DS1345W [DALLAS]

3.3V 1024k Nonvolatile SRAM with Battery Monitor; 3.3V 1024K非易失SRAM,带有电池监控器
DS1345W
型号: DS1345W
厂家: DALLAS SEMICONDUCTOR    DALLAS SEMICONDUCTOR
描述:

3.3V 1024k Nonvolatile SRAM with Battery Monitor
3.3V 1024K非易失SRAM,带有电池监控器

电池 内存集成电路 静态存储器 监控
文件: 总12页 (文件大小:250K)
中文:  中文翻译
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DS1345W  
3.3V 1024k Nonvolatile SRAM  
with Battery Monitor  
www.maxim-ic.com  
FEATURES  
PIN ASSIGNMENT  
C 10 years minimum data retention in the  
absence of external power  
C Data is automatically protected during power  
loss  
BW  
A15  
A16  
RST  
VCC  
NC  
NC  
A14  
A13  
A12  
A11  
A10  
A9  
1
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
2
3
C Power supply monitor resets processor when  
4
5
V
CC power loss occurs and holds processor in  
WE  
6
OE  
7
reset during VCC ramp-up  
CE  
8
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ2  
DQ1  
DQ0  
GND  
A8  
9
C Battery monitor checks remaining capacity  
daily  
A7  
10  
11  
12  
13  
14  
15  
16  
17  
A6  
A5  
C Read and write access times as fast as 100 ns  
C Unlimited write cycle endurance  
C Typical standby current 50 µA  
C Upgrade for 128k x 8 SRAM, EEPROM or  
Flash  
A4  
A3  
A2  
VBAT  
GND  
A1  
A0  
34-Pin PowerCap Module (PCM)  
(Uses DS9034PC PowerCap)  
C Lithium battery is electrically disconnected to  
retain freshness until power is applied for the  
first time  
PIN DESCRIPTION  
A0-A16  
DQ0-DQ7  
CE  
WE  
OE  
RST  
BW  
- Address Inputs  
C Optional industrial temperature range of  
-40°C to +85°C, designated IND  
C PowerCap Module (PCM) package  
- Directly surface-mountable module  
- Replaceable snap-on PowerCap provides  
lithium backup battery  
- Data In/Data Out  
- Chip Enable  
- Write Enable  
- Output Enable  
- Reset Output  
- Battery Warning Output  
- Power (+3.3 Volts)  
- Ground  
- Standardized pinout for all nonvolatile  
SRAM products  
VCC  
GND  
NC  
- Detachment feature on PowerCap allows  
easy removal using a regular screwdriver  
- No Connect  
DESCRIPTION  
The DS1345W 3.3V 1024k Nonvolatile SRAM is a 1,048,576-bit, fully static, nonvolatile SRAM  
organized as 131,072 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and  
control circuitry, which constantly monitors VCC for an out-of-tolerance condition. When such a condition  
occurs, the lithium energy source is automatically switched on and write protection is unconditionally  
enabled to prevent data corruption. Additionally, the DS1345W has dedicated circuitry for monitoring the  
status of VCC and the status of the internal lithium battery. DS1345W devices in the PowerCap Module  
package are directly surface mountable and are normally paired with a DS9034PC PowerCap to form a  
complete Nonvolatile SRAM module. The devices can be used in place of 128k x 8 SRAM, EEPROM or  
Flash components.  
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071701  
DS1345W  
READ MODE  
The DS1345W executes a read cycle whenever WE (Write Enable) is inactive (high) and CE (Chip  
Enable) and OE (Output Enable) are active (low). The unique address specified by the 17 address inputs  
(A0 - A16) defines which of the 131,072 bytes of data is to be accessed. Valid data will be available to the  
eight data output drivers within tACC(Access Time) after the last address input signal is stable, providing  
that CE and OE (Output Enable) access times are also satisfied. If OE and CE access times are not  
satisfied, then data access must be measured from the later occurring signal (CE or OE ) and the limiting  
parameter is either tCO for CE or tOE for OE rather than address access.  
