DS1497 [DALLAS]

RAMified Real Time Clock; 分枝实时时钟
DS1497
型号: DS1497
厂家: DALLAS SEMICONDUCTOR    DALLAS SEMICONDUCTOR
描述:

RAMified Real Time Clock
分枝实时时钟

时钟
文件: 总19页 (文件大小:197K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DS1495/DS1497  
DS1495/DS1497  
RAMified Real Time Clock  
FEATURES  
PIN ASSIGNMENT  
Ideal for EISA bus PCs  
A0  
1
A2  
A3  
V
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
2
3
4
A1  
X2  
Functionally compatible with MC146818 in 32 KHz  
mode  
DD  
X1  
SQW  
A4  
STBY  
5
6
Totally nonvolatile with over 10 years of operation in  
the absence of power  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
A5  
7
V
BAT  
8
IRQ  
Self-contained subsystem includes lithium, quartz,  
and support circuitry  
9
RESET  
RD  
10  
11  
12  
13  
B
GND  
Counts seconds, minutes, hours, day of the week,  
date, month, and year with leap year compensation  
WR  
XRAM  
RTC  
V
14  
SS  
Binary or BCD representations of time, calendar, and  
alarm  
DS1495S 28-Pin SOIC (330 mil)  
1
2
3
A0  
A1  
A2  
A3  
V
28  
27  
26  
12- or 24-hour clock with AM and PM in 12-hour mode  
Daylight Savings Time option  
X2  
DD  
4
5
6
7
X1  
SQW  
A4  
25  
24  
Interfacedwith software as 64 register/RAM locations  
plus 8K x 8 of static RAM  
STBY  
D0  
A5  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14 bytes of clock and control registers  
50 bytes of general and control registers  
Separate 8K x 8 nonvolatile SRAM  
V
D1  
D2  
D3  
BAT  
8
IRQ  
9
RESET  
RD  
10  
11  
12  
13  
14  
D4  
Programmable square wave output signal  
Bus-compatible interrupt signals (IRQ)  
B
D5  
D6  
D7  
GND  
WR  
XRAM  
RTC  
V
SS  
Three interrupts are separately software-maskable  
and testable:  
DS1495 28-Pin DIP (600 mil)  
Time-of-day alarm once/second to once/day  
Periodic rates from 122 µs to 500 ms  
End-of-clock update cycle  
1
A0  
A1  
28 A2  
2
A3  
V
27  
26  
3
NC  
NC  
DD  
4
SQW  
A4  
25  
24  
23  
28-pin JEDEC footprint  
5
STBY  
D0  
6
A5  
Available as chip (DS1495/DS1495S) or stand alone  
module with embedded lithium battery and crystal  
(DS1497)  
D1  
NC  
7
22  
21  
20  
19  
D2  
IRQ  
RESET  
RD  
8
D3  
D4  
D5  
D6  
D7  
9
10  
11  
12  
13  
14  
ORDERING INFORMATION  
NC  
18  
17  
DS1495  
DS1495S  
DS1497  
RTC Chip; 28–pin DIP  
RTC Chip; 28–pin SOIC  
RTC Module; 28–pin DIP  
WR  
XRAM  
RTC  
16  
15  
V
SS  
DS1497 28-Pin Encapsulated Package (720 mil)  
ECopyright 1995 by Dallas Semiconductor Corporation.  
All Rights Reserved. For important information regarding  
patents and other intellectual property rights, please refer to  
Dallas Semiconductor databooks.  
020894 1/19  
DS1495/DS1497  
cessible. Registers are selected by the A0 line. Data is  
driven onto the data bus when RD is low. Data is re-  
ceived from the bus when WR is pulsed low and then  
high.  
PIN DESCRIPTIONS  
V , V – Busoperationalpowerissuppliedtothepart  
DD SS  
via these pins. The voltage level present on these pins  
should be monitored to transition between operational  
power and battery power.  
SQW – Square Wave (output): Frequency selectable  
output. Frequency is selected by setting register A bits  
RSO-RS3. See Table 2 for frequencies that can be se-  
lected.  
D0-D7 – Data Bus (bidirectional): Data is written into  
the device from the data bus if either XRAM or RTC is  
asserted during a write cycle at the rising edge of a WR  
pulse. Data is read from the device and driven onto the  
data bus if either XRAM or RTC is asserted during a  
read cycle when the RD signal is low.  
XRAMExtendedRAMSelect(input): Whenthissig-  
nal is asserted low, the extended RAM bytes are acces-  
sible. The XRAM page register is selected when the A5  
address line is high. A 32-byte page of RAM is accessi-  
ble when A5 is low. A0-A4 select the bytes within the  
page of RAM pointed to by the page register. Data is  
driven onto the data bus when RD is low. Data is re-  
ceived from the bus when WR is pulsed low and then  
high.  
A0-A5 – Address Bus (input): Various internal regis-  
ters of the device are selected by these lines. When  
RTC is asserted, A0 selects between the indirect ad-  
dress register and RTC data register. When the XRAM  
is asserted, A0-A5 addresses a 32–byte page of RAM.  
When A5 is high, the RAM page register is accessible.  
When A5 is low, A0-A4 address the 32-byte page of  
RAM.  
