DS1497 [DALLAS]
RAMified Real Time Clock; 分枝实时时钟型号: | DS1497 |
厂家: | DALLAS SEMICONDUCTOR |
描述: | RAMified Real Time Clock |
文件: | 总19页 (文件大小:197K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DS1495/DS1497
DS1495/DS1497
RAMified Real Time Clock
FEATURES
PIN ASSIGNMENT
• Ideal for EISA bus PCs
A0
1
A2
A3
V
28
27
26
25
24
23
22
21
20
19
18
17
16
15
2
3
4
A1
X2
• Functionally compatible with MC146818 in 32 KHz
mode
DD
X1
SQW
A4
STBY
5
6
• Totally nonvolatile with over 10 years of operation in
the absence of power
D0
D1
D2
D3
D4
D5
D6
D7
A5
7
V
BAT
8
IRQ
• Self-contained subsystem includes lithium, quartz,
and support circuitry
9
RESET
RD
10
11
12
13
B
GND
• Counts seconds, minutes, hours, day of the week,
date, month, and year with leap year compensation
WR
XRAM
RTC
V
14
SS
• Binary or BCD representations of time, calendar, and
alarm
DS1495S 28-Pin SOIC (330 mil)
1
2
3
A0
A1
A2
A3
V
28
27
26
• 12- or 24-hour clock with AM and PM in 12-hour mode
• Daylight Savings Time option
X2
DD
4
5
6
7
X1
SQW
A4
25
24
• Interfacedwith software as 64 register/RAM locations
plus 8K x 8 of static RAM
STBY
D0
A5
23
22
21
20
19
18
17
16
15
–
–
–
14 bytes of clock and control registers
50 bytes of general and control registers
Separate 8K x 8 nonvolatile SRAM
V
D1
D2
D3
BAT
8
IRQ
9
RESET
RD
10
11
12
13
14
D4
• Programmable square wave output signal
• Bus-compatible interrupt signals (IRQ)
B
D5
D6
D7
GND
WR
XRAM
RTC
V
SS
• Three interrupts are separately software-maskable
and testable:
DS1495 28-Pin DIP (600 mil)
–
–
–
Time-of-day alarm once/second to once/day
Periodic rates from 122 µs to 500 ms
End-of-clock update cycle
1
A0
A1
28 A2
2
A3
V
27
26
3
NC
NC
DD
4
SQW
A4
25
24
23
• 28-pin JEDEC footprint
5
STBY
D0
6
A5
• Available as chip (DS1495/DS1495S) or stand alone
module with embedded lithium battery and crystal
(DS1497)
D1
NC
7
22
21
20
19
D2
IRQ
RESET
RD
8
D3
D4
D5
D6
D7
9
10
11
12
13
14
ORDERING INFORMATION
NC
18
17
DS1495
DS1495S
DS1497
RTC Chip; 28–pin DIP
RTC Chip; 28–pin SOIC
RTC Module; 28–pin DIP
WR
XRAM
RTC
16
15
V
SS
DS1497 28-Pin Encapsulated Package (720 mil)
ECopyright 1995 by Dallas Semiconductor Corporation.
All Rights Reserved. For important information regarding
patents and other intellectual property rights, please refer to
Dallas Semiconductor databooks.
020894 1/19
DS1495/DS1497
cessible. Registers are selected by the A0 line. Data is
driven onto the data bus when RD is low. Data is re-
ceived from the bus when WR is pulsed low and then
high.
PIN DESCRIPTIONS
V , V – Busoperationalpowerissuppliedtothepart
DD SS
via these pins. The voltage level present on these pins
should be monitored to transition between operational
power and battery power.
SQW – Square Wave (output): Frequency selectable
output. Frequency is selected by setting register A bits
RSO-RS3. See Table 2 for frequencies that can be se-
lected.
D0-D7 – Data Bus (bidirectional): Data is written into
the device from the data bus if either XRAM or RTC is
asserted during a write cycle at the rising edge of a WR
pulse. Data is read from the device and driven onto the
data bus if either XRAM or RTC is asserted during a
read cycle when the RD signal is low.
XRAM–ExtendedRAMSelect(input): Whenthissig-
nal is asserted low, the extended RAM bytes are acces-
sible. The XRAM page register is selected when the A5
address line is high. A 32-byte page of RAM is accessi-
ble when A5 is low. A0-A4 select the bytes within the
page of RAM pointed to by the page register. Data is
driven onto the data bus when RD is low. Data is re-
ceived from the bus when WR is pulsed low and then
high.
A0-A5 – Address Bus (input): Various internal regis-
ters of the device are selected by these lines. When
RTC is asserted, A0 selects between the indirect ad-
dress register and RTC data register. When the XRAM
is asserted, A0-A5 addresses a 32–byte page of RAM.
When A5 is high, the RAM page register is accessible.
When A5 is low, A0-A4 address the 32-byte page of
RAM.
