AP2171AFM-7 [DIODES]
Buffer/Inverter Based Peripheral Driver,;
| 型号： | AP2171AFM-7 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | Buffer/Inverter Based Peripheral Driver, 驱动 光电二极管 接口集成电路 |
| 文件： | 总18页 (文件大小：1275K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AP2161A/ AP2171A
1A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2161A and AP2171A are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and undervoltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting and
does not require any external components.
( Top View )
1
2
3
4
8
7
6
5
NC
GND
IN
OUT
OUT
FLG
IN
EN
SO-8
All devices are available in SO-8, MSOP-8EP, SOT25, and
U-DFN2018-6 packages.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Single USB Port Power Switches
Over-Current and Thermal Protection
1.5A Accurate Current Limiting
Reverse Current Blocking
95mΩ On-Resistance
Input Voltage Range: 2.7V – 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active Low (AP2161A) or Active High (AP2171A) Enable
Ambient Temperature Range: -40°C to +85°C
SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:
Available in “Green” Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
•
•
•
•
( Top View )
1
6
5
4
GND
OUT
OUT
FLG
2
3
IN
EN
Applications
U-DFN2018-6
•
•
•
Consumer Electronics – LCD TVs & Monitors, Game Machines
Communications – Set-Top-Boxes, GPS, Smartphones
Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
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© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Typical Applications Circuit
Available Options
Current Limit
(typ)
Recommended Maximum Continuous
Load Current
Part Number
Channel
Enable Pin (EN)
AP2161A
AP2171A
1
1
Active Low
Active High
1.5A
1.5A
1.0A
1.0A
Pin Descriptions
Pin Number
Pin
Name
Function
SO-8
1
MSOP-8EP
SOT25
U-DFN2018-6
GND
IN
1
2, 3
4
2
5
4
1
2
3
Ground
2, 3
4
Voltage input pin (all IN pins must be tied together externally)
Enable input, active low (AP2161A) or active high (AP2171A)
EN
Over-current and over-temperature fault report; open-drain flag is active low when
triggered
FLG
5
5
3
4
OUT
NC
6, 7
8
6, 7
8
1
5, 6
N/A
Voltage output pin (all OUT pins must be tied together externally)
No internal connection; recommend tie to OUT pins
N/A
Exposed pad.
It should be connected to GND and thermal mass for enhanced thermal
impedance. It should not be used as electrical ground conduction path.
Exposed tab
-
Exposed tab
-
Exposed tab
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Functional Block Diagram
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Human Body Model ESD Protection
Ratings
Units
ESD HBM
4
kV
Machine Model ESD Protection
for MSOP-8EP, SOT25 packages
400
V
V
ESD MM
Machine Model ESD Protection
for U-DFN2018-6, SO-8 packages
300
Input Voltage
6.5
VIN +0.3
6.5
V
V
VIN
VOUT
Output Voltage
Enable Voltage
V
VEN , VFLG
ILOAD
TJ(MAX)
TST
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Internal Limited
150
A
°C
°C
-65 to +150
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Min
Max
Units
Input Voltage
2.7
5.5
V
Output Current
0
1.0
A
°C
V
IOUT
TA
Operating Ambient Temperature
High-Level Input Voltage on EN or
Low-Level Input Voltage on EN or
-40
+85
VIH
2.0
0
VIN
0.8
EN
VIL
V
EN
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© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)