IRQ – Interrupt Request (output): The IRQ signal is  
anactivelow,opendrainoutputthatisusedasaproces-  
sor interrupt request. The IRQ output follows the state  
of the IRQF bit (bit 7) in status register C. IRQ can be  
asserted by the alarm, update ended, or periodic inter-  
rupt functions depending on the configuration of  
register B.  
RD – Read Strobe (input): Data is read from the se-  
lected register and driven onto the data bus by the de-  
vice when this line is low and either RTC or XRAM is as-  
serted.  
WR – Write Strobe (input): Data is written into the de-  
vice from the data bus on the rising edge after a low  
pulse on this line when the device has been selected by  
either the XRAM or RTC signals.  
RESET – Reset (input): The reset signal is used to ini-  
tialize certain registers to allow proper operation of the  
RTC module. When RESET is low, the following oc-  
curs.  
STBY – Standby (input): Accesses to the device are  
inhibited and outputs are tri-stated to a high impedance  
statewhenthissignalisassertedlow. AlldatainRAMof  
the device is preserved. The real time clock continues  
to keep time.  
1. The following register bits are cleared:  
a. Periodic interrupt (PIE)  
b. Alarm interrupt enable (AIE)  
c. Update ended interrupt (UF)  
d. Interrupt request flag (IRQF)  
e. Periodic interrupt flag (PF)  
f. Alarm interrupt flag (AF)  
If a read or write cycle is in progress when the STBY sig-  
nal is asserted low, the internal cycle will be terminated  
wheneithertheexternalcyclecompletesorwhenthein-  
g. Square wave output enable (SQWE)  
h. Update ended interrupt enable (UIE)  
ternalchipenablecondition(V is4.25volts, typical)is  
DD  
negated, whichever occurs first.  
2. The IRQ pin is in the high impedance state.  
3. The RTC is not processor accessible.  
RTC – Real Time Clock Select (input): When this sig-  
nal is asserted low, the real time clock registers are ac-  
020894 2/19  
DS1495/DS1497  
WhenV fallsbelowtheCE  
(4.25voltstypical), the  
THR  
ADDITIONAL PIN DESCRIPTION  
(FOR DS1495, DS1495S)  
DD  
chip select inputs RTC and XRAM are forced to an inac-  
tive state regardless of the state of the pin signals. This  
puts the module into a write protected mode in which all  
inputs are ignored and all outputs are in a high imped-  
X1, X2 – Connectionsforastandard32.768KHzquartz  
crystal, Daiwa part number DT-26S or equivalent. The  
internal oscillator circuitry is designed for operation with  
ance state. When V falls below 3.2 volts (typical), the  
DD  
a crystal having a specified load capacitance (C ) of  
module is switched over to an internal power source in  
the case of the DS1497, or to an external battery con-  
L
6pF. The crystal is connected directly to the X1 and X2  
pins. There is no need for external capacitors or resis-  
tors. Note: X1 and X2 are very high impedance nodes.  
It is recommended that they and the crystal be guard–  
ringed with ground and that high frequency signals be  
kept away from the crystal area. For more information  
on crystal selection and crystal layout considerations,  
please consult Application Note 58, “Crystal Consider-  
ations with Dallas Real Time Clocks”.  
nected to the V  
and BGND pins in the case of the  
BAT  
DS1495 and DS1495S, so that power is not interrupted  
to timekeeping and nonvolatile RAM functions.  
AddressMap:Theregistersofthedeviceappearintwo  
distinct address ranges. One set of registers is active  
when RTC is asserted low and represents the real time  
clock. ThesecondsetofregistersisactivewhenXRAM  
is asserted low and represents the extended RAM.  
V
BAT  
Battery input for any standard +3 volt lithium cell  
or other energy source. Battery voltage must be held  
between 2.5 and 3.7 volts for proper operation. The  
nominal write protect trip point voltage at which access  
to the real time clock and user RAM is denied is set by  
RTC Address Map: The address map of the RTC mod-  
ule is shown in Figure 2. The address map consists of  
50 bytes of general purpose RAM, 10 bytes of RTC/cal-  
endar information, and 4 bytes of status and control in-  
formation. All 64 bytes can be accessed as read/write  
registers except for the following:  
the internal circuitry at 4.25 volts typical. A maximum  
o
load of 1 µA at 25 C and 3.0V on V  
in the absence of  
BAT  
power should be used to size the external energy  
source.  
1. Registers C and D are Read Only (status informa-  
tion)  
The battery should be connected directly to the V  
BAT  
2. Bit 7 of register A is Read Only  
pin. Adiodemustnotbeplacedinserieswiththebattery  
to the V pin. Furthermore, a diode is not necessary  
3. Bit 7 of the “Seconds” byte (00) is Read Only  
BAT  
because reverse charging current protection circuitry is  
provided internal to the device and has passed the  
requirements of Underwriters Laboratories for UL list-  
ing.  
The first byte of the real time clock address map is the  
RTC indirect address register, accessible when A0 is  
low. The second byte is the RTC data register, accessi-  
blewhen A0 is high. The function of the RTC indirect ad-  
dress register is to point to one of the 64 RTC registers  
that are indirectly accessible through the RTC data reg-  
ister.  
B
Battery ground: This pin or pin 14 can be used  
GND  
for the battery ground return.  
