IPM12C0A0R06FA [DELTA]

Delphi Series IPM, Non-Isolated, Integrated Point-of-Load Power Modules: 3V~5.5V input, 0.8~3.3V and 6A Output Current; 德尔福系列IPM ，非隔离式负载点的集成功率模块： 3V 〜 5.5V的输入电压， 0.8 〜 3.3V和6A的输出电流


型号：	IPM12C0A0R06FA
厂家：	DELTA ELECTRONICS, INC.
描述：	Delphi Series IPM, Non-Isolated, Integrated Point-of-Load Power Modules: 3V~5.5V input, 0.8~3.3V and 6A Output Current 德尔福系列IPM ，非隔离式负载点的集成功率模块： 3V 〜 5.5V的输入电压， 0.8 〜 3.3V和6A的输出电流
文件：	总15页 (文件大小：812K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FEATURES

ꢀ

High efficiency: 93% @ 5.0Vin, 3.3V/6A out

ꢀ

Small size and low profile:

17.8 x 15.0 x 7.8mm (0.70” x 0.59” x 0.31”)

Output voltage adjustment: 0.9V~3.3V

Monotonic startup into normal and

pre-biased loads

ꢀ

Input UVLO, output OCP

Remote ON/OFF

Output short circuit protection

Fixed frequency operation

Copper pad to provide excellent thermal

performance

ꢀ

ISO 9001, TL 9000, ISO 14001, QS9000,

OHSAS18001 certified manufacturing

UL/cUL 60950 (US & Canada) Recognized,

and TUV (EN60950) Certified

CE mark meets 73/23/EEC and 93/68/EEC

directives

Delphi Series IPM, Non-Isolated, Integrated

Point-of-Load Power Modules: 3V~5.5V input,

0.8~3.3V and 6A Output Current

The Delphi Series IPM04C non-isolated, fully integrated

Point-of-Load (POL) power modules, are the latest offerings from a

world leader in power supply technology and manufacturing ― Delta

Electronics, Inc. This product family provides up to 6A of output

current or 19.8W of output power in an industry standard, compact,

IC-like, molded package. It is highly integrated and does not require

external components to provide the point-of-load function. A copper

pad on the back of the module, in close contact with the internal heat

dissipation components, provides excellent thermal performance.

The assembly process of the modules is fully automated with no

manual assembly involved. These converters possess outstanding

electrical and thermal performance, as well as extremely high

reliability under highly stressful operating conditions. IPM04C

operate from a 3V~5.5V source and provide a programmable output

voltage of 0.8V~3.3V. The IPM product family is available in both a

SMD or SIP package. IPM family is also available for input 8V~14V,

please refer to IPM12C datasheet for details.

OPTION

ꢀ

SMD or SIP package

APPLICATIONS

ꢀ

Telecom/DataCom

Wireless Networks

Optical Network Equipment

Server and Data Storage

Industrial/Test Equipment

DATASHEET

IPM04C0A0R/S06_08242006

Delta Electronics, Inc.

TECHNICAL SPECIFICATIONS

T_A= 25°C, airflow rate = 300 LFM, V_in= 5.0Vdc, nominal Vout unless otherwise noted.

PARAMETER

NOTES and CONDITIONS

IPM04C0A0R/S06FA

Min.

Typ.

Max.

Units

ABSOLUTE MAXIMUM RATINGS

Input Voltage (Continuous)