IRQ – Interrupt Request (output): The IRQ signal is
anactivelow,opendrainoutputthatisusedasaproces-
sor interrupt request. The IRQ output follows the state
of the IRQF bit (bit 7) in status register C. IRQ can be
asserted by the alarm, update ended, or periodic inter-
rupt functions depending on the configuration of
register B.
RD – Read Strobe (input): Data is read from the se-
lected register and driven onto the data bus by the de-
vice when this line is low and either RTC or XRAM is as-
serted.
WR – Write Strobe (input): Data is written into the de-
vice from the data bus on the rising edge after a low
pulse on this line when the device has been selected by
either the XRAM or RTC signals.
RESET – Reset (input): The reset signal is used to ini-
tialize certain registers to allow proper operation of the
RTC module. When RESET is low, the following oc-
curs.
STBY – Standby (input): Accesses to the device are
inhibited and outputs are tri-stated to a high impedance
statewhenthissignalisassertedlow. AlldatainRAMof
the device is preserved. The real time clock continues
to keep time.
1. The following register bits are cleared:
a. Periodic interrupt (PIE)
b. Alarm interrupt enable (AIE)
c. Update ended interrupt (UF)
d. Interrupt request flag (IRQF)
e. Periodic interrupt flag (PF)
f. Alarm interrupt flag (AF)
If a read or write cycle is in progress when the STBY sig-
nal is asserted low, the internal cycle will be terminated
wheneithertheexternalcyclecompletesorwhenthein-
g. Square wave output enable (SQWE)
h. Update ended interrupt enable (UIE)
ternalchipenablecondition(V is4.25volts, typical)is
DD
negated, whichever occurs first.
2. The IRQ pin is in the high impedance state.
3. The RTC is not processor accessible.
RTC – Real Time Clock Select (input): When this sig-
nal is asserted low, the real time clock registers are ac-
020894 2/19
DS1495/DS1497
WhenV fallsbelowtheCE
(4.25voltstypical), the
THR
ADDITIONAL PIN DESCRIPTION
(FOR DS1495, DS1495S)
DD
chip select inputs RTC and XRAM are forced to an inac-
tive state regardless of the state of the pin signals. This
puts the module into a write protected mode in which all
inputs are ignored and all outputs are in a high imped-
X1, X2 – Connectionsforastandard32.768KHzquartz
crystal, Daiwa part number DT-26S or equivalent. The
internal oscillator circuitry is designed for operation with
ance state. When V falls below 3.2 volts (typical), the
DD
a crystal having a specified load capacitance (C ) of
module is switched over to an internal power source in
the case of the DS1497, or to an external battery con-
L
6pF. The crystal is connected directly to the X1 and X2
pins. There is no need for external capacitors or resis-
tors. Note: X1 and X2 are very high impedance nodes.
It is recommended that they and the crystal be guard–
ringed with ground and that high frequency signals be
kept away from the crystal area. For more information
on crystal selection and crystal layout considerations,
please consult Application Note 58, “Crystal Consider-
ations with Dallas Real Time Clocks”.
nected to the V
and BGND pins in the case of the
BAT
DS1495 and DS1495S, so that power is not interrupted
to timekeeping and nonvolatile RAM functions.
AddressMap:Theregistersofthedeviceappearintwo
distinct address ranges. One set of registers is active
when RTC is asserted low and represents the real time
clock. ThesecondsetofregistersisactivewhenXRAM
is asserted low and represents the extended RAM.
V
BAT
– Battery input for any standard +3 volt lithium cell
or other energy source. Battery voltage must be held
between 2.5 and 3.7 volts for proper operation. The
nominal write protect trip point voltage at which access
to the real time clock and user RAM is denied is set by
RTC Address Map: The address map of the RTC mod-
ule is shown in Figure 2. The address map consists of
50 bytes of general purpose RAM, 10 bytes of RTC/cal-
endar information, and 4 bytes of status and control in-
formation. All 64 bytes can be accessed as read/write
registers except for the following:
the internal circuitry at 4.25 volts typical. A maximum
o
load of 1 µA at 25 C and 3.0V on V
in the absence of
BAT
power should be used to size the external energy
source.
1. Registers C and D are Read Only (status informa-
tion)
The battery should be connected directly to the V
BAT
2. Bit 7 of register A is Read Only
pin. Adiodemustnotbeplacedinserieswiththebattery
to the V pin. Furthermore, a diode is not necessary
3. Bit 7 of the “Seconds” byte (00) is Read Only
BAT
because reverse charging current protection circuitry is
provided internal to the device and has passed the
requirements of Underwriters Laboratories for UL list-
ing.
The first byte of the real time clock address map is the
RTC indirect address register, accessible when A0 is
low. The second byte is the RTC data register, accessi-
blewhen A0 is high. The function of the RTC indirect ad-
dress register is to point to one of the 64 RTC registers
that are indirectly accessible through the RTC data reg-
ister.
B
– Battery ground: This pin or pin 14 can be used
GND
for the battery ground return.
