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DS32KHZ-N [DALLAS]

32.768kHz Temperature-Compensated Crystal Oscillator; 32.768kHz的温度补偿晶体振荡器
DS32KHZ-N
型号： DS32KHZ-N
厂家： DALLAS SEMICONDUCTOR    DALLAS SEMICONDUCTOR
描述：

32.768kHz Temperature-Compensated Crystal Oscillator
32.768kHz的温度补偿晶体振荡器

振荡器 晶体振荡器 温度补偿
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DS32kHz  
32.768kHz Temperature-Compensated  
Crystal Oscillator  
www.maxim-ic.com  
GENERAL DESCRIPTION  
FEATURES  
The DS32kHz is a temperature-compensated crystal  
oscillator (TCXO) with an output frequency of  
32.768kHz. This device addresses applications  
requiring better timekeeping accuracy and can be  
used to drive the X1 input of most Dallas  
Semiconductor real-time clocks (RTCs), chipsets, and  
other ICs containing RTCs. This device is available in  
commercial (DS32kHz) and industrial (DS32kHz-N)  
temperature versions.  
Cꢀ Accurate to ±4 Min/Yr (-40°C to +85°C)  
Cꢀ Accurate to ±1 Min/Yr (0°C to +40°C)  
Cꢀ Battery Backup for Continuous Timekeeping  
Cꢀ VBAT Operating Voltage: 2.7V to 5.5V with VCC  
Grounded  
Cꢀ VCC Operating Voltage: 4.5V to 5.5V  
Cꢀ Operating Temperature Range:  
0°C to +70°C (Commercial)  
-40°C to +85°C (Industrial)  
Cꢀ No Calibration Required  
Cꢀ Low-Power Consumption  
APPLICATIONS  
Cꢀ Surface Mountable Using BGA Package  
Cꢀ UL Recognized  
GPS Receivers  
Telematics  
Network Timing and Synchronization in Servers,  
Routers, Hubs, and Switches  
Automatic Power Meters  
ORDERING INFORMATION  
PART  
TEMP RANGE  
0ºC to +70ºC  
-40ºC to +85ºC  
0ºC to +70ºC  
-40ºC to +85ºC  
PIN-PACKAGE  
14 DIP  
DS32kHz/DIP  
DS32kHz-N/DIP  
DS32kHz/WBGA  
DS32kHz-N/WBGA  
14 DIP  
36 BGA  
36 BGA  
PIN CONFIGURATIONS  
TOP VIEW  
N.C.  
1
14  
13  
12  
11  
10  
9
N.C.  
VCC  
32KHZ OUT  
TPIN  
TPIN  
N.C.  
2
3
4
5
6
7
GND  
VBAT  
N.C.  
N.C.  
8
N.C.  
DIP  
BGA  
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device  
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.  
1 of 10  
REV: 041603  
DS32kHz  
ABSOLUTE MAXIMUM RATINGS  
Voltage Range on Any Pin Relative to Ground  
Operating Temperature Range  
Commercial  
-3.0V to +7.0V  
0°C to +70°C  
-40°C to +85°C  
Industrial  
Storage Temperature Range  
Soldering Temperature (BGA)  
Soldering Temperature, Leads (DIP)  
-40°C to +85°C  
See IPC/JEDEC J-STD-020A (2x max) (Note 1)  
260°C for 10 seconds (Notes 1, 2)  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,  
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is  
not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device.  
RECOMMENDED DC OPERATING CONDITIONS  
(TA = -40°C to +85°C)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Power-Supply Voltage  
Battery Voltage (Note 3)  
VCC  
VBAT  
4.5  
2.7  
5.0  
3.0  
5.5  
3.3, 5.5  
V
V
DC ELECTRICAL CHARACTERISTICS  
(Over the operating range, unless otherwise specified.)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Active Supply Current  
ICC  
(Notes 4, 5)  
150  
180  
µA  
VCC = 0V, VBAT = 3.3V  
(Notes 4, 5, 6, 7)  
Active Battery Current  
IBAT  
1
4
µA  
High Output Voltage (VCC)  
Low Output Voltage  
VOH  
VOL  
VSW  
VOH  
IOH = -1.0mA  
2.4  
2.4  
V
V
V
V
IOL = 2.1mA  
0.4  
Battery Switch Voltage  
High Output Voltage (VBAT  
VBAT  
)
IOH = -0.1mA  
Note 1: Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibration is not used. Such cleaning can  
damage the crystal.  