Operating Temperature

-40

-55

116

125

Vdc

°C

Refer to figure 33 for measuring point

Storage Temperature

INPUT CHARACTERISTICS

Operating Input Voltage

3.0

3.3/5.0

5.5

Input Under-Voltage Lockout

Turn-On Voltage Threshold

Turn-Off Voltage Threshold

Maximum Input Current

2.4

2.1

2.7

2.4

7.0

100

Vin=Vin,min to Vin,max, Io=Io,max

No-Load Input Current

mAp-p

Off Converter Input Current

Input Reflected-Ripple Current

Input Voltage Ripple Rejection

OUTPUT CHARACTERISTICS

Output Voltage Set Point

Output Voltage Adjustable Range

Output Voltage Regulation

Over Line

100

TBD

P-P 1µH inductor, 5Hz to 20MHz

120 Hz

150

Vin=5.0V, Io=Io,max,

0.889

0.8

0.900

0.911

3.3

% Vo,set

Vin=Vin,min to Vin,max

Io=Io,min to Io,max

Over Load

Over Temperature

Ta=-40°C to 85°C

Over sample load, line and temperature

5Hz to 20MHz bandwidth

Full Load, 1µF ceramic, 10µF tantalum

+3.0

% Vo,set

Total Output Voltage Range

Output Voltage Ripple and Noise

Peak-to-Peak

-3.0

100

mVp-p

RMS

Output Current Range

Output Voltage Over-shoot at Start-up

Output DC Current-Limit Inception

DYNAMIC CHARACTERISTICS

Dynamic Load Response

Positive Step Change in Output Current

Negative Step Change in Output Current

Setting Time to 10% of Peak Devitation

Turn-On Transient

Vin=3.0V to 5.5V, Io=0A to 6A,

200

% Vo,set

% Io

10µF Tan & 1µF Ceramic load cap, 0.5A/µs

50% Io, max to 100% Io, max

100% Io, max to 50% Io, max

150

190

mVpk

µs

Io=Io.max

Start-Up Time, From On/Off Control

Start-Up Time, From Input

Output Voltage Rise Time

Maximum Output Startup Capacitive Load

1000

5000

µF

Time for Vo to rise from 10% to 90% of Vo,set,

Full load; ESR ≧1mΩ

Full load; ESR ≧10mΩ

EFFICIENCY

Vo=0.9V

Vo=1.2V

Vo=1.5V

Vo=1.8V

Vo=2.5V

Vo=3.3V

Vin=5.0V, Io=Io,max,

80.0

83.0

86.0

88.0

91.0

93.0

FEATURE CHARACTERISTICS

Switching Frequency

ON/OFF Control, (Logic High-Module ON)

Logic High

300

kHz

Module On

2.2

Vin,max

Logic Low

Module Off

Ion/off at Von/off=0

Logic High, Von/off=5V

-0.2

0.8

µA

ON/OFF Current

Leakage Current

GENERAL SPECIFICATIONS

MTBF

0.25

Io=80% Io,max,

30.3

M hours

grams

Weight

DS_IPM04C0A0R06_08242006

ELECTRICAL CHARACTERISTICS CURVES

Vin=5.0V

Vin=4.0V

Vin=3.3V

Vin=5.0V

Vin=4.0V

Vin=3.3V

LOAD (A)

Figure 1: Converter efficiency vs. output current

Figure 2: Converter efficiency vs. output current

(0.90V output voltage)

(1.2V output voltage)

Vin=5.0V

Vin=4.0V

Vin=3.3V

Vin=5.0V

Vin=4.0V

Vin=3.3V

LOAD (A)

Figure 3: Converter efficiency vs. output current

Figure 4: Converter efficiency vs. output current

(1.5V output voltage)

(1.8V output voltage)

Vin=5.5V

Vin=5.0V

Vin=4.0V

Vin=5.0V

Vin=4.0V

Vin=3.3V

LOAD (A)

Figure 5: Converter efficiency vs. output current

Figure 6: Converter efficiency vs. output current

(2.5V 0utput voltage)

(3.3V output voltage)