OPERATION
ExtendedRAM Address Map: The first 32 bytes of the
extended RAM represent one of 256 pages of general
purposenonvolatilememory. These 32 bytes on a page
are addressed by A0 through A4 when A5 is low. When
A5 is high, the XRAM page register is accessible. The
value in the XRAM page register points to one of 256
pages of nonvolatile memory available. The address of
the XRAM page register is dependent only on A5 being
high; thus, there are 31 aliases of this register in I/O
spaces. (See Figure 3.)
Power-Down/Power-Up: The real time clock will con-
tinue to operate and all of the RAM, time, and calendar
and alarm memory locations will remain non-volatile re-
gardless of the voltage level of V . When the voltage
level applied to the V input is greater than 4.25 volts
(typical), the module becomes accessible after 200 ms
provided that the oscillator and countdown chain have
been programmed to be running. This time period al-
lows the module to stabilize after power is applied.
DD
DD
020894 3/19
DS1495/DS1497
checked for an alarm condition. If a read of the time and
calendardataoccursduringanupdate,aproblemexists
where seconds, minutes, hours, etc. may not correlate.
The probability of reading incorrect time and calendar
data is low. Several methods of avoiding any possible
incorrect time and calendar reads are covered later in
this text.
TIME, CALENDAR AND ALARM LOCATIONS
The time and calendar information is obtained by read-
ing the appropriate register bytes shown in Table 1. The
time, calendar, and alarm are set or initialized by writing
theappropriate register bytes. The contents of the time,
calendar, and alarm registers can be either Binary or
Binary-Coded Decimal (BCD) format. Table 1 shows
thebinaryandBCDformatsofthetwelvetime,calendar,
and alarm locations.
The three alarm bytes can be used in two ways. First,
when the alarm time is written in the appropriate hours,
minutes, and seconds alarm locations, the alarm inter-
ruptisinitiatedatthespecifiedtimeeachdayifthealarm
enable bit is high . The second method is to insert a
“don’tcare”stateinoneormoreofthethreealarmbytes.
The “don’t care” code is any hexadecimal value from C0
to FF. The two most significant bits of each byte set the
“don’t care” condition when at logic 1. An alarm will be
generatedeachhourwhenthe“don’tcare”bitsaresetin
the hours byte. Similarly, an alarm is generated every
minute with “don’t care” codes in the hours and minute
alarm bytes. The “don’t care” codes in all three alarm
bytes create an interrupt every second.
Beforewritingtheinternaltime,calendar,andalarmreg-
isters, the SET bit in Register B should be written to a
logic one to prevent updates from occurring while ac-
cess is being attempted. Also at this time, the data for-
mat (binary or BCD), should be set via the data mode bit
(DM) of Register B. All time, calendar, and alarm regis-
ters must use the same data mode. The set bit in Regis-
ter B should be cleared after the data mode bit has been
written to allow the real-time clock to update the time
and calendar bytes.
Onceinitialized, thereal-timeclockmakesallupdatesin
the selected mode. The data mode cannot be changed
without reinitializing the ten data bytes. The 24/12 bit
cannot be changed without reinitializing the hour loca-
tions. When the 12-hour format is selected, the high or-
der bit of the hours byte represents PM when it is a logic
one. Thetime,calendar, andalarmbytesarealwaysac-
cessible because they are double buffered. Once per
second the ten bytes are advanced by one second and
USER NONVOLATILE RAM - RTC
The 50 user nonvolatile RAM bytes are not dedicated to
any special function within the DS1495/DS1497. They
can be used by the application program as nonvolatile
memory and are fully available during the update cycle.
This memory is directly accessible in the RTC section.
020894 4/19
DS1495/DS1497
DS149X BLOCK DIAGRAM Figure 1
D E C O D E R
R E G I S T E R
I N D E X
020894 5/19
DS1495/DS1497
REAL TIME CLOCK RAM MAP Figure 2
RTC
INDIRECT ADDRESS REGISTER
RTC +1
RTC DATA REGISTER
14– BYTES
REAL TIME CLOCK
INDIRECT
ADDRESS
00
00
00
01
SECONDS
14–BYTES
RTC
SECONDS ALARM
0D
0E
13
14
02
03
MINUTES
MINUTES ALARM
50–BYTES
USER RAM
04
05
HOURS
HOURS ALARM
3F
63
06
DAY OF WEEK
07
08
DAY OF MONTH
MONTH
09
YEAR
0A
0B
REGISTER A
REGISTER B
0C
0D
REGISTER C
REGISTER D
EXTENDED RAM ADDRESS MAP Figure 3
XRAM
256 PAGES
PAGE FF
OF 32–BYTES
EXTENDED RAM
THRU
02
01
PAGE 00
XRAM + 1F
XRAM + 20
XRAM PAGE REGISTER
XRAM + 21
THRU
ALIASES OF
PAGE REGISTER
XRAM + 3F
020894 6/19
DS1495/DS1497
TIME, CALENDAR AND ALARM DATA MODES Table 1
RANGE
BINARY DATA MODE
ADDRESS
LOCATION
DECIMAL
RANGE
FUNCTION
BCD DATA MODE
00-59
0
1
2
3
4
Seconds
0-59
0-59
0-59
0-59
1-12
0-23
1-12
0-23
1-7
00-3B
Seconds Alarm
Minutes
00-3B
00-59
00-3B
00-59
Minutes Alarm
00-3B
00-59
Hours-12-hr Mode
Hours-24-hr Mode
Hours Alarm-12-hr
Hours Alarm-24-hr
01-0C AM, 81-8C PM
00-17
01-12AM,81-92PM
00-23
5
6
01-0C AM, 81-8C PM
00-17
01-12AM,81-92PM
00-23
Day of the Week
Sunday = 1
01-07
01-07
7
8
9
Date of the Month
Month
1-31
1-12
0-99
01-1F
01-0C
00-63
01-31
01-12
00-99
Year
Register B. The flag bit can be used in a polling mode
withoutenablingthecorrespondingenablebits. Whena
flagisset, anindicationisgiventosoftwarethataninter-
rupt event has occurred since the flag bit was last read.
