AP2411AS-13 [DIODES]

Buffer/Inverter Based Peripheral Driver,;
AP2411AS-13
型号: AP2411AS-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Buffer/Inverter Based Peripheral Driver,

驱动 接口集成电路
文件: 总18页 (文件大小:481K)
中文:  中文翻译
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AP2401A/AP2411A  
Green  
2.0A SINGLE CHANNEL CURRENT-LIMITED  
POWER SWITCH WITH LATCH-OFF  
Description  
Pin Assignments  
The AP2401A and AP2411A are single-channel, current-limited,  
integrated high-side power switches optimized for Universal Serial  
Bus (USB) and other hot-swap applications. The family of devices  
complies with USB standards and is available with both polarities of  
enable input.  
(Top View)  
GND  
IN  
1
2
3
4
8
7
6
5
NC  
OUT  
OUT  
IN  
The devices have fast short-circuit response time for improved overall  
system robustness, and have integrated output discharge function to  
ensure completely controlled discharging of the output voltage  
capacitor. They provide a complete protection solution for applications  
subject to heavy capacitive loads and the prospect of short circuit,  
and offer reverse current blocking, overcurrent, over-temperature and  
short-circuit protection, as well as controlled rise time and  
undervoltage lockout functionality. A 7ms deglitch capability on the  
open-drain Flag output prevents false overcurrent reporting and does  
not require any external components. AP2401A and AP2411A will be  
latched off after a 7ms deglitch.  
EN  
FLG  
SO-8  
(Top View)  
1
8
NC  
GND  
IN  
2
3
4
7
6
5
OUT  
OUT  
FLG  
IN  
EN  
MSOP-8/MSOP-8EP  
Note: Latter with exposed pad  
(dotted line)  
All devices are available in SO-8, MSOP-8, MSOP-8EP,  
U-DFN3030-8 and U-DFN2020-6 packages.  
(Top View)  
1
8
NC  
GND  
IN  
Features  
2
3
4
7
6
5
OUT  
OUT  
FLG  
Single Channel Current-Limited Power Switch  
Output Discharge Function  
IN  
EN  
Output Current Latch-Off when OCP Triggered  
Fast Short-Circuit Response Time: 2µs  
2.5A Accurate Current Limiting  
U-DFN3030-8  
Reverse Current Blocking  
70mOn-Resistance  
Input Voltage Range: 2.7V - 5.5V  
Built-In Soft-Start with 0.6ms Typical Rise Time  
Overcurrent and Thermal Protection  
Fault Report (FLG) with Blanking Time (7ms typ)  
ESD Protection: 2kV HBM, 200V MM  
U-DFN2020-6  
Active Low (AP2401A) or Active High (AP2411A) Enable  
Ambient Temperature Range: -40°C to +85°C  
SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:  
Available in “Green” Molding Compound (No Br, Sb)  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
UL Recognized, File Number E322375  
IEC60950-1 CB Scheme Certified  
Applications  
LCD TVs & Monitors  
Set-Top-Boxes, Residential Gateways  
Laptops, Desktops, Servers, E-Readers  
Printers, Docking Stations, HUBs  
Notes:  
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
1 of 18  
www.diodes.com  
March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Typical Applications Circuit  
Enable Active High  
IN  
Load  
Power Supply  
2.7V to 5.5V  
OUT  
0.1uF  
0.1uF  
10k  
120uF  
FLG  
EN  
GND  
ON  
OFF  
Available Options  
Recommended Maximum  
Continuous Load Current  
(A)  
Typical Output Latch-Off  
Current Limit  
(A)  
Enable Pin  
Part  
Number  
Channel  
Package  
(EN)  
SO-8  
AP2401A  
1
1
Active Low  
MSOP-8  
2
2.5  
MSOP-8EP  
U-DFN3030-8  
U-DFN2020-6  
AP2411A  
Active High  
Pin Descriptions  
Pin Number  
MSOP-8EP,  
MSOP-8 U-DFN3030-8  
Pin Name  
SO-8,  
Function  
U-DFN2020-6  
GND  
IN  
1
2, 3  
4
1
2, 3  
4
2
1
Ground  
Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to GND as close  
as possible. (all IN pins must be tied together externally)  
EN  
3
4
Enable Input. Active low (AP2401A) or active high (AP2411A).  