OPERATION  
ExtendedRAM Address Map: The first 32 bytes of the  
extended RAM represent one of 256 pages of general  
purposenonvolatilememory. These 32 bytes on a page  
are addressed by A0 through A4 when A5 is low. When  
A5 is high, the XRAM page register is accessible. The  
value in the XRAM page register points to one of 256  
pages of nonvolatile memory available. The address of  
the XRAM page register is dependent only on A5 being  
high; thus, there are 31 aliases of this register in I/O  
spaces. (See Figure 3.)  
Power-Down/Power-Up: The real time clock will con-  
tinue to operate and all of the RAM, time, and calendar  
and alarm memory locations will remain non-volatile re-  
gardless of the voltage level of V . When the voltage  
level applied to the V input is greater than 4.25 volts  
(typical), the module becomes accessible after 200 ms  
provided that the oscillator and countdown chain have  
been programmed to be running. This time period al-  
lows the module to stabilize after power is applied.  
DD  
DD  
020894 3/19  
DS1495/DS1497  
checked for an alarm condition. If a read of the time and  
calendardataoccursduringanupdate,aproblemexists  
where seconds, minutes, hours, etc. may not correlate.  
The probability of reading incorrect time and calendar  
data is low. Several methods of avoiding any possible  
incorrect time and calendar reads are covered later in  
this text.  
TIME, CALENDAR AND ALARM LOCATIONS  
The time and calendar information is obtained by read-  
ing the appropriate register bytes shown in Table 1. The  
time, calendar, and alarm are set or initialized by writing  
theappropriate register bytes. The contents of the time,  
calendar, and alarm registers can be either Binary or  
Binary-Coded Decimal (BCD) format. Table 1 shows  
thebinaryandBCDformatsofthetwelvetime,calendar,  
and alarm locations.  
The three alarm bytes can be used in two ways. First,  
when the alarm time is written in the appropriate hours,  
minutes, and seconds alarm locations, the alarm inter-  
ruptisinitiatedatthespecifiedtimeeachdayifthealarm  
enable bit is high . The second method is to insert a  
“don’tcarestateinoneormoreofthethreealarmbytes.  
The “don’t care” code is any hexadecimal value from C0  
to FF. The two most significant bits of each byte set the  
“don’t care” condition when at logic 1. An alarm will be  
generatedeachhourwhenthedon’tcarebitsaresetin  
the hours byte. Similarly, an alarm is generated every  
minute with “don’t care” codes in the hours and minute  
alarm bytes. The “don’t care” codes in all three alarm  
bytes create an interrupt every second.  
Beforewritingtheinternaltime,calendar,andalarmreg-  
isters, the SET bit in Register B should be written to a  
logic one to prevent updates from occurring while ac-  
cess is being attempted. Also at this time, the data for-  
mat (binary or BCD), should be set via the data mode bit  
(DM) of Register B. All time, calendar, and alarm regis-  
ters must use the same data mode. The set bit in Regis-  
ter B should be cleared after the data mode bit has been  
written to allow the real-time clock to update the time  
and calendar bytes.  
Onceinitialized, thereal-timeclockmakesallupdatesin  
the selected mode. The data mode cannot be changed  
without reinitializing the ten data bytes. The 24/12 bit  
cannot be changed without reinitializing the hour loca-  
tions. When the 12-hour format is selected, the high or-  
der bit of the hours byte represents PM when it is a logic  
one. Thetime,calendar, andalarmbytesarealwaysac-  
cessible because they are double buffered. Once per  
second the ten bytes are advanced by one second and  
USER NONVOLATILE RAM - RTC  
The 50 user nonvolatile RAM bytes are not dedicated to  
any special function within the DS1495/DS1497. They  
can be used by the application program as nonvolatile  
memory and are fully available during the update cycle.  
This memory is directly accessible in the RTC section.  
020894 4/19  
DS1495/DS1497  
DS149X BLOCK DIAGRAM Figure 1  
D E C O D E R  
R E G I S T E R  
I N D E X  
020894 5/19  
DS1495/DS1497  
REAL TIME CLOCK RAM MAP Figure 2  
RTC  
INDIRECT ADDRESS REGISTER  
RTC +1  
RTC DATA REGISTER  
14– BYTES  
REAL TIME CLOCK  
INDIRECT  
ADDRESS  
00  
00  
00  
01  
SECONDS  
14–BYTES  
RTC  
SECONDS ALARM  
0D  
0E  
13  
14  
02  
03  
MINUTES  
MINUTES ALARM  
50–BYTES  
USER RAM  
04  
05  
HOURS  
HOURS ALARM  
3F  
63  
06  
DAY OF WEEK  
07  
08  
DAY OF MONTH  
MONTH  
09  
YEAR  
0A  
0B  
REGISTER A  
REGISTER B  
0C  
0D  
REGISTER C  
REGISTER D  
EXTENDED RAM ADDRESS MAP Figure 3  
XRAM  
256 PAGES  
PAGE FF  
OF 32–BYTES  
EXTENDED RAM  
THRU  
02  
01  
PAGE 00  
XRAM + 1F  
XRAM + 20  
XRAM PAGE REGISTER  
XRAM + 21  
THRU  
ALIASES OF  
PAGE REGISTER  
XRAM + 3F  
020894 6/19  
DS1495/DS1497  
TIME, CALENDAR AND ALARM DATA MODES Table 1  
RANGE  
BINARY DATA MODE  
ADDRESS  
LOCATION  
DECIMAL  
RANGE  
FUNCTION  
BCD DATA MODE  
00-59  
0
1
2
3
4
Seconds  
0-59  
0-59  
0-59  
0-59  
1-12  
0-23  
1-12  
0-23  
1-7  
00-3B  
Seconds Alarm  
Minutes  
00-3B  
00-59  
00-3B  
00-59  
Minutes Alarm  
00-3B  
00-59  
Hours-12-hr Mode  
Hours-24-hr Mode  
Hours Alarm-12-hr  
Hours Alarm-24-hr  
01-0C AM, 81-8C PM  
00-17  
01-12AM,81-92PM  
00-23  
5
6
01-0C AM, 81-8C PM  
00-17  
01-12AM,81-92PM  
00-23  
Day of the Week  
Sunday = 1  
01-07  
01-07  
7
8
9
Date of the Month  
Month  
1-31  
1-12  
0-99  
01-1F  
01-0C  
00-63  
01-31  
01-12  
00-99  
Year  
Register B. The flag bit can be used in a polling mode  
withoutenablingthecorrespondingenablebits. Whena  
flagisset, anindicationisgiventosoftwarethataninter-  
rupt event has occurred since the flag bit was last read.  