However, care should be taken when using the flag bits
as they are cleared each time Register C is read.
Double latching is included with Register C so that bits
which are set remain stable throughout the read cycle.
All bits which are set (high) are cleared when read and
new interrupts which are pending during the read cycle
are held until after the cycle is completed. One, two, or
threebits can be set when reading Register C. Each uti-
lized flag bit should be examined when read to ensure
that no interrupts are lost.
INTERRUPTS
The RTC plus RAM includes three separate, fully auto-
matic sources of interrupt for a processor. The alarm in-
terrupt can be programmed to occur at rates from once
per second to once per day. The periodic interrupt can
be selected for rates from 500 ms to 122 µs. The up-
date-ended interrupt can be used to indicate to the pro-
gram that an update cycle is complete. Each of these
independent interrupt conditions is described in greater
detail in other sections of this text.
The application program can select which interrupts, if
any, are going to be used. Three bits in Register B en-
able the interrupts. Writing a logic 1 to an interrupt-en-
able bit permits that interrupt to be initiated when the
event occurs. A logic 0 in an interrupt-enable bit prohib-
its the IRQ pin from being asserted from that interrupt
condition. If an interrupt flag is already set when an in-
terrupt is enabled, IRQ is immediately set at an active
level, although the interrupt initiating the event may
haveoccurredmuchearlier. Asaresult, therearecases
where the program should clear such earlier initiated in-
terrupts before first enabling new interrupts.
The alternative flag bit usage method is with fully en-
abledinterrupts. Whenaninterruptflagbitissetandthe
corresponding interrupt enable bit is also set, the IRQ
pin is asserted low. IRQ is asserted as long as at least
oneofthethreeinterruptsourceshasitsflagandenable
bits both set. The IRQF bit in Register C is a one when-
ever the IRQ pin is being driven low. Determination that
the RTC initiated an interrupt is accomplished by read-
ing Register C. A logic one in bit 7 (IRQF bit) indicates
that one or more interrupts have been initiated by the
DS1495/DS1497. The act of reading Register C clears
all active flag bits and the IRQF bit.
When an interrupt event occurs, the relating flag bit is
set to logic 1 in Register C. These flag bits are set inde-
pendent of the state of the corresponding enable bit in
020894 7/19
DS1495/DS1497
Once the frequency is selected, the output of the SQW
pin can be turned on and off under program control with
the square wave enable bit (SQWE).
OSCILLATOR CONTROL BITS
When the DS1495/DS1497 is shipped from the factory,
the internal oscillator is turned off. This feature prevents
thelithium battery from being used until it is installed in a
system. A pattern of 010 in bits 4 through 6 of Register A
will turn the oscillator on and enable the countdown
chain. A pattern of 11X will turn the oscillator on, but
holds the countdown chain of the oscillator in reset. All
other combinations of bits 4 through 6 keep the oscilla-
tor off.
PERIODIC INTERRUPT SELECTION
The periodic interrupt will cause the IRQ pin to go to an
active state from once every 500 ms to once every
122 µs. This function is separate from the alarm inter-
rupt which can be output from once per second to once
per day. The periodic interrupt rate is selected using the
same Register A bits which select the square wave fre-
quency (see Table 1). Changing the Register A bits af-
fects both the square wave frequency and the periodic
interruptoutput. However, eachfunctionhasaseparate
enable bit in Register B. The SQWE bit controls the
square wave output. Similarly, the periodic interrupt is
enabled by the PIE bit in Register B. The periodic inter-
rupt can be used with software counters to measure in-
puts, create output intervals, or await the next needed
software function.