Over-temperature and overcurrent fault reporting with 7ms deglitch; active low open-drain  
output. FLG is disabled for 7ms after turn-on.  
FLG  
5
5
OUT  
NC  
6, 7  
8
6, 7  
8
5
6
Voltage Output Pin (all OUT pins must be tied together externally)  
No Internal Connection. Recommend tie to OUT pins.  
Exposed pad. It should be externally connected to GND plane and thermal mass for  
enhanced thermal impedance. Exposed pad should not be used as electrical ground  
conduction path.  
Exposed Pad  
Exposed Pad  
Exposed Pad  
2 of 18  
www.diodes.com  
March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Functional Block Diagram  
Current  
Sense  
IN  
OUT  
Discharge  
Control  
UVLO  
Current  
Limit  
Driver  
EN  
FLG  
Deglitch  
Thermal  
Sense  
GND  
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Symbol  
ESD HBM  
ESD MM  
VIN  
Parameter  
Human Body Model ESD Protection  
Machine Model ESD Protection  
Input Voltage (Note 4)  
Ratings  
4
Unit  
kV  
V
300  
-0.3 to 6.5  
V
Output Voltage (Note 4)  
V
VOUT  
-0.3 to VIN +0.3 or 6.5  
-0.3 to VIN +0.3 or 6.5  
Internal Limited  
150  
Enable Voltage (Note 4)  
V
VEN , VFLG  
ILOAD  
TJ(MAX)  
TST  
Maximum Continuous Load Current  
Maximum Junction Temperature  
Storage Temperature Range (Note 4)  
A
°C  
°C  
-65 to +150  
Notes:  
4. All voltages referred to GND pin. Maximums are the lower of V + 0.3 and 6.5V.  
IN  
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified T from -65°C to +150°C).  
ST  
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings  
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may  
be affected by exposure to absolute maximum rating conditions for extended periods of time.  
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling  
and transporting these devices.  
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)  
Symbol  
VIN  
Parameter  
Min  
2.7  
0
Max  
5.5  
2
Unit  
V
Input Voltage  
Output Current  
A
IOUT  
VIL  
EN Input Logic Low Voltage  
EN Input Logic High Voltage  
Operating Ambient Temperature  
0
0.8  
VIN  
+85  
V
2
V
VIH  
-40  
°C  
TA  
3 of 18  
www.diodes.com  
March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, CIN = 0.1µF, CL= 1µF, unless otherwise specified.)  
Symbol  
VUVLO  
VUVLO  
ISHDN  
IQ  
Parameter  
Test Conditions (Note 5)  
Min  
Typ  
2.0  
50  
0.1  
60  
0.1  
0.01  
70  
-
Max  
2.4  
-
Unit  
V
Input UVLO  
1.6  
VIN rising  
Input UVLO Hysteresis  
Input Shutdown Current  
Input Quiescent Current  
Input Leakage Current  
Reverse Leakage Current  
-
-
-
-
-
-
-
