DA14531MOD-00F0100C [DIALOG]
SmartBond TINYTM Module;
| 型号： | DA14531MOD-00F0100C |
| 厂家： | 
Dialog Semiconductor |
| 描述： | SmartBond TINYTM Module |
| 文件： | 总32页 (文件大小：2153K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DA14531MOD
SmartBond TINYTM Module
Final
General Description
The DA14531 SmartBond TINYTM Module is the first Dialog Semiconductor Bluetooth® Low Energy
module based on world’s lowest power DA14531 SoC.
The module offers a unique combination of the lowest power and the integration of all external
components including antenna at a very affordable price.
The module is designed to enable the use of Bluetooth® Low Energy in applications where
Bluetooth® Low Energy could not be used until now because of cost or complexity. The bigger picture
is to drive Bluetooth® Low Energy technology into every application, turning every product into a
connected IoT node to drive the next 1 billion IoT devices in the market.
The SmartBond TINYTM Module is supported by software that is easy to work with. This lowers the
threshold to use Bluetooth® Low Energy technology and significantly speeds up the design time.
The module comes with a configurable DSPS (serial port service) and next generation Codeless
software to design Bluetooth® applications without Bluetooth® knowledge or advanced programming
skills.
The combination of an affordable price, the lowest power consumption and ease of use makes the
DA14531 TINYTM Module an ideal product for the mass market, including the makers community.
Key Features
□
I2C
■
Bluetooth
■
■
Power Management
□
Compatible with Bluetooth® v5.1,
ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US) and
ARIB STD-T66 (Japan) core
□
□
Operating range (1.8 V - 3.3 V)
Inrush current control
Other
□
□
Supports up to 3 connections
□
□
Real Time Clock
Trimmed 32 MHz Crystal
Dialog Semiconductor registered BD
address preprogrammed in OTP
■
■
Packaging
■
■
Processing and memories
□
16 MHz 32-bit Arm® Cortex® M0+ with
SWD interface
□
12.5 mm x 14.5 mm x 2.8 mm package
Module Software Development Kit
□
□
□
□
128 Kbytes internal FLASH
48 Kbytes RAM
□
□
□
Configurable DSPS
Codeless v2.0
144 Kbytes ROM
32 Kbytes OTP
SDK6 support
■
■
Module Software Tools
Current Consumption
□
□
□
□
□
□
Flash/OTP programmer
SUOTA support
□
□
□
2 mA RX at VBAT=3V
4 mA TX at VBAT=3V and 0 dBm
1.8 µA at sleep with all RAM retained
Battery Life Estimation
Data Rate Monitoring
Real-Time Power Profiling
Production Line Testing
■
■
Radio
□
Programmable RF transmit power from
-19 to +2.2 dBm
Standards Conformance
□
-93 dBm receiver sensitivity
□
□
□
□
□
□
□
BT SIG QDID 113959
Europe (CE/RED) and US (FCC)
Canada and Japan
South Korea and Taiwan
South Africa and Brazil
China and Thailand
India
Interfaces
□
□
□
□
□
□
Quadrature decoder with 3 channels
3 channel 11-bit ENOB ADC
2 general purpose timers with PWM
9 GPIOs
SPI
2x UART, 1-wire UART support
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
Applications
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Beacons
Remote Controls
Proximity tags
Low Power Sensors
Commissioning/Provisioning
RF pipe
Toys
Industrial applications
Data acquisition
Wellness
Infotainment
IoT
Robotics
Gaming
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
Contents
General Description ............................................................................................................................ 1
Key Features ........................................................................................................................................ 1
Applications ......................................................................................................................................... 2
1
2
3
4
References ..................................................................................................................................... 5
Block Diagram ............................................................................................................................... 6
Pinout ............................................................................................................................................. 7
Characteristics .............................................................................................................................. 9
4.1 Absolute Maximum Ratings .................................................................................................. 9
4.2 Recommended Operating Conditions................................................................................. 10
4.3 Device Characteristics ........................................................................................................ 10
5
6
Mechanical Specifications.......................................................................................................... 13
5.1 Dimensions ......................................................................................................................... 13
5.2 PCB Footprint...................................................................................................................... 14
5.3 Marking................................................................................................................................ 14
Packaging Information................................................................................................................ 15
6.1 Tape & Reel ........................................................................................................................ 15
6.2 Labeling............................................................................................................................... 16
7
8
Application Information.............................................................................................................. 16
Design Guidelines....................................................................................................................... 17
8.1 Installation Location ............................................................................................................ 17
8.2 Antenna Graphs.................................................................................................................. 18
8.3 Radiation Pattern ................................................................................................................ 19
9
Soldering...................................................................................................................................... 22
10 Ordering Information .................................................................................................................. 23
11 Regulatory Information............................................................................................................... 23
11.1 CE (Radio Equipment Directive 2014/53/EU (RED)) - (Europe)......................................... 24
11.2 FCC - (U.S.A.)..................................................................................................................... 25
11.3 IC (CANADA) ...................................................................................................................... 25
11.4 MIC (JAPAN)....................................................................................................................... 26
11.5 NCC (Taiwan) ..................................................................................................................... 27
11.6 MSIP (South Korea)............................................................................................................ 27