Symbol
VUVLO
ISHDN
IQ
Parameter
Test Conditions
Min
1.6
—
Typ
1.9
0.5
45
Max
2.5
1
Unit
V
Input UVLO
RLOAD = 1kΩ
Input Shutdown Current
Input Quiescent Current
Input Leakage Current
Reverse Leakage Current
uA
µA
µA
µA
Disabled, IOUT = 0
Enabled, IOUT = 0
—
70
Disabled, OUT grounded
—
—
1
ILEAK
IREV
—
1
—
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
SOT25, MSOP-8EP, SO-8
U-DFN2018-6
—
95
115
110
140
140
170
—
TA = +25°C
VIN = 5V,
IOUT = 1A
—
90
—
—
-40°C ≤ TA ≤ +85°C
TA = +25°C
Switch On-Resistance
mΩ
RDS(ON)
—
120
—
VIN = 3.3V,
IOUT = 1A
—
-40°C ≤ TA ≤ +85°C
Short-Circuit Current Limit
Over-Load Current Limit
Current Limiting Trigger Threshold
EN Input Leakage
—
1.2
1.5
A
ISHORT
ILIMIT
ITrig
Enabled into short circuit, CL = 68µF
VIN = 5V, VOUT = 4.6V, CL = 68µF, -40°C ≤ TA ≤ +85°C
Output Current Slew rate (<100A/s) , CL=68µF
VEN = 5V
1.1
1.9
A
—
—
—
—
—
—
2.0
—
—
1
A
µA
ms
ms
ms
ms
ISINK
Output Turn-On Delay Time
Output Turn-On Rise Time
Output Turn-Off Delay Time
Output Turn-Off Fall Time
0.05
0.6
—
1.5
—
0.1
tD(ON)
tR
tD(OFF)
tF
CL = 1µF, RLOAD = 10Ω
CL = 1µF, RLOAD = 10Ω
0.01
0.05
CL = 1µF, RLOAD = 10Ω
CL = 1µF, RLOAD = 10Ω
Fault Flag
RFLG
tBlank
FLG Output FET On-Resistance
FLG Blanking Time
—
4
20
7
40
15
Ω
IFLG = 10mA
ms
CIN = 10µF, CL = 68µF
Over-Temperature Protection
Thermal Shutdown Threshold
—
—
—
—
140
25
°C
TSHDN
THYS
Enabled, RLOAD = 1kΩ
-
Thermal Shutdown Hysteresis
°C
SO-8 (Note 5)
—
—
—
—
110
60
—
—
—
—
°C/W
°C/W
°C/W
°C/W
MSOP-8EP (Note 6)
SOT25 (Note 7)
U-DFN2018-6 (Note 8)
Thermal Resistance Junction-to-
Ambient
θJA
157
70
Notes:
5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
7. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
8. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer 1.0”x1.4” ground plane.
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Typical Performance Characteristics
VEN
VEN
50%
50%
50%
50%
TD(OFF)
TD(OFF)
TR
TR
TF
TF
TD(ON)
TD(ON)
90%
90%
90%
90%
VOUT
VOUT
10%
10%
10%
10%
Figure 1 Voltage Waveforms: AP2161A (left), AP2171A (right)
All Enable Plots are for AP2171A Active High
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
C
L
= 1µF
T
= +25°C
= 10Ω
A
Vout
2V/div
Vout
2V/div
R
L
C
L
= 1µF
T
= +25°C
= 10Ω
A
R
L
500µs/div
500µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
C
= 100µF
= +25°C
= 10Ω
L
T
A
Vout
2V/div
Vout
2V/div
R
L
C
= 100µF
= +25°C
= 10Ω
L
T
A
R
L
500µs/div
500µs/div
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Typical Performance Characteristics (continued)
Short Circuit Current,
Device Enabled Into Short
Inrush Current
Ven
5V/div
Ven
5V/div
CL=100µF
V
IN
= 5V
T
= +25°C
A
R
L
= 5Ω
Iout
200mA/div
V
T
= 5V
IN
CL=470µF
= +25°C
= 68µF
Iout
500mA/div
A
C
L
CL=220µF
500µs/div
1ms/div
1 Ω Load Connected to Enabled Device
2Ω Load Connected to Enabled Device
V
T
= 5V
V
= 5V
IN
IN
= +25°C
= 68µF
T
= +25°C
A
A
Vflag
2V/div
Vflag
2V/div
C
C = 68µF
L
Iout
1A/div
Iout
1A/div
2ms/div
2ms/div
Short Circuit with Blanking Time and Recovery
Power On
V
IN
= 5V
Vflag
5V/div
T
= +25°C
= 68µF
A
Vout
5V/div
C
L
Iout
500mA/di
v
Vflag
5V/div
T
= +25°C
= 68µF
= 5Ω
A
C
L
L
R
Ven
5V/div
Iout
1A/div
Vin
5V/div
20ms/div
1ms/div
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© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Typical Performance Characteristics (cont.)