-
-
mV  
µA  
µA  
µA  
µA  
VIN decreasing  
Disabled, OUT = open  
1
Enabled, OUT = open  
100  
1
Disabled, OUT grounded  
ILEAK  
1
IREV  
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN  
84  
105  
108  
135  
TA = +25°C  
VIN = 5V, IOUT= 2.0A  
-40°C TA +85°C  
TA = +25°C  
Switch on-Resistance  
mΩ  
RDS(ON)  
90  
-
VIN = 3.3V, IOUT= 2.0A  
VIN= 5V, VOUT= 4.5V  
-40°C TA +85°C  
Over-Load Current Limit  
(Note 6)  
2.05  
2.5  
2.85  
A
ILIMIT  
-40°C TA +85°C  
Current Limiting Trigger Threshold Output Current Slew rate (< 100A/s)  
-
1.8  
-
2.5  
2.75  
2
-
3.3  
-
A
A
ITrig  
ISHORT  
TSHORT  
VIL  
Short-Circuit Current Limit  
Short-Circuit Response Time  
EN Input Logic Low Voltage  
EN Input Logic High Voltage  
EN Input Leakage  
Enabled into short circuit  
µs  
V
VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground)  
VIN = 2.7V to 5.5V  
-
-
0.8  
-
2
-
-
V
VIH  
VIN = 2.7V to 5.5V  
0.01  
0.5  
0.1  
0.6  
0.1  
0.05  
25  
1
µA  
µA  
ms  
ms  
ms  
ms  
ILEAK-EN  
ILEAK-O  
TD(ON)  
TR  
VIN = 5V, VEN = 0V and 5.5V  
Output Leakage Current  
Output Turn-on Delay Time  
Output Turn-on Rise Time  
Output Turn-off Delay Time  
Output Turn-off Fall Time  
FLG Output FET on-Resistance  
FLG Off Current  
-
1
Disabled, VOUT = 0V  
CL = 1µF, RLOAD = 5Ω  
CL = 1µF, RLOAD = 5Ω  
CL = 1µF, RLOAD = 5Ω  
CL = 1µF, RLOAD = 5Ω  
-
-
-
1.5  
-
-
TD(OFF)  
TF  
RFLG  
IFOH  
-
0.1  
40  
1
-
I
FLG = 10mA  
-
0.01  
µA  
VFLG = 5V  
Assertion or deassertion due to overcurrent and over-  
temperature condition  
FLG Blanking and Latch-off Time  
4
7
15  
ms  
TBLANK  
Discharge Time  
-
-
0.6  
-
-
ms  
TDIS  
RDIS  
CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V  
VIN = 5V, disabled, IOUT = 1mA  
Enabled  
Discharge Resistance (Note 7)  
Thermal Shutdown Threshold  
Thermal Shutdown Hysteresis  
105  
-
-
-
-
-
-
140  
20  
-
-
-
-
-
-
°C  
TSHDN  
THYS  
-
°C  
SO-8 (Note 8)  
96  
°C/W  
°C/W  
°C/W  
°C/W  
MSOP-8 (Note 8)  
130  
92  
Thermal Resistance Junction-to-  
Ambient  
MSOP-8EP (Note 9)  
U-DFN3030-8 (Note 9)  
θJA  
84  
U-DFN2020-6 (Note 10)  
-
90  
-
°C/W  
Notes:  
6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.  
7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V < V  
IN  
.
UVLO  
The discharge function offers a resistive discharge path for the external storage capacitor for limited time.  
8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.  
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground  
plane.  
10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.  