11.7 Australia/ New Zealand (RCM) ........................................................................................... 28
11.8 South Africa (ICASA) .......................................................................................................... 28
11.9 Brazil (Anatel)...................................................................................................................... 28
11.10 China (SRRC) ..................................................................................................................... 29
11.11 Thailand (NBTC) ................................................................................................................. 29
11.12 India (WPC)......................................................................................................................... 29
12 Environmental Information......................................................................................................... 29
13 Bluetooth® SIG Qualification...................................................................................................... 29
Revision History ................................................................................................................................ 31
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
Figures
Figure 1: DA14531 SmartBond TINYTM Module Block Diagram ........................................................... 6
Figure 2: Pinout Diagram Top View ...................................................................................................... 7
Figure 3: Mechanical Drawing............................................................................................................. 13
Figure 4: Module Footprint Top View .................................................................................................. 14
Figure 5: Module Shield Marking......................................................................................................... 14
Figure 6: Tape and Reel...................................................................................................................... 15
Figure 7: Reel Labeling ....................................................................................................................... 16
Figure 8: Installation Locations for Optimum Antenna Performance .................................................. 17
Figure 9: Antenna Performance in Proximity of Copper (Left), Laminate (Middle) and Laminate under
Antenna (Right) ................................................................................................................................... 18
Figure 10: DA14531 TINYTM Module Evaluation Board ...................................................................... 18
Figure 11: VSWR Installed in the Upper Left Corner (Position #1) of Evaluation Board .................... 19
Figure 12: VSWR with Module Installed in Center (Position #2) of the Evaluation Board .................. 19
Figure 13: VSWR with Module Installed in the Upper Right Corner (Position #3) of the Evaluation
Board ................................................................................................................................................... 19
Figure 14: Measurement Plane Definition........................................................................................... 20
Figure 15: Radiation Pattern for XY-Plane, Horizontal Polarization.................................................... 21
Figure 16: Radiation Pattern for XY-Plane, Vertical Polarization........................................................ 21
Figure 17: Radiation Pattern for XZ-Plane, Horizontal Polarization.................................................... 21
Figure 18: Radiation Pattern for XZ-Plane, Vertical Polarization ........................................................ 21
Figure 19: Radiation Pattern for YZ-Plane, Horizontal Polarization.................................................... 21
Figure 20: Radiation Pattern for YZ-Plane, Vertical Polarization ........................................................ 21
Figure 21: Recommended Reflow Profile for Lead Free Solder ......................................................... 22
Tables
Table 1: Pin Description ........................................................................................................................ 7
Table 2: Absolute Maximum Ratings..................................................................................................... 9
Table 3: Recommended Operating Conditions ................................................................................... 10
Table 4: DC Characteristics................................................................................................................. 10
Table 5: XTAL32MHz - Recommended Operating Conditions ........................................................... 11
Table 6: Digital IO - Recommended Operating Conditions................................................................. 11
Table 7: Digital IO - DC Characteristics .............................................................................................. 12
Table 8: Radio 1Mbps - AC Characteristics ........................................................................................ 12
Table 9: Reel Specifications................................................................................................................ 15
Table 10: Antenna Efficiency vs TINYTM Module Positions................................................................. 17
Table 11: Reflow Profile Specification................................................................................................. 22
Table 12: MSL Level vs Floor Life Time.............................................................................................. 23
Table 13: Ordering Information (Samples).......................................................................................... 23
Table 14: Ordering Information (Production)....................................................................................... 23
Table 15: Standards Conformance ..................................................................................................... 24
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
1
References
[1] DA14531, Datasheet, Dialog Semiconductor.
[2] DA14585/DA14531 SW Platform Reference Manual (available at https://www.dialog-
semiconductor.com/products/connectivity/bluetooth-low-energy/products/da14531)
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
2
Block Diagram
The SmartBond TINY™ Module is based on the Dialog Semiconductor DA14531 SoC configured in
buck mode. With an integrated 1 Mbit flash, 32 MHz XTAL and a printed antenna, the module
enables a faster time to market at reduced development costs.
The module, as seen in Figure 1, is comprised of:
●
●
●
●
●
1 Mbit SPI FLASH
32 MHz XTAL
2 decoupling capacitors
A power inductor
A CLC filter and matching components for the printed antenna
VBAT
J7
J12 (RST)
2.2uH
2.2uF
10uF
P25Q11U
1Mbit
NOR-SPI
Data Flash
P0_0
P0_1
P0_3
P0_4
P0_2
P0_5
P0_6
P0_7
P0_8
P0_9
P0_10
P0_11
J10
J14
J5
DA14531
J13
J16
J15
J9
RF Filter &
Matching
J8
32MHz
J2, J3, J4,
J6, J11, (J1)
Figure 1: DA14531 SmartBond TINYTM Module Block Diagram
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DA14531MOD
SmartBond TINYTM Module
Final
3
Pinout
ANTENNA AREA
P0_8
J16
J15
J14
J13
J12
n.c.
J1
J2
J3
J4
J5
P0_9
GND
GND
P0_5/RxTx
MARKING AREA
P0_7
GND
P0_6
P0_0/RST
J6
J7
J8
J9
J10
J11
Figure 2: Pinout Diagram Top View
Note that J1 has no internal connection. J1 should be connected to ground.
