AP2182MPG-13 [DIODES]

Buffer/Inverter Based Peripheral Driver, 2 Driver, 1.5A, PDSO8, MSOP-8;
AP2182MPG-13
型号: AP2182MPG-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Buffer/Inverter Based Peripheral Driver, 2 Driver, 1.5A, PDSO8, MSOP-8

驱动 光电二极管 接口集成电路 驱动器
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AP2182/ AP2192  
1.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH  
Description  
Pin Assignments  
The AP2182 and AP2192 are integrated high-side power switches  
optimized for Universal Serial Bus (USB) and other hot-swap  
applications. The family of devices complies with USB 2.0 and is  
available with both polarities of Enable input. They offer current and  
thermal limiting and short circuit protection as well as controlled rise  
time and under-voltage lockout functionality. A 7ms deglitch capability  
on the open-drain Flag output prevents false over-current reporting  
and does not require any external components.  
( Top View )  
1
2
3
4
8
7
6
5
GND  
IN  
FLG1  
OUT1  
OUT2  
EN1  
EN2  
FLG2  
SO-8  
All devices are available in SO-8 and MSOP-8EP packages.  
( Top View )  
Features  
1
2
8
7
6
FLG1  
OUT1  
OUT2  
FLG2  
GND  
Dual USB Port Power Switches  
IN  
EN1  
EN2  
Over-Current and Thermal Protection  
2.1A Accurate Current Limiting  
3
4
5
Reverse Current Blocking  
115mOn-Resistance  
MSOP-8EP  
Input Voltage Range: 2.7V - 5.5V  
0.6ms Typical Rise Time  
Very Low Shutdown Current: 1µA (Max)  
Fault Report (FLG) with Blanking Time (7ms typ)  
ESD Protection: 3KV HBM, 300V MM  
Active High (AP2192) or Active Low (AP2182) Enable  
Ambient Temperature Range -40°C to +85°C  
SO-8 and MSOP-8EP (Exposed Pad): Available in Green‖  
Molding Compound (No Br, Sb)  
Applications  
Consumer Electronics LCD TVs & Monitors, Game Machines  
Communications Set-Top-Boxes, GPS Systems, Smartphones  
Computing Laptops, Desktops, Servers, Printers, Docking  
Stations, HUBs  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
UL Recognized, File Number E322375  
IEC60950-1 CB Scheme Certified  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Typical Applications Circuit  
AP2192 Enable Active High  
Power Supply  
2.7V to 5.5V  
Load  
Load  
IN  
OUT1  
OUT2  
0.1mF  
0.1mF  
68mF  
68mF  
0.1mF  
10k  
10mF  
10k  
FLG1  
FLG2  
ON  
EN1  
EN2  
GND  
OFF  
1 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Available Options  
Part Number  
Enable Pin  
(EN)  
Current Limit  
(typ)  
Recommended Maximum  
Continuous Load Current  
Channel  
AP2182  
AP2192  
2
2
Active Low  
Active High  
2.1A  
2.1A  
1.5A  
1.5A  
Pin Descriptions  
Pin Number  
Pin  
Name  
Function  
SO-8  
MSOP-8EP  
GND  
IN  
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Ground  
Voltage input pin  
EN1  
Switch 1 enable input, active low (AP2182) or active high (AP2192)  
Switch 2 enable input, active low (AP2182) or active high (AP2192)  
EN2  
FLG2  
OUT2  
OUT1  
FLG1  
Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered  
Switch 2 voltage output pin  
Switch 1 voltage output pin  
Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered  
Exposed pad.  
Exposed Tab  
Exposed Tab It should be connected to GND and thermal mass for enhanced thermal impedance.  
It should not be used as electrical ground conduction path.  
Functional Block Diagram  
FLG1  
Thermal  
Sense  
AP2182, AP2192  
Deglitch  
Current  
Limit  
EN1  
Driver  
GND  
UVLO  
Current  
Sense  
OUT1  
IN  
Current  
Sense  
OUT2  
FLG2  
UVLO  
Current  
Limit  
Driver  
EN2  
Deglitch  
Thermal  
Sense  
GND  
2 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Symbol  
ESD HBM  
ESD MM  
VIN  
Parameter  
Human Body Model ESD Protection  
Machine Model ESD Protection  
Input Voltage  
Rating  
3
Unit  
kV  
V
300  
6.5  
V
Output Voltage  
V
VOUT  
VIN +0.3  
6.5  
Enable Voltage  
V
VEN , VFLG  
ILOAD  
TJ(MAX)  
TST  
Maximum Continuous Load Current  
Maximum Junction Temperature  
Storage Temperature Range (Note 4)  
Internal Limited  
+150  
A
°C  
°C  
-65 to +150  
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;  
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be  
affected by exposure to absolute maximum rating conditions for extended periods of time.  
