DA16600MOD_技术文档

DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

General Description

The DA16600 series is a highly integrated ultra-low-power Wi-Fi + Bluetooth^®Low Energy Combo

Module solution. This module includes the DA16200 that has an 802.11b/g/n radio (PHY), a

baseband processor, a media access controller (MAC), on-chip memory, and a host networking

application processor. DA16600 also has a DA14531 that has a 2.4 GHz transceiver and an Arm^®

Cortex-M0+^®microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of

32 kB. The radio transceiver, the baseband processor, and the qualified Bluetooth^®low energy stack

is fully compliant with the Bluetooth Low Energy 5.1 standard.

The DA16600 is a synthesis of breakthrough ultra-low-power technologies, which enables an

extremely low power operation in the module. The DA16200 and DA14531 shut down every micro

element of the chip that is not in use, which creates a power consumption that is near zero when not

actively transmitting or receiving data. Such low power operation can extend the battery life up to a

year or more depending on the application. The DA16600 also enables ultra-low power transmission

and reception modes when the SoC needs to be awake to exchange information with other devices.

Advanced algorithms enable sleep mode until the exact moment when wake up is required to

transmit or receive data.

Module Features

■

Module Variants

□

DA16600MOD-AAC4WA32 (Chip Antenna)

DA16600MOD-AAE4WA32 (u.FL Connector)

■

Dimensions

□

14.3 mm × 24.3 mm × 3.0 mm, 51-Pins

Ambient operating temperature range

□

-40 °C to 85 °C

Regulatory certifications:

□

FCC

IC

CE

TELEC

Wi-Fi Features

■

Highly integrated ultra-low power Wi-Fi^®

system on a chip

■ Wi-Fi processor

□

IEEE 802.11b/g/n, 1x1, 20 MHz channel

bandwidth, 2.4 GHz

■

RF Performance

□

Tx Power: +18 dBm, 1 Mbps DSSS

□

Wi-Fi security: WPA/WPA2-

Enterprise/Personal, WPA2 SI, WPA3

SAE, and OWE

Rx Sensitivity: -97.5 dBm, 1 Mbps DSSS

■

Full offload: SoC runs full networking OS and

TCP/IP stack

□

Vendor EAP types: EAP-

TTLS/MSCHAPv2, PEAPv0/EAP-

MSCHAPv2, PEAPv1, EAP-FAST, and

EAP-TLS

Hardware accelerators

□

General HW CRC engine

□

Operating modes: Station, Soft AP

WPS-PIN/PBC for easy Wi-Fi provisioning

Fast Wi-Fi connections

HW zeroing function for fast booting

Pseudo random number generator

(PRNG)

■

SPI flash Memory

Datasheet

Revision 3.0

23-Feb-2021

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

□

32 M-bit / 4 M-byte

■

Supports various interfaces

■

Complete software stack

□

Two UARTs

□

Comprehensive networking software stack

SPI Master/Slave interface

I2C Master/Slave interface

I2S for digital audio streaming

4-channel PWM

Provides TCP/IP stack in the form of

network socket APIs

CPU core subsystem

□

Arm^®Cortex^®-M4F core with clock

frequency of 30~160 MHz

Individually programmable, multiplexed

GPIO pins

□

ROM: 256 KB, SRAM: 512 KB, OTP: 8

KB, Retention Memory: 48 KB

□

JTAG and SWD

■

Advanced security

■

Built-in 2-channel auxiliary ADC for sensor

interfaces

□

Secure booting

Secure debugging using JTAG/SWD and

UART ports

□

12-bit SAR ADC: single-ended two

channels

□

Secure asset storage

Supply

Built-in hardware crypto engines for advanced

security

□

Operating voltage: 2.1 V to 3.6 V (typical:

3.3 V)

□

TLS/DTLS security protocol functions

□

2 Digital I/O Supply Voltage: 1.8 V / 3.3 V

Black-out and brown-out detector

Crypto engine for key deliberate generic

security functions: AES (128,192,256),

DES/3DES, SHA1/224/256, RSA, DH,

ECC, CHACHA, and TRNG

■

Power management unit

□

On-Chip RTC

Wake-up control of fast booting or full

booting with minimal initialization time

□

Supports three ultra-low power sleep

modes

Bluetooth Features

■

Bluetooth

■

Radio

□

Compatible with Bluetooth^®v5.1,

ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US) and

ARIB STD-T66 (Japan) core

□

Programmable RF transmit power

-93 dBm receiver sensitivity

Interfaces

□

2 channel 11-bit ENOB ADC

□

Supports up to 3 connections

2 general purpose timers with PWM

■

Processing and memories

5 GPIOs

□

16 MHz 32-bit Arm^®Cortex-M0+ with SWD

interface

SPI

□

48 Kbytes RAM

144 Kbytes ROM

32 Kbytes OTP

2x UART, 1-wire UART support

I2C

■

Power management

■

Current Consumption

□

Operating range (1.8 V - 3.3 V)

Inrush current control

□

2 mA RX at VBAT = 3V

4 mA TX at VBAT = 3 V and 0 dBm

1.8 uA at sleep with all RAM retained

Other

□

Real Time Clock

Trimmed 32 MHz Crystal

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

Contents

1

2

3

References ..................................................................................................................................... 5

Block Diagram ............................................................................................................................... 6

Pinout ............................................................................................................................................. 7

3.1 Pinout Description (51-pins).................................................................................................. 7

3.2 Pin Multiplexing................................................................................................................... 10

4

Electrical Specification............................................................................................................... 11

4.1 Absolute Maximum Ratings ................................................................................................ 11

4.2 Recommended Operating Conditions................................................................................. 11

4.3 Electrical Characteristics..................................................................................................... 11

4.3.1

4.3.2

4.3.3

DC Parameters, 1.8 V IO..................................................................................... 11

DC Parameters, 3.3 V IO..................................................................................... 12

DC Parameters for RTC Block ............................................................................ 12

4.4 Radio Characteristics.......................................................................................................... 13

4.4.1

4.4.2

Wi-Fi Characteristics............................................................................................ 13

Bluetooth^®LE Characteristics.............................................................................. 14

4.5 Current Consumption.......................................................................................................... 14

4.5.1

4.5.2

Wi-Fi Characteristics............................................................................................ 14

Bluetooth^®LE Characteristics.............................................................................. 15

4.6 Radiation Performance ....................................................................................................... 16

4.7 ESD Ratings........................................................................................................................ 16

5

6

Power-on Sequence.................................................................................................................... 17

Applications Schematic.............................................................................................................. 18

6.1 Typical Application .............................................................................................................. 18

7

Package Information................................................................................................................... 19

7.1 Dimension: DA16600MOD-AAC......................................................................................... 19

7.2 Dimension: DA16600MOD-AAE ......................................................................................... 19

7.3 PCB Land Pattern ............................................................................................................... 20

7.4 4-layer PCB Example.......................................................................................................... 22

7.5 Soldering Information.......................................................................................................... 23

7.5.1

Ordering Information .................................................................................................................. 24

Revision History ................................................................................................................................ 25

Recommended Condition for Reflow Soldering .................................................. 23

8

Datasheet

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Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

Figures

Figure 1: DA16600 Block Diagram........................................................................................................ 6

Figure 2: DA16600MOD 51-Pins Pinout Diagram (Top View) .............................................................. 7

Figure 3: TIS 3D .................................................................................................................................. 16

Figure 4: TRP 3D................................................................................................................................. 16

Figure 5: Power On Sequence ............................................................................................................ 17

Figure 6: Typical Application ............................................................................................................... 18

Figure 7: AAC Module Dimension ....................................................................................................... 19

Figure 8: AAE Module Dimension ....................................................................................................... 20

Figure 9: PCB Land Pattern (Top View).............................................................................................. 20

Figure 10: PCB Land Pattern (Bottom View)....................................................................................... 21

Figure 11: 4-Layer PCB Example........................................................................................................ 22

Figure 12: Reflow Condition ................................................................................................................ 23

Tables

Table 1: Pin Description ........................................................................................................................ 8

Table 2: DA16200 Pin Multiplexing ..................................................................................................... 10

Table 3: Absolute Maximum Ratings................................................................................................... 11

Table 4: Recommended Operating Conditions ................................................................................... 11

Table 5: DC Parameters, 1.8 V IO ...................................................................................................... 11

Table 6: DC Parameters, 3.3 V IO ...................................................................................................... 12