SQUARE WAVE OUTPUT SELECTION
Thirteen of the 15 divider taps are made available to a
1-of-15 selector, as shown in the block diagram of Fig-
ure 1. The first purpose of selecting a divider tap is to
generate a square wave output signal on the SQW pin.
The RS0-RS3 bits in Register A establish the square
wave output frequency. These frequencies are listed in
Table 2. The SQW frequency selection shares its
1-of-15 selector with the periodic interrupt generator.
PERIODIC INTERRUPT RATE AND SQUARE WAVE OUTPUT FREQUENCY Table 2
SELECT BITS REGISTER A
t
PERIODIC
SQW OUTPUT
FREQUENCY
PI
INTERRUPT RATE
RS3
0
RS2
0
RS1
0
RS0
0
None
None
0
0
0
1
3.90625 ms
7.8125 ms
122.070 µs
244.141 µs
488.281 µs
976.5625 µs
1.953125 ms
3.90625 ms
7.8125 ms
15.625 ms
31.25 ms
62.5 ms
256 Hz
128 Hz
8.192 KHz
4.096 KHz
2.048 KHz
1.024 KHz
512 Hz
256 Hz
128 Hz
64 Hz
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
32 Hz
1
1
0
0
16 Hz
1
1
0
1
125 ms
8 Hz
1
1
1
0
250 ms
4 Hz
1
1
1
1
500 ms
2 Hz
020894 8/19
DS1495/DS1497
ter C should be cleared before leaving the interrupt rou-
tine.
UPDATE CYCLE
The DS1495/DS1497 executes an update cycle once
per second regardless of the SET bit in Register B.
When the SET bit in Register B is set to one, the user
copy of the double buffered time, calendar, and alarm
bytes is frozen and will not update as the time incre-
ments. However, the time countdown chain continues
to update the internal copy of the buffer. This feature al-
lows time to maintain accuracy independent of reading
or writing the time, calendar, and alarm buffers and also
guarantees that time and calendar information is con-
sistent. The update cycle also compares each alarm
byte with the corresponding time byte and issues an
alarm if a match or if a “don’t care” code is present in all
three positions.
A second method uses the update-in-progress bit (UIP)
in Register A to determine if the update cycle is in prog-
ress. The UIP bit will pulse once per second. After the
UIP bit goes high, the update transfer occurs 244 µs lat-
er. If a low is read on the UIP bit, the user has at least
244 µs before the time/calendar data will be changed.
Therefore, the user should avoid interrupt service rou-
tines that would cause the time needed to read valid
time/calendar data to exceed 244 µs.
The third method uses a periodic interrupt to determine
if an update cycle is in progress. The UIP bit in Register
A is set high between the setting of the PF bit in Register
C (see Figure 3). Periodic interrupts that occur at a rate
There are three methods that can handle access of the
real-timeclockthatavoidanypossibilityofaccessingin-
consistent time and calendar data. The first method
uses the update-ended interrupt. If enabled, an inter-
rupt occurs after every update cycle that indicates that
over 999 ms are available to read valid time and date in-
formation. If this interrupt is used, the IRQF bit in Regis-
of greater than t
allow valid time and date informa-
BUC
tion to be reached at each occurrence of the periodic in-
terrupt. The reads should be complete within
(t /2+t
)toensurethatdataisnotreadduringtheup-
PI
BUC
date cycle.
UPDATE-ENDED AND PERIODIC INTERRUPT RELATIONSHIP Figure 4
UIP BIT IN
REGISTER A
t
BUC
UF BIT IN
REGISTER C
t
t
PI/2
PI/2
PF BIT IN
REGISTER C
t
PI
t
t
= Periodic interrupt time interval per Table 1.
PI
= Delay time before update cycle = 244 µs.
BUC
020894 9/19
DS1495/DS1497
transfer is inhibited and the program can initialize the
time and calendar bytes without an update occurring in
the midst of initializing. Read cycles can be executed in
asimilarmanner. SET is a read/write bit that is not modi-
fied by internal functions of the DS1495/DS1497.
REGISTERS
The DS1495/DS1497 has four control registers which
are accessible at all times, even during the update
cycle.
REGISTER A
PIE - The Periodic Interrupt Enable bit is a read/write bit
which allows the Periodic Interrupt Flag (PF) bit in Reg-
isterCtodrivetheIRQpin low. WhenthePIEbitissetto
one, periodic interrupts are generated by driving the
IRQ pin low at a rate specified by the RS3-RS0 bits of
Register A. A zero in the PIE bit blocks the IRQ output
from being driven by a periodic interrupt, but the Period-
ic Flag (PF) bit is still set at the periodic rate. PIE is not
modified by any internal DS1495/DS1497 functions but
is cleared by the hardware RESET signal.
MSB
LSB
BIT 0
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
UIP
DV2
DV1
DV0
RS3
RS2
RS1
RS0
UIP - The Update In Progress (UIP) bit is a status flag
that can be monitored. When the UIP bit is a one, the
update transfer will soon occur. When UIP is a zero, the
update transfer will not occur for at least 244 µs. The
time, calendar, and alarm information in RAM is fully
available for access when the UIP bit is zero. The UIP
bitisreadonly. WritingtheSETbitinRegisterBtoaone
inhibits any update transfer and clears the UIP status
bit.