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling  
and transporting these devices.  
Note:  
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).  
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)  
Symbol  
VIN  
Parameter  
Min  
2.7  
0
Max  
5.5  
Unit  
V
Input Voltage  
Output Current  
1.5  
A
IOUT  
VIL  
EN Input Logic Low Voltage  
0
0.8  
V
EN Input Logic High Voltage  
2
V
VIH  
VIN  
+85  
Operating Ambient Temperature  
-40  
°C  
TA  
3 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)  
Symbol  
VUVLO  
ISHDN  
IQ  
Parameter  
Test Conditions  
Min  
Typ  
1.9  
0.5  
100  
-
Max Unit  
Input UVLO  
1.6  
2.5  
1
V
µA  
µA  
µA  
µA  
mΩ  
mΩ  
mΩ  
A
RLOAD = 1kΩ  
Input Shutdown Current  
Input Quiescent Current, Dual  
Input Leakage Current  
-
-
Disabled, IOUT = 0  
Enabled, IOUT = 0  
160  
1
Disabled, OUT Grounded  
-
ILEAK  
IREV  
Reverse Leakage Current  
-
1
-
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN  
-
115  
120  
140  
2.0  
2.1  
3.0  
-
150  
160  
180  
-
MSOP-8EP, -40°C ≤ TA ≤ +85°C  
SO-8, -40°C ≤ TA ≤ +85°C  
VIN = 5V,  
IOUT = 0.5A,  
Switch On-Resistance  
-
RDS(ON)  
-
VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA +85°C  
Enabled into short circuit, CL = 68µF  
VIN = 5V, VOUT = 4.5V, CL = 68µF, -40°C ≤ TA ≤ +85°C  
VIN = VEN, Output Current Slew Rate (<100A/WS), CL = 68µF  
VIN = 2.7V to 5.5V  
Short-Circuit Current Limit  
Over-Load Current Limit  
-
ISHORT  
ILIMIT  
ITRIG  
VIL  
1.6  
-
2.6  
-
A
Current Limiting Trigger Threshold  
EN Input Logic Low Voltage  
EN Input Logic High Voltage  
EN Input Leakage  
A
-
0.8  
-
V
2
-
-
V
VIH  
VIN = 2.7V to 5.5V  
-
1
µA  
ms  
ms  
ms  
ms  
Ω
ISINK  
TD(ON)  
TR  
VEN = 5V  
Output Turn-On Delay Time  
Output Turn-On Rise Time  
Output Turn-Off Delay Time  
Output Turn-Off Fall Time  
FLG Output FET On-Resistance  
FLG Blanking Time  
-
0.05  
0.6  
0.01  
0.05  
30  
-
CL=1µF, RLOAD = 10Ω  
-
1.5  
-
CL=1µF, RLOAD = 10Ω  
-
TD(OFF)  
TF  
CL=1µF, RLOAD = 10Ω  
-
0.1  
50  
CL=1µF, RLOAD = 10Ω  
-
RFLG  
TBLANK  
TSHDN  
THYS  
IFLG =10mA  
4
-
7
15  
-
ms  
CIN =10µF, CL = 68µF  
Enabled, RLOAD = 1kΩ  
-
Thermal Shutdown Threshold  
Thermal Shutdown Hysteresis  
+140  
+25  
110  
60  
C  
C  
-
-
SO-8 (Note 5)  
-
-
°C/W  
°C/W  
Thermal Resistance Junction-to-Ambient  
θJA  
MSOP-8EP (Note 6)  
-
-
Notes:  
5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.  
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom  
layer ground plane.  
4 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Typical Performance Characteristics  
VEN  
VEN  
50%  
50%  
50%  
50%  
TD(OFF)  
TD(OFF)  
CL= 1µF  
TA = +25°C  
RL = 5Ω  
TR  
TR  
TF  
TF  
TD(ON)  
TD(ON)  
90%  
90%  
90%  
90%  
10%  
VOUT  
VOUT  
10%  
10%  
10%  
Figure 1 Voltage Waveforms: AP2182 (Left), AP2192 (Right)  
All Enable Plots are for AP2192 Active High  
Channel 1 Turn-On Delay and Rise Time  
Channel 1 Turn-Off Delay and Fall Time  
VEN  
1
VEN  
1
5V/div  
5V/div  
CL= 1µF  
TA = +25°C  
VOUT  
1
2V/div  
RL = 5Ω  
VOUT  
2V/div  
1
C
= 1µF  
= +25°C  
= 5Ω  
L
T
A
R
L
400µs/div  
400µs/div  
Channel 2 Turn-On Delay and Rise Time  
Channel 2 Turn-Off Delay and Fall Time  
VEN  
2
VEN  
2
5V/div  
5V/div  
CL= 1µF  
TA = +25°C  
RL = 5Ω  
VOUT  
2V/div  
2
VOUT  
2V/div  
2
CL= 1µF  
TA = +25°C  
RL = 5Ω  
400µs/div  
400µs/div  
5 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Typical Performance Characteristics (Cont.)  