Table 1: Pin Description
Reset
Pin #
Pin Name
Type
Description
State
Not internally connected.
Recommended to be connected to
ground externally
J1
n.c
J2
J3
J4
GND
GND
GND
GND
GND
GND
Ground
Ground
Ground
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power
down
DIO
J5
P0_6
GND
(Type A)
Note 1
I-PD
J6
GND
Ground
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DA14531MOD
SmartBond TINYTM Module
Final
Reset
State
Pin #
Pin Name
Type
Description
POWER. Battery connection. IO
supply
J7
VBAT
PWR
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power
down
DIO
J8
P0_11
(Type A)
I-PD
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power
down
P0_10
SWDIO
P0_2
J9
DIO (Type A)
I-PD
INPUT/OUTPUT. SWI Data
input/output. Bidirectional data and
control communication (by default)
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power-
down
DIO
J10
J11
I-PD
(Type B)
SWCLK
GND
INPUT SWI clock signal (by default)
Ground
GND
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power-
down
P0_0
RST
DIO
J12
(Type B)
Note 2
I-PD
RST active high hardware reset
(default)
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power
down
DIO
J13
J14
P0_7
(Type A)
I-PD
I-PD
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power
down
DIO
P0_5
(Type B)
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
Reset
State
Pin #
Pin Name
Type
Description
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power
down
DIO
J15
P0_9
I-PD
I-PD
(Type A)
INPUT/OUTPUT with selectable pull
up/down resistors. Pull-down enabled
during and after reset. General
purpose I/O port bit or alternate
function nodes. Contains state
retention mechanism during power
down
DIO
J16
P0_8
(Type A)
Note 1 There are two types of pads, namely Type A and Type B. Type A is a normal IO pad with a Schmitt
trigger on input while Type B has an extra RC Filter with a cutoff frequency of 100 kHz
Note 2 This pin is also used for the communication to the internal SPI FLASH
●
●
●
●
●
I-PD is Input-Pulled Down
I-PU is Input-Pulled Up
DIO is Digital Input-Output
PWR is power
GND is Ground
4
Characteristics
All MIN/MAX specification limits are guaranteed by design, production testing and/or statistical
characterization. Typical values are based on characterization results at default measurement
conditions and are informative only.
Default measurement conditions (unless otherwise specified): VBAT= 3.0 V, TA = 25 oC. All radio
measurements are done with standard RF measurement equipment.
4.1 Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to
the device. These are stress ratings only, so functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of the specification are not implied.
Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Table 2: Absolute Maximum Ratings
Parameter Description
Conditions
Min
Max
Unit
VBAT_LIM
limiting battery supply voltage
-0.1
3.6
V
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
4.2 Recommended Operating Conditions
Table 3: Recommended Operating Conditions
Parameter Description
Conditions
Min
Typ
Max
Unit
battery supply voltage
enabling FLASH
VBAT
1.65
3.3
V
programming
VPIN
TA
voltage on a pin
-0.1
-40
3.3
85
V
ambient operating
temperature
25
°C
4.3 Device Characteristics
Table 4: DC Characteristics
Parameter Description
battery supply current with
Conditions
Min
Typ
Max
Unit
IBAT_ACTIVE
CPU running CoreMark from
RAM at 16MHz
0.4
mA
Average battery supply
current with system in
Advertising state (3
IBAT_BLE_ADV_
100ms
channels) every 100ms and
extended sleep with all RAM
retained. TX output power at
2dBm. FLASH is off.
80
92
μA
μA
Average battery supply
current with system in a
connection state with 30ms
connection interval and
extended sleep with all RAM
retained. TX output power at
2dBm. FLASH is off.
IBAT_BLE_CON
N_30ms
battery supply current with
CPU fetching code from
serial FLASH. RF is off.
IBAT_FLASH
IBAT_HIBERN
IBAT_IDLE
0.24
0.6
mA
μA
battery supply current with
system shut down
(Hibernation or shipping
mode). FLASH is off.
battery supply current with
CPU in Wait for Interrupt
Mode. FLASH is off.