UVLO Increasing
UVLO Decreasing
T
= +25°C
= 68µF
= 5Ω
A
C
L
L
Vin
2V/div
Vin
2V/div
R
T
= +25°C
= 68µF
= 5Ω
A
C
L
L
R
Iout
500mA/div
Iout
500mA/div
1ms/div
10ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
750
700
650
600
550
500
450
400
350
300
30
29
29
28
28
27
27
26
26
C
R
= 1µF
L
= 10Ω
L
T
= +25°C
A
C
R
= 1µF
L
= 10Ω
= +25°C
L
T
A
25
250
1.5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Rise Time vs Input Voltage
Fall Time vs Input Voltage
22
22
21
21
20
20
650
600
550
500
450
400
350
300
C
= 1µF
C
R
T
= 1µF
L
L
R
T
= 10Ω
= +25°C
= 10Ω
= +25°C
L
L
A
A
19
2
250
2
2.5
3
3.5
4
4.5
5
5.5
6
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Typical Performance Characteristics (cont.)
Supply Current, Output Enabled vs Ambient Temperature
Supply Current, Output Disabled vs Ambient Temperature
68
Vin=5.5V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
63
Vin=3.3V
Vin=5.0V
Vin=5.0V
58
Vin=5.5V
53
48
43
38
33
Vin=3.3V
40
Vin=2.7V
60
Vin=2.7V
-20 0
Ambient Temperature (°C)
28
-60
-40
20
40
60
80
100
-60
-40
-20
0
20
80
100
Ambient Temperature (°C)
Static Drain-Source On-State Resistance vs Ambient
Temperature
Short-Circuit Output Current vs Ambient Temperature
1.56
1.55
1.54
1.53
1.52
1.51
1.50
1.49
1.48
1.47
1.46
1.45
C =100µF
L
170
Vin=2.7V
Vin=3.3V
160
150
140
130
120
110
100
90
Vin=2.7V
Vin=5.0V
Vin=3.3V
Vin=5V
Vin=5.5V
80
80
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
0
20
40
60
100
Ambient Temperature (°C)
Ambient Temperature (°C)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
1.99
1.98
1.97
1.96
1.95
1.94
1.93
1.92
1.91
1.90
1.89
1.88
2.20
2.10
2.00
1.90
1.80
1.70
1.60
UVLO Rising
T
= +25°C
A
C
= 68µF
UVLO Falling
L
2.8
3.3
3.8
4.3
4.8
5.3
-60
-40
-20
0
20
40
60
80
100
Input Voltage (V)
Ambient Temperature (°C)
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Typical Performance Characteristics (cont.)
Current Limit Response vs Peak Current
120
100
80
V
= 5V
IN
60
40
20
0
T
= +25°C
A
0
2
4
6
8
10
12
Peak Current (A)
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Application Information
Power Supply Considerations
A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves
the immunity of the device to short-circuit transients.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2161A/AP2171A senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2161A/AP2171A is capable of delivering current
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and is set at ILIMIT
.
Note that when the output has been shorted to GND at an extremely low temperature (< -30°C), a minimum 120-µF electrolytic capacitor on the
output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum
electrolytic capacitor type is Panasonic FC series.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2161A/AP2171A is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient Temperature °C
RθJA = Thermal Resistance
PD = Total Power Dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2161A/AP2171A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 145°C due to excessive power dissipation in an over-current or short-circuit condition, the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing
the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Application Information (continued)
Undervoltage Lockout (UVLO)
The undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,
even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered And Bus-Powered HUBs
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power
supply must provide from 5.25V to 4.75V to the board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs
are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors,
printers, and stand-alone hubs.
Figure 2 Typical One-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2161A/AP2171A, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2161A/AP2171A also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2161A/AP2171A between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
system surge current and provides a hot-plugging mechanism for any device.
Dual-Purpose Port Applications
AP2161A/AP2171A is suitable for use in dual-purpose port applications in which a single port is used for data communication between the host and
peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of this is a shared HDMI/MHL
(Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a
charge to the smartphone or tablet battery. In such dual-purpose port applications, it is important to insure Vin of the AP2161A/AP2171A is ramped
to its operating voltage prior to enabling the output.