Channel 1 Turn-On Delay and Rise Time  
Channel 1 Turn-Off Delay and Fall Time  
VEN  
1
VEN  
2
5V/div  
5V/div  
CL = 100µF  
TA = +25°C  
RL = 5Ω  
VOUT  
1
VOUT  
2
2V/div  
2V/div  
CL = 100µF  
TA = +25°C  
RL = 5Ω  
400µs/div  
400µs/div  
Channel 2 Turn-On Delay and Rise Time  
Channel 2 Turn-Off Delay and Fall Time  
VEN  
2
VEN  
2
5V/div  
5V/div  
CL = 100µF  
TA = +25°C  
RL = 5Ω  
VOUT  
2
VOUT  
2
2V/div  
2V/div  
CL = 100µF  
TA = +25°C  
RL = 5Ω  
400µs/div  
400µs/div  
Channel 1 Short Circuit Current,  
Device Enabled Into Short  
Channel 2 Short Circuit Current,  
Device Enabled Into Short  
VEN  
1
VEN  
2
5V/div  
5V/div  
IOUT  
500mA/div  
1
IOUT  
500mA/div  
2
VIN = 5V  
VIN = 5V  
TA = 25°C  
CL = 68µF  
TA = +25°C  
CL = 68µF  
500µs/div  
500µs/div  
6 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Typical Performance Characteristics (Cont.)  
Channel 1 Inrush Current  
Channel 2 Inrush Current  
VEN  
1
VEN  
2
5V/div  
5V/div  
CL=470µF  
CL=470µF  
VIN = 5V  
CL=100µF  
CL=100µF  
VIN = 5V  
TA = +25°C  
RL = 3.3Ω  
TA = +25°C  
RL = 3.3Ω  
IOUT  
500mA/div  
1
IOUT  
500mA/div  
2
CL=220µF  
CL=220µF  
1ms/div  
Channel 1  
1ms/div  
Channel 2  
0.6 Ω Load Connected to Enabled Device  
0.6 Ω Load Connected to Enabled Device  
VIN = 5V  
VIN = 5V  
TA = +25°C  
CL = 68µF  
TA = +25°C  
CL = 68µF  
VFLAG  
1
VFLAG  
2
2V/div  
2V/div  
IOUT  
1
IOUT  
2
1A/div  
1A/div  
2ms/div  
2ms/div  
Channel 1  
Channel 2  
Short Circuit with Blanking Time and Recovery  
Short Circuit with Blanking Time and Recovery  
VOUT  
5V/div  
1
VOUT  
5V/div  
2
VIN = 5V  
TA = +25°C  
CL = 68µF  
VIN = 5V  
TA = +25°C  
CL = 68µF  
VFLAG  
1
VFLAG 2  
5V/div  
5V/div  
IOUT  
1
IOUT  
2
2A/div  
2A/div  
20ms/div  
20ms/div  
7 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Typical Performance Characteristics (Cont.)  
Channel 1 Power On  
Channel 2 Power On  
VFLAG  
1
VFLAG  
2
5V/div  
5V/div  
TA = +25°C  
CL = 68µF  
RL = 3Ω  
TA = +25°C  
CL = 68µF  
RL = 3Ω  
IOUT  
1
IOUT  
2
500mA/div  
500mA/div  
VEN  
1
VEN 2  
5V/div  
5V/div  
VIN  
VIN  
5V/div  
5V/div  
1ms/div  
1ms/div  
Channel 1 UVLO Increasing  
Channel 1 UVLO Decreasing  
TA = +25°C  
CL = 68µF  
RL = 3Ω  
VIN  
2V/div  
VIN  
2V/div  
TA = +25°C  
CL = 68µF  
RL = 3Ω  
IOUT  
500mA/div  
1
IOUT  
500mA/div  
1
10ms/div  
1ms/div  
Channel 2 UVLO Increasing  
Channel 2 UVLO Decreasing  
TA = +25°C  
CL = 68µF  
RL = 3Ω  
VIN  
2V/div  
VIN  
2V/div  
TA = +25°C  
CL = 68µF  
RL = 3Ω  
I IOUT  
500mA/div  
IOUT  
500mA/div  
1ms/div  
10ms/div  
8 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Typical Performance Characteristics (Cont.)  