4 of 18  
www.diodes.com  
March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Typical Performance Characteristics  
VEN  
VEN  
50%  
50%  
50%  
50%  
TD(OFF)  
TD(OFF)  
TR  
TR  
TF  
TF  
TD(ON)  
TD(ON)  
90%  
90%  
90%  
90%  
10%  
VOUT  
VOUT  
10%  
10%  
10%  
Figure 1 Voltage Waveforms: AP2401A (left), AP2411A (right)  
All Enable Plots are for Enable Active Low  
Turn-On Delay and Rise Time  
Turn-Off Delay and Fall Time  
Vout  
2V/div  
TA=25°C  
VIN=5V  
CL=1µF  
ROUT=2.5  
TA=25°C  
VIN=5V  
CL=1µF  
ROUT=2.5Ω  
Vout  
2V/div  
Ven  
5V/div  
Ven  
5V/div  
Device Enable  
Device Disable  
Iin  
1A/div  
Iin  
1A/div  
Turn-On Delay and Rise Time  
Turn-Off Delay and Fall Time  
TA=25°C  
VIN=5V  
CL=120µF  
ROUT=2.5Ω  
Vout  
2V/div  
Vout  
2V/div  
TA=25°C  
VIN=5V  
CL=120µF  
ROUT=2.5Ω  
Ven  
5V/div  
Ven  
5V/div  
Device Enable  
Device Disable  
Iin  
1A/div  
Iin  
1A/div  
Inrush Current Limit  
5 of 18  
www.diodes.com  
March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Typical Performance Characteristics (continued)  
Device Enabled Into Short-Circuit  
Inrush Current  
TA=25°C  
VIN=5V  
CL=120µF,220uF, 470µF  
ROUT=5Ω  
TA=25°C  
VIN=5V  
CL=120µF  
Ven  
5V/div  
Ven  
5V/div  
ROUT=1Ω  
CL=470µF  
CL=220µF  
CL=120µF  
Iout  
0.5A/div  
Iout  
1A/div  
Full-Load to Short-Circuit  
Transient Response  
No-Load to Short-Circuit  
Transient Response  
Output Short Circuit  
Vout  
2V/div  
Output Short Circuit  
Vout  
2V/div  
TA=25°C  
VIN=5V  
TA=25°C  
VIN=5V  
ROUT=2.5Ω  
Iin  
2A/div  
Iin  
2A/div  
Device Turns off and Re-enables  
Into Current-Limit  
Device Turns off and Re-enables  
Into Current-Limit  
FLG  
5V/div  
Device is latched-off  
FLG  
5V/div  
Device is latched-off  
6 of 18  
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March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Typical Performance Characteristics (cont.)  
Power ON  
UVLO Increasing  
FLG  
Vin  
2V/div  
5V/div  
TA=25°C  
VIN=5V  
IIout  
1A/div  
TA=25°C  
VIN=5V  
ROUT=2.5Ω  
CL=120µF  
ROUT=2.5Ω  
CL=120µF  
Vout  
5V/div  
Iout  
2A/div  
Vin  
5V/div  
UVLO Decreasing  
Vin  
2V/div  
TA=25°C  
VIN=5V  
ROUT=2.5Ω  
CL=120µF  
Iout  
2A/div  
7 of 18  
www.diodes.com  
March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Typical Performance Characteristics (cont.)  
200  
190  
180  
170  
160  
150  
140  
130  
120  
110  
100  
90  
80  
70  
60  
50  
40  
260  
240  
220  
200  
180  
160  
140  
120  
100  
80  
60  
40  
C
R
T
= 1µF  
L
L
30  
20  
10  
0
= 5  
20  
0
= 25°C  
A
2
2.5  
3
3.5  
4
4.5  
Input Voltage (V)  
5
5.5  
6
2
2.5  
3
3.5  
Input Voltage (V)  
Turn-Off vs. Input Voltage  
4
4.5  
5
5.5  
6
Turn-On vs. Input Voltage  
1000  
900  
100  
90  
80  
800  
70  
700  
600  
500  
60  
50  
40  
30  
400  
300  
C
= 1µF  
20  
L
200  
R
T
= 5Ω  
L
= 25°C  
10  
0
100  
0
A
2
2.5  
3
3.5  
Input Voltage (V)  
Fall Time vs. Input Voltage  
4
4.5  
5
5.5  
6
2
2.5  
3
3.5  
Input Voltage (V)  
Rise Time vs. Input Voltage  
4
4.5  
5
5.5  
6
8 of 18  
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March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Typical Performance Characteristics (cont.)  