However, care should be taken when using the flag bits  
as they are cleared each time Register C is read.  
Double latching is included with Register C so that bits  
which are set remain stable throughout the read cycle.  
All bits which are set (high) are cleared when read and  
new interrupts which are pending during the read cycle  
are held until after the cycle is completed. One, two, or  
threebits can be set when reading Register C. Each uti-  
lized flag bit should be examined when read to ensure  
that no interrupts are lost.  
INTERRUPTS  
The RTC plus RAM includes three separate, fully auto-  
matic sources of interrupt for a processor. The alarm in-  
terrupt can be programmed to occur at rates from once  
per second to once per day. The periodic interrupt can  
be selected for rates from 500 ms to 122 µs. The up-  
date-ended interrupt can be used to indicate to the pro-  
gram that an update cycle is complete. Each of these  
independent interrupt conditions is described in greater  
detail in other sections of this text.  
The application program can select which interrupts, if  
any, are going to be used. Three bits in Register B en-  
able the interrupts. Writing a logic 1 to an interrupt-en-  
able bit permits that interrupt to be initiated when the  
event occurs. A logic 0 in an interrupt-enable bit prohib-  
its the IRQ pin from being asserted from that interrupt  
condition. If an interrupt flag is already set when an in-  
terrupt is enabled, IRQ is immediately set at an active  
level, although the interrupt initiating the event may  
haveoccurredmuchearlier. Asaresult, therearecases  
where the program should clear such earlier initiated in-  
terrupts before first enabling new interrupts.  
The alternative flag bit usage method is with fully en-  
abledinterrupts. Whenaninterruptflagbitissetandthe  
corresponding interrupt enable bit is also set, the IRQ  
pin is asserted low. IRQ is asserted as long as at least  
oneofthethreeinterruptsourceshasitsflagandenable  
bits both set. The IRQF bit in Register C is a one when-  
ever the IRQ pin is being driven low. Determination that  
the RTC initiated an interrupt is accomplished by read-  
ing Register C. A logic one in bit 7 (IRQF bit) indicates  
that one or more interrupts have been initiated by the  
DS1495/DS1497. The act of reading Register C clears  
all active flag bits and the IRQF bit.  
When an interrupt event occurs, the relating flag bit is  
set to logic 1 in Register C. These flag bits are set inde-  
pendent of the state of the corresponding enable bit in  
020894 7/19  
DS1495/DS1497  
Once the frequency is selected, the output of the SQW  
pin can be turned on and off under program control with  
the square wave enable bit (SQWE).  
OSCILLATOR CONTROL BITS  
When the DS1495/DS1497 is shipped from the factory,  
the internal oscillator is turned off. This feature prevents  
thelithium battery from being used until it is installed in a  
system. A pattern of 010 in bits 4 through 6 of Register A  
will turn the oscillator on and enable the countdown  
chain. A pattern of 11X will turn the oscillator on, but  
holds the countdown chain of the oscillator in reset. All  
other combinations of bits 4 through 6 keep the oscilla-  
tor off.  
PERIODIC INTERRUPT SELECTION  
The periodic interrupt will cause the IRQ pin to go to an  
active state from once every 500 ms to once every  
122 µs. This function is separate from the alarm inter-  
rupt which can be output from once per second to once  
per day. The periodic interrupt rate is selected using the  
same Register A bits which select the square wave fre-  
quency (see Table 1). Changing the Register A bits af-  
fects both the square wave frequency and the periodic  
interruptoutput. However, eachfunctionhasaseparate  
enable bit in Register B. The SQWE bit controls the  
square wave output. Similarly, the periodic interrupt is  
enabled by the PIE bit in Register B. The periodic inter-  
rupt can be used with software counters to measure in-  
puts, create output intervals, or await the next needed  
software function.  
SQUARE WAVE OUTPUT SELECTION  
Thirteen of the 15 divider taps are made available to a  
1-of-15 selector, as shown in the block diagram of Fig-  
ure 1. The first purpose of selecting a divider tap is to  
generate a square wave output signal on the SQW pin.  
The RS0-RS3 bits in Register A establish the square  
wave output frequency. These frequencies are listed in  
Table 2. The SQW frequency selection shares its  
1-of-15 selector with the periodic interrupt generator.  