WRITE MODE  
The DS1345W executes a write cycle whenever the WE and CE signals are in the active (low) state after  
address inputs are stable. The later occurring falling edge of CE or WE will determine the start of the  
write cycle. The write cycle is terminated by the earlier rising edge of CE or WE . All address inputs must  
be kept valid throughout the write cycle. WE must return to the high state for a minimum recovery time  
(tWR) before another cycle can be initiated. The OE control signal should be kept inactive (high) during  
write cycles to avoid bus contention. However, if the output drivers are enabled ( CE and OE active) then  
WE will disable the outputs in tODW from its falling edge.  
DATA RETENTION MODE  
The DS1345W provides full functional capability for VCC greater than 3.0 volts and write protects by 2.8  
volts. Data is maintained in the absence of VCC without any additional support circuitry. The nonvolatile  
static RAMs constantly monitor VCC. Should the supply voltage decay, the NV SRAMs automatically  
write protect themselves, all inputs become “don’t care,” and all outputs become high impedance. As VCC  
falls below approximately 2.5 volts, the power switching circuit connects the lithium energy source to  
RAM to retain data. During power-up, when VCC rises above approximately 2.5 volts, the power  
switching circuit connects external VCC to the RAM and disconnects the lithium energy source. Normal  
RAM operation can resume after VCC exceeds 3.0 volts.  
SYSTEM POWER MONITORING  
The DS1345W has the ability to monitor the external VCC power supply. When an out-of-tolerance power  
supply condition is detected, the NV SRAM warns a processor-based system of impending power failure  
by asserting RST . On power up, RST is held active for 200ms nominal to prevent system operation  
during power-on transients and to allow tREC to elapse. RST has an open-drain output driver.  
BATTERY MONITORING  
The DS1345W automatically performs periodic battery voltage monitoring on a 24-hour time interval.  
Such monitoring begins within tREC after VCC rises above VTP and is suspended when power failure  
occurs.  
After each 24-hour period has elapsed, the battery is connected to an internal 1Mtest resistor for 1  
second. During this 1 second, if battery voltage falls below the battery voltage trip point (2.6V), the  
battery warning output BW is asserted. Once asserted, BW remains active until the module is replaced.  
The battery is still retested after each VCC power-up, however, even if BW is active. If the battery voltage  
is found to be higher than 2.6V during such testing, BW is de-asserted and regular 24-hour testing  
resumes. BW has an open-drain output driver.  
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DS1345W  
FRESHNESS SEAL  
Each DS1345W is shipped from Dallas Semiconductor with its lithium energy source disconnected,  
guaranteeing full energy capacity. When VCC is first applied at a level greater than VTP, the lithium  
energy source is enabled for battery backup operation.  
PACKAGES  
The 34-pin PowerCap Module integrates SRAM memory and nonvolatile control into a module base  
along with contacts for connection to the lithium battery in the DS9034PC PowerCap. The PowerCap  
Module package design allows a DS1345W device to be surface mounted without subjecting its lithium  
backup battery to destructive high-temperature reflow soldering. After a DS1345W is reflow soldered, a  
DS9034PC is snapped on top of the PCM to form a complete Nonvolatile SRAM module. The  
DS9034PC is keyed to prevent improper attachment. DS1345W module bases and DS9034PC  
PowerCaps are ordered separately and shipped in separate containers. See the DS9034PC data sheet for  
further information.  
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DS1345W  
ABSOLUTE MAXIMUM RATINGS*  
Voltage On Any Pin Relative To Ground  
Operating Temperature  
-0.3V to +4.6V  
0°C to 70°C, -40°C to +85°C for IND parts  
Storage Temperature  
-40°C to +70°C, -40°C to +85°C for IND parts  
260°C for 10 seconds  
Soldering Temperature  
* This is a stress rating only and functional operation of the device at these or any other conditions  
above those indicated in the operation sections of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended periods of time may affect reliability.  