0.23
1.7
mA
μA
battery supply current with
system in extended sleep
mode and 20KB RAM
retained
IBAT_SLP_20KB
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
Unit
μA
Parameter Description
Conditions
Min
Typ
Max
battery supply current with
IBAT_SLP_48KB system in extended sleep
mode and all RAM retained
2.1
Continuous RX; FLASH in
sleep mode; DCDC
converter is on;
IBAT_RF_RX
battery supply current
2.3
4.3
mA
mA
Continuous TX; FLASH in
sleep mode; DCDC
converter is on; Output
power at 2.5 dBm;
IBAT_RF_TX_+3
dBm
battery supply current
Note 1
Continuous TX;FLASH in
sleep mode; DCDC
converter is on; Output
power at 0 dBm;
IBAT_RF_TX_0d
Bm
battery supply current
battery supply current
battery supply current
battery supply current
3.6
2.8
2.3
1.5
mA
mA
mA
mA
Continuous TX;FLASH in
sleep mode; DCDC
converter is on; Output
power at -3.5 dBm;
IBAT_RF_TX_-
3dBm
Continuous TX;FLASH in
sleep mode; DCDC
converter is on; Output
power at -7 dBm
IBAT_RF_TX_-
7dBm
Continuous TX;FLASH in
sleep mode; DCDC
converter is on; Output
power at -19.5 dBm
IBAT_RF_TX_-
19dBm
Note 1 The actual TX output power is slightly different than the one indicated in the parameter name
Table 5: XTAL32MHz - Recommended Operating Conditions
Parameter Description
Conditions
Min
Typ
Max
Unit
fXTAL_32M
crystal oscillator frequency
crystal frequency tolerance
32
MHz
After trimming; including
aging and temperature drift
ΔfXTAL
-25
25
ppm
Table 6: Digital IO - Recommended Operating Conditions
Parameter Description
Conditions
Min
Typ
Max
Unit
V
VIH
VIL
HIGH level input voltage
LOW level input voltage
0.52
0.27
V
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DA14531MOD
SmartBond TINYTM Module
Final
Table 7: Digital IO - DC Characteristics
Parameter Description
Conditions
Min
-10
-10
60
Typ
Max
10
Unit
μA
IIH
HIGH level input current
LOW level input current
HIGH level input current
LOW level input current
VI=VBAT_HIGH=3.0V
VI=VSS=0V
IIL
10
μA
IIH_PD
IIL_PU
VOH
VI=VBAT=3.0V
180
-60
μA
VI=VSS=0V, VBAT=3.0V
-180
μA
0.8*VB
AT
HIGH level output voltage
LOW level output voltage
IO=3.5mA, VBAT=1.8V
IO=3.5mA, VBAT=1.8V
IO=0.3mA, VBAT=1.8V
IO=0.3mA, VBAT=1.8V
V
V
V
V
0.2*VB
AT
VOL
0.8*VB
AT
VOH_LOWDRV HIGH level output voltage
VOL_LOWDRV LOW level output voltage
0.2*VB
AT
Table 8: Radio 1Mbps - AC Characteristics
Parameter Description
Conditions
Min
Typ
Max
Unit
Dirty Transmitter disabled;
DC-DC converter disabled;
PER = 30.8 %;
PSENS_CLEAN sensitivity level
-93
dBm
Note 2
Extended packet size (255
octets)
PSENS_EPKT
sensitivity level
-91
dBm
Note 2 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/4.0.1, section 6.4.1.
Datasheet
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DA14531MOD
SmartBond TINYTM Module
Final
5
Mechanical Specifications
5.1 Dimensions
The module’s dimensions are shown in Figure 3:
Top view
J1
J2
J3
J4
J5
J16
J15
J14
J13
J12
J16
J15
J14
J13
J12
J1
J2
J3
J4
J5
Common Dimensions
J11 J10 J9
J8
J7
J6
Left side
view
Right side
view
Front view
Rear view
Bottom view
Figure 3: Mechanical Drawing
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Final
5.2 PCB Footprint
The footprint for the PCB is shown in Figure 4:
12.5mm
9.5mm
0.9mm
1.5mm
1mm
1.75mm
2.0mm
2.0mm
Figure 4: Module Footprint Top View
5.3 Marking
Antenna Area
J16
J1
J2
J15
J14
J13
J3
J4
DA14531MOD-00F0100 yyww
FCC ID: Y82-DA14531MOD
IC:9576A-DA14531MOD
ANATEL:05382-20-12967
J5
J12
J10
J9
J8
J11
J6 J7
Figure 5: Module Shield Marking
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Final
6
Packaging Information
6.1 Tape & Reel
Figure 6: Tape and Reel
The actual reel specifications are presented in the following table:
Table 9: Reel Specifications
Diameter
13 inch
Reel tape width 24 inch
Tape material
Qty/Reel
Leader
Antistatic
100/1000 pcs
400 mm + 10%
160 mm + 10%
Trailer
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SmartBond TINYTM Module
Final
6.2 Labeling
Figure 7: Reel Labeling
7
Application Information
There are some special considerations for the use of the TINYTM module, namely:
•
The RST signal is shared with the MOSI input of the NOR flash. For this reason, RST must
not be driven to GND. When the internal Flash is in use, the reset functionality is not
available.
•
The SPI Bus of DA14531 is used for the communication of the SoC with the NOR Flash at
boot time. Three of the four signals are not driven to external module pins. For this reason, a
sensor that utilizes the SPI bus must be assigned (by software) on to the module pins to
communicate with after boot is completed and when NOR Flash is no longer in use. An
example is given in Figure 11.
VBAT
J10
J14
J5
P0_2
UTX
URX
SCK
P0_6
P0_7
P0_5
P0_10
J13
J16
J15
MCU
J9
Sensor
/CS
P0_8
P0_9
J12
GPIO
DA14531
MOSI
P25Q11U
J8
P0_0/RST
MOSI
1Mbit
NOR
Flash
MISO
P0_11
P0_1
P0_3
P0_4
/CS
MISO
SCK
DA14531 TINY Module
J1, J2, J3, J4, J6, J11
Figure 11: Example of Connecting a Sensor to the SPI Bus and an MCU to RST and UART
Note that P0_0/RST pin (J12) should not be driven while the TINYTM module boots from its internal
SPI FLASH.