PERIODIC INTERRUPT RATE AND SQUARE WAVE OUTPUT FREQUENCY Table 2  
SELECT BITS REGISTER A  
t
PERIODIC  
SQW OUTPUT  
FREQUENCY  
PI  
INTERRUPT RATE  
RS3  
0
RS2  
0
RS1  
0
RS0  
0
None  
None  
0
0
0
1
3.90625 ms  
7.8125 ms  
122.070 µs  
244.141 µs  
488.281 µs  
976.5625 µs  
1.953125 ms  
3.90625 ms  
7.8125 ms  
15.625 ms  
31.25 ms  
62.5 ms  
256 Hz  
128 Hz  
8.192 KHz  
4.096 KHz  
2.048 KHz  
1.024 KHz  
512 Hz  
256 Hz  
128 Hz  
64 Hz  
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
32 Hz  
1
1
0
0
16 Hz  
1
1
0
1
125 ms  
8 Hz  
1
1
1
0
250 ms  
4 Hz  
1
1
1
1
500 ms  
2 Hz  
020894 8/19  
DS1495/DS1497  
ter C should be cleared before leaving the interrupt rou-  
tine.  
UPDATE CYCLE  
The DS1495/DS1497 executes an update cycle once  
per second regardless of the SET bit in Register B.  
When the SET bit in Register B is set to one, the user  
copy of the double buffered time, calendar, and alarm  
bytes is frozen and will not update as the time incre-  
ments. However, the time countdown chain continues  
to update the internal copy of the buffer. This feature al-  
lows time to maintain accuracy independent of reading  
or writing the time, calendar, and alarm buffers and also  
guarantees that time and calendar information is con-  
sistent. The update cycle also compares each alarm  
byte with the corresponding time byte and issues an  
alarm if a match or if a “don’t care” code is present in all  
three positions.  
A second method uses the update-in-progress bit (UIP)  
in Register A to determine if the update cycle is in prog-  
ress. The UIP bit will pulse once per second. After the  
UIP bit goes high, the update transfer occurs 244 µs lat-  
er. If a low is read on the UIP bit, the user has at least  
244 µs before the time/calendar data will be changed.  
Therefore, the user should avoid interrupt service rou-  
tines that would cause the time needed to read valid  
time/calendar data to exceed 244 µs.  
The third method uses a periodic interrupt to determine  
if an update cycle is in progress. The UIP bit in Register  
A is set high between the setting of the PF bit in Register  
C (see Figure 3). Periodic interrupts that occur at a rate  
There are three methods that can handle access of the  
real-timeclockthatavoidanypossibilityofaccessingin-  
consistent time and calendar data. The first method  
uses the update-ended interrupt. If enabled, an inter-  
rupt occurs after every update cycle that indicates that  
over 999 ms are available to read valid time and date in-  
formation. If this interrupt is used, the IRQF bit in Regis-  
of greater than t  
allow valid time and date informa-  
BUC  
tion to be reached at each occurrence of the periodic in-  
terrupt. The reads should be complete within  
(t /2+t  
)toensurethatdataisnotreadduringtheup-  
PI  
BUC  
date cycle.  
UPDATE-ENDED AND PERIODIC INTERRUPT RELATIONSHIP Figure 4  
UIP BIT IN  
REGISTER A  
t
BUC  
UF BIT IN  
REGISTER C  
t
t
PI/2  
PI/2  
PF BIT IN  
REGISTER C  
t
PI  
t
t
= Periodic interrupt time interval per Table 1.  
PI  
= Delay time before update cycle = 244 µs.  
BUC  
020894 9/19  
DS1495/DS1497  
transfer is inhibited and the program can initialize the  
time and calendar bytes without an update occurring in  
the midst of initializing. Read cycles can be executed in  
asimilarmanner. SET is a read/write bit that is not modi-  
fied by internal functions of the DS1495/DS1497.  
REGISTERS  
The DS1495/DS1497 has four control registers which  
are accessible at all times, even during the update  
cycle.  
REGISTER A  
PIE - The Periodic Interrupt Enable bit is a read/write bit  
which allows the Periodic Interrupt Flag (PF) bit in Reg-  
isterCtodrivetheIRQpin low. WhenthePIEbitissetto  
one, periodic interrupts are generated by driving the  
IRQ pin low at a rate specified by the RS3-RS0 bits of  
Register A. A zero in the PIE bit blocks the IRQ output  
from being driven by a periodic interrupt, but the Period-  
ic Flag (PF) bit is still set at the periodic rate. PIE is not  
modified by any internal DS1495/DS1497 functions but  
is cleared by the hardware RESET signal.  
MSB  
LSB  
BIT 0  
BIT 7  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
UIP  
DV2  
DV1  
DV0  
RS3  
RS2  
RS1  
RS0  
UIP - The Update In Progress (UIP) bit is a status flag  
that can be monitored. When the UIP bit is a one, the  
update transfer will soon occur. When UIP is a zero, the  
update transfer will not occur for at least 244 µs. The  
time, calendar, and alarm information in RAM is fully  
available for access when the UIP bit is zero. The UIP  
bitisreadonly. WritingtheSETbitinRegisterBtoaone  
inhibits any update transfer and clears the UIP status  
bit.  
