
1
2
Name  
ADJ/GND  
OUTPUT  
INPUT  
1
2
3
3
SOT-223  
Absolute Maximum Ratings  
Symbol  
Parameter  
Maximum  
Units  
PD  
VIN  
TOPR  
Power Dissipation  
Input Voltage  
Operating Junction Temperature Range  
850  
-0.3 ~ +15  
-40 ~ +125  
mW  
V
TSTG  
TMJ  
Storage Temperature  
Maximum Junction Temperature  
-65 ~ +150  
150  
Ordering Information  
Device  
Output Voltage  
Adjustable  
1.5V  
Package  
SOT-223  
(pb-free lead plating and 2500 pcs/ tape & reel  
halogen-free package)  
Shipping  
LM1117-ADJL3-0-T3-G  
LM1117-1.5L3-0-T3-G  
LM1117-1.8L3-0-T3-G  
LM1117-2.5L3-0-T3-G  
LM1117-3.3L3-0-T3-G  
LM1117-5.0L3-0-T3-G  
1.8V  
2.5V  
3.3V  
5.0V  
Block Diagram  
LM1117L3 series  
CYStek Product Specification  
Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 3/8  
CYStech Electronics Corp.  
Electrical Characteristics @ IO=10mA,TJ=25, unless otherwise specified  
Parameter  
Device  
Test Conditions  
Min Typ Max Units  
Reference voltage  
Adj version  
1.225 1.250  
1.275  
VIN-VOUT=1.5V  
V
3.0VVIN12V  
3.3VVIN12V  
4.0VVIN12V  
4.8VVIN12V  
6.5VVIN12V  
1.470 1.500 1.530  
1.764 1.800 1.836  
2.450 2.500 2.550  
3.235 3.300 3.365  
4.900 5.000 5.100  
V
V
V
V
V
%
Output Voltage  
LM1117-1.5  
LM1117-1.8  
LM1117-2.5  
LM1117-3.3  
LM1117-5.0  
Line Regulation  
All version VOUT+1.5VVIN12V  
-
-
-
-
-
-
-
-
0.2  
1
Load Regulation  
(Note 1, 2)  
LM1117-ADJ VIN=3.3V, Vadj=0, 10mAIO1A  
-
%
VIN=3.0V, 0mAIO1A  
VIN=3.3V, 0mAIO1A  
VIN=4.0V, 0mAIO1A  
VIN=5.0V, 0mAIO1A  
VIN=8.0V, 0mAIO1A  
12  
15  
20  
26  
40  
15  
18  
25  
33  
50  
mV  
mV  
mV  
mV  
mV  
LM1117-1.5  
LM1117-1.8  
LM1117-2.5  
LM1117-3.3  
LM1117-5.0  
Dropout Voltage  
All version  
IO=1A (ΔVOUT=1%VOUT)  
-
1.3  
-
1.4  
-
V
A
(VIN-VOUT)  
Current Limit  
All version VIN-VOUT=5V  
Adj version VIN=5V  
1.1  
Minimum Load  
Current  
-
5
10  
mA  
Adjust Pin Current  
Quiescent Current  
Adj version VIN=12V, IO=10mA  
Fixed version VIN=12V, IO=0mA  
-
-
50  
-
100  
12  
μA  
mA  
All version  
All version  
-
60  
-
0.008 0.04 %/W  
TA=25, 30ms pulse  
Thermal Regulation  
Ripple Rejection  
f=120Hz, VIN=VOUT+3V, IO= 1A,  
70  
-
-
dB  
%
COUT=25μF tantalum  
Temperature Stability  
All version IO= 10mA  
All version  
0.5  
Thermal Resistance,  
Junction to Ambient(  
No heat sink, no air  
flow)  
-
-
117  
15  
-
-
/W  
/W  
Thermal Resistance,  
Junction to Case  
All version Control Circuitry/ Power transistor  
Note : 1.See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at  
a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead 1/18” from the  
package.  