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DA14531MOD
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Final
8
Design Guidelines
The DA14531 SmartBond TINY™ Module comes with an integrated PCB trace antenna. The
antenna area is 12x4 mm. The antenna’s Voltage Standing Wave Ratio (VSWR) and efficiency
depend on the installation location.
The radiation performance of the PCB trace antenna depends on the host PCB layout. The maximum
antenna gain is -0.5 dBi when installed on a 50x50 mm reference board, as shown in Figure 19. The
radiation pattern is omnidirectional. The RF front end is optimized to achieve the maximum possible
efficiency for various installation positions of the module on a host PCB. To obtain similar
performance, follow the guidelines described in the following sections.
8.1 Installation Location
For optimum performance, install the module at the edge of a host PCB with the antenna edge facing
out. The module can be located on either of the outer corners or the middle of the host PCB with
equivalent performance.
The antenna should have 4 mm free space in all directions. Copper or laminate in the proximity of the
PCB trace antenna will affect the efficiency of the antenna. Laminate or copper under the antenna
should be avoided as it severely affects the performance of the antenna. The antenna keep-out area
can be seen in Figure 9.
Metals close to the antenna will degrade the antenna’s performance. The amount of degradation
depends on the host system’s characteristics.
Table 10 summarizes the antenna efficiency at different installation locations on a host PCB as
shown in Figure 8.
Table 10: Antenna Efficiency vs TINYTM Module Positions
Position # 1 (Left)
Position # 2 (Middle)
Position # 3 (Right)
Freq
Antenna efficiency
Antenna efficiency
Antenna efficiency
[MHz]
[%]
[dB]
[%]
[dB]
[%]
[dB]
2405
2440
2480
52
46
50
-2,8
-3,4
-3,0
40
34
40
-4,0
-4,7
-4,0
40
41
52
-4,0
-3,9
-2,8
Figure 8: Installation Locations for Optimum Antenna Performance
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Figure 9: Antenna Performance in Proximity of Copper (Left), Laminate (Middle) and Laminate
under Antenna (Right)
The actual TINYTM module evaluation board layout that has been used to conduct measurements is
shown in Figure 10.
Figure 10: DA14531 TINYTM Module Evaluation Board
8.2 Antenna Graphs
The antenna VSWR measurements for the three installation positions are given in the following
figures.
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Figure 11: VSWR Installed in the Upper Left Corner (Position #1) of Evaluation Board
Figure 12: VSWR with Module Installed in Center (Position #2) of the Evaluation Board
Figure 13: VSWR with Module Installed in the Upper Right Corner (Position #3) of the
Evaluation Board
8.3 Radiation Pattern
The antenna radiation pattern measurements are carried out in an anechoic chamber. Radiation
patterns are presented for three measurement planes: XY-, XZ- and YZ- planes with horizontal and
vertical polarization of the receiving antenna.
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Figure 14: Measurement Plane Definition
Measurements are carried out for the module installed in the upper right corner on the reference
board with no laminate below the antenna trace.
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Radiation Pattern for Antenna Trace
Vertical polarization
Horizontal polarization
Figure 15: Radiation Pattern for XY-Plane, Horizontal
Polarization
Figure 16: Radiation Pattern for XY-Plane, Vertical Polarization
Figure 17: Radiation Pattern for XZ-Plane, Horizontal
Polarization
Figure 18: Radiation Pattern for XZ-Plane, Vertical Polarization
Figure 19: Radiation Pattern for YZ-Plane, Horizontal
Polarization
Figure 20: Radiation Pattern for YZ-Plane, Vertical Polarization
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9
Soldering
The successful reflow soldering of the DA14531 TINYTM Module on a PCB depends on several
parameters such as the thickness of the stencil, the pads solder paste aperture, the solder paste
characteristics, the reflow soldering profile, size of the PCB, etc.
The volume of solder paste applied to the board is mainly determined by the aperture size and stencil
thickness. An initial solder paste aperture for the pads is provided on the solder paste layer of the
PCB footprint. This aperture is modified by the assembly process experts according to stencil
thickness, solder paste and available assembly equipment.
The solder profile depends on the solder paste type used. For example, the soldering profile of a
lead-free solder paste, Sn3Ag0.5Cu with no clean Flux (ROL0) and Solder Powder Type 4, is
presented below.
No clean flux is recommended because washing must not be applied after assembly to avoid that
moisture is trapped under the shield.
Figure 21: Recommended Reflow Profile for Lead Free Solder
Table 11: Reflow Profile Specification
Statistic name
Low limit
High limit
Units
Slope1 (Target=2.0) Between 30.0 and 70.0
Slope2 (Target=2.0) Between 70.0 and 150.0
Slope3 (Target=-2.8) Between 220.0 and 150.0
Preheat time 110-190C
1
1
3
Degrees/Second
Degrees/Second
Degrees/Second
Seconds
3
-5
-0.5
120
65
60
30
235
10
Seconds
Time above reflow @220C
Peak temperature
250
30
Degrees Celsius
Second
Total time above @235C
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Solderability reflow check of 5 cycles was performed, applying the procedures mentioned in JESD-
A113E standard.