Channel 1 Enabled and Shorted with Channel 2 Disabled  
Channel 1 Disabled and Channel 2 Enabled  
VOUT  
1
5V/div  
VEN  
1
5V/div  
VOUT  
2
VOUT 1  
5V/div  
5V/div  
VFLAG  
5V/div  
1
VEN  
5V/div  
2
TA = +25°C  
CL = 68µF  
TA = +25°C  
CL = 68µF  
IOUT  
2
VOUT  
2
500mA/div  
5V/div  
100ms/div  
50ms/div  
Turn-On Time vs. Input Voltage  
Turn-Off Time vs. Input Voltage  
850  
750  
650  
550  
450  
350  
55  
50  
45  
40  
35  
30  
25  
CL = 1µF  
RL = 10Ω  
TA = +25°C  
CL = 1µF  
RL = 10Ω  
TA = +25°C  
250  
1.5  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Input Voltage (V)  
Input Voltage (V)  
Rise Time vs. Input Voltage  
Fall Time vs. Input Voltage  
650  
600  
550  
500  
450  
400  
350  
25  
24  
23  
22  
21  
20  
19  
CL = 1µF  
RL = 10Ω  
TA = +25°C  
CL = 1µF  
RL = 10Ω  
TA = +25°C  
300  
2
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Input Voltage (V)  
Input Voltage (V)  
9 of 17  
www.diodes.com  
May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Typical Performance Characteristics (Cont.)  
Supply Current, Output Enabled vs. Ambient Temperature  
Supply Current, Output Disabled vs. Ambient Temperature  
52  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
VIN =5.5V  
VIN=5.0V  
VIN =5.0V  
47  
VIN=5.5V  
42  
VIN =3.3V  
37  
VIN=2.7V  
32  
VIN=3.3V  
VIN =2.7V  
27  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
-60  
-40  
-20  
0
20  
40  
60  
80  
80  
80  
100  
100  
100  
Ambient Temperature (°C)  
Ambient Temperature (°C)  
Static Drain-Source On-State Resistance vs. Ambient  
Temperature  
Short-Circuit Output Current vs. Ambient Temperature  
2.60  
2.50  
2.40  
2.30  
2.20  
2.10  
2.00  
180  
CL=100µF  
VIN =2.7V  
170  
160  
150  
140  
130  
120  
110  
100  
90  
VIN=5.0V  
VIN=3.3V  
VIN=2.7V  
VIN =3.3V  
VIN =5V  
VIN=5.5V  
80 100  
80  
-60  
-40  
-20  
0
20  
40  
60  
-60  
-40  
-20  
0
20  
40  
60  
Ambient Temperature (°C)  
Ambient Temperature (°C)  
Undervoltage Lockout vs. Ambient Temperature  
Threshold Trip Current vs. Input Voltage  
2.15  
3.24  
3.22  
3.20  
3.18  
3.16  
3.14  
3.12  
3.10  
3.08  
2.10  
2.05  
2.00  
1.95  
1.90  
UVLO Rising  
TA = +25°C  
CL = 68µF  
UVLO Falling  
2.8  
3.3  
3.8  
4.3  
4.8  
5.3  
-60  
-40  
-20  
0
20  
40  
60  
Input Voltage (V)  
Ambient Temperature (°C)  
10 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Typical Performance Characteristics (Cont.)  
Current Limit Response vs. Peak Current  
45  
40  
35  
30  
25  
20  
15  
10  
5
VIN = 5V  
TA = +25°C  
CL = 68µF,  
0
0
2
4
6
8
10  
12  
Peak Current (A)  
11 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Application Information  
Power Supply Considerations  
A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value  
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply  
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity  
of the device to short-circuit transients.  
Over-Current and Short Circuit Protection  
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series  
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output  
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.  
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN  
has been applied. The AP2182/AP2192 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT  
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may  
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current  
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT  
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the  
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2182/AP2192 is capable of delivering current up  
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode  
and is set at ILIMIT  
.
FLG Response  
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms  
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive  
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.  
The AP2182/AP2192 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.  
Power Dissipation and Junction Temperature  
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating  
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:  
PD = RDS(ON)× I2  
Finally, calculate the junction temperature:  
TJ = PD x RJA + TA  
Where:  
TA = Ambient Temperature C  
RJA = Thermal Resistance  
PD = Total Power Dissipation  
Thermal Protection  
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The  
AP2182/AP2192 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die  
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense  
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the  
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input  
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.  