2. Line and load regulation are guaranteed up to the maximum power dissipation of 3W. Power dissipation is determined by the  
difference in input and output and the output current. Guaranteed maximum power dissipation will not be available over the full  
input/output range.  
LM1117L3 series  
CYStek Product Specification  
Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 4/8  
CYStech Electronics Corp.  
Characteristic Curves  
LM1117L3 series  
CYStek Product Specification  
Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 5/8  
CYStech Electronics Corp.  
Recommended soldering footprint  
LM1117L3 series  
CYStek Product Specification  
Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 6/8  
CYStech Electronics Corp.  
Reel Dimension  
Carrier Tape Dimension  
LM1117L3 series  
CYStek Product Specification  
Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 7/8  
CYStech Electronics Corp.  
Recommended wave soldering condition  
Product  
Peak Temperature  
Soldering Time  
5 +1/-1 seconds  
Pb-free devices  
260 +0/-5 °C  
Recommended temperature profile for IR reflow  
Profile feature  
Average ramp-up rate  
(Tsmax to Tp)  
Sn-Pb eutectic Assembly  
Pb-free Assembly  
3°C/second max.  
3°C/second max.  
Preheat  
Temperature Min(TS min)  
Temperature Max(TS max)  
Time(ts min to ts max)  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
Time maintained above:  
Temperature (TL)  
Time (tL)  
183°C  
60-150 seconds  
240 +0/-5 °C  
217°C  
60-150 seconds  
260 +0/-5 °C  
Peak Temperature(TP)  
Time within 5°C of actual peak  
temperature(tp)  
10-30 seconds  
20-40 seconds  
Ramp down rate  
6°C/second max.  
6°C/second max.  
6 minutes max.  
8 minutes max.  
Time 25 °C to peak temperature  
Note : All temperatures refer to topside of the package, measured on the package body surface.  
LM1117L3 series  
CYStek Product Specification  
Spec. No. : C506L3  
Issued Date : 2003.03.22  
Revised Date :2013.06.19  
Page No. : 8/8  
CYStech Electronics Corp.  
SOT-223 Dimension  
A
Marking:  
Vout:  
1.5V-15  
1.8V-18  
Device Name  
1117□□□  
□□□□  
2.5V-25  
3.3V-33  
5.0V-50  
ADJblank  
Date Code : (from left to right)  
B
C
1st code : year code, 12011,  
22012, …,etc.  
1
2
F
3
2nd code : month code, referring to the  
following table  
3
rd and 4th codes : production lot serial  
number , 01, 02, 03, … etc  
D
E
a1  
H
Style: Pin 1.Adj/Gnd 2.Output 3.Input  
I
G
3-Lead SOT-223 Plastic  
Surface Mounted Package  
CYStek Package Code: L3  
a2  
Month code :  
Month  
Jan  
A
Feb  
B
Mar  
C
Apr  
D
May  
E
Jun  
F
Jul  
G
Aug  
H
Sep  
J
Oct  
K
Nov  
L
Dec  
M
Code  
*: Typical  
Inches  
Min.  
Millimeters  
Min. Max.  
Inches  
Millimeters  
DIM  
DIM  
Max.  
0.1220  
0.2874  
0.1457  
0.0315  
-
Min.  
Max.  
Min.  
1.40  
0.25  
0.02  
*13o  
0 o  
Max.  
1.80  
0.35  
0.10  
-
A
B
C
D
E
F
0.1142  
0.2638  
0.1299  
0.0236  
*0.0906  
0.2480  
2.90  
6.70  
3.30  
0.60  
*2.30  
6.30  
3.10  
7.30  
3.70  
0.80  
-
G
H
I
a1  
a2  
0.0551  
0.0098  
0.0008  
*13o  
0.0709  
0.0138  
0.0039  
-
0 o  
10 o  
10 o  
0.2638  
6.70  
Notes: 1.Controlling dimension: millimeters.  
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material:  
Lead: Pure tin plated.  
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
CYStek reserves the right to make changes to its products without notice.  
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
LM1117L3 series  
CYStek Product Specification  

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