RLT1632-F-R100J [DELTA]

1/3W, 1206, Low Resistance Chip Resistor (Lead free / Halogen Free); 1 / 3W ， 1206年，低电阻贴片电阻（无铅/无卤）


型号：	RLT1632-F-R100J
厂家：	DELTA ELECTRONICS, INC.
描述：	1/3W, 1206, Low Resistance Chip Resistor (Lead free / Halogen Free) 1 / 3W ， 1206年，低电阻贴片电阻（无铅/无卤）
文件：	总9页 (文件大小：119K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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SPECIFICATION FOR APPROVAL

1/3W, 1206, Low Resistance Chip Resistor (Lead free / Halogen Free)

1. Scope

This specification applies to3.2mm x 1.6mm size 1/3W, fixed thick film low resistance value chip

resistors rectangular type.

2. Type Designation

RLT1632 - F - □□□□ □

(1)

(2)

(3)

(4)

Where

(1) Size No.

(2) Power Rating:

F = 1/3W

(3) Resistance value: Refer to paragraph 4-1

For example --

Four digits of number

R100 = 0.1Ω

1R00 = 1.0Ω

The “R” shall be used as a decimal point

(4) Resistance tolerance:

F = ±1.0%, G= ±2%, J= ±5%

3. Outline Dimensions

Code Letter

Dimension

3.20± 0.20

1.60 ± 0.20

0.60 ± 0.10

0.50 ± 0.25

Unit : mm

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4. Ratings

4-1 Specification

Table 1

Power Rating*

1/3 W

1%(F), 2%(G), 5%(J)

Resistance Tolerance

Resistance Range

0.05Ω ~ <0.1Ω

0.1Ω ~ <10Ω

Temperature Coefficient of

Resistance(ppm/℃)

Note*:

0 ~ +250

0 ~ +200

Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.

For resistor operated at ambient temperature in excess of 70℃,the maximum load

shall be derated in accordance with the following curve.

100

-55

125

AMBIENT TEMPERATURE(℃)

4-2 Rated Voltage

The d.c. or a.c. r.m.s. voltage shall be calculated from the following expression

V = P × R

Where V : Rated voltage (V)

: Rated power (W)

: Nominal resistance (Ω)

4-3 Operating and Storage Temperature Range

-55 to +125℃

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SPECIFICATION FOR APPROVAL

5. Marking

Each Resistor is marked with 4 digits code on the protective coating to designate to the nominal

resistance value.

0.05 ≦R ＜10Ω , Marking 4 digits

EX) 0.05Ω→ R050 , 0.1Ω → R100

4.7Ω → 4R70 , 10Ω → 10R0

6. Characteristics

6-1 Electrical

Item

Specification and Requirement

Test Method (JIS 5201)

Room temperature

Temperature Coefficient As follow table 1.

of Resistance(ppm/℃)

Short Time Overload

Room temperature +100℃

(1) Applied voltage: 2.5 x rated

voltage

△ R:±1.0%

Without damage by flashover, spark,

arcing, burning or breakdown

(2) Test time: 5 seconds

Insulation Resistance

Voltage Proof

(1) Setup as figure 1

(2) Test voltage: 100V_DC±15V_DC

(3) Test time: 60 + 10 / - 0 seconds

Over 100 MΩ on Overcoat layer

face up

Over 1,000 MΩ on Substrate side

face up

Resistance range:±1.0%

(1) Setup as figure 1

Without damage by flashover, spark, (2) Test voltage: 400V_AC(rms.)

arcing, burning or breakdown

(3) Test time: 60 + 10 / - 0 seconds

Pressure Rod

(Metal)

Insulation Plate

Measurement Point A

(R=0.5 mm)

Spring

Sample Electrode

Voltage Supply

Substrate

Metal Block

Over coat Film

Substrate Side

Measurement Point B

Figure 1 : Measurment Setup

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6-2 Mechanical

Item

Specification and Requirement

Test Method (JIS 5201)

Solderability

The surface of terminal immersed Solder bath:

shall be minimum of 95% covered After immersing in flux, dip in

with a new coating of solder

245 ± 5℃ molten solder bath for 2 ±

0.5 seconds

Resistance to Solder

Heat

△ R: ± 1.0%

Without distinct deformation in

appearance

(1) Pre-heat: 100~110℃

for 30 seconds

(2) Immersed at solder bath of

270 ± 5℃ for 10 ± 1

seconds

(3) Measuring resistance 1

hour after test

Bending Test

Bending value: 3 mm for 30 ± 1

seconds

△ R: ± 1.0%

Without mechanical damage such as

break

Solvent Resistance

Without mechanical and distinct

damage in appearance

(1) Solvent: Trichloroethane

or Isopropyl alcohol

(2) Immersed in solvent at room

temperature for 300 seconds

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6-3 Endurance

Item

Specification and Requirement

Test Method (JIS 5201)