100  
90  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0
V
= 5.5V  
IN  
V
= 5.5V  
IN  
V
= 5V  
80  
70  
IN  
V
= 5V  
IN  
60  
50  
V
= 3.3V  
IN  
V
= 3.3V  
IN  
V
= 2.7V  
V
= 2.7V  
IN  
IN  
-0.05  
-0.10  
-0.15  
40  
30  
20  
-0.20  
-0.25  
-0.30  
10  
0
-50 - 25  
0
25  
50  
75  
100 125  
-50 -25  
0
25  
50  
75  
100 125  
Temperature (C)  
Supply Current, Output Enabled vs. Temperature  
Temperature (C)  
Supply Current, Output Disabled vs. Temperature  
180  
3.0  
170  
160  
2.9  
2.8  
2.7  
V
= 2.7V  
IN  
V
= 3.3V  
150  
140  
130  
120  
110  
IN  
V
= 2.7V  
IN  
V
= 3.3V  
IN  
2.6  
2.5  
V
= 5V  
IN  
100  
90  
80  
70  
60  
50  
40  
V
= 5.5V  
2.4  
2.3  
IN  
2.2  
2.1  
2.0  
V
= 5.5V  
IN  
V
= 5V  
IN  
-50 -25  
0
25  
Temperature (°C)  
Short-Circuit, Output Current vs. Temperature  
50  
75  
100 125  
-50 -25  
0
25  
50  
Temperature (°C)  
RDS(ON) vs. Temperature  
75  
100 125  
2.15  
2.10  
2.05  
2.00  
3.5  
3.4  
3.3  
C
T
= 120µF  
= 25°C  
L
A
UVLO Rising  
3.2  
3.1  
1.95  
1.90  
3.0  
2.9  
UVLO Falling  
1.85  
1.80  
2.8  
2.7  
1.75  
1.70  
1.65  
2.6  
2.5  
-50 -25  
0
25  
Temperature (°C)  
Undervoltage Lockout vs. Temperature  
50  
75  
100 125  
2
2.5  
3
3.5  
Input Voltage (V)  
Turn-Off vs. Input Voltage  
4
4.5  
5
5.5  
6
9 of 18  
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March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Application Information  
Power Supply Considerations  
A 0.1µF to 2.2µF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external  
power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device  
maximum input rating during short circuit condition. In this case a 2.2µF or bigger capacitor is recommended. Placing a high-value electrolytic  
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that  
may cause ringing on the input. Additionally, bypassing the output with a 0.1µF to 1.0µF ceramic capacitor improves the immunity of the device  
to short-circuit transients.  
Overcurrent and Short Circuit Protection  
An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series  
resistance of the current path. When an overcurrent condition is detected, the devices will limit the current until the overload condition is removed  
or the internal deglitch time (7ms typical) is reached and the device is turned off. The device will remain latched off even the overload condition is  
removed until power is cycled or the device enable is toggled.  
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before  
VIN has been applied. The AP2401A/AP2411A senses the short circuit and immediately clamps output current to a certain safe level namely  
ILIMIT, and turns off after deglitch time (7ms typical).  
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current  
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the  
overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT current for deglitch time period  
(7ms typical), and then turned off.  
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the  
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2401A/AP2411A is capable of delivering  
current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current  
limiting mode and output current is clamped at ILIMIT for deglitch time period (7ms typical), and then turned off.  
FLG Response  
When an overcurrent or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7ms  
deglitch timeout.  
When that happens, the FLG will remain low and the switch will be latched off until the fault condition is removed. Connecting a heavy capacitive  
load to the output of the device can cause a momentary overcurrent condition, which does not trigger the FLG due to the 7ms deglitch timeout.  
The AP2401A/AP2411A is designed to eliminate false, overcurrent reporting without the need of external components to remove unwanted  
pulses.  
Power Dissipation and Junction Temperature  
The low, on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating  
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:  
PD = RDS(ON)× I2  
Finally, calculate the junction temperature:  
TJ = PD x RθJA + TA  
Where:  
TA= Ambient Temperature°C  
RθJA = Thermal Resistance  
PD = Total Power Dissipation  
Thermal Protection  
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The  
AP2401A/AP2411A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die  
temperature rises to approximately 140°C due to excessive power dissipation in an overcurrent condition, the internal thermal sense circuitry  
turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to  
cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is  
removed. The FLG open-drain output is asserted when an over-temperature shutdown occurs with 7ms deglitch.  
When the FLG is asserted, the switch will be latched off until the temperature drops to 20°C below the thermal shutdown threshold and the power  
or EN pin is cycled.  
