DS1217M1-25 [DALLAS]

Nonvolatile Read/Write Cartridge; 非易失性读/写墨盒
DS1217M1-25
型号: DS1217M1-25
厂家: DALLAS SEMICONDUCTOR    DALLAS SEMICONDUCTOR
描述:

Nonvolatile Read/Write Cartridge
非易失性读/写墨盒

存储 内存集成电路 静态存储器
文件: 总8页 (文件大小:87K)
中文:  中文翻译
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DS1217M  
DS1217M  
Nonvolatile Read/Write Cartridge  
FEATURES  
PIN ASSIGNMENT  
User-insertable  
Name  
Position  
A1  
Name  
Ground  
+5 Volts  
No Connect  
Address 14  
Address 12  
Address 7  
Address 6  
Address 5  
Address 4  
Address 3  
Address 2  
Address 1  
Address 0  
Data I/O 0  
Data I/O 1  
Data I/O 2  
Ground  
B1  
Data retention greater than 5 years  
Capacity up to 512K x 8  
A2  
B2  
Write Enable  
Address 13  
Address 8  
A3  
B3  
A4  
B4  
Standard bytewide pinout facilitates connection to  
JEDEC 28-pin DIP via ribbon cable  
A5  
B5  
Address 9  
A6  
B6  
Software-controlled banks maintain 32 x 8 JEDEC  
28-pin compatibility  
Address 11  
Output Enable  
Address 10  
Cartridge Enable  
Data I/O 7  
A7  
B7  
A8  
B8  
A9  
B9  
Multiple cartridges can reside on a common bus  
A10  
A11  
A12  
A13  
A14  
A15  
B10  
B11  
B12  
B13  
B14  
B15  
Automatic write protection circuitry safeguards  
against data loss  
Data I/O 6  
Data I/O 5  
Manual switch unconditionally protects data  
Compact size and shape  
Data I/O 4  
Data I/O 3  
Rugged and durable  
Wide operating temperature range of 0°C to 70°C  
3”  
A1  
B1  
See Mech. Drawings Section  
DESCRIPTION  
The DS1217M is a nonvolatile RAM designed for porta-  
ble applications requiring a rugged and durable pack-  
age. The Nonvolatile Cartridge has memory capacities  
from 64K x 8 to 512K x 8. The cartridge is accessed in  
continuous 32K byte banks. Bank switching is accom-  
plished under software control by pattern recognition  
fromtheaddressbus. Acardedgeconnectorisrequired  
for connection to a host system. A standard 30-pin con-  
nector can be used for direct mount to a printed circuit  
board. Alternatively, remote mounting can be accom-  
plished with a ribbon cable terminated with a 28-pin DIP  
plug. The remote method can be used to retrofit existing  
systems which have JEDEC 28-pin bytewide memory  
sites.  
030598 1/8  
DS1217M  
source. Normal RAM operation can resume after V  
exceeds 4.5 volts.  
READ MODE  
CC  
The DS1217M executes a read cycle whenever WE  
(write enable) is inactive (high) and CE (cartridge en-  
able) is active (low). The unique address specified by  
the address inputs (A0-A14) defines which byte of data  
is to be accessed. Validdatawillbeavailabletotheeight  
TheDS1217Mchecksbatterystatustowarnofpotential  
data loss. Each time that V power is restored to the  
CC  
cartridge the battery voltage is checked with a precision  
comparator. If the battery supply is less than 2.0 volts,  
the second memory cycle is inhibited. Battery status  
can, therefore, be determined by performing a read  
cycle after power-up to any location in memory, record-  
ing that memory location content. A subsequent write  
cycle can then be executed to the same memory loca-  
tion, altering data. If the next read cycle fails to verify the  
written data, the contents of the memory are question-  
able.  
data I/O pins within t  
(access time) after the last ad-  
ACC  
dress input signal is stable, providing that CE (cartridge  
enable) and OE (output enable) access times are also  
satisfied. If OE and CE times are not satisfied, then data  
access mustbemeasuredfromthelateoccurringsignal  
(CE or OE) and the limiting parameter is either t  
for  
CO  
CE or t  
for OE rather than address access. Read  
OE  
cycles can only occur when V  
is greater than 4.5  
CC  
volts. When V is less than 4.5 volts, the memory is in-  
CC  
hibited and all accesses are ignored.  