The MSL is an indicator for the maximum allowable time period (floor life time) in which a moisture
sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a
maximum temperature of 30°C and a maximum relative humidity of 60 % RH before the solder reflow
process.
DA14531 TINY Module is qualified for MSL 3.
Table 12: MSL Level vs Floor Life Time
MSL Level
MSL 4
Floor Life Time
72 hours
MSL 3
168 hours
MSL 2A
MSL 2
4 weeks
1 year
MSL 1
Unlimited at 30°C/85%RH
10 Ordering Information
The ordering number consists of the part number followed by a suffix that indicates the packing
method. For details and availability, please consult your Dialog Semiconductor local sales
representative.
Table 13: Ordering Information (Samples)
Part Number
Size (mm)
Shipment Form
Pack Quantity
MOQ
DA14531MOD-00F0100C
12.5 x 14.5 x 2.8
Reel
100
3
Table 14: Ordering Information (Production)
Part Number
Size (mm)
Shipment Form
Pack Quantity
MOQ
DA14531MOD-00F01002
12.5 x 14.5 x 2.8
Reel
1000
1
11 Regulatory Information
This section outlines the regulatory information for the DA14531 TINYTM Module. The module is
certified for a global market. This facilitates the user end-product market entry. Please note that the
end-product would need to apply for the end-product certification, however the module certification
listed below will facilitate that procedure.
When the end user sends the end-product to those markets, the end-product may need to follow
additional requirements according to the specific market regulation.
For example, some markets have additional testing and/or certification like Korea EMC, South Africa
SABS EMC and some have the requirement to put on the end-product label a modular approval ID or
mark that consists of an approved Bluetooth® Low Energy modular ID on host label directly, like
Japan, Taiwan, Brazil.
A list with the Conformance Standards that DA14531 TINYTM Module meets is presented in Table 15.
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Table 15: Standards Conformance
Area
Item
Service
Standard
Certificate ID
SG ITS-21032
Note 3
Safety for
module
Global
CB
IEC 62368-1:2014
EN 300 328 v2.2.2
EN 62479:2010
SE-RED-2001958 Ed.1
Wireless
RED
CE
Safety for
module
Europe
US/CA
EN 62368-1
EN 301 489-1 v2.1.1
EN 301 489 v3.1.1
EMC
RED
FCC ID
FCC PART 15 C:2017
Y82-DA14531MOD
RSS-247 Issue 2:
February 2017
RSS-Gen Issue 4:
November 2014
9576A-DA14531MOD
Wireless
IC ID
Japan
Wireless
Wireless
MIC
JRL
018-200152
Taiwan
NCC
LP0002
CCAG20LP0160T6
R-R-Dlg-DA14531MOD
방송통신표준
KS X 3123 "무선 설비
적합성 평가 시험 방법"
KN 301 489
South Korea
Wireless
MSIP
South Africa
Brazil
Wireless
Wireless
ICASA
Anatel
Based on RED
TA-2020/5882
ATO No.14448/2017
Resolution No.680
05382-20-12967
2020DP5042
信部无【2002】
353
China
Wireless
SRRC
Thailand
India
Wireless
Wireless
NBTC
WPC
NBTC TS 1035-2562
Based on RED
RT 1768
ETA-SD-20210402433
Note 3 Include national differences of US / Canada / Japan / China / Korea / Europe / Australia / South Africa
/ Taiwan / Brazil / Thailand.
11.1 CE (Radio Equipment Directive 2014/53/EU (RED)) - (Europe)
The DA14531 TINYTM Module is a Radio Equipment Directive (RED) assessed radio that is CE
marked. The module has been manufactured and tested with the intention of being a sub assembly
to a final product. The module has been tested to RED 2014/53/EU Essential Requirements for
Health, Safety and Radio. The applicable standards are:
○
○
○
○
Radio: EN 300 328 V2.2.2 (2019-07)
Health: (SAR) EN 62479:2010
Safety: EN 62368-1
EMC: EN 301 489-1 v2.1.1, EN 301 489 v3.1.1
End-product will need to perform the radio EMC tests according to EN 301 489. The conducted tests
can be inherited from the module test report. It is recommended to repeat the EN 300 328 radiated
testing with the end-product assembly.
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11.2 FCC - (U.S.A.)
FCC ID: Y82-DA14531MOD
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
Warning: Changes or modifications to this unit not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement:
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment and
meets the FCC radio frequency (RF) Exposure Guidelines. This transmitter must not be co-located or
operating in conjunction with any other antenna or transmitter.
OEM Responsibilities to comply with FCC Regulations:
OEM integrator is responsible for testing their end-product for any additional compliance
requirements needed for the module installation like EMC testing according to FCC Part 15B.
Class B Device Notice
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
○
○
○
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
○
Consult the dealer or an experienced radio/TV technician for help.