RECOMMENDED DC OPERATING CONDITIONS  
(TA: See Note 10)  
PARAMETER  
Power Supply Voltage  
Logic 1  
SYMBOL  
VCC  
MIN  
3.0  
TYP  
MAX  
3.6  
VCC  
0.4  
UNITS  
NOTES  
3.3  
V
V
V
VIH  
VIL  
2.2  
0.0  
Logic 0  
DC ELECTRICAL CHARACTERISTICS  
(TA: See Note 10) (VCC = 3.3V M 0.3V)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
NOTES  
Input Leakage Current  
I/O Leakage Current  
CE O VIH ? VCC  
IIL  
-1.0  
+1.0  
µA  
IIO  
-1.0  
+1.0  
µA  
Output Current @ 2.2V  
Output Current @ 0.4V  
Standby Current CE = 2.2V  
Standby Current  
IOH  
IOL  
ICCS1  
-1.0  
2.0  
mA  
mA  
µA  
14  
14  
50  
30  
250  
150  
ICCS2  
µA  
CE = VCC -0.2V  
Operating Current  
ICCO1  
VTP  
50  
3.0  
mA  
V
Write Protection Voltage  
2.8  
2.9  
CAPACITANCE  
PARAMETER  
(TA = 25°C)  
SYMBOL  
CIN  
MIN  
TYP  
MAX  
10  
10  
UNITS  
pF  
NOTES  
Input Capacitance  
5
5
Input/Output Capacitance  
CI/O  
pF  
4 of 12  
DS1345W  
AC ELECTRICAL CHARACTERISTICS  
(TA: See Note 10) (VCC =3.3V M 0.3V)  
DS1345W-100 DS1345W-150  
MIN MAX MAX MIN  
PARAMETER  
SYMBOL  
UNITS  
NOTES  
Read Cycle Time  
Access Time  
OE to Output Valid  
CE to Output Valid  
OE or CE to Output Active  
Output High Z  
tRC  
tACC  
tOE  
100  
150  
ns  
ns  
ns  
ns  
ns  
100  
50  
150  
70  
tCO  
100  
150  
tCOE  
5
5
5
5
5
5
tOD  
35  
35  
35  
35  
ns  
from Deselection  
Output Hold from  
Address Change  
Write Cycle Time  
Write Pulse Width  
Address Setup Time  
tOH  
ns  
tWC  
tWP  
tAW  
100  
75  
0
150  
100  
0
ns  
ns  
ns  
3
tWR1  
tWR2  
tODW  
tOEW  
tDS  
5
5
12  
13  
5
5
4
12  
13  
Write Recovery Time  
ns  
20  
20  
ns  
ns  
ns  
Output High Z from WE  
Output Active from WE  
Data Setup Time  
5
40  
0
5
60  
0
tDH1  
tDH2  
Data Hold Time  
ns  
20  
20  
READ CYCLE  
SEE NOTE 1  
5 of 12  
DS1345W  
WRITE CYCLE 1  
SEE NOTES 2, 3, 4, 6, 7, 8 AND 12  
WRITE CYCLE 2  
SEE NOTES 2, 3, 4, 6, 7, 8 AND 13  
6 of 12  
DS1345W  
POWER-DOWN/POWER-UP CONDITION  
BATTERY WARNING DETECTION  
SEE NOTE 14  
7 of 12  
DS1345W  
POWER-DOWN/POWER-UP TIMING  
(TA: See Note 10)  
PARAMETER  
SYMBOL  
MIN  
150  
TYP  
MAX  
UNITS  
µs  
NOTES  
VCC Fail Detect to CE and  
WE Inactive  
tPD  
tF  
1.5  
11  
VCC slew from VTP to 0V  
VCC Fail Detect to RST  
Active  
µs  
tRPD  
tR  
15  
µs  
14  
VCC slew from 0V to VTP  
VCC Valid to CE and WE  
Inactive  
VCC Valid to End of Write  
Protection  
150  
µs  
tPU  
2
ms  
tREC  
125  
ms  
tRPU  
tBPU  
150  
200  
350  
1
ms  
s
14  
14  
VCC Valid to RST Inactive  
VCC Valid to BW Valid  
BATTERY WARNING TIMING  
(TA: See Note 10)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
NOTES  
Battery Test Cycle  
tBTC  
tBTPW  
tBW  
24  
hr  
s
s
Battery Test Pulse Width  
Battery Test to BW Active  
1
1
(TA= 25°C)  
PARAMETER  
Expected Data  
Retention Time  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
NOTES  
tDR  
10  
years  
9
WARNING:  
Under no circumstance are negative undershoots, of any amplitude, allowed when device is in battery  
backup mode.  
NOTES:  
1. WE is high for a read cycle.  
2. OE = VIH or VIL . If OE = VIH during write cycle, the output buffers remain in a high impedance state.  
3. tWP is specified as the logical AND of CE and WE . tWP is measured from the latter of CE or WE  
going low to the earlier of CE or WE going high.  
4. tDS is measured from the earlier of CE or WE going high.  