AIE - The Alarm Interrupt Enable (AIE) bit is a read/write  
bitwhich, whensettoaone, permitstheAlarmFlag(AF)  
bit in register C to assert IRQ. An alarm interrupt occurs  
foreachsecondthatthethreetimebytesequalthethree  
alarm bytes including a don’t care alarm code of binary  
11XXXXXX. When the AIE bit is set to zero, the AF bit  
doesnotinitiatetheIRQsignal. Theinternalfunctionsof  
the DS1495/DS1497 do not affect the AIE bit but is  
cleared by RESET.  
DV2, DV1, DV0 - These three bits are used to turn the  
oscillator on or off and to reset the countdown chain. A  
patternof010istheonlycombinationofbitsthatwillturn  
the oscillator on and allow the RTC to keep time. A pat-  
tern of 11X will enable the oscillator but holds the count-  
down chain in reset. The next update will occur at 500  
ms after a pattern of 010 is written to DV2, DV1, and  
DV0.  
UIE - The Update Ended Interrupt Enable (UIE) bit is a  
read/write bit that enables the Update Ended Flag (UF)  
bitinRegisterCtoassertIRQ. TheSETbitgoinghighor  
the RESET pin going low clears the UIE bit.  
RS3, RS2, RS1, RS0-Thesefourrate-selectionbitsse-  
lect one of the 13 taps on the 15-stage divider or disable  
thedivider output. The tap selected can be used to gen-  
erateanoutputsquarewave(SQWpin)and/oraperiod-  
ic interrupt. The user can do one of the following  
SQWE - When the Square Wave Enable (SQWE) bit is  
set to a one, a square wave signal at the frequency set  
by the rate-selection bits RS3 through RS0 is driven out  
on a SQW pin. When the SQWE bit is set to zero, the  
SQW pin is held low. SQWE is a read/write bit and is  
cleared by RESET.  
1. Enable the interrupt with the PIE bit;  
2. Enable the SQW output pin with the SQWE bit;  
3. Enable both at the same time and the same rate; or  
4. Enable neither.  
DM - The Data Mode (DM) bit indicates whether time  
and calendar information is in binary or BCD format.  
The DM bit is set by the program to the appropriate for-  
matandcanbereadasrequired. Thisbitisnotmodified  
by internal functions. A one in DM signifies binary data  
while a zero in DM specifies Binary Coded Decimal  
(BCD) data.  
Table 2 lists the periodic interrupt rates and the square  
wave frequencies that can be chosen with the RS bits.  
REGISTER B  
MSB  
LSB  
BIT 7 BIT 6 BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1 BIT 0  
24/12 - The 24/12 control bit establishes the format of  
the hours byte. A one indicates the 24-hour mode and a  
zero indicates the 12-hour mode. This bit is read/write.  
SET  
PIE  
AIE  
UIE  
SQWE  
DM  
24/12  
DSE  
SET - When the SET bit is a zero, the update transfer  
functions normally by advancing the counts once per  
second.WhentheSETbitiswrittentoaone, anyupdate  
020894 10/19  
DS1495/DS1497  
DSE - The Daylight Savings Enable (DSE) bit is a read/  
write bit which enables two special updates when DSE  
is set to one. On the first Sunday in April the time incre-  
ments from 1:59:59 AM to 3:00:00 AM. On the last  
Sunday in October when the time first reaches 1:59:59  
AMitchangesto1:00:00AM. Thesespecialupdatesdo  
not occur when the DSE bit is a zero. This bit is not af-  
fected by internal functions.  
AF – A one in the Alarm Interrupt Flag (AF) bit indicates  
that the current time has matched the alarm time. If the  
AIEbitisalsoaone, theIRQpinwillgolowandaonewill  
appearintheIRQFbit. AreadofRegisterCoraRESET  
will clear AF.  
UF – The Update Ended Interrupt Flag (UF) bit is set af-  
tereachupdatecycle. WhentheUIEbitissettoone,the  
one in UF causes the IRQF bit to be a one which will as-  
sert the IRQ pin. UF is cleared by reading Register C or  
by RESET.  
REGISTER C  
MSB  
LSB  
BIT 7  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
BIT 0  
BIT 0 THROUGH BIT 3 – These are reserved bits of the  
statusRegisterC. Thesebitsalwaysreadzeroandcan-  
not be written.  
IRQF  
PF  
AF  
UF  
0
0
0
0
IRQF – The Interrupt Request Flag (IRQF) bit is set to a  
one when one or more of the following are true:  
REGISTER D  
PF = PIE = 1  
AF = AIE = 1  
UF = UIE = 1  
MSB  
LSB  
BIT 7  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
BIT 0  
i.e., IRQF = (PF PIE) + (AF AIE) + (UF UIE)  
VRT  
0
0
0
0
0
0
0
VRT – The Valid RAM and Time (VRT) bit is set to the  
one state by Dallas Semiconductor Corporation prior to  
shipment. Thisbitisnotwritableandshouldalwaysbea  
one when read. If a zero is ever present, an exhausted  
internal lithium energy source is indicated and both the  
contents of the RTC data and RAM data are question-  
able.  
Any time the IRQF bit is a one, the IRQ pin is driven low.  
All flag bits are cleared after Register C is read by the  
program or when the RESET pin is low.  
PF – The Periodic Interrupt Flag (PF) is a read-only bit  
which is set to a one when an edge is detected on the  
selected tap of the divider chain. The RS3 through RS0  
bits establish the periodic rate. PF is set to a one inde-  
pendent of the state of the PIE bit. When both PF and  
PIE are ones, the IRQ signal is active and will set the  
IRQF bit. The PF bit is cleared by a software read of  
Register C or by RESET.  