AIE - The Alarm Interrupt Enable (AIE) bit is a read/write
bitwhich, whensettoaone, permitstheAlarmFlag(AF)
bit in register C to assert IRQ. An alarm interrupt occurs
foreachsecondthatthethreetimebytesequalthethree
alarm bytes including a don’t care alarm code of binary
11XXXXXX. When the AIE bit is set to zero, the AF bit
doesnotinitiatetheIRQsignal. Theinternalfunctionsof
the DS1495/DS1497 do not affect the AIE bit but is
cleared by RESET.
DV2, DV1, DV0 - These three bits are used to turn the
oscillator on or off and to reset the countdown chain. A
patternof010istheonlycombinationofbitsthatwillturn
the oscillator on and allow the RTC to keep time. A pat-
tern of 11X will enable the oscillator but holds the count-
down chain in reset. The next update will occur at 500
ms after a pattern of 010 is written to DV2, DV1, and
DV0.
UIE - The Update Ended Interrupt Enable (UIE) bit is a
read/write bit that enables the Update Ended Flag (UF)
bitinRegisterCtoassertIRQ. TheSETbitgoinghighor
the RESET pin going low clears the UIE bit.
RS3, RS2, RS1, RS0-Thesefourrate-selectionbitsse-
lect one of the 13 taps on the 15-stage divider or disable
thedivider output. The tap selected can be used to gen-
erateanoutputsquarewave(SQWpin)and/oraperiod-
ic interrupt. The user can do one of the following
SQWE - When the Square Wave Enable (SQWE) bit is
set to a one, a square wave signal at the frequency set
by the rate-selection bits RS3 through RS0 is driven out
on a SQW pin. When the SQWE bit is set to zero, the
SQW pin is held low. SQWE is a read/write bit and is
cleared by RESET.
1. Enable the interrupt with the PIE bit;
2. Enable the SQW output pin with the SQWE bit;
3. Enable both at the same time and the same rate; or
4. Enable neither.
DM - The Data Mode (DM) bit indicates whether time
and calendar information is in binary or BCD format.
The DM bit is set by the program to the appropriate for-
matandcanbereadasrequired. Thisbitisnotmodified
by internal functions. A one in DM signifies binary data
while a zero in DM specifies Binary Coded Decimal
(BCD) data.
Table 2 lists the periodic interrupt rates and the square
wave frequencies that can be chosen with the RS bits.
REGISTER B
MSB
LSB
BIT 7 BIT 6 BIT 5
BIT 4
BIT 3
BIT 2
BIT 1 BIT 0
24/12 - The 24/12 control bit establishes the format of
the hours byte. A one indicates the 24-hour mode and a
zero indicates the 12-hour mode. This bit is read/write.
SET
PIE
AIE
UIE
SQWE
DM
24/12
DSE
SET - When the SET bit is a zero, the update transfer
functions normally by advancing the counts once per
second.WhentheSETbitiswrittentoaone, anyupdate
020894 10/19
DS1495/DS1497
DSE - The Daylight Savings Enable (DSE) bit is a read/
write bit which enables two special updates when DSE
is set to one. On the first Sunday in April the time incre-
ments from 1:59:59 AM to 3:00:00 AM. On the last
Sunday in October when the time first reaches 1:59:59
AMitchangesto1:00:00AM. Thesespecialupdatesdo
not occur when the DSE bit is a zero. This bit is not af-
fected by internal functions.
AF – A one in the Alarm Interrupt Flag (AF) bit indicates
that the current time has matched the alarm time. If the
AIEbitisalsoaone, theIRQpinwillgolowandaonewill
appearintheIRQFbit. AreadofRegisterCoraRESET
will clear AF.
UF – The Update Ended Interrupt Flag (UF) bit is set af-
tereachupdatecycle. WhentheUIEbitissettoone,the
one in UF causes the IRQF bit to be a one which will as-
sert the IRQ pin. UF is cleared by reading Register C or
by RESET.
REGISTER C
MSB
LSB
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
BIT 0 THROUGH BIT 3 – These are reserved bits of the
statusRegisterC. Thesebitsalwaysreadzeroandcan-
not be written.
IRQF
PF
AF
UF
0
0
0
0
IRQF – The Interrupt Request Flag (IRQF) bit is set to a
one when one or more of the following are true:
REGISTER D
PF = PIE = 1
AF = AIE = 1
UF = UIE = 1
MSB
LSB
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
i.e., IRQF = (PF • PIE) + (AF • AIE) + (UF • UIE)
VRT
0
0
0
0
0
0
0
VRT – The Valid RAM and Time (VRT) bit is set to the
one state by Dallas Semiconductor Corporation prior to
shipment. Thisbitisnotwritableandshouldalwaysbea
one when read. If a zero is ever present, an exhausted
internal lithium energy source is indicated and both the
contents of the RTC data and RAM data are question-
able.
