SH960MD-HM170T8-6100E [DFI]

6th Gen Intel Xeon/Core Processor COM Express Basic;
SH960MD-HM170T8-6100E
型号: SH960MD-HM170T8-6100E
厂家: DFI    DFI
描述:

6th Gen Intel Xeon/Core Processor COM Express Basic

文件: 总2页 (文件大小:720K)
中文:  中文翻译
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6th Gen Intel® Xeon®/CoreTM Processor  
COM Express® Basic  
SH960MD-CM236/QM170  
CM236  
QM170  
Features  
BGA 1440  
• Dual channel DDR4 2133MHz onboard Memory up to 16GB  
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI  
Supports three independent displays  
• eDP resolution supports up to 4096x2304 @ 60Hz  
• Multiple expansion: 1 PCIe x16, 8 PCIe x1  
• Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0  
* Populated by default  
DDR4  
Intel CM236  
/QM170  
850C  
CPU Fan  
R
2.1  
-400C  
Wide  
Temperature  
Type  
6
3 Displays  
RAID  
AMT  
Mechanical Drawing  
Block Diagram  
DDR4 2133MHz  
Memory Down  
Processor  
(optional)  
Channel A  
Channel B  
CORE CORE  
CORE CORE  
DDR4 2133MHz  
Memory Down  
eDP  
LVDS  
6th Generation  
PTN3460  
PCIe x16 (PEG)  
Intel® Xeon®/CoreE3/i7/i5  
DDI Port 1  
DDI Port 2  
Memory  
Controller  
Graphics  
CORE  
VGA  
CH7517  
LPC Bus  
Serial Port 0,1  
SLP/LID  
TPM 1.2  
optional)  
WDT  
Embedded  
Controller  
IT8528E  
Fan PWM/  
TACH_IN  
I
2C Bus  
USB 3.0 4x  
Coming Soon  
Mobile  
Intel® CM236/QM170  
Chipset  
PCIe (2 x1/1 x2)  
PCIe (4 x1/1 x4)  
PCIe (2 x1/1 x2)  
PCIe x1  
MDI  
Intel® GLAN  
I210IT  
USB 2.0 8x  
SATA 3.0 4x  
HDA  
SPI Bus  
SPI Flash  
PCIe L0~3  
PCIe L4~5  
x2  
PCIe L6~7  
x2  
x4  
x4  
x2  
x2  
x1  
x1  
x1  
x1  
x1  
x1  
x1  
x1  
* 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2  
SH960MD-CM236/QM170  
Specifications  
SYSTEM  
Processor  
6th Generation Intel® CoreTM Processors, BGA 1440  
Intel® Xeon® E3-1515M v5 Processor, Quad Core, 8M Cache, 2.8GHz (3.7GHz), 45W (Support ECC)  
Intel® Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45W  
Intel® Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25W  
Intel® Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35W (Support ECC)  
Intel® Celeron® Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35W (Support ECC)  
Chipset  
Memory  
BIOS  
Controller  
Feature  
Intel® CM236 Chipset  
Intel® QM170 Chipset  
8GB/16GB DDR4 Memory Down  
Insyde SPI 128Mbit  
Dual Channel DDR4 2133MHz  
GRAPHICS  
Intel® HD Graphics  
OpenGL up to 4.4, DirectX 12, OpenCL 2.1  
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9  
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9  
Display  
1 x VGA/DDI (DDI available upon request)  
1 x LVDS/eDP (eDP available upon request)  
2 x DDI (HDMI/DVI/DP++)  
VGA: resolution up to 1920x1200 @ 60Hz  
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz  
HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz  
DVI: resolution up to 1920x1200 @ 60Hz  
DP++/eDP: resolution up to 4096x2304 @ 60Hz  
Triple Displays  
Interface  
VGA + LVDS + DDI or VGA + DDI1 + DDI2 eDP + 2 DDI (available upon request)  
EXPANSION  
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)  
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)  
1 x LPC  
1 x I2C  
1 x SMBus  
2 x UART (TX/RX)  
AUDIO  
ETHERNET  
I/O  
Interface  
Controller  
USB  
HD Audio  
1 x Intel® I210IT (10/100/1000Mbps)  
4 x USB 3.0  
8 x USB 2.0  
SATA  
4 x SATA 3.0 (up to 6Gb/s)  
RAID 0/1/5/10  
DIO  
1 x 8-bit DIO  
WATCHDOG TIMER  
SECURITY  
Output & Interval  
TPM  
System Reset, Programmable via Software from 1 to 255 Seconds  
Available Upon Request  
POWER  
Type  
12V, 5VSB, VCC_RTC (ATX mode)  
12V, VCC_RTC (AT mode)  
OS SUPPORT  
Windows 8.1 64-bit  
Windows 7 (/WES7) 32/64-bit  
Windows 10 IoT Enterprise 64-bit  
Debian 8 (with VESA graphic driver)  
CentOS 7 (with VESA graphic driver)  
Linux  
ENVIRONMENT  
Temperature  
Operating: 0 to 60°C  
-40 to 85°C  
Storage: -40 to 85°C  
Humidity  
MTBF  
Dimensions  
Compliance  
Operating: 5 to 90% RH  
TBD  
COM Express® Basic  
PICMG COM Express® R2.1, Type 6  
CE, FCC, RoHS  
Storage: 5 to 90% RH  
MECHANICAL  
95mm (3.74") x 125mm (4.9")  
CERTIFICATIONS  
Ordering Information  
Model Name  
P/N  
Processor Memory VGA/DDI LVDS/eDP GbE USB 3.0 USB 2.0 Power Thermal Temp.  
Coating  
VGA  
VGA  
VGA  
VGA  
VGA  
VGA  
LVDS  
LVDS  
LVDS  
LVDS  
LVDS  
LVDS  
1
1
1
1
1
1
4
4
4
4
4
4
8
8
8
8
8
8
ATX/AT Cooler  
ATX/AT Cooler  
ATX/AT Cooler  
ATX/AT Cooler  
ATX/AT Cooler  
ATX/AT Cooler  
-40 to 85oC Upon Request  
-40 to 85oC Upon Request  
-40 to 85oC Upon Request  
-40 to 85oC Upon Request  
-40 to 85oC Upon Request  
-40 to 85oC Upon Request  
SH960MD-CM236T1-E3-1515M 770-SH96M1-000G E3-1515M  
16G onboard  
8G onboard  
16G onboard  
8G onboard  
8G onboard  
8G onboard  
SH960MD-QM170T8-6442EQ  
SH960MD-QM170T1-6820EQ  
SH960MD-HM170T8-6100E  
SH960MD-CM236T8-G3900E  
SH960MD-QM170T1-6822EQ  
770-SH96M1-100G i5-6442EQ  
770-SH96M1-200G i7-6820EQ  
770-SH96M1-300G i3-6100E  
770-SH96M1-400G G3900E  
770-SH96M1-500G i7-6822EQ  
Note: HALT test, shock/ vibration test and conformal coating are optional for the application in especially harsh environments.  
Optional Items  
Packing List  
COM332-B carrier board kit  
• Heat spreader (Height: 11mm)  
770-CM3321-000G  
TBD  
• 1 SH960MD-CM236/QM170 board  
• 1 Cooler (Height: 36.58mm)  
A71-111101-000G  
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales  
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © Aug 25, 2020 DFI Inc.  
www.dfi.com  

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