Table 7: DC Parameters for RTC block, 3.3 V VBAT.......................................................................... 12

Table 8: DC Parameters for RTC block, 2.1 V VBAT.......................................................................... 12

Table 9: Wi-Fi Receiver Characteristics.............................................................................................. 13

Table 10: Wi-Fi Transmitter Characteristics........................................................................................ 13

Table 11: Radio 1 Mb/s – AC Characteristics ..................................................................................... 14

Table 12: Current Consumption in Active State .................................................................................. 14

Table 13: Current Consumption in Low Power Operation................................................................... 14

Table 14: DC Characteristics............................................................................................................... 15

Table 15: ESD Performance................................................................................................................ 16

Table 16: Power On Sequence Timing Requirements........................................................................ 17

Table 17: Coexistence Connection ..................................................................................................... 18

Table 18: Component Value................................................................................................................ 18

Table 19: Typical Reflow Profile (Lead Free): J-STD-020C................................................................ 23

Table 20: Ordering Information (Samples).......................................................................................... 24

Table 21: Ordering Information (Production)....................................................................................... 24

Datasheet

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23-Feb-2021

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

1

References

DA16600MOD consist of a DA16200 and a DA14531 chipset. Please see the respective chipset and

module datasheets for details.

[1] DA16200 Datasheet, Dialog Semiconductor

[2] DA16200MOD Datasheet, Dialog Semiconductor

(available at https://www.dialog-semiconductor.com/products/connectivity/wi-fi)

[3] DA14531, Datasheet, Dialog Semiconductor

[4] DA14531MOD Datasheet, Dialog Semiconductor

(available at https://www.dialog-semiconductor.com/products/connectivity/bluetooth-low-

energy/products/da14530-and-da14531)

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

2

Block Diagram

The DA16600 provides a high level of integration for a battery used wireless system, with integrated

IEEE 802.11 b/g/n and Bluetooth V5.1. The DA16600 is designed to address the needs of battery

used devices that require minimal power consumption and reliable operation.

Figure 1 shows the interconnection of all the physical blocks in DA16600MOD.

32 MHz

Crystal

DA14531

Matching

Circuit

GPIO Multiplexing

Low power

BLE SoC

U.FL

connector

or

Chip

antenna

SPDT for

antenna

switching

UART

DA16200

GPIO Multiplexing

RTC control

2.4GHz

BPF &

Matching

Circuit

Low power

Wi-Fi SoC

UART for debug

32.768

KHz

Crystal

4MByte

Serial

Flash

40 MHz

Crystal

Figure 1: DA16600 Block Diagram

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

3

Pinout

3.1 Pinout Description (51-pins)

VBAT_BLE

P0_10

P0_11

P0_5

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

DA16600

MOD Series

NC

P0_7

1

2

P0_2

P0_8

P0_6

P0_9

3

TP

GND

4

TEST or NC

GND

TP

5

GPIOA2

GPIOA3

VDD_DIO1

TP

6

RTC_PWR_KEY

TP

7

8

RTC_GPO

TMS

9

GND

TP

10

11

12

13

14

15

16

17

18

19

TCLK

GPIOA6

GPIOA7

GPIOA8

GPIOA9

GPIOA10

GPIOA11

GND

GPIOC_8

GPIOC_7

GPIOC_6

UART0_TXD

UART0_RXD

VDD_DIO2

TP

GND

TP

GND

Figure 2: DA16600MOD 51-Pins Pinout Diagram (Top View)

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

Table 1: Pin Description

#Pin Pin Name

Type

Drive(mA) Reset Related

State Device

Description

1

2

3

NC

AI

DA14531

Not Connect

P0_2

P0_6

DIO

General Purpose I/O

Internally connected to

RF switch

Note 1

4

5

GND

AI

Common

Ground

TEST or NC

Chip antenna type:

RF_Test

u.FL connector type: NC

6

7

8

GND

DI

Common

DA16200

Ground

RTC_PWR_KEY

TP

RTC block enable signal

DNC

RTC block wake up

signal is internally

connected

Note 1

9

RTC_GPO

TMS

DO

DA16200

Sensor control signal

JTAG I/F, SWDIO

10

11

DIO

2/4/8/12

I-PU

I-PD

DA16200

TCLK

JTAG I/F, SWCLK,

General Purpose I/O

12

13

14

15

16

17

GPIOC_8

DIO

DO

2/4/8/12

I-PD

O

DA16200

General Purpose I/O

UART transmit data

UART receive data

GPIOC_7

GPIOC_6

UART0_TXD

UART0_RXD

VDD_DIO2

DI

I

Supply power for digital

I/O

VDD

GPIOC6~GPIOC8,

TMS/TCLK, TXD/RXD

18

19

20

TP

DNC

DA16200

F_IO0 is internally

connected to Flash

Memory

F_CLK is internally

connected to Flash

Memory

F_IO3 is internally

connected to Flash

Memory

21

22

23

GND

TP

GND

DNC

Common

DA16200

Ground

F_IO1 is internally

connected to Flash

Memory

24

TP

DNC

DA16200

F_CSN is internally

connected to Flash

Memory

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

#Pin Pin Name

Type

Drive(mA) Reset Related

State Device

Description

25

26

TP

DNC

DA16200

F_IO2 is internally

connected to Flash

Memory

RTC_WAKE_UP2

DI

DA16200

RTC block wake-up

signal

27

28

GND

VDD

Common

DA16200

Ground

Supply power for internal

DC-DC, DIO_LDO, and

Analog IP of DA16200

VBAT_3V3

29

30

31

32

33

34

35

36

37

38

GND

DIO

DNC

Common

Ground

GND

Ground

GND

Ground

GPIOA11

GPIOA10

GPIOA9

GPIOA8

GPIOA7

GPIOA6

TP

2/4/8/12

I-PD

DA16200

Common

General Purpose I/O

GPIOA5 of DA16200 is

internally connected to

P0_3 of DA14531 Note 1

39

40

TP

DNC

VDD

2/4/8/12

I-PD

Common

DA16200

GPIOA4 of DA16200 is

internally connected to

P0_4 of DA14531 Note 1

Supply power for digital

I/O

VDD_DIO1

GPIOA0~GPIOA11

41

42

43

GPIOA3

GPIOA2

TP

AI/DIO

DNC

2/4/8/12

I-PD

DA16200

Common

Aux. ADC input/General

Purpose I/O

Aux. ADC input/General

Purpose I/O

GPIOA1 of DA16200 is

internally connected to

P0_0 of DA14531 Note 1

44

TP

DNC

2/4/8/12

I-PD

Common

GPIOA0 of DA16200 is

internally connected to

P0_1 of DA14531 Note 1

45

46

47

48

49

50

51

P0_9

DIO

VDD

3.5 / 0.3

I-PD

DA14531

General Purpose I/O

P0_8

P0_7

P0_5

P0_11

P0_10

VBAT_BLE

Supply power for

DA14531

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

Note 1 Pin3, Pin8, Pin 38, Pin 39, Pin 43, and Pin 44 are connected internally so these pins can`t be used as

GPIO or as wake up input in application system.

3.2 Pin Multiplexing

This device provides various interfaces to support many kinds of applications.

In DA16200, it is possible to control each pin according to the required application in reference to the

pin multiplexing illustrated in Table 2 Pin control can be realized through register setting.

In DA14531, I/O pin assignment can be configured by the SW and is organized into the Port 0.

Please refer the datasheet and user manual of DA16200 and DA14531 respectively for detail

information.

Table 2: DA16200 Pin Multiplexing

Several pins are internally connected in the module, so these pins can’t be used as GPIO. These

pins are described as TP (test point) except P0_6 in DA16600MOD. Because of internally used pins,

several interfaces of DA16200 – SDIO, SDeMMC and UART1– are not possible on DA16600MOD.

●

DA16200: GPIOA0, GPIOA1, GPIOA4, GPIOA5

DA14531: P0_0, P0_1, P0_3, P0_4, P0_6

P0_6 of DA14531 is internally connected to RF switch and need to be connected externally to

GPIO_A9 or GPIO_A10 of DA16200 for coexistence, so this pin can’t be used as other purpose of

GPIO too.

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

4

Electrical Specification

4.1 Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to

the device. These are stress ratings only, so functional operation of the device at these or any other

conditions beyond those indicated in the operational sections of the specification are not implied.

Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

Table 3: Absolute Maximum Ratings

Parameter

VBAT_3V3

VDD_DIO1

VDD_DIO2

VBAT_BLE

#Pins

28

Min

-0.1

Max

3.9

Units

V

40

-0.1

3.9

3.6

17

51

4.2 Recommended Operating Conditions

Table 4: Recommended Operating Conditions

Parameter

VBAT_3V3

VDD_DIO1

VDD_DIO2

VBAT_BLE

#Pins

28

Min

Typ

Max

Units

2.1

3.6

3.3

V

40

1.62

1.8

V

17

51

Ambient operating temperature range

(T_A)

-40

+85

°C

4.3 Electrical Characteristics

4.3.1

DC Parameters, 1.8 V IO

Table 5: DC Parameters, 1.8 V IO

Symbol Parameter Condition

Min

Typ

Max

Units

Guaranteed logic Low

level

0.3 ×

DVDD

V_IL

Input Low Voltage

VSS

V

Note 1

Guaranteed logic High

level

0.7 ×

DVDD

V_IH

Input High Voltage

DVDD

V

0.2 ×

DVDD

V_OL

V_OH

Output Low Voltage DVDD=Min.

Output High Voltage DVDD=Min.

VSS

0.8 ×

DVDD

R_PU

R_PD

Pull-up Resistor

V_PAD=V_IH, DIO=Min.

V_PAD=VIL, DIO=Min.

32.4

kΩ

Pull-down Resistor

Note 1 DVDD = 1.8V, VDD_DIO1, VDD_DIO2 Logic Level.

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

4.3.2

DC Parameters, 3.3 V IO

Table 6: DC Parameters, 3.3 V IO

Symbol Parameter Condition

Min

Typ

Max

Units

Guaranteed logic Low

level

V_IL

V_IH

Input Low Voltage

VSS

0.8

V

Note 2

Guaranteed logic High

level

Input High Voltage

2.0

DVDD

V

V_OL

V_OH

R_PU

R_PD

Output Low Voltage DVDD=Min.

Output High Voltage DVDD=Min.

VSS

2.4

0.4

DVDD

19.4

V

Pull-up Resistor

VPAD=VIH, DIO=Min.

V_PAD=V_IL, DIO=Min.

kΩ

Pull-down Resistor

16.0

Note 2 DVDD= 3.3 V, VDD_DIO1, VDD_DIO2 Logic Level.

4.3.3

DC Parameters for RTC Block

There are several control pins in RTC block.

Table 7: DC Parameters for RTC block, 3.3 V VBAT

Symbol Parameter

Condition

Min

Typ

Max

Units

Guaranteed logic Low

level

V_IL

V_IH

Input Low Voltage

Input High Voltage

VSS

0.6

V

Guaranteed logic High

level

2.2

VBAT

V

(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)

Table 8: DC Parameters for RTC block, 2.1 V VBAT

Symbol Parameter

Condition

Min

Typ

Max

Units

Guaranteed logic Low

level

V_IL

V_IH

Input Low Voltage

Input High Voltage

VSS

0.3

V

Guaranteed logic High

level

1.6

VBAT

V

(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)

Datasheet

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Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

4.4 Radio Characteristics

4.4.1

Wi-Fi Characteristics

●

TA = +25 °C, VBAT = 3.3 V, CH1 (2412 MHz)

Table 9: Wi-Fi Receiver Characteristics

Parameter

Condition

Min

-98.5

-94

-89

-90

-88

-81

-75

-90

-72

-4

Typ

-97.5

-93

-88

-89

-87

-80

-74

-89

-71

0

Max

-95.5

-91

-86

-87

-85

-78

-72

-87

-69

0

Units

1 Mbps DSSS

2 Mbps DSSS

11 Mbps CCK

6 Mbps OFDM

9 Mbps OFDM

18 Mbps OFDM

36 Mbps OFDM

54 Mbps OFDM

MCS0(GF)

Sensitivity

(8% PER for 11b rates, 10%

PER for 11g/11n rates)

dBm

MCS7(GF)

Maximum input level

802.11b

(8% PER for 11b rates, 10%

PER for 11g/11n rates)