In many applications, data integrity is paramount. The  
cartridge thus has redundant batteries and an internal  
isolationswitchwhichprovidesfortheconnectionoftwo  
batteries. During battery backup time, the battery with  
the highest voltage is selected for use. If one battery  
fails, the other will automatically take over. The switch  
between batteries is transparent to the user. A battery  
status warning will occur only if both batteries are less  
than 2.0 volts.  
WRITE MODE  
The DS1217M is in the write mode whenever both the  
WE and CE signals are in the active (low) state after ad-  
dress inputs are stable. The last occurring falling edge  
of either CE or WE will determine the start of the write  
cycle. The write cycle is terminated by the first rising  
edge of either CE or WE. All address inputs must be  
kept valid throughout the write cycle. WE must return to  
the high state for a minimum recovery time (t ) before  
WR  
BANK SWITCHING  
another cycle can be initiated.The OE control signal  
should be kept inactive (high) during write cycles to  
avoid bus contention. However, if the output bus has  
been enabled (CE and OE active) then WE will disable  
Bank switching is accomplished via address lines A8,  
A9,A10, andA11.Initially, onpower-upallbanksarede-  
selectedsothatmultiplecartridgescanresideonacom-  
monbus. Bank switching requires that a predefined pat-  
tern of 64 bits is matched by sequencing 4 address  
inputs(A8 through A11) 16 times while ignoring all other  
addressinputs. Priortoenteringthe64-bitpatternwhich  
will set the band switch, a read cycle of 1111 (address  
inputs A8 through A11) must be executed to guarantee  
that pattern entry starts with the first set of 3 bits. Each  
set of address inputs is entered into the DS1217M by  
executing read cycles.The first eleven cycles must  
match the exact bit pattern as shown in Table 2. The last  
five cycles must match the exact bit pattern for address-  
es A9, A10, and A11. However, address line 8 defines  
which of the 16 banks is to be enabled, or all banks are  
deselected, as per Table 3. Switching from one bank to  
another occurs as the last of the 16 read cycles is com-  
pleted. A single bank is selected at any one time. A se-  
lected bank will remain active until a new bank is se-  
lected, all banks are deselected, or until power is lost.  
(See DS1222 BankSwitch Chip data sheet for more de-  
tail.)  
the outputs in t  
from its falling edge. Write cycles  
ODW  
canonlyoccurwhenV isgreaterthan4.5volts. When  
CC  
V
CC  
is less than 4.5 volts, the memory is write-pro-  
tected.  
DATA RETENTION MODE  
The Nonvolatile Cartridge provides full functional capa-  
bilityfor V greater than 4.5 volts and guarantees write  
CC  
protection for V  
less than 4.5 volts. Data is main-  
CC  
tainedin the absence of V without any additional sup-  
CC  
port circuitry. The DS1217M constantly monitors V  
.
CC  
Should the supply voltage decay, the RAM is automati-  
cally write-protected below 4.5 volts. As V falls below  
CC  
approximately3.0volts, thepowerswitchingcircuitcon-  
nects a lithium energy source to RAM to retain data.  
During power-up, when V rises above approximately  
CC  
3.0volts, the power switching circuit connects theexter-  
nal V to the RAM and disconnects the lithium energy  
CC  
030598 2/8  
DS1217M  
Number 499188-4. The 28-pin ribbon cable must be  
right-justified, such that positions A1 and B1 are left dis-  
connected. For applications where the cartridge is in-  
stalledorremovedwithpowerapplied,bothgroundcon-  
tacts (A1 and B1) on the card edge connector should be  
grounded to further enhance data integrity. Access time  
push-out may occur as the distance between the car-  
tridge and the driving circuitry is increased.  
REMOTE CONNECTION VIA A RIBBON  
CABLE  
Existing systems which contain 28-pin bytewide sock-  
ets can be retrofitted using a 28-pin DIP plug. The DIP  
plug, AMP Part Number 746616-2, can be inserted into  
the28-pinsiteafterthememoryisremoved.Connection  
to the cartridge is accomplished via a 28-pin cable con-  
nected to a 30-contact card edge connector, AMP Part  
CARTRIDGE NUMBERING Table 1  
PART NO.  