DS_IPM04C0A0R06_08242006

ELECTRICAL CHARACTERISTICS CURVES

Figure 7: Output ripple & noise at 5.0Vin, 0.9V/ 6A out

Figure 8: Output ripple & noise at 5.0Vin, 1.2V/ 6A out

Figure 10: Output ripple & noise at 5.0Vin, 1.8V/ 6A out

Figure 12: Output ripple & noise at 5.0Vin, 3.3V /6A out

Figure 9: Output ripple & noise at 5.0Vin, 1.5V/ 6A out

Figure 11: Output ripple & noise at 5.0Vin, 2.5V/ 6A out

DS_IPM04C0A0R06_08242006

ELECTRICAL CHARACTERISTICS CURVES

Figure 13: Power on waveform at 5.0vin, 0.9V/ 6A out

Figure 14: Power on waveform at 5.0vin, 3.3V/ 6A out

with application of Vin

Figure 15: Power off waveform at 5.0vin, 0.9V/ 6A out

Figure 16: Power off waveform 5.0vin, 3.3V/ 6A out

with application of Vin

Figure 17: Remote turn on delay time at 5.0vin,

Figure 18: Remote turn on delay time at 5.0vin,

0.9V/ 6A out

3.3V/ 6A out

DS_IPM04C0A0R06_08242006

ELECTRICAL CHARACTERISTICS CURVES

Figure 19: Turn on delay at 5.0vin, 0.9V/ 6A out

Figure 20: Turn on delay at 5.0vin, 3.3V/ 6A out

with application of Vin

Figure 21: Typical transient response to step load change at

0.5A/µS from 0% to 50% of Io, max at 5.0Vin,

2.5V out (measurement with a 1uF ceramic

and a 10µF tantalum

Figure 22: Typical transient response to step load change at

0.5A/µS from 50% to 0% of Io, max at 5.0Vin,

2.5V out (measurement with a 1uF ceramic

and a 10µF tantalu)

DS_IPM04C0A0R06_08242006

TEST CONFIGURATIONS

DESIGN CONSIDERATIONS

TO OSCILLOSCOPE

Input Source Impedance

To maintain low-noise and ripple at the input voltage, it is

critical to use low ESR capacitors at the input to the

module. Figure 26 shows the input ripple voltage

(mVp-p) for various output models using 2x100 uF low

ESR tantalum capacitors (KEMET P/N:T491D107M,

100uF/16V or equivalent) or 2x22 uF very low ESR

ceramic capacitors (TDK P/N:C3225X7S1C226MT,

22uF/16V or equivalent).

VI(+)

100uF

Tantalum

BATTERY

VI(-)

Note: Input reflected-ripple current is measured with a

simulated source inductance. Current is

measured at the input of the module.

The input capacitance should be able to handle an AC

ripple current of at least:

Figure 23: Input reflected-ripple current test setup

Vout

Vin

Vout

Vin

⎛

⎜

⎞

⎟

Irms = Iout

1 −

Arms

⎝

⎠

COPPER STRIP

300

250

200

150

100

Resistive

Load

1uF

10uF

tantalum ceramic

SCOPE

GND

Note: Use a 10µF tantalum and 1µF capacitor. Scope

measurement should be made using a BNC

connector.

Tantalum

Ceramic

Figure 24: Peak-peak output noise and startup transient

measurement test setup

Output Voltage (Vdc)

CONTACT AND

DISTRIBUTION LOSSES

Figure 26: Input ripple voltage for various output models,

Io = 6A (Cin = 2x100uF tantalum capacitors or

2x22uF ceramic capacitors at the input)

LOAD

SUPPLY

GND

The power module should be connected to a low

ac-impedance input source. Highly inductive source

impedances can affect the stability of the module. An

input capacitance must be placed close to the modules

input pins to filter ripple current and ensure module

stability in the presence of inductive traces that supply

the input voltage to the module.

CONTACT RESISTANCE

Figure 25: Output voltage and efficiency measurement test

setup

Note: All measurements are taken at the module

terminals. When the module is not soldered (via

socket), place Kelvin connections at module

terminals to avoid measurement errors due to

contact resistance.