802.11g

-10

-4

-3

Table 10: Wi-Fi Transmitter Characteristics

Parameter

Condition

Min

15

Typ

18

Max

19

Units

1 Mbps DSSS

2 Mbps DSSS

5.5 Mbps CCK

11 Mbps CCK

6 Mbps OFDM

9 Mbps OFDM

12 Mbps OFDM

18 Mbps OFDM

24 Mbps OFDM

36 Mbps OFDM

48 Mbps OFDM

54 Mbps OFDM

MCS0 OFDM

MCS7 OFDM

15

18

19

15

18

19

15

18

19

14

17

18

14

17

18

Maximum Output Power

measured form IEEE

spectral mask and EVM

14

17

18

dBm

14

17

18

13

16

17

13

16

17

11.5

10.5

14

14.5

13.5

17

15.5

14.5

18

10.5

13.5

14.5

Transmit center frequency

accuracy

-25

+25

ppm

Datasheet

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth^®LE Combo

Module

4.4.2

Bluetooth^®LE Characteristics

Table 11: Radio 1 Mb/s – AC Characteristics

Parameter

Description

Condition

Min

Typ

Max

Unit

Dirty Transmitter disabled;

DC-DC converter disabled;

PER = 30.8 %;

P_{SENS_CLEAN}

sensitivity level

-93

dBm

Note 1

Extended packet size

(255 octets)

P_{SENS_EPKT}

sensitivity level

-90

dBm

Note 1

Note 1 Measured according to Bluetooth^®Low Energy Test Specification RF-PHY.TS/5.1.0

4.5 Current Consumption

4.5.1

Wi-Fi Characteristics

TA = +25 °C, VBAT = 3.3 V, w/ CPU clock is 80 MHz.

Table 12: Current Consumption in Active State

Parameter

Condition

1 Mbps DSSS

Min

260

240

180

25

Typ

280

260

200

29

Max

320

300

240

51

Units

@ 18.0 dBm

@ 17.0 dBm

@ 13.5 dBm

6 Mbps OFDM

54 Mbps OFDM

MCS7

TX

RX

ACTIVE

No signal Note 1

mA

1 Mbps DSSS Note 1

1 Mbps DSSS

54 Mbps OFDM

MCS7

26.5

27

30.5

37.5

38.5

53

54

29

54

29

54

Note 1 Low Power Mode & CPU clock 30 MHz.

TA = +25 °C, VBAT = 3.3 V

Table 13: Current Consumption in Low Power Operation

Parameter

Condition

Min

Typ

Max

Units

5.2

Sleep 1

Note 1

6.8

Low Power

Operation

Sleep 2

Sleep 3

µA

Note 1

8.5

Note 1

Note 1 RF switch current consumption is included. VDD of RF switch is connected to VBAT_3V3 for DA16200

and typical current consumption of RF switch is 5 µA.

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4.5.2

Bluetooth^®LE Characteristics

Table 14: DC Characteristics

Parameter

Description

Conditions

Min

Typ

Max

Units

Battery supply current

0.4

mA

I_{BAT_ACTIVE}

Average battery supply

current with system in

Advertising state (3

channels) every 100ms

and extended sleep with

all RAM retained.

Average battery supply

current with system in a

connection state with

30ms connection interval

and extended sleep with

all RAM retained.

80

92

µA

I_{BAT_BLE_ADV_100ms}

I_{BAT_BLE_CONN_30ms}

Battery supply current

with system shut down

0.6

2.3

µA

I_{BAT_HIBERN}

I_{BAT_RF_RX}

Continuous Rx

Battery supply current

mA

Continuous Tx; Output

power at 2dBm

Note 1

Battery supply current

mA

I_{BAT_RF_TX_+2}

4.3

Continuous Tx; Output

power at -1dBm

Note 2

Continuous Tx; Output

power at -4dBm

Battery supply current

mA

I_{BAT_RF_TX_-1}

I_{BAT_RF_TX_-4}

3.6

2.8

Note 1 All Bluetooth applications run on DA16200, so DA16200 should be active to handle Bluetooth data

(e.g. Bluetooth Connection Request coming from a Bluetooth peer), in which case, Rx active current of

DA16200 is added to the total current consumption.

Note 2 The actual Tx output power is slightly different than the one indicated in the parameter name.