BIT 6 THROUGH BIT 0 TheremainingbitsofRegister  
D are reserved and not usable. They cannot be written  
and, when read, they will always read zero.  
020894 11/19  
DS1495/DS1497  
ABSOLUTE MAXIMUM RATINGS*  
DD  
Input Voltage  
V
Pin Potential to Ground Pin  
-0.3V to +7.0V  
– 0.3 to V + 0.3V  
V
SS  
DD  
Power Dissipation  
Storage Temperature  
500 mW  
DS1497: –40°C to +70°C  
DS1495: –55°C to +125°C  
0°C to 70°C  
Ambient Temperature  
Soldering Temperature  
260°C for 10 seconds  
* This is a stress rating only and functional operation of the device at these or any other conditions above those  
indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods of time may affect reliability.  
RECOMMENDED DC OPERATING CONDITIONS  
(0°C to 70°C)  
CHARACTERISTIC  
Supply Voltage  
TEST CONDITION  
SYM  
MIN  
4.5  
MAX UNITS NOTES  
V
CC  
5.5  
V
Input High Voltage  
Recognized as a High Signal Over  
V
IH  
2.2  
V
0.3  
+
V
V
DD  
Recommended V and t Range  
DD  
A
Input Low Voltage  
Battery Voltage  
Recognized as a Low Signal Over  
Recommended V and t Range  
V
-0.3  
2.5  
0.8  
V
IL  
DD  
A
V
BAT  
3.7  
V
DC ELECTRICAL CHARACTERISTICS  
(VDD = 5.0V + 10%, VSS = 0V, tA = 0° C to 70°C)  
CHARACTERISTIC  
TEST CONDITION  
SYM  
MIN  
MAX  
UNIT NOTES  
Input Leakage  
For any Single Pin: D0-7, RD, WR,  
A0-5, XRAM, RTC, RESET  
I
I
+1  
µA  
V =0V, V =V  
IL  
IH  
DD  
Output High Voltage  
Output Low Voltage  
V
=5.0V I  
=1 mA  
V
OH  
2.4  
V
V
DD  
DD  
LOAD  
V
= 5.0V I  
= 2 mA  
V
0.4  
50  
LOAD  
OL  
DD  
Power Supply Current Outputs Unloaded  
I
mA  
µA  
µA  
STBY pin Input Current STBY=V  
STBY pin Input Current STBY=V  
I
I
+500  
–1  
DD  
SS  
STBY  
STBY  
AC SWITCHING CHARACTERISTICS  
(0°C to 70°C; VDD = 4.5V to 5.5V)  
CHARACTERISTIC  
Reset Pulse Width  
Oscillator Startup  
TEST CONDITION  
SYM  
MIN  
MAX  
UNIT NOTES  
t
5
µs  
s
RWL  
From Software Enable Via DV Bits  
t
1
2
RC  
IRQ Release from RD  
High  
t
µs  
IRDS  
IRQ Release from  
RESET Low  
t
2
µs  
IRR  
020894 12/19  
DS1495/DS1497  
IRQ RELEASE DELAY  
RD  
V
HIGH  
t
RWL  
RESET  
V
IRQ  
HIGH  
t
IRR  
t
IRDS  
OSCILLATOR START-UP  
t
RC  
SQW Pin  
WR  
V
HIGH  
DV0–2  
NOTE:  
Timing assumes RS3-0 Bits = 0011, minimum t .  
PI  
020894 13/19  
DS1495/DS1497  
BUS TIMING  
PARAMETER  
(0°C to 70°C; VDD = 4.5V to 5.5V)  
SYM  
MIN  
395  
200  
TYP  
MAX  
UNIT  
NOTES  
Cycle Time  
t
DC  
ns  
CYC  
Pulse Width, RD/WR Low  
PW  
ns  
RWL  
F
Signal Rise and Fall Time, RTC,  
XRAM, RD, WR  
t , t  
R
30  
ns  
Address Hold Time  
t
20  
50  
0
ns  
ns  
ns  
ns  
AH  
Address Setup Time Before RD  
Address Setup Time Before WR  
t
ARS  
t
AWS  
RTC/XRAM Select Setup Time Be-  
fore RD  
t
50  
CRS  
RTC/XRAM Select Setup Time Be-  
fore WR  
t
0
ns  
ns  
CWS  
RTC/XRAM Select Hold Time After  
RD or WR  
t
20  
CH  
Read Data Hold Time  
t
10  
0
100  
200  
ns  
ns  
ns  
ns  
DHR  
Write Data Hold Time  
t
DHW  
Output Data Delay Time from RD  
Write Data Setup Time  
t
20  
200  
DDR  
DSW  
t
OUTPUT LOAD  
+5 V  
1.1KΩ  
D.U.T.  