Vo× Io

η = (

)×100 %

Vi × Ii

DS_IPM04C0A0R06_08242006

DESIGN CONSIDERATIONS

FEATURES DESCRIPTIONS

Safety Considerations

Over-Current Protection

For safety-agency approval the power module must be

installed in compliance with the spacing and separation

requirements of the end-use safety agency standards.

To provide protection in an output over load fault

condition, the unit is equipped with internal over-current

protection. When the over-current protection is

triggered, the unit enters hiccup mode. The units

operate normally once the fault condition is removed.

For the converter output to be considered meeting the

requirements of safety extra-low voltage (SELV), the

input must meet SELV requirements. The power module

has extra-low voltage (ELV) outputs when all inputs are

ELV.

Pre-Bias Startup Capability

The IPM would perform the monotonic startup into the

pre-bias loads; so as to avoid a system voltage drop

occur upon application. In complex digital systems an

external voltage can sometimes be presented at the

output of the module during power on. This voltage may

be feedback through a multi-supply logic component,

such as FPGA or ASIC. Another way might be via a

clamp diode as part of a power up sequencing

implementation.

The input to these units is to be provided with a

maximum 10A time-delay fuse in the ungrounded lead.

Remote On/Off

The IPM series power modules have an On/Off control

pin for output voltage remote On/Off operation. The

On/Off pin is an open collector/drain logic input signal

that is referenced to ground. When On/Off control pin is

not used, leave the pin unconnected.

Output Voltage Programming

The output voltage of IPM can be programmed to any

voltage between 0.9Vdc and 3.3Vdc by connecting one

resistor (shown as Rtrim in Figure 28, 29) between the

TRIM and GND pins of the module to trim up (0.9V ~

3.3V) and between the Trim and +Output to trim down

(0.8V ~ 0.9V). Without this external resistor, the output

voltage of the module is 0.9 Vdc. To calculate the value of

the resistor Rtrim for a particular output voltage Vo,

please use the following equation:

The remote on/off pin is internally connected to +Vin

through an internal pull-up resistor. Figure 27 shows the

circuit configuration for applying the remote on/off pin.

The module will execute a soft start ON when the

transistor Q1 is in the off state.

The typical rise for this remote on/off pin at the output

voltage of 0.9V and 3.3V are shown in Figure 17 and 18.

Trim up

7.0

Vadj. –0.9

Rtrim =

Trim Down

Rtrim =

- 0.187 (KΩ)

- 10.187 (KΩ)

Vin

IPM

On/Off

2.0

0.9 – Vadj.

GND

Rtrim is the external resistor in KΩ

Vout is the desired output voltage

Figure 27: Remote on/off implementation

DS_IPM04C0A0R06_08242006

FEATURES DESCRIPTIONS (CON.)

For example: to program the output voltage of the IPM

module to 3.3Vdc, Rtrim is calculated as follows:

7.0

3.3 –0.9

Rtrim =

- 0.187 (KΩ)

Rtrim = 2.729 KΩ

Figure 28: Trim up Circuit configuration for programming

output voltage using an external resistor

IPM can also be programmed by applying a voltage

between the TRIM and GND pins (Figure 30). The

following equation can be used to determine the value of

Vtrim needed for a desired output voltage Vo:

Vout

Rtrim

Load

Vtrim = 0.7168 – 0.0187Vo

Trim

GND

Vtrim is the external voltage in V

Vo is the desired output voltage

For example, to program the output voltage of a IPM

module to 3.3 Vdc, Vtrim is calculated as follows

Figure 29: Trim down Circuit configuration for programming

output voltage using an external resistor

Vtrim = 0.7168 – 0.0187 x 3.3

Vtrim = 0.6551V

Figure 30: Circuit configuration for programming output voltage

using external voltage source

DS_IPM04C0A0R06_08242006

FEATURE DESCRIPTIONS (CON.)