Note 2: Encapsulated DIP modules can be successfully processed through conventional wave-soldering techniques, as long as the temperature  
of the crystal contained inside does not exceed +150°C.  
Note 3: VBAT must be no greater than 3.3V when the device is used in the dual-supply operating modes.  
Note 4: Typical values are at +25°C and 5.0V VCC, 3.0 VBAT, unless otherwise indicated.  
Note 5: These parameters are measured under no load conditions.  
Note 6: This current is the active mode current sourced from the backup supply/battery.  
Note 7: Battery current increases to 450µA (typ) for 122ms (typ) for every 64 seconds.  
2 of 10  
DS32kHz  
AC TIMING CHARACTERISTICS  
(Over the operating range, unless otherwise specified.)  
PARAMETER  
Output Frequency  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
fOUT  
32.768  
kHz  
0°C to +40°C  
-2.0  
-7.5  
45  
+2.0  
+7.5  
55  
Frequency Stability vs.  
Temperature  
∆f/fO  
ppm  
-40°C to +85°C or  
0°C to +70°C  
Duty Cycle  
tW/t  
tCYC  
tH/tL  
tR  
50  
30.518  
15.06  
200  
%
µs  
µs  
ns  
ns  
s
Cycle Time  
(Note 8)  
(Note 8)  
(Note 8)  
(Note 8)  
High/Low Time  
Rise Time  
Fall Time  
tF  
60  
Oscillator Startup Time  
tOSC  
(Note 8)  
1
VCC = 5.0V or  
Frequency Stability vs.  
Operating Voltage  
V
BAT = 3.0V, VCC = 0V  
±2.5  
±1.0  
ppm/V  
∆f/V  
(Notes 4, 9)  
(Notes 4, 10)  
Crystal Aging  
∆f/fO  
ppm/yr  
Note 8: These parameters are measured using a 15pF load.  
Note 9: Error is measured from the nominal supply voltage of whichever supply is powering the device.  
Note 10: After reflow.  
3 of 10  
DS32kHz  
TYPICAL OPERATING CHARACTERISTICS  
(VCC = 3.3V, TA = +25°C, unless otherwise noted.)  
I
vs. V  
I
vs. V  
I
vs. OUTPUT LOAD vs. V  
BAT  
BAT  
BAT  
CC  
CC  
CC  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
150  
125  
100  
75  
15.0  
12.5  
10.0  
7.50  
6.00  
2.50  
0
47pF  
22pF  
10pF  
0pF  
50  
25  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
V
BAT  
(V)  
V
CC  
(V)  
V
BAT  
FREQUENCY ERROR vs. V  
FREQUENCY ERROR vs. V  
CC  
BAT  
2.0  
8
7
6
5
4
3
2
1
0
1.5  
1.0  
0.5  
0
-0.5  
-1.0  
-1  
4.5  
5.0  
5.5  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
V
CC  
(V)  
VBAT (V)  
4 of 11  
DS32kHz  
PIN DESCRIPTIONS  
PIN  
NAME  
FUNCTION  
+3V Batttery Supply  
BGA  
DIP  
A4, A5, B4, B5  
A7, A8, B7, B8,  
C7, C8, D7, D8  
5
10, 11  
13  
VBAT  
TPIN  
Test Pin (must be grounded)  
Primary Power Supply  
32.768kHz Output  
C2, C3, D2, D3  
VCC  
C4, C5, D4, D5  
12  
32KHZ OUT  
—
1, 6–9, 14  
4
N.C.  
No Connection  
Ground  
All remaining balls  
GND  
Figure 1. Delta Time and Frequency vs. Temperature  
0.00  
-10.00  
-20.00  
-30.00  
-40.00  
-50.00  
-60.00  
-70.00  
TYPICAL CRYSTAL  
DS32kHz  
OUTPUT  
UNCOMPENSATED  
-80.00  
-90.00  
-100.00  
FUNCTIONAL DESCRIPTION  
The DS32kHz requires four pins for operation: VCC, GND, VBAT, and 32KHZ OUT. (See Figure 3 for connection  
schemes.) Power is applied through VCC and GND, while VBAT is used to maintain the 32kHz output in the absence  
of power. The output is accurate to ±7.5ppm (±4 min/yr) from –40°C to +85°C and ±2ppm (±1 min/yr) from 0°C to  
+40°C.  
The DS32kHz is packaged in  
a
small 36-pin SMD using ball grid array (BGA) technology  
with dimensions 0.400" wide, 0.450" long, and 0.124" high. It also is available in a 14-pin DIP module.  