10 of 18  
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© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Application Information (continued)  
Undervoltage Lockout (UVLO)  
Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even  
if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the  
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.  
Discharge Function  
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch  
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue  
of the output voltage when either no external output resistance or load resistance is present at the output.  
Dual-Purpose Port Applications  
AP2401A/AP2411A is suitable for use in dual-purpose port applications in which a single port is used for data communication between the host  
and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of this is a shared  
HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while  
maintaining a charge to the smartphone or tablet battery. In such dual-purpose port applications, it is important to insure Vin of the  
AP2401A/AP2411A is ramped to its operating voltage prior to enabling the output. Since the AP2401A/AP2411A includes an embedded discharge  
feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to  
continual discharge whenever the AP2401A/AP2411A is disabled. An overstress condition to the device's discharge MOS transistor may result.  
Ordering Information  
7”/13” Tape and Reel  
Part  
Number  
Package  
Code  
Status  
Packaging  
Quantity  
Part Number Suffix  
AP24X1AS-13  
AP24X1AM8-13  
AP24X1AMP-13  
AP24X1AFGE-7  
AP24X1ASN-7  
New Product  
New Product  
New Product  
New Product  
Preview  
S
SO-8  
2,500/Tape & Reel  
2,500/Tape & Reel  
2,500/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
-13  
-13  
-13  
-7  
M8  
MSOP-8  
MP  
FGE  
SN  
MSOP-8EP  
U-DFN3030-8  
U-DFN2020-6  
-7  
11 of 18  
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March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Marking Information  
(1) SO-8  
(2) MSOP-8  
(3) MSOP-8EP  
12 of 18  
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© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Marking Information (continued)  
(4) U-DFN3030-8  
( Top View )  
XX : Identification Code  
Y : Year : 0~9  
X X  
W : Week : A~Z : 1~26 week;  
a~z : 27~52 week; z represents  
52 and 53 week  
Y
X
W
X : A~Z : Internal Code  
Part Number  
Package  
Identification Code  
AP2401AFGE-7  
AP2411AFGE-7  
U-DFN3030-8  
U-DFN3030-8  
4W  
4X  
(5) U-DFN2020-6  
( Top View )  
XX : Identification Code  
Y : Year : 0~9  
X X  
W : Week : A~Z : 1~26 week;  
a~z : 27~52 week; z represents  
52 and 53 week  
Y
X
W
X : A~Z : Internal Code  
Part Number  
AP2401ASN-7  
AP2411ASN-7  
Package  
Identification Code  
U-DFN2020-6  
U-DFN2020-6  
4Y  
4Z  
13 of 18  
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© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
                                                                                                                                                                                                                      
AP2401A/AP2411A  
Package Outline Dimensions (All dimensions in mm.)  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
1. Package type: SO-8  
SO-8  
Dim  
A
Min  
-
Max  
1.75  
0.20  
1.50  
0.25  
0.5  
A1  
