CH960-HM370BS-8100H [DFI]

8th/9th Gen Intel Core Processor COM Express Basic;
CH960-HM370BS-8100H
型号: CH960-HM370BS-8100H
厂家: DFI    DFI
描述:

8th/9th Gen Intel Core Processor COM Express Basic

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中文:  中文翻译
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8th/9th Gen Intel® CoreTM Processor  
COM Express® Basic  
Features  
CH960-HM370  
• Dual channel DDR4 2666MHz SODIMM up to 64GB  
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI  
Supports three independent displays  
HM370  
BGA 1440  
• eDP resolution supports up to 4096x2304 @ 60Hz  
• Multiple expansion: 1 PCIe x16, 8 PCIe x1  
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0  
* Populated by default  
DDR4_2  
SODIMM  
DDR4_1  
SODIMM  
850C  
Intel HM370  
R
2.1  
-400C  
Wide  
Temperature  
Type  
6
CPU Fan  
3 Displays  
USB 3.1  
SATA 3.0  
Mechanical Drawing  
Block Diagram  
DDR4 2666MHz  
SODIMM  
Processor  
(optional)  
Channel A  
Channel B  
DDR4 2666MHz  
SODIMM  
8th Generation  
Intel® Corei7 (6 CORE)  
eDP  
LVDS  
PTN3460  
8th/9th Generation  
PCIe x16 (PEG)  
Intel® Corei5/i3 (4 CORE)  
DDI Port 1  
DDI Port 2  
Memory  
Controller  
2x Graphics  
CORES  
VGA  
CH7517  
LPC Bus  
Serial Port 0,1  
SLP/LID  
4.00  
0.00  
WDT  
Embedded  
Fan PWM/  
Controller  
TACH_IN  
IT8528E  
I
2C Bus  
USB 3.0 4x  
19.43  
41.53  
58.ꢀ7  
Mobile  
Intel® HM370  
Chipset  
PCIe (2 x1/1 x2)  
PCIe (4 x1/1 x4)  
PCIe (2 x1/1 x2)  
PCIe x1  
MDI  
Intel® GLAN  
I219LM  
USB 2.0 8x  
87.00  
91.00  
SATA 30 4x  
HDA  
SPI Bus  
SPI Flash  
PCIe L0~3  
PCIe L4~5  
x2  
PCIe L6~7  
x2  
x4  
x4  
x2  
x2  
x1  
x1  
x1  
x1  
x1  
x1  
x1  
x1  
* 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2  
CH960-HM370  
Specifications  
SYSTEM  
Processor  
8th/9th Generation Intel® CoreTM Processors, BGA 1440  
Intel® Core™ i5-8400H, 4 Cores, 8M Cache, 2.5GHz (4.2GHz), 45W (HM370)  
Intel® Core™ i3-8100H, 4 Cores, 6M Cache, 3.0GHz, 45W (HM370)  
Intel® Core™ i3-9100HL, 4 Cores, 6M Cache, 1.6GHz (2.9GHz), 25W (HM370)  
Intel® Celeron® G5600E, 2 Cores, 4M Cache, 3.9GHz, 35W (HM370)  
Intel® Celeron® G4932E, 2 Cores, 2M Cache, 1.9GHz (1.9GHz), 25W (HM370)  
Chipset  
Memory  
BIOS  
Controller  
Feature  
Intel® HM370 Chipset  
Two 260-pin SODIMM up to 64GB  
AMI SPI 128Mbit  
Dual Channel DDR4 2666MHz  
GRAPHICS  
Intel® HD Graphics  
OpenGL up to 4.5, DirectX 11, OpenCL 2.1  
HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit)  
HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8  
Display  
1 x VGA/DDI (DDI available upon request)  
1 x LVDS/eDP (eDP available upon request)  
2 x DDI (HDMI/DVI/DP++)  
VGA: resolution up to 1920x1200 @ 60Hz  
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz  
HDMI: resolution up to 4096x2160 @ 30 24bpp  
DVI: resolution up to 1920x1200 @ 60Hz  
DP++/eDP: resolution up to 4096x2304 @ 60Hz  
Triple Displays  
Interface  
VGA + LVDS + DDI or VGA + DDI 1 + DDI 2 eDP + 2 DDI (available upon request)  
EXPANSION  
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)  
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)  
1 x LPC  
1 x I2C  
1 x SMBus  
2 x UART (TX/RX)  
AUDIO  
ETHERNET  
I/O  
Interface  
Controller  
USB  
HD Audio  
1 x Intel® I219LM PCIe (10/100/1000Mbps)  
4 x USB 3.1  
8 x USB 2.0  
SATA  
4 x SATA 3.0 (up to 6Gb/s)  
DIO  
1 x 8-bit DIO (Default 4 inputs and 4 outputs)  
System Reset, Programmable via Software from 1 to 255 Seconds  
WATCHDOG TIMER  
POWER  
Output & Interval  
Type  
12V, 5VSB, VCC_RTC (ATX mode)  
12V, VCC_RTC (AT mode)  
Consumption  
Typical: 12V @ 0.85A (13.07Watt)  
Max.: 12V @ 5.75A (74.084Watt)  
OS SUPPORT  
Windows: Windows 10 IoT Enterprise 64-bit Linux  
ENVIRONMENT  
Temperature  
Operating: 0 to 60°C  
-40 to 85°C  
Storage: -40 to 85°C  
Humidity  
MTBF  
Operating: 5 to 90% RH  
1,360,171 hrs @ 25°C; 892,642 hrs @ 45°C; 624,277 hrs @ 60°C excluding accessories  
Calculation Model: Telcordia Issue 4  
Storage: 5 to 90% RH  
Environment: GB, GC – Ground Benign, Controlled  
MECHANICAL  
Dimensions  
Compliance  
COM Express® Basic  
PICMG COM Express® R2.1, Type 6  
95mm (3.74") x 125mm (4.9")  
Ordering Information  
Model Name  
P/N  
Processor  
Memory  
VGA/DDI LVDS/eDP GbE USB 3.0 USB 2.0 Power  
Thermal Temp.  
CH960-HM370BS-8400H 770-CH9601-400G i5-8400H  
CH960-HM370BS-8100H 770-CH9601-600G i3-8100H  
CH960-HM370BS-9100HL 770-CH9601-E00G i3-9100HL  
CH960-HM370BS-G5600E 770-CH9601-F00G G5600E  
CH960-HM370BS-G4932E 770-CH9601-H00G G4932E  
2 SODIMM VGA  
2 SODIMM VGA  
2 SODIMM VGA  
2 SODIMM VGA  
2 SODIMM VGA  
LVDS  
LVDS  
LVDS  
LVDS  
LVDS  
1
1
1
1
1
4
4
4
4
4
8
8
8
8
8
ATX/AT  
ATX/AT  
ATX/AT  
ATX/AT  
ATX/AT  
Cooler  
Cooler  
Cooler  
Cooler  
Cooler  
0 to 60oC  
0 to 60oC  
0 to 60oC  
0 to 60oC  
0 to 60oC  
Optional Items  
Packing List  
COM332-B carrier board kit  
770-CM3321-000G  
• 1 CH960-HM370 board  
• Heat spreader (Height: 11mm)  
A71-808316-000G  
Wide Temp: A71-111100-010G  
Standard: A71-111100-000G  
• 1 Cooler (Height: 36.58mm)  
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales  
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © April 1, 2020 DFI Inc.  
www.dfi.com  

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