The additional board space required is negligible in most applications and, therefore, the recommended land  
pattern layout should be implemented on all new designs and future board revisions to satisfy applications requiring  
better timekeeping accuracy.  
5 of 10  
DS32kHz  
Figure 2. Block Diagram  
OPERATION  
The DS32kHz module contains a crystal and an IC. While powered, the DS32kHz peridocially measures the  
temperature and adjusts the crystal load to compensate.  
The DS32kHz is designed to operate in two modes. In the dual-supply mode, a comparator circuit, powered by VCC,  
monitors the relationship between the VCC and VBAT input levels. When VCC drops below a certain level compared to  
V
BAT, the device switches over to VBAT (Figure 3A). This mode uses VCC to conserve the battery connected to VBAT  
while VCC is applied.  
In the single-supply mode, VCC is grounded and the unit is powered by VBAT. Current consumption is less than that  
of VCC, because the comparator circuit is unpowered (Figure 3B).  
Figure 3A shows how the DS32kHz should be connected when using two power supplies. VCC should be between  
4.5V and 5.5V and VBAT should be between 2.7V and 3.3V. Figure 3B shows how the DS32kHz can be used when  
only a single-supply system is available. VCC should be grounded and VBAT should then be held between 2.7V and  
5.5V. The VBAT pin should be connected directly to a battery. Figure 3C shows a single supply mode where VCC is  
held at +5V. See the frequency stability versus operating voltage for information about frequency error versus  
supply voltage.  
Figure 3. Power-Supply Connections  
6 of 10  
DS32kHz  
Figure 4 illustrates how a standard 32.768kHz crystal and the DS32kHz should be connected to address the  
interchangeable option. Using this connection scheme and the recommended layout provides a solution, which  
requires no hardware modifications. Only one device should be used at a time, and both layouts should be located  
very close together if the recommended layout is not used.  
The DS32kHz ICC and IBAT currents are specified with no output loads. Many RTC oscillator circuits use a quartz  
crystal or resonator. Driving the oscillator circuit with the rail-to-rail output of the DS32kHz can increase the ICC and  
I
BAT currents significantly and increase the current consumption of the RTC as well. Figure 5 shows one circuit that  
can be used to reduce the current consumption of a DS32kHz and an RTC. The values of R1 and C1 may vary  
depending on the RTC used. However, values of 1.0Mꢀ and 100pF are recommended as a starting point. R2 is  
used to shift the input waveform to the proper level. The recommended value for R2 is 33kꢀ.  
Figure 4. DS32kHz Connections  
THE STANDARD 32.768kHz CRYSTAL AND THE DS32kHz SHOULD BE CONNECTED TO ADDRESS THE  
INTERCHANGEABLE OPTION.  
Figure 5. DS32kHz and RTC Connections  
THIS SHOWS A CIRCUIT THAT CAN BE USED TO REDUCE  
THE CURRENT CONSUMPTION OF A DS32kHz AND AN RTC.  
7 of 10  
DS32kHz  
Figure 6. DS32kHz Output Waveform  
RELATED APPLICATION NOTES  
Application Note 58: Crystal Considerations with Dallas Real-Time Clocks  
Application Note 701: Using the DS32kHz with Dallas RTCs  
PACKAGE INFORMATION  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package information, go to  
www.maxim-ic.com/DallasPackInfo.)  
G
PKG  
36-PIN BGA  
DIM  
A IN  
B IN  
C IN  
D IN  
E IN  
F IN  
G IN  
H IN  
MIN  
MAX  
0.405  
0.455  
0.028  
0.053  
0.053  
0.353  
0.130  
0.030  
0.395  
0.445  
0.022  
0.047  
0.047  
0.347  
0.118  
0.020  
E
H
F
A
C
D
B
8 of 10  
DS32kHz  
PACKAGE INFORMATION (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package information, go to  
www.maxim-ic.com/DallasPackInfo.)  
9 of 10  
DS32kHz  
PACKAGE INFORMATION (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package information, go to  
www.maxim-ic.com/DallasPackInfo.)  
Note: Pins 2, 3 are missing by design.  
PKG  
DIM  
A IN  
B IN  
C IN  
D IN  
E IN  
F IN  
G IN  
H IN  
J IN  
K IN  
14-PIN DIP  
MIN  
MAX  
0.840  
0.440  
0.260  
0.130  
0.030  
0.140  
0.110  
0.330  
0.012  
0.021  
0.825  
0.420  
0.235  
0.100  
0.015  
0.110  
0.090  
0.290  
0.008  
0.015  
10 of 10  

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