DENSITY  
64K x 8  
NO. OF BANKS  
DS1217M 1/2-25  
DS1217M 1-25  
DS1217M 2-25  
DS1217M 3-25  
DS1217M 4-25  
2
4
128K x 8  
156K x 8  
384K x 8  
512K x 8  
8
12  
16  
ADDRESS INPUT PATTERN Table 2  
ADDRESS  
BIT SEQUENCE  
INPUTS  
0
1
0
1
0
1
0
1
0
1
2
1
0
1
0
3
0
1
0
1
4
0
1
0
1
5
0
1
0
1
6
1
0
1
0
7
1
0
1
0
8
0
1
0
1
9
1
1
1
0
10 11 12 13 14 15  
A8  
0
0
0
1
X
0
1
0
X
0
1
0
X
0
1
0
X
1
0
1
X
1
0
1
A9  
A10  
A11  
X = See Table 3  
BANK SELECT TABLE Table 3  
BANK  
A8 BIT SEQUENCE  
BANK  
A8 BIT SEQUENCE  
SELECTED  
BANKS OFF  
BANK 0  
BANK 1  
BANK 2  
BANK 3  
BANK 4  
BANK 5  
BANK 6  
11  
0
1
1
1
1
1
1
1
12  
X
0
13  
X
0
14  
X
0
15  
X
0
BANK 7  
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
0
0
1
1
0
0
1
1
1
BANK 8  
0
1
0
1
0
1
0
1
BANK 9  
0
0
0
1
BANK 10  
BANK 11  
BANK 12  
BANK 13  
BANK 14  
BANK 15  
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
030598 3/8  
DS1217M  
ABSOLUTE MAXIMUM RATINGS*  
Voltage on Connection Relative to Ground  
Operation Temperature  
-0.3V to + 7.0V  
0°C to 70°C  
Storage Temperature  
-40°C to +70°C  
* This is a stress rating only and functional operation of the device at these or any other conditions above those  
indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods of time may affect reliability.  
RECOMMENDED DC OPERATION CONDITIONS  
(0°C to 70°C)  
PARAMETER  
SYMBOL  
MIN  
4.5  
2.2  
0.0  
TYP  
MAX  
UNITS  
NOTES  
Power Supply Voltage  
Input High Voltage  
Input Low Voltage  
V
CC  
5.0  
5.5  
V
V
V
V
IH  
V
CC  
V
IL  
+0.8  
DC ELECTRICAL CHARACTERISTICS  
(0°C to 70°C; VCC = 5V ± 10%)  
PARAMETER  
SYMBOL  
MIN  
-60  
-10  
TYP  
MAX  
UNITS  
NOTES  
Input Leakage Current  
I
IL  
+60  
µA  
I/O Leakage Current  
I
IO  
+10  
µA  
CE > V < V  
IH  
CC  
Output Current @ 2.4V  
Output Current @ 0.4V  
Standby Current CE = 2.2V  
Operating Current  
I
-1.0  
2.0  
-2.0  
3.0  
15  
mA  
mA  
mA  
mA  
OH  
I
OL  
I
25  
CCS1  
CCO1  
I
50  
100  
CAPACITANCE  
PARAMETER  
(tA =25°C)  
SYMBOL  
MIN  
TYP  
MAX  
100  
UNITS  
pF  
NOTES  
Input Capacitance  
C
IN  
Input/Output Capacitance  
C
100  
pF  
OUT  
030598 4/8  
DS1217M  
AC ELECTRICAL CHARACTERISTICS  
(0°C to 70°C; VCC = 5V+ 10%)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
ns  
NOTES  
Read Cycle Time  
t
250  
RC  
Access Time  
t
250  
125  
210  
ns  
ACC  
OE to Output Valid  
CE to Output Valid  
OE or CE to Output Active  
Output High Z From Deselection  
t
ns  
OE  
CO  
t
ns  
t
5
5
ns  
5
5
COE  
t
125  
ns  
OD  
OH  
Output Hold From  
Address Change  
t
ns  
Read Recovery Time  
Write Cycle Time  
t
40  
250  
170  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RR  
t
WC  
Write Pulse Width  
t
3
WP  
Address Setup Time  
Write Recovery Time  
Output High Z From WE  
Output Active From WE  
Data Setup Time  
t
AW  
WR  
t
20  
t
100  
5
5
4
4
ODW  
t
5
OEW  
t
100  
20  
DS  
Data Hold Time From WE  
t
DH  
030598 5/8  
DS1217M  
t
RC  
READ CYCLE (1)  
V
IH  
V
IL  
V
IH  
V
IL  
V
IH  
V
IL  
ADDRESSES  
t
ACC  
t
OH  
V