Any time the IRQF bit is a one, the IRQ pin is driven low.
All flag bits are cleared after Register C is read by the
program or when the RESET pin is low.
PF – The Periodic Interrupt Flag (PF) is a read-only bit
which is set to a one when an edge is detected on the
selected tap of the divider chain. The RS3 through RS0
bits establish the periodic rate. PF is set to a one inde-
pendent of the state of the PIE bit. When both PF and
PIE are ones, the IRQ signal is active and will set the
IRQF bit. The PF bit is cleared by a software read of
Register C or by RESET.
BIT 6 THROUGH BIT 0 –TheremainingbitsofRegister
D are reserved and not usable. They cannot be written
and, when read, they will always read zero.
020894 11/19
DS1495/DS1497
ABSOLUTE MAXIMUM RATINGS*
DD
Input Voltage
V
Pin Potential to Ground Pin
-0.3V to +7.0V
– 0.3 to V + 0.3V
V
SS
DD
Power Dissipation
Storage Temperature
500 mW
DS1497: –40°C to +70°C
DS1495: –55°C to +125°C
0°C to 70°C
Ambient Temperature
Soldering Temperature
260°C for 10 seconds
* This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
(0°C to 70°C)
CHARACTERISTIC
Supply Voltage
TEST CONDITION
SYM
MIN
4.5
MAX UNITS NOTES
V
CC
5.5
V
Input High Voltage
Recognized as a High Signal Over
V
IH
2.2
V
0.3
+
V
V
DD
Recommended V and t Range
DD
A
Input Low Voltage
Battery Voltage
Recognized as a Low Signal Over
Recommended V and t Range
V
-0.3
2.5
0.8
V
IL
DD
A
V
BAT
3.7
V
DC ELECTRICAL CHARACTERISTICS
(VDD = 5.0V + 10%, VSS = 0V, tA = 0° C to 70°C)
CHARACTERISTIC
TEST CONDITION
SYM
MIN
MAX
UNIT NOTES
Input Leakage
For any Single Pin: D0-7, RD, WR,
A0-5, XRAM, RTC, RESET
I
I
+1
µA
V =0V, V =V
IL
IH
DD
Output High Voltage
Output Low Voltage
V
=5.0V I
=1 mA
V
OH
2.4
V
V
DD
DD
LOAD
V
= 5.0V I
= 2 mA
V
0.4
50
LOAD
OL
DD
Power Supply Current Outputs Unloaded
I
mA
µA
µA
STBY pin Input Current STBY=V
STBY pin Input Current STBY=V
I
I
+500
–1
DD
SS
STBY
STBY
AC SWITCHING CHARACTERISTICS
(0°C to 70°C; VDD = 4.5V to 5.5V)
CHARACTERISTIC
Reset Pulse Width
Oscillator Startup
TEST CONDITION
SYM
MIN
MAX
UNIT NOTES
t
5
µs
s
RWL
From Software Enable Via DV Bits
t
1
2
RC
IRQ Release from RD
High
t
µs
IRDS
IRQ Release from
RESET Low
t
2
µs
IRR
020894 12/19
DS1495/DS1497
IRQ RELEASE DELAY
RD
V
HIGH
t
RWL
RESET
V
IRQ
HIGH
t
IRR
t
IRDS
OSCILLATOR START-UP
t
RC
SQW Pin
WR
V
HIGH
DV0–2
NOTE:
Timing assumes RS3-0 Bits = 0011, minimum t .
PI
020894 13/19
DS1495/DS1497
BUS TIMING
PARAMETER
(0°C to 70°C; VDD = 4.5V to 5.5V)
SYM
MIN
395
200
TYP
MAX
UNIT
NOTES
Cycle Time
t
DC
ns
CYC
Pulse Width, RD/WR Low
PW
ns
RWL
F
Signal Rise and Fall Time, RTC,
XRAM, RD, WR
t , t
R
30
ns
Address Hold Time
t
20
50
0
ns
ns
ns
ns
AH
Address Setup Time Before RD
Address Setup Time Before WR
t
ARS
t
AWS
RTC/XRAM Select Setup Time Be-
fore RD
t
50
CRS
RTC/XRAM Select Setup Time Be-
fore WR
t
0
ns
ns
CWS
RTC/XRAM Select Hold Time After
RD or WR
t
20
CH
Read Data Hold Time
t
10
0
100
200
ns
ns
ns
ns
DHR
Write Data Hold Time
t
DHW
Output Data Delay Time from RD
Write Data Setup Time
t
20
200
DDR
DSW
t
OUTPUT LOAD
+5 V
1.1KΩ
D.U.T.