End-product labelling
The DA14531 TINYTM Module is labelled with its own FCC ID: Y82-DA14531MOD. If the FCC ID is
not visible when the module is installed inside another device, then the outside of the end-product
into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use the following or similar wording:
“Contains FCC ID: Y82-DA14531MOD”
11.3 IC (CANADA)
IC ID: 9576A-DA14531MOD
The DA14531 TINYTM Module is certified for the IC as a single-modular transmitter. The module meets
IC modular approval and labelling requirements. The IC follows the same testing and rules as the FCC
regarding certified modules in authorized equipment.
The module has been tested according to following standards:
○
Radio: RSS-247 Issue 2: February 2017, RSS-Gen Issue 4: November 2014
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○
Health: RSS-102 Issue 5:2015
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to
the following two conditions: (1) this device may not cause interference, and (2) this device must accept
any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si
le brouillage est susceptible d'en compromettre le fonctionnement.
RF Exposure Statement
This device complies with IC radiation exposure limits set forth for an uncontrolled environment and
meets RSS-102 of the IC radio frequency (RF) Exposure rules. This transmitter must not be co-located
or operating in conjunction with any other antenna or transmitter.
Le présent appareil est conforme à l'exposition aux radiations IC définies pour un environnement non
contrôlé et répond aux RSS-102 de la fréquence radio (RF) IC règles d'exposition. L'émetteur ne doit
pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
OEM Responsibilities to comply with IC Regulations:
OEM integrator is responsible for testing their end-product for any additional compliance
requirements needed for the module installation like IC ES003 (EMC). This can be combined with
the FCC Part 15B test.
End-product labelling
The DA14531 TINYTM Module is labelled with its own IC ID: 9576A-DA14531MOD. If the IC ID is not
visible when the module is installed inside another device, then the outside of the end-product into
which the module is installed must also display a label referring to the enclosed module. This exterior
label can use the following or similar wording: “Contains IC ID: 9576A-DA14531MOD”
11.4 MIC (JAPAN)
The DA14531 TINYTM Module has received type certification as required to conform to the technical
standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
The module has been tested according to the following standard:
○
Radio: JRL “Article 49-20 and the relevant articles of the Ordinance Regulating Radio”
Equipment
End-product may need to follow additional requirement according to regulation EMC.
End-product labelling
The MIC ID can be applied directly on end-product's label. The end-product may bear the GITEKI
mark and certification number so that is clear that the end-product contains a certified radio module.
The following note may be show next to, below, above the GITEKI mark and certification number in
order to indicate the presence of a certified radio module:
当該機器には電波法に基づく、技術基準適合証明等を受けた特定無線設備を装着している。
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Translation on the text:
“This equipment contains specified radio equipment that has been certified to the Technical
Regulation Conformity Certification under the Radio Law.”
11.5 NCC (Taiwan)
DA14531MOD-00F0100
The DA14531 TINYTM Module has received compliance approval in accordance with the
Telecommunications Act. The module has been tested according to following standard:
●
Radio: Low Power Radio Frequency Devices Technical Regulations (LP0002)
End-product may need to follow additional requirement according to regulation EMC.
注意！
依據 低功率電波輻射性電機管理辦法
第十二條
經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者
均不得擅自變更頻率、加大功率或變更原設計之特性及功能。
第十四條
低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有
干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。
前項合法通信，指依電信法規定作業之無線電通信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電
機設備之干擾。
End-product labelling
The NCC ID can be applied directly on end-product's label.
11.6 MSIP (South Korea)
R-R-Dlg-DA14531MOD
DA14531 TINYTM Module has received certification of conformity in accordance with Radio Waves
Act. The module has been tested according to following standard:
○
Radio: Ministry of Science and ICT Notice No. 2019-105
For end-product wireless test, you can refer to Dialog's own certification report so that the lab knows
the module itself has passed although it still needs to be tested.
Additionally EMC for wireless (KN301489).
End-product labelling
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The MSIP ID can be applied directly on end-product's label. The ID should be clearly visible on the
final end-product. The integrator of the module should refer to the labeling requirements for Korea
available on the Korea Communications Commission (KCC) website.
11.7 Australia/ New Zealand (RCM)
DA14531 TINYTM Module has not been certified for the Australian/ New Zealand market. However,
the module’s CE test reports can be used in part to demonstrate compliance in accordance with
Short Range Devices- SRD Standards. The integrator of the module must construct a compliance
folder with all relevant test reports: RF, EMC, Electrical Safety and DoC (Declaration of Conformity).
11.8 South Africa (ICASA)
South Africa certification is based on RED(CE) approval.
TA-2020/5882
APPROVED
Approval is granted to print labels for the products as described below:
1. For use as Label on the product size: 80 mm (W) X 40 mm (H). To be printed on the product.
2. For use as Label on the package size: 80 mm (W) X 40 mm (H). To be printed on the
package
End-product may need to follow additional requirement according to regulation EMC.
11.9 Brazil (Anatel)
05382-20-12967
The module has been tested and found to be compliant according to following Category II standards:
•
ATO (Act) No 14448/2017
End-product may need to follow additional requirement according to regulation EMC.
“Este equipamento não tem direito à proteção contra interferência prejudicial e não pode causar
interferência em sistemas devidamente autorizados.”
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Translation on the text:
"This equipment is not entitled to protection against harmful interference and must not cause
interference in duly authorized systems."