50 pF  
680Ω  
020894 14/19  
DS1495/DS1497  
BUS READ/WRITE TIMING  
t
CYC  
VALID  
A0-A5  
t
t
F
R
RTC  
XRAM  
t
t
CWS  
CH  
t
t
F
R
WR  
PW  
RWL  
t
AWS  
t
AH  
t
DSW  
t
DATA BUS  
WRITE  
DATA  
DHW  
VALID  
D0–D7  
DATA BUS  
READ  
VALID  
DATA  
D0–D7  
t
t
CRS  
t
DDR  
CH  
t
RD  
PW  
RWL  
t
ARS  
DHR  
t
AH  
POWER-DOWN/ POWER-UP TIMING  
(tA = 25°C)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
ns  
NOTES  
CE High to Power Fail  
Recovery at Power Up  
t
PF  
0
t
150  
ms  
REC  
V
CC  
V
CC  
V
CC  
Slew Rate Power Down  
Slew Rate Power Down  
Slew Rate Power Up  
t
300  
10  
0
µs  
F
4.0 <V < 4.5V  
CC  
t
FB  
µs  
µs  
3.0 <V < 4.0V  
CC  
t
R
4.5V>V >4.0V  
CC  
Expected Data Retention  
t
10  
years  
DR  
NOTE:  
CE is chip enabled for access, an internal signal which is defined by (RD + WR) (XRAM + RTC).  
CAPACITANCE  
(tA = 25°C)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
12  
UNITS  
pF  
NOTES  
Input Capacitance  
Output Capacitance  
C
IN  
C
12  
pF  
OUT  
020894 15/19  
DS1495/DS1497  
GENERAL INFORMATION  
PARAMETER  
SYM  
MIN  
TYP  
MAX  
UNIT  
NOTES  
t
10  
Years  
Expected Data Retention @ 25°C  
(DS1497 only)  
DR  
C
±1  
Min/Mo  
Clock Accuracy for t @ 25°C  
Q
DR  
(DS1497 only)  
2
Clock Accuracy Temperature Coefficient  
(DS1497)  
K
.050  
30  
ppm/°C  
0°C  
Clock Temperature Coefficient  
t
O
20  
Turnover Temperature (DS1497 only)  
Chip Enable Threshold (DS1497 only)  
POWER–UP CONDITION  
CE  
CE  
4.5  
V
THR  
V
IH  
t
REC  
4.5V  
4.25V  
4.0V  
V
CC  
t
R
POWER FAIL  
NOTE:  
CE is an internal signal generated by the power switching reference in the DS149X products.  
POWER–DOWN CONDITION  
CE  
V
IH  
t
PF  
t
F
V
CC  
4.5V  
4.25V  
4.0V  
V
t
DR  
BAT  
t
FB  
POWER FAIL  
020894 16/19  
DS1495/DS1497  
DS1495 28–PIN DIP  
PKG  
28–PIN  
MIN  
DIM  
MAX  
A IN.  
MM  
1.445  
36.70  
1.470  
37.34  
B
D
B IN.  
MM  
0.530  
13.46  
0.550  
13.97  
C IN.  
MM  
0.140  
3.56  
0.160  
4.06  
1
D IN.  
MM  
0.600  
15.24  
0.625  
15.88  
A
E IN.  
MM  
0.015  
0.38  
0.040  
1.02  
F IN.  
MM  
0.120  
3.05  
0.145  
3.68  
G IN.  
MM  
0.090  
2.29  
0.110  
2.79  
H IN.  
MM  
0.625  
15.88  
0.675  
17.15  
C
F
J IN.  
MM  
0.008  
0.20  
0.012  
0.30  
E
K
G
K IN.  
MM  
0.015  
0.38  
0.022  
0.56  
J
H
020894 17/19  
DS1495/DS1497  
DS1495S 28–PIN SOIC  
K
G
PKG  
28-PIN  
MIN  
DIM  
MAX  
A IN.  
MM  
0.706  
17.93  
0.728  
18.49  
B IN.  
MM  
0.338  
8.58  
0.350  
8.89  
C IN.  
MM  
0.086  
2.18  
0.110  
2.79  
D IN.  
MM  
0.020  
0.58  
0.050  
1.27  
E IN.  
MM  
0.002  
0.05  
0.014  
0.36  
F IN.  
MM  
0.090  
2.29  
0.124  
3.15  
0.050  
1.27  
BSC  
G IN.  
MM  
C
H IN.  
MM  
0.460  
11.68  
0.480  
12.19  
A
J IN.  
MM  
0.006  
0.15  
0.013  
0.33  
E
K IN.  
MM  
0.014  
0.36  
0.020  
0.51  
B
H
F
0–8 deg. typ.  
J
D
020894 18/19  
DS1495/DS1497  
DS1497 28–PIN 720 MIL FLUSH ENCAPSULATED  
15  
28  
PKG  
28-PIN  
MIN  
DIM  
MAX  
A
IN.  
MM  
1.520  
38.61  
1.540  
39.12  
B
C
D
E
F
IN.  
MM  
0.695  
17.65  
0.720  
18.29  
1
14  
IN.  
MM  
0.350  
8.89  
0.375  
9.52  
A
IN.  
MM  
0.100  
2.54  
0.130  
3.30  
IN.  
MM  
0.015  
0.38  
0.030  
0.76  
IN.  
MM  
0.110  
2.79  
0.140  
3.56  
C
E
G
H
J
IN.  
MM  
0.090  
2.29  
0.110  
2.79  
IN.  
MM  
0.590  
14.99  
0.630  
16.00  
F
D
K
G
IN.  
MM  
0.008  
0.20  
0.012  
0.30  
13 EQUAL SPACES AT  
.100 ± .010 TNA  
K
IN.  
MM  
0.015  
0.38  
0.021  
0.53  
NOTE:  
PINS 3, 4, 18 AND 22 ARE MISSING BY DESIGN.  
J
H
B
020894 19/19  

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