Rapid Change of

Temperature

(1) Repeat 5 cycle as follow:

△ R:±1.0%

Without distinct damage in

appearance

(-55 ± 3℃,30minutes)

→(Room temperature, 2~3

minutes)

→(+125 ± 2℃,30minutes)

→(Room temperature 2~3

minutes)

(2) Measuring resistance

1 hour after test

Moisture with Load

(1) Environment condition:

40 ± 2℃,90~95% RH

(2) Applied Voltage: rated voltage

(3) Test period: (1.5 hour ON)

→(0.5 hour OFF) cycled for

total

△ R: ±5.0%

Without distinct damage in

appearance

1,000 + 48 / - 0 hours

(4) Measuring resistance

1 hour after test

Load Life

△ R: ±5.0%

Without distinct

damage in appearance

(1) Test temperature: 70 ± 3℃

(2) Applied Voltage: rated voltage

(3) Test period: (1.5 hour ON)

→(0.5 hour OFF) cycled for

total

1,000 + 48 / - 0 hours

(4) Measuring resistance

1 hour after test

Low Temperature Store

High Temperature Store

(1) Store temperature:

-55 ± 3℃ for total

1,000 + 48 / - 0 hours

(2) Measuring resistance

1 hour after test

(1) Store temperature:

+125 ± 2℃ for total

1,000 + 48 / - 0 hours

(2) Measuring resistance

1 hour after test

△ R: ± 5.0%

Without distinct

damage in appearance

△ R: ± 5.0%

Without distinct

damage in appearance

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7. Recommend Land Pattern Dimensions

2.2~2.6

4.4~4.8

1.8~2.4

Unit : mm

8. Construction Drawing

Resin coating(Epoxy)

Dielectric coating

Thick film Resistor

Alumina substrate ( Al₂O₃)

Thin electrode film:NiCr+NiCu

Cu+Ni+Sn plating

Side Electrode:

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9. Packaging

9-1 Dimensions

9-1-1 Tape packaging dimensions

Sprocket hole

¯1.5±0.1

0.75±0.1

4.0±0.1

2.0±0.05

8.0±0.3

Chip

0.84 ± 0.1

4.0±0.1

A=2.0±0.2

Carrier cavity

Pulling direction

Unit : mm

B=3.5±0.2

C=1.75±0.1

D=3.5±0.05

Remark: Leader tape length≧30 cm( 150 Hollow carrier cavity)

9-1-2 Reel dimensions

2.0±0.5

¯13.0±1.0

20min.

9.0±1.0

11.5 ±1.0

Unit : mm

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9-2 Peel force of top cover tape

The peel speed shall be about 300 mm/min.

The peel force of top cover tape shall be between 0.1 to 0.7 N.

Top Cover Tape

165 ~ 180°

0.1~0.7 N

9-3 Numbers of taping 5,000 pieces /reel

9-4 Label making

The following items shall be marked on the reel.

(1) Type designation.

(2) Quantity

(3) Manufacturing date code

(4) Manufacturer’s name

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10. Carenote

10-1 Care note for storage

(1) Chip resistor shall be stored in a room where temperature and humidity must be controlled.

(temperature 5 to 35℃, humidity 45 to 85% RH) However, a humidity keep it low, as it is

possible.

(2) Chip resistor shall be stored as direct sunshine doesn’t hit on it.

(3) Chip resistor shall be stored with no moisture, dust, a material that will make solderability

inferior, and a harmful gas (Chloridation hydrogen, sulfurous acid gas, and sulfuration

hydrogen)

10-2 Carenote for operating and handling

(1) It is necessary to protect the edge and protection coat of resistors from mechanical stress.

(2) Handle with care when printing circuit board (PCB) is divided or fixed on support body,

because bending of printing circuit board (PCB) mounting will make mechanical stress for

resistors.

(3) Resistors shall be used with in rated range shown in specification. Especially, if voltage

more than specified value will be loaded to resistor, there is a case it will make damage for

machine because of temperature rise depending on generating of heat, and increase

resistance value or breaks.

(4) In case that resistor is loaded a rated voltage, it is necessary to confirms temperature of a

resistor and to reduce a load power according to load reduction curve, because a

temperature rise of a resistor depends on influence of heat from mounting density and

neighboring element.

(5) Observe Limiting element voltage and maximum overload voltage specified in each

specification

(6) If there is possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it

is necessary that operating condition shall be set up before use.

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