5. These parameters are sampled with a 5 pF load and are not 100% tested.  
6. If the CE low transition occurs simultaneously with or latter than the WE low transition, the output  
buffers remain in a high impedance state during this period.  
7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output  
buffers remain in high impedance state during this period.  
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,  
the output buffers remain in a high impedance state during this period.  
9. Each DS1345W has a built-in switch that disconnects the lithium source until VCC is first applied by  
the user. The expected tDR is defined as accumulative time in the absence of VCC starting from the  
time power is first applied by the user.  
8 of 12  
DS1345W  
10. All AC and DC electrical characteristics are valid over the full operating temperature range. For  
commercial products, this range is 0°C to 70°C. For industrial products (IND), this range is -40°C to  
+85°C.  
11. In a power-down condition the voltage on any pin may not exceed the voltage on VCC.  
12. tWR1 and tDH1 are measured from WE going high.  
13. tWR2 and tDH2 are measured from CE going high.  
14. RST and BW are open-drain outputs and cannot source current. External pullup resistors should be  
connected to these pins for proper operation. Both pins will sink 10mA.  
15. DS1345 PowerCap modules are pending U.L review. Contact the factory for status.  
DC TEST CONDITIONS  
Outputs Open  
Cycle = 200ns for operating current  
All voltages are referenced to ground  
AC TEST CONDITIONS  
Output Load: 100 pF + 1TTL Gate  
Input Pulse Levels: 0 to 2.7V  
Timing Measurement Reference Levels  
Input: 1.5V  
Output: 1.5V  
Input pulse Rise and Fall Times: 5ns  
ORDERING INFORMATION  
DS1345 W P - SSS - III  
Operating Temperature Range  
blank: 0L to 70L  
IND: -40L to +85LC  
Access Speed  
100: 100ns  
150: 150ns  
P: 34-pin PowerCap Module  
9 of 12  
DS1345W  
DS1345W NONVOLATILE SRAM, 34-PIN POWERCAP MODULE  
INCHES  
PKG  
DIM  
A
MIN NOM MAX  
0.920 0.925 0.930  
0.980 0.985 0.990  
B
C
-
-
0.080  
D
0.052 0.055 0.058  
0.048 0.050 0.052  
0.015 0.020 0.025  
0.020 0.025 0.030  
E
F
G
10 of 12  
DS1345W  
DS1345W NONVOLATILE SRAM, 34-PIN POWERCAP MODULE WITH  
POWERCAP  
INCHES  
PKG  
DIM  
A
MIN NOM MAX  
0.920 0.925 0.930  
0.955 0.960 0.965  
0.240 0.245 0.250  
0.052 0.055 0.058  
0.048 0.050 0.052  
0.015 0.020 0.025  
0.020 0.025 0.030  
B
C
D
E
F
G
ASSEMBLY AND USE  
Reflow soldering  
Dallas Semiconductor recommends that  
PowerCap Module bases experience one  
pass through solder reflow oriented  
label-side up (live-bug).  
Hand soldering and touch-up  
Do not touch soldering iron to leads for  
more than 3 seconds. To solder, apply  
flux to the pad, heat the lead frame pad  
and apply solder. To remove part, apply  
flux, heat pad until solder reflows, and  
use a solder wick.  
LPM replacement in a socket  
To replace a Low Profile Module in a  
68-pin PLCC socket, attach  
a
DS9034PC PowerCap to a module base  
then insert the complete module into the  
socket one row of leads at a time,  
pushing only on the corners of the cap.  
Never apply force to the center of the  
device. To remove from a socket, use a  
PLCC extraction tool and ensure that it  
does not hit or damage any of the  
module IC components. Do not use any  
other tool for extraction.  
11 of 12  
DS1345W  
RECOMMENDED POWERCAP MODULE LAND PATTERN  
INCHES  
MIN NOM MAX  
PKG  
DIM  
A
-
-
-
-
-
1.050  
0.826  
0.050  
0.030  
0.112  
-
-
-
-
-
B
C
D
E
RECOMMENDED POWERCAP MODULE SOLDER STENCIL  
INCHES  
PKG  
DIM  
A
MIN NOM MAX  
-
-
-
-
-
1.050  
0.890  
0.050  
0.030  
0.080  
-
-
-
-
-
B
C
D
E
12 of 12  

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