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4.6 Radiation Performance

Figure 3: TIS 3D

Figure 4: TRP 3D

4.7 ESD Ratings

Table 15: ESD Performance

Reliability Test

Standards

Test Conditions

± 2,000 V

Result

Pass

Human Body Model (HBM)

Charge Device Mode (CDM)

ANSI/ESDA/JEDEC JS-001-2017

ANSI/ESDA/JEDEC JS-002-2018

± 500 V

Pass

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5

Power-on Sequence

The sequence after the initial switching from power-off to power-on of DA16200 is shown in Figure 5.

The RTC_PWR_KEY is a pin that enables the RTC block of DA16200. Once RTC_PWR_KEY is

enabled after VBAT power is supplied, all the internal regulators are switched on automatically in the

sequence pre-defined by the RTC block.

Once RTC_PWR_KEY is switched on, LDOs for both XTAL and digital I/O are switched on shortly

and then the DC-DC regulator is switched on according to the pre-defined interval. The enabling

intervals can also be modified in the register settings after initial power-up.

VBAT

50% VBAT

T0

IO Voltage

50% IO

POWER_KEY

CLK_32K

50% VBAT

T1

T2

T3

Figure 5: Power On Sequence

Table 16: Power On Sequence Timing Requirements

Name

T0

Description

Min

Typ

Max

Unit

ms

VBAT power-on time from 10 % to 90 % of VBAT

IO voltage and VCC supply

T1

0

ms

T2

RTC_PWR_KEY turn-on time from 50 % VBAT to 50

% POWER_KEY * Note 3

5*T0

ms

T3

Internal RC oscillator wake-up time

217

µs

Note 3 If the T0 = 10 ms to switch on VBAT, the recommended T2 is 50 ms for the safe booting operation. It

would be externally controlled by MCU or it would be implemented using RC filter at the input of

RTC_PWR_KEY. The recommended C is 470 nF or 1 uF (not to exceed 1 uF) and R value is chosen to have T2

delay. For example, R and C values will be 82 kΩ and 1uF when T0 = 10 ms.

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6

Applications Schematic

6.1 Typical Application

10uF

VBAT_BLE 51

P0_10 50

VBAT_BLE

P0_10

P0_11

P0_5

P0_7

DA16600

MOD Series

P0_11

49

P0_5

P0_7

48

47

1

2

NC

P0_8 46

P0_9 45

P0_2

P0_6

P0_2

BLE_Debug /GPIO

Interface

0

3

P0_6

GND

TP

4

44

43

Note: Remove R1 and C1 when

MCU control RTC_PWR_KEY.

TEST or NC

5

6

GND

GPIOA_2 42

GPIOA_3 41

VDD_DIO1 40

R1

GPIO Interface

VDD_DIO1

7

External Power Control

RTC_PWR_KEY

TP

C1

8

9

39

38

RTC_GPO

TMS

TP

1uF

10

GND

JTAG Interface

GPIO Interface

11 TCLK

12

13 GPIOC_7

GPIOA_6 37

GPIOA_7 36

GPIOA_8 35

GPIO Interface

GPIOC_8

GPIOA_8

GPIOA_9

GPIOA_10

GPIOC_6

GPIOA_9

14

15

34

33

UART0_TX

GPIOA_10

UART Interface for debug

VDD_DIO2

16 UART0_RX

GPIOA_11 32

GPIO Interface

17 VDD_DIO2

31

30

29

18

19

1uF

4.7K

10uF

Figure 6: Typical Application

Table 17: Coexistence Connection

DA14531 part

P0_5

DA16200 part

Function

Wi-Fi_ACT

BT_ACT

GPIOA_8

GPIOA_9

GPIOA_10

P0_6

P0_7

BT_PRIO

Table 18: Component Value

Part Reference

Value

Description

Remove R1 when MCU control ‘RTC_PWR_KEY’.

This value should be chosen by customer application to achieve

the enough delay time depending on the power-on time of VBAT.

For detail information, see Section 5.

R1

470 kΩ

Remove C1 when MCU control ‘RTC_PWR_KEY’.

This value should be chosen by customer application to achieve

the enough delay time depending on the power-on time of VBAT.

Not to exceed 1uF. For detail information, see Section 5.