A2  
A3  
b
0.10  
1.30  
0.15  
0.3  
E1  
E
Gauge Plane  
Seating Plane  
A1  
L
D
4.85  
5.90  
3.85  
4.95  
6.10  
3.95  
Detail ‘A’  
E
E1  
e
7°~9°  
h
°
45  
1.27 Typ  
h
-
0.35  
0.82  
8°  
Detail ‘A’  
A2  
A3  
A
L
0.62  
0°  
θ
b
e
All Dimensions in mm  
D
2. Package type: MSOP-8  
MSOP-8  
Dim Min Max Typ  
D
A
-
1.10  
-
A1 0.05 0.15 0.10  
A2 0.75 0.95 0.86  
A3 0.29 0.49 0.39  
0.25  
b
c
D
E
0.22 0.38 0.30  
0.08 0.23 0.15  
2.90 3.10 3.00  
4.70 5.10 4.90  
E
Gauge Plane  
Seating Plane  
x
y
L
E1 2.90 3.10 3.00  
E3 2.85 3.05 2.95  
Detail C  
1
b
e
L
a
x
y
-
-
0.65  
0.40 0.80 0.60  
E3  
E1  
A3  
0°  
-
-
8°  
-
-
4°  
0.750  
0.750  
A2  
A1  
A
e
c
All Dimensions in mm  
See Detail C  
14 of 18  
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© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Package Outline Dimensions (cont.) (All dimensions in mm.)  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
3. Package type: MSOP-8EP  
MSOP-8EP  
Dim Min Max Typ  
1.10  
D
A
-
-
A1 0.05 0.15 0.10  
A2 0.75 0.95 0.86  
A3 0.29 0.49 0.39  
D1  
x
b
c
0.22 0.38 0.30  
0.08 0.23 0.15  
2.90 3.10 3.00  
E
E2  
Gauge Plane  
Seating Plane  
D
y
D1 1.60 2.00 1.80  
4.70 5.10 4.90  
E1 2.90 3.10 3.00  
E2 1.30 1.70 1.50  
E3 2.85 3.05 2.95  
E
L
1
8Xb  
e
Detail C  
E3  
E1  
A1  
A3  
e
L
a
x
y
-
-
0.65  
0.40 0.80 0.60  
c
A2  
A
0°  
-
-
8°  
-
-
4°  
0.750  
0.750  
D
See Detail C  
All Dimensions in mm  
4. Package type: U-DFN3030-8 Type E  
U-DFN3030-8  
(TYPE E)  
Dim  
A
Min  
0.57  
0.00  
-
0.20  
2.95  
2.15  
2.95  
1.40  
-
Max  
0.63  
0.05  
-
0.30  
3.05  
2.35  
3.05  
1.60  
-
Typ  
0.60  
0.02  
0.15  
0.25  
3.00  
2.25  
3.00  
1.50  
0.65  
0.45  
0.40  
A1  
A3  
b
D
D2  
E
E2  
e
L
0.30  
-
0.60  
-
z
All Dimensions in mm  
5.  
Package type: U-DFN2020-6  
U-DFN2020-6  
Dim Min Max Typ  
A
A1  
A3  
b
0.57 0.63 0.60  
0
0.05 0.03  
0.15  
0.20 0.30 0.25  
1.95 2.075 2.00  
D2 1.45 1.65 1.55  
D
e
E
0.65  
1.95 2.075 2.00  
0.76 0.96 0.86  
0.30 0.40 0.35  
E2  
L
All Dimensions in mm  
15 of 18  
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March 2015  
© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
(1) Package type: SO-8  
X
Dimensions Value (in mm)  
X
Y
0.60  
1.55  
5.4  
C1  
C1  
C2  
1.27  
C2  
Y
(2) Package type: MSOP-8  
X
C
Y
Dimensions Value (in mm)  
C
X
0.650  
0.450  
1.350  
5.300  
Y1  
Y
Y1  
(3) Package type: MSOP-8EP  
X
C
Value  
(in mm)  
0.650  
0.450  
0.450  
2.000  
1.350  
1.700  
5.300  
Dimensions  
C
G
X
Y
G
X1  
Y
Y2  
Y1  
Y1  
Y2  
X1  
16 of 18  
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© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
Suggested Pad Layout (continued)  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
(4) Package type: U-DFN3030-8 Type E  
Value  
(in mm)  
0.650  
0.350  
2.350  
2.300  
0.650  
1.600  
3.300  
Dimensions  
C
X
X1  
X2  
Y
Y1  
Y2  
(5) Package type: U-DFN2020-6  
Value  
(in mm)  
0.65  
0.15  
0.37  
Dimensions  
C
G
X
X1  
Y
1.67  
0.45  
Y1  
0.90  
17 of 18  
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© Diodes Incorporated  
AP2401A/AP2411A  
Document number: DS37744 Rev. 1 - 2  
AP2401A/AP2411A  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2015, Diodes Incorporated  
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Document number: DS37744 Rev. 