IH  
t
CO  
V
IH  
CE  
OE  
V
IL  
t
OD  
V
IH  
t
OE  
V
IH  
V
IL  
t
t
OD  
COE  
t
COE  
V
OUTPUT  
DATA VALID  
V
V
OH  
OL  
OH  
OL  
D
OUT  
V
t
WC  
WRITE CYCLE 1 (2), (6), (7)  
V
IH  
V
IL  
V
IH  
V
IL  
V
IH  
IL  
ADDRESSES  
V
t
AW  
V
V
V
V
CE  
IL  
IL  
t
t
WR  
WP  
V
IH  
V
IH  
OEW  
WE  
IL  
IL  
t
t
ODW  
HIGH  
IMPEDANCE  
D
OUT  
IN  
t
t
DH  
DS  
V
IH  
V
IH  
DATA IN  
STABLE  
D
V
IL  
V
IL  
t
WC  
WRITE CYCLE 2 (2), (8)  
V
V
V
IH  
V
IL  
V
V
IH  
IL  
IH  
IL  
ADDRESSES  
t
t
AW  
WR  
t
WP  
CE  
V
V
IH  
IH  
V
V
V
IL  
IL  
V
IL  
V
IH  
WE  
V
IL  
IL  
t
ODW  
t
COE  
D
D
OUT  
t
t
DH  
DS  
V
V
V
V
IH  
IH  
DATA IN  
STABLE  
IN  
IL  
IL  
030598 6/8  
DS1217M  
POWER-DOWN/POWER-UP CONDITION  
V
CC  
4.50V  
3.2V  
t
F
t
R
t
REC  
t
PD  
CE  
DATA RETENTION TIME  
LEAKAGE CURRENT I  
L
SUPPLIED FROM LITHIUM CELL  
t
DR  
POWER-DOWN/POWER-UP TIMING  
(0° to 70°C)  
PARAMETER  
SYMBOL  
MIN  
0
TYP  
MAX  
UNITS  
µs  
NOTES  
CE at VIH before Power-Down  
t
10  
PD  
V
CC  
slew from 4.5V to 0V  
t
F
100  
µs  
(CE at V  
)
IH  
V
slew from 0V to 4.5V  
t
0
2
µs  
CC  
R
(CE at V  
)
IH  
CE at V after Power-Up  
t
125  
ms  
10  
IH  
REC  
(tA=25°C)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
NOTES  
Expected Data Retention Time  
t
5
years  
9
DR  
WARNING:  
Undernocircumstancesarenegativeundershoots, ofanyamplitude, allowedwhendeviceisinbatterybackupmode.  
030598 7/8  
DS1217M  
NOTES:  
1. WE is high for a read cycle.  
2. OE = V or V . If OE = V during a write cycle, the output buffers remain in a high impedance state.  
IH  
IL  
IH  
3. t  
is specified as the logical AND of CE and WE. t  
is measured from the latter of CE or WE going low to  
WP  
WP  
the earlier of CE of WE going high.  
4. t , t are measured from the earlier of CE or WE going high.  
DH DS  
5. These parameters are sampled with a 5 pF load and are not 100% tested.  
6. If the CE low transition occurs simultaneously with or later than the WE low transition in Write Cycle 1, the  
output buffers remain in a high impedance state in this period.  
7. If the CE high transition occurs prior to or simultaneously with the WE high transition in Write Cycle 1, the  
output buffers remain in a high impedance state in this period.  
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition, the output  
buffers remain in a high impedance state in this period.  
9. Each DS1217M is marked with a 4-digit date code AABB. AA designates the year of manufacture. BB desig-  
nates the week of manufacture. The expected t is defined as starting at the date of manufacture.  
DR  
10.Removing and installing the cartridge with power applied may disturb data.  
DC TEST CONDITIONS  
Outputs Open  
t Cycle = 250 ns  
AC TEST CONDITIONS  
Output Load: 100pF + 1TTL Gate  
Input Pulse Levels: 0-3.0V  
Timing Measurement Reference Levels  
Input: 1.5V  
All Voltages Are Referenced to Ground  
Output: 1.5V  
Input Pulse Rise and Fall Times: 5ns  
030598 8/8  

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