Table 1 provides Rtrim values required for some common

output voltages, while Table 2 provides value of external

voltage source, Vtrim, for the same common output

voltages. By using a 0.5% tolerance resistor, set point

tolerance of ±2% can be achieved as specified in the

electrical specification.

The amount of power delivered by the module is the

voltage at the output terminals multiplied by the output

current. When using the trim feature, the output voltage

of the module can be increased, which at the same

output current would increase the power output of the

module. Care should be taken to ensure that the

maximum output power of the module must not exceed

the maximum rated power (Vo.set x Io.max ≤ P max).

Table 1

Voltage Margining

VO (V)

0.9

Rtrim (Ω)

Open

Output voltage margining can be implemented in the IPM

modules by connecting a resistor, R^margin-up, from the Trim

pin to the ground pin for margining-up the output voltage

and by connecting a resistor, R^margin-down, from the Trim pin

to the output pin for margining-down. Figure 31 shows

the circuit configuration for output voltage margining. If

unused, leave the trim pin unconnected.

1.2

23.146K

11.479K

7.590K

4.188K

2.729K

1.5

1.8

2.5

3.3

Table 2

Vin

VO (V)

0.9

1.2

1.5

1.8

Vtrim (V)

0.7000

0.6943

0.6887

0.6831

0.6700

0.6551

Rmargin-down

IPM

Trim

On/Off

Rmargin-up

2.5

3.3

Rtrim

GND

Figure 31: Circuit configuration for output voltage margining

DS_IPM04C0A0R06_08242006

THERMAL CONSIDERATIONS

Thermal management is an important part of the system

design. To ensure proper, reliable operation, sufficient

cooling of the power module is needed over the entire

temperature range of the module. Convection cooling is

usually the dominant mode of heat transfer.

Hence, the choice of equipment to characterize the

thermal performance of the power module is a wind

tunnel.

Thermal Testing Setup

Delta’s DC/DC power modules are characterized in

heated vertical wind tunnels that simulate the thermal

environments encountered in most electronics

equipment. This type of equipment commonly uses

vertically mounted circuit cards in cabinet racks in which

the power modules are mounted.

Figure 33: Temperature measurement location

* The allowed maximum hot spot temperature is defined at 116℃.

The following figure shows the wind tunnel

characterization setup. The power module is mounted on

a test PWB and is vertically positioned within the wind

tunnel. The height of this fan duct is constantly kept at

25.4mm (1’’).

Thermal Derating

Heat can be removed by increasing airflow over the

module. To enhance system reliability, the power

module should always be operated below the maximum

operating temperature. If the temperature exceeds the

maximum module temperature, reliability of the unit may

be affected.

PWB

FACING PWB

MODULE

AIR VELOCITY

AND AMBIENT

TEMPERATURE

MEASURED BELOW

THE MODULE

50.8 (2.0”)

AIR FLOW

12.7 (0.5”)

25.4 (1.0”)

Figure 32: Wind tunnel test setup

DS_IPM04C0A0R06_08242006

THERMAL CURVES (CON.)

IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity

@ Vin=3.3V, Vout = 2.5V (Either Orientation)

Output Current(A)

@ Vin=5V, Vout = 3.3V (Either Orientation)

Output Current(A)

Natural

Convection

Natural

Convection

Ambient Temperature (℃)

Figure 34: Output current vs. ambient temperature and air velocity

Figure 37: Output current vs. ambient temperature and air velocity

@ Vin=5V, Vout=3.3V(Eithere Orientation)

@ Vin=3.3V, Vo=2.5V(Either Orientation

IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity

Output Current(A)

@ Vin=5V, Vout = 1.8V (Either Orientation)

@ Vin=3.3V, Vout =1.5V (Either Orientation)

Natural

Convection

Natural

Convection

Ambient Temperature (℃)

Figure 38: Output current vs. ambient temperature and air velocity

Figure 35: Output current vs. ambient temperature and air velocity

@ Vin=5V, Vout=1.8V(Either Orientation)