11.10 China (SRRC)
Model no. DA14531MOD-00F0100
CMIIT ID:2020DP5042
The module has been tested and found to be compliant according to following standards
•
信部无【2002】353号
End-product may need to follow additional requirement according to regulation EMC.
11.11 Thailand (NBTC)
Model no. DA14531MOD-00F0100
NBTC SDoC ID: RT 1768
DA14531 TINYTM Module is compliant with NBTC requirements in Thailand.
End-product may need to follow additional requirement according to regulation EMC.
End-product labelling
End-products will have their own ID and labelling requirements.
11.12 India (WPC)
Model no. DA14531MOD-00F0100
Registration No: ETA-SD-20210402433
India certification is based on RED(CE) approval/ reports. There are no marking/ labeling
requirements.
End-product may need to follow additional requirement according to regulation EMC.
12 Environmental Information
Dialog Semiconductor’s suppliers certify that its products are in compliance with the requirements of
REACH and Directive 2015/863/EU of the European Parliament on the restriction of the use of
certain hazardous substances in electrical and electronic equipment. RoHS certificates from Dialog’s
suppliers are available on request.
13 Bluetooth® SIG Qualification
The DA14531 TINYTM Module is listed on the Bluetooth® SIG Website as a qualified product. The
customers can refer to the following QDIDs in order to qualify their product:
●
●
QDID 113957 for Host Subsystem
QDID 113959 for Controller Subsystem
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●
QDID 138960 for Profile Subsystem
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Revision History
Revision
Date
Description
○
○
Corrected number of channels for 11-bit ENOB ADC
3.1
31-May-2021
Updated Regulatory Information (India)
○
○
○
○
○
Added BD address information to features
Corrected typical ambient temperature in Table 3
Updated Table 4
3.0
08-Dec-2020
Updated Regulatory information on ICASA
Added MSL qualification level and description
2.3
2.2
25-Aug-2020
26-Jun-2020
○
Updated Regulatory information
Various updates:
○
○
Updated Regulatory information
Various text updates
Various updates:
○
○
○
○
Added Soldering
2.1
1.2
18-Jun-2020
18-May-2020
Updated Regulatory information
Updated PCB Footprint
Updated Characteristics
Initial target datasheet version
○
○
Various text updates
Electrical Characteristics update from mini-characterization
Initial target datasheet version
1.1
1.0
23-Mar-2020
6-Mar-2020
○
Updated Regulatory Information section
Initial target datasheet version
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Status Definitions
Revision
Datasheet Status
Product Status
Definition
This datasheet contains the design specifications for product development.
Specifications may be changed in any manner without notice.
1.<n>
Target
Development
This datasheet contains the specifications and preliminary characterization
data for products in pre-production. Specifications may be changed at any
time without notice in order to improve the design.
2.<n>
3.<n>
Preliminary
Qualification
This datasheet contains the final specifications for products in volume
production. The specifications may be changed at any time in order to
improve the design, manufacturing and supply. Major specification changes
are communicated via Customer Product Notifications. Datasheet changes
are communicated via www.dialog-semiconductor.com.
Final
Production
Archived
This datasheet contains the specifications for discontinued products. The
information is provided for reference only.
4.<n>
Obsolete
Disclaimer
Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this document are not
designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications
where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog
Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any representations or
warranties, express or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no
responsibility whatsoever for the content in this document if provided by any information source outside of Dialog Semiconductor.
Dialog Semiconductor reserves the right to change without notice the information published in this document, including, without limitation, the
specification and the design of the related semiconductor products, software and applications. Notwithstanding the foregoing, for any automotive
grade version of the device, Dialog Semiconductor reserves the right to change the information published in this document, including, without
limitation, the specification and the design of the related semiconductor products, software and applications, in accordance with its standard
automotive change notification process.
Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes
no representation or warranty that such applications, software and semiconductor products will be suitable for the specified use without further
testing or modification. Unless otherwise agreed in writing, such testing or modification is the sole responsibility of the customer and Dialog
Semiconductor excludes all liability in this respect.
Nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications
referred to in this document. Such license must be separately sought by customer with Dialog Semiconductor.
All use of Dialog Semiconductor products, software and applications referred to in this document is subject to Dialog Semiconductor’s Standard
Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated.
Dialog, Dialog Semiconductor and the Dialog logo are trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service
names and marks are the property of their respective owners.
© 2021 Dialog Semiconductor. All rights reserved.
RoHS Compliance
Dialog Semiconductor’s suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European
Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our
suppliers are available on request.
Contacting Dialog Semiconductor
United Kingdom (Headquarters)
Dialog Semiconductor (UK) LTD
Phone: +44 1793 757700
North America
Hong Kong
China (Shenzhen)
Dialog Semiconductor Inc.
Phone: +1 408 845 8500
Dialog Semiconductor Hong Kong
Phone: +852 2607 4271
Dialog Semiconductor China
Phone: +86 755 2981 3669
Germany
Japan
Korea
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Phone: +49 7021 805-0
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Phone: +81 3 5769 5100
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Phone: +82 2 3469 8200
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Phone: +86 21 5424 9058
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Phone: +31 73 640 8822
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Phone: +886 281 786 222
Email:
Web site:
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CFR0011-120-00
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