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AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Ordering Information
7”/13” Tape and Reel
Part Number
Package Code
Packaging
Quantity
Part Number Suffix
AP21X1AW-7
AP21X1AS-13
AP21X1AMP-13
AP21X1AFM-7
W
S
SOT25
SO-8
3,000/Tape & Reel
2,500/Tape & Reel
2,500/Tape & Reel
3,000/Tape & Reel
-7
-13
-13
-7
MP
FM
MSOP-8EP
U-DFN2018-6
Marking Information
(1) SO-8
(2) MSOP-8EP
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March 2015
© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Marking Information (continued)
(3) SOT25
( Top View )
5
4
XX : Identification code
Y : Year 0~9
W X
XX Y
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
1
2
3
Device
Package type
SOT25
Identification Code
AP2161AW
AP2171AW
VV
SOT25
VW
(4) U-DFN2018-6
Device
Package type
U-DFN2018-6
U-DFN2018-6
Identification Code
AP2161AFM
AP2171AFM
ZV
ZW
13 of 18
www.diodes.com
March 2015
© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package Type: SO-8
SO-8
Dim
A
Min
-
Max
1.75
0.20
1.50
0.25
0.5
E1
E
Gauge Plane
Seating Plane
A1
A1
A2
A3
b
0.10
1.30
0.15
0.3
L
Detail ‘A’
D
4.85
5.90
3.85
4.95
6.10
3.95
7°~9°
h
°
45
E
E1
e
Detail ‘A’
A2
A3
A
1.27 Typ
h
-
0.35
0.82
8°
b
e
L
0.62
0°
D
θ
All Dimensions in mm
(2) Package Type: MSOP-8EP
D
MSOP-8EP
Dim Min Max Typ
A
A1
A2
A3
b
-
1.10
-
0.05 0.15 0.10
0.75 0.95 0.86
0.29 0.49 0.39
0.22 0.38 0.30
0.08 0.23 0.15
2.90 3.10 3.00
1.60 2.00 1.80
4.70 5.10 4.90
2.90 3.10 3.00
1.30 1.70 1.50
2.85 3.05 2.95
D1
x
E
E2
Gauge Plane
Seating Plane
c
D
y
L
D1
E
E1
E2
E3
e
L
a
x
1
8Xb
e
Detail C
E3
E1
A1
A3
c
A2
A
-
-
0.65
0.40 0.80 0.60
D
0°
-
-
8°
-
-
4°
0.750
0.750
See Detail C
y
All Dimensions in mm
14 of 18
www.diodes.com
March 2015
© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Package Outline Dimensions (continued) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(3) Package Type: SOT25
A
SOT25
Dim Min Max Typ
A
B
C
D
H
J
K
L
M
N
α
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
0.95
B C
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
0.70 0.80 0.75
H
K
M
N
J
0°
8°
L
D
All Dimensions in mm
(4) Package Type: U-DFN2018-6
A3
A
U-DFN2018-6
Dim Min Max Typ
SEATING PLANE
A
A1
A3
b
0.545 0.605 0.575
0
A1
0.05 0.02
0.13
Pin#1 ID
D
D2
0.15 0.25 0.20
1.750 1.875 1.80
D2 1.30 1.50 1.40
D
L
e
0.50
1.95 2.075 2.00
E
E2 0.90 1.10 1.00
E2
E
L
z
0.20 0.30 0.25
0.30
z
All Dimensions in mm
b
e
15 of 18
www.diodes.com
March 2015
© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.55
5.4
C1
1.27
C2
Y
(2) Package Type: MSOP-8EP
X
C
Y
G
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
Dimensions
C
G
X
X1
Y
Y1
Y2
Y2
Y1
X1
(3) Package Type: SOT25
C2
C2
Dimensions Value (in mm)
Z
G
3.20
1.60
0.55
0.80
2.40
C1
G
Z
X
Y
C1
C2
Y
0.95
X
16 of 18
www.diodes.com
March 2015
© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
Suggested Pad Layout (continued)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) Package Type: U-DFN2018-6
X
C
Y
Dimensions
Value (in mm)
C
G
0.50
0.20
0.25
1.60
0.35
1.20
X
Y1
X1
Y
Y1
G
X1
Taping Orientation (Note 9)
For U-DFN2018-6
Notes: 9. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.
17 of 18
www.diodes.com
March 2015
© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
AP2161A/ AP2171A
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
18 of 18
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March 2015
© Diodes Incorporated
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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