C1

1 uF

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7

Package Information

7.1 Dimension: DA16600MOD-AAC

Unit: millimeters (mm)

Tolerance : 14.3 (±0.2) x 24.3 (±0.2) x 3.0 (±0.1)

Figure 7: AAC Module Dimension

7.2 Dimension: DA16600MOD-AAE

Unit: millimeters (mm)

Tolerance : 14.3 (±0.2) x 24.3 (±0.2) x 3.0 (±0.1)

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Figure 8: AAE Module Dimension

7.3 PCB Land Pattern

Unit: millimeters (mm)

Figure 9: PCB Land Pattern (Top View)

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Figure 10: PCB Land Pattern (Bottom View)

Ant GND is only needed on the bottom of the PCB. GND must be removed for all layers including the

inner layer except the bottom. See Figure 11 for details.

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7.4 4-layer PCB Example

Top Layer

layer 2

layer 3

Bottom layer

Figure 11: 4-Layer PCB Example

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7.5 Soldering Information

7.5.1

Recommended Condition for Reflow Soldering

The reflow profile depends on the solder paste being used and the recommendations from the paste

manufacturer should be followed to determine the proper reflow profile.

Table 19: Typical Reflow Profile (Lead Free): J-STD-020C

Profile Feature

Lead Free SMD

Average ramp up rate (Ts_maxto T_p)

3 °C/s Max.

Preheat

●

Temperature Min (Ts_min

Temperature Max (Ts_max

Time (Ts_maxto Ts_min

)

●

150 °C

)

200 °C

)

60 to 180 seconds

Time maintained above

●

Temperature (T_L)

Time (t_L)

●

217 °C

60 to 150 seconds

Peak/Classification temperature (T_p)

Time within 5 °C of peak temperature (tp)

Ramp down rate

260 °C

20 to 40 seconds

6 °C/s Max.

8 minutes Max.

Time from 25 °C to peak temperature

Figure 12: Reflow Condition

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8

Ordering Information

The order number consists of the part number followed by a suffix that indicates the packing method.

For details and availability, please consult Dialog Semiconductor’s website at https://www.dialog-

semiconductor.com/products/da16600-modules or your local sales representative.

Table 20: Ordering Information (Samples)

Part Number

Pins

51

Size (mm)

Shipment Form

Reel

Pack Quantity

DA16600MOD-AAC4WA32

DA16600MOD-AAE4WA32

14.3 x 24.3 x 3.0

51

Reel

Table 21: Ordering Information (Production)

Part Number

Pins

51

Size (mm)

Shipment Form

Reel

Pack Quantity

DA16600MOD-AAC4WA32

DA16600MOD-AAE4WA32

14.3 x 24.3 x 3.0

500

51

Reel

Part Number Legend:

DA16600MOD-AAC4WA32

AA: Module revision number

C: Select module type

[C] Chip antenna, [E] u.FL connector

4: Flash memory

[4] 4Mbyte, [2] 2 Mbyte

W: Voltage range

[W] 3.3 V, [L] 1.8 V

A3: Package No.

2: T&R packing

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Revision History

Revision

3.0

Date

Description

23-Feb-2020

26-Oct-2020

15-July-2020

22-May-2020

29-April-2020

Official release

1.4

Modified application schematic

Added ESD performance, Table 15

Preliminary datasheet

1.3

1.2

1.1

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Status Definitions

Revision

Datasheet Status

Product Status

Definition

This datasheet contains the design specifications for product development.

Specifications may be changed in any manner without notice.

1.<n>

Target

Development

This datasheet contains the specifications and preliminary characterization

data for products in pre-production. Specifications may be changed at any

time without notice in order to improve the design.

2.<n>

3.<n>

Preliminary

Qualification

This datasheet contains the final specifications for products in volume

production. The specifications may be changed at any time in order to

improve the design, manufacturing and supply. Major specification changes

are communicated via Customer Product Notifications. Datasheet changes

are communicated via www.dialog-semiconductor.com.

Final

Production

Archived

This datasheet contains the specifications for discontinued products. The

information is provided for reference only.

4.<n>

Obsolete

Disclaimer

Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this document are not

designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications

where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury,

death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog

Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or use is at the

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warranties, express or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no

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型号：	DA16600MOD
厂家：	Dialog Semiconductor
描述：	Ultra-Low Power Wi-Fi BluetoothÂ® LE Combo Module
文件：	总26页 (文件大小：1141K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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