50 pF
680Ω
020894 14/19
DS1495/DS1497
BUS READ/WRITE TIMING
t
CYC
VALID
A0-A5
t
t
F
R
RTC
XRAM
t
t
CWS
CH
t
t
F
R
WR
PW
RWL
t
AWS
t
AH
t
DSW
t
DATA BUS
WRITE
DATA
DHW
VALID
D0–D7
DATA BUS
READ
VALID
DATA
D0–D7
t
t
CRS
t
DDR
CH
t
RD
PW
RWL
t
ARS
DHR
t
AH
POWER-DOWN/ POWER-UP TIMING
(tA = 25°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
ns
NOTES
CE High to Power Fail
Recovery at Power Up
t
PF
0
t
150
ms
REC
V
CC
V
CC
V
CC
Slew Rate Power Down
Slew Rate Power Down
Slew Rate Power Up
t
300
10
0
µs
F
4.0 <V < 4.5V
CC
t
FB
µs
µs
3.0 <V < 4.0V
CC
t
R
4.5V>V >4.0V
CC
Expected Data Retention
t
10
years
DR
NOTE:
CE is chip enabled for access, an internal signal which is defined by (RD + WR) (XRAM + RTC).
CAPACITANCE
(tA = 25°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
12
UNITS
pF
NOTES
Input Capacitance
Output Capacitance
C
IN
C
12
pF
OUT
020894 15/19
DS1495/DS1497
GENERAL INFORMATION
PARAMETER
SYM
MIN
TYP
MAX
UNIT
NOTES
t
10
Years
Expected Data Retention @ 25°C
(DS1497 only)
DR
C
±1
Min/Mo
Clock Accuracy for t @ 25°C
Q
DR
(DS1497 only)
2
Clock Accuracy Temperature Coefficient
(DS1497)
K
.050
30
ppm/°C
0°C
Clock Temperature Coefficient
t
O
20
Turnover Temperature (DS1497 only)
Chip Enable Threshold (DS1497 only)
POWER–UP CONDITION
CE
CE
4.5
V
THR
V
IH
t
REC
4.5V
4.25V
4.0V
V
CC
t
R
POWER FAIL
NOTE:
CE is an internal signal generated by the power switching reference in the DS149X products.
POWER–DOWN CONDITION
CE
V
IH
t
PF
t
F
V
CC
4.5V
4.25V
4.0V
V
t
DR
BAT
t
FB
POWER FAIL
020894 16/19
DS1495/DS1497
DS1495 28–PIN DIP
PKG
28–PIN
MIN
DIM
MAX
A IN.
MM
1.445
36.70
1.470
37.34
B
D
B IN.
MM
0.530
13.46
0.550
13.97
C IN.
MM
0.140
3.56
0.160
4.06
1
D IN.
MM
0.600
15.24
0.625
15.88
A
E IN.
MM
0.015
0.38
0.040
1.02
F IN.
MM
0.120
3.05
0.145
3.68
G IN.
MM
0.090
2.29
0.110
2.79
H IN.
MM
0.625
15.88
0.675
17.15
C
F
J IN.
MM
0.008
0.20
0.012
0.30
E
K
G
K IN.
MM
0.015
0.38
0.022
0.56
J
H
020894 17/19
DS1495/DS1497
DS1495S 28–PIN SOIC
K
G
PKG
28-PIN
MIN
DIM
MAX
A IN.
MM
0.706
17.93
0.728
18.49
B IN.
MM
0.338
8.58
0.350
8.89
C IN.
MM
0.086
2.18
0.110
2.79
D IN.
MM
0.020
0.58
0.050
1.27
E IN.
MM
0.002
0.05
0.014
0.36
F IN.
MM
0.090
2.29
0.124
3.15
0.050
1.27
BSC
G IN.
MM
C
H IN.
MM
0.460
11.68
0.480
12.19
A
J IN.
MM
0.006
0.15
0.013
0.33
E
K IN.
MM
0.014
0.36
0.020
0.51
B
H
F
0–8 deg. typ.
J
D
020894 18/19
DS1495/DS1497
DS1497 28–PIN 720 MIL FLUSH ENCAPSULATED
15
28
PKG
28-PIN
MIN
DIM
MAX
A
IN.
MM
1.520
38.61
1.540
39.12
B
C
D
E
F
IN.
MM
0.695
17.65
0.720
18.29
1
14
IN.
MM
0.350
8.89
0.375
9.52
A
IN.
MM
0.100
2.54
0.130
3.30
IN.
MM
0.015
0.38
0.030
0.76
IN.
MM
0.110
2.79
0.140
3.56
C
E
G
H
J
IN.
MM
0.090
2.29
0.110
2.79
IN.
MM
0.590
14.99
0.630
16.00
F
D
K
G
IN.
MM
0.008
0.20
0.012
0.30
13 EQUAL SPACES AT
.100 ± .010 TNA
K
IN.
MM
0.015
0.38
0.021
0.53
NOTE:
PINS 3, 4, 18 AND 22 ARE MISSING BY DESIGN.
J
H
B
020894 19/19
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