12 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Application Information (Cont.)  
Under-Voltage Lockout (UVLO)  
The Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,  
even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the  
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.  
Host/Self-Powered HUBs  
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This  
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts  
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop  
PCs, monitors, printers, and stand-alone hubs.  
Downstream  
USB Ports  
Power Supply  
3.3V 5V  
D+  
AP2182  
OUT1  
D-  
2
7
6
IN  
VBUS  
68mF  
68mF  
0.1mF  
0.1mF  
0.1mF  
GND  
8
3
5
4
FLG1  
EN1  
D+  
USB  
Controller  
D-  
FLG2  
EN2  
OUT2  
VBUS  
GND  
1
GND  
Figure 2 Typical Two-Port USB Host / Self-Powered Hub  
Generic Hot-Plug Applications  
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug  
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most  
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a  
power supply normally turns on. Due to the controlled rise times and fall times of the AP2182/AP2192, these devices can be used to provide a  
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2182/AP2192 also ensures that the switch is off  
after the card has been removed, and that the switch is off during the next insertion.  
By placing the AP2182/AP2192 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The  
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system  
surge current and provides a hot-plugging mechanism for any device.  
13 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Ordering Information  
13” Tape and Reel  
Part Number  
Package Code  
Packaging  
Quantity  
Part Number Suffix  
AP21X2SG-13  
S
SO-8  
2,500/Tape & Reel  
2,500/Tape & Reel  
-13  
-13  
AP21X2MPG-13  
MP  
MSOP-8EP  
Marking Information  
(1) SO-8  
( Top view )  
8
7
6
5
4
Logo  
2 : 2 Channel  
G : Green  
YY : Year : 08, 09,10~  
WW : Week : 01~52; 52  
represents 52 and 53 week  
X : Internal Code  
Part Number  
8 : Active Low  
9 : Active High  
AP21X X  
YY WW X X  
2
3
1
(2) MSOP-8EP  
( Top view )  
8
1
7
6
5
A~Z : Green  
MSOP-8EP  
Y : Year : 0~9  
W : Week : A~Z : 1~26 week;  
a~z : 27~52 week; z represents  
52 and 53 week  
Logo  
Y W X E  
Part Number  
8 : Active Low  
9 : Active High  
AP21X X  
2 : 2 Channel  
2
3
4
14 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Package Outline Dimensions (All dimensions in mm.)  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
(1) Package type: SO-8  
SO-8  
Min  
-
0.10  
1.30  
0.15  
0.3  
Dim  
A
A1  
A2  
A3  
b
Max  
1.75  
0.20  
1.50  
0.25  
0.5  
D
E
E1  
e
4.85  
5.90  
3.85  
4.95  
6.10  
3.95  
1.27 Typ  
h
L
  
-
0.35  
0.82  
8  
0.62  
0  
All Dimensions in mm  
(2) Package type: MSOP-8EP  
MSOP-8EP  
Dim Min Max Typ  
D
A
A1  
A2  
A3  
b
-
1.10  
-
0.05 0.15 0.10  
0.75 0.95 0.86  
0.29 0.49 0.39  
0.22 0.38 0.30  
0.08 0.23 0.15  
2.90 3.10 3.00  
1.60 2.00 1.80  
4.70 5.10 4.90  
2.90 3.10 3.00  
1.30 1.70 1.50  
2.85 3.05 2.95  
D1  
x
E
E2  
Gauge Plane  
Seating Plane  
c
D
y
D1  
E
E1  
E2  
E3  
e
L
a
x
y
a
L
1
8Xb  
e
Detail C  
E3  
E1  
A1  
A3  
c
-
-
0.65  
A2  
A
0.40 0.80 0.60  
0°  
-
8°  
-
-
4°  
0.750  
0.750  
D
-
See Detail C  
All Dimensions in mm  
15 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
(1) Package type: SO-8  
X
Dimensions Value (in mm)  
X
Y
C1  
C2  
0.60  
1.55  
5.4  
C1  
1.27  
C2  
Y
(2) Package type: MSOP-8EP  
X
C
Y
Value  
(in mm)  
0.650  
0.450  
0.450  
2.000  
1.350  
1.700  
5.300  
G
Dimensions  
C
G
X
X1  
Y
Y1  
Y2  
Y2  
Y1  
X1  
16 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  
AP2182/ AP2192  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2016, Diodes Incorporated  
www.diodes.com  
17 of 17  
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May 2016  
© Diodes Incorporated  
AP2182/AP2192  
Document number: DS31569 Rev. 10 - 2  

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