@ Vin=3.3V, Vout=1.5V(Either Orientation)

IPM04C(Standard) Output Current vs. Ambient Temperature and Air Velocity

Output Current(A)

@ Vin=3.3V, Vout =0.9V (Either Orientation)

Output Current(A)

@ Vin=3.3V, Vout = 2.5V (Either Orientation)

Natural

Convection

Natural

Convection

Ambient Temperature (℃)

Figure 39: Output current vs. ambient temperature and air velocity

Figure 36: Output current vs. ambient temperature and air velocity

@ Vin=3.3V, Vout=0.9V(Either Orientation)

@ Vin=3.3V, Vout=2.5V(Eithere Orientation)

DS_IPM04C0A0R06_08242006

PICK AND PLACE LOCATION

SURFACE-MOUNT TAPE & REEL

All dimensions are in millimeters (inches)

LEAD FREE PROCESS RECOMMEND TEMP. PROFILE

Temp

Peak Temp. ~ 220

℃

210℃

200℃

Ramp down

max. 4 /sec

℃

150℃

Preheat time

90~150 sec

Time Limited 60 sec

above 210

℃

Ramp up

max. 3 /sec

℃

25℃

Time

Note: All temperature refers to topside of the package, measured on the package body surface.

LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE

Temp

Peak Temp. ~ 225

℃

Ramp down

max. 4 /sec

183℃

150℃

℃

100℃

Preheat time

60~150 sec

60 ~ 120 sec

Ramp up

max. 3 /sec

℃

25℃

Time

Note: All temperature refers to assembly application board, measured on the land of assembly application board.

DS_IPM04C0A0R06_08242006

MECHANICAL DRAWING

SMD PACKAGE

SIP PACKAGE

2 3 4 5

RECOMMEND PWB HOLE LAYOUT

RECOMMEND PWB PAD LAYOUT

Note: The copper pad is recommended to connect to the ground

2 3 4 5

Note: All dimension are in millimeters (inches) standard dimension tolerance is± 0.10(0.004”)

DS_IPM04C0A0R06_08242006

PART NUMBERING SYSTEM

IPM

0A0

Product

Family

Number of

Outputs

Output

Current

06 - 6A

Input Voltage

Output Voltage

Package

Option Code

F- RoHS 6/6

(Lead Free)

Integrated POL 04 - 3V ~ 5.5V C - Low current

Module 12 - 8V ~ 14V

0A0 – programmable

output

R - SIP

A - Standard Functions

S - SMD

MODEL LIST

Efficiency (Typical @ full

Model Name

Packaging

Input Voltage

Output Voltage

Output Current

IPM12C0A0R04FA

IPM12C0A0S04FA

IPM04C0A0R06FA

IPM04C0A0S06FA

SIP

SMD

SIP

8V ~14V

3V ~ 5.5V

0.8V ~ 5V

91%

93%

0.8V ~ 3.3V

SMD

CONTACT: www.delta.com.tw/dcdc

USA:

Telephone:

East Coast: (888) 335 8201

West Coast: (888) 335 8208

Fax: (978) 656 3964

Email: DCDC@delta-corp.com

Asia & the rest of world:

Telephone: +886 3 4526107 ext 6220

Fax: +886 3 4513485

Europe:

Phone: +41 31 998 53 11

Fax: +41 31 998 53 53

Email: DCDC@delta.com.tw

Email: DCDC@delta-es.com

WARRANTY

Delta offers a two (2) year limited warranty. Complete warranty information is listed on our web site or is available upon

request from Delta.

Information furnished by Delta is believed to be accurate and reliable. However, no responsibility is assumed by Delta

for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license

is granted by implication or otherwise under any patent or patent rights of Delta. Delta reserves the right to revise these

specifications at any time, without notice.

DS_IPM04C0A0R06_08242006

IPM12C0A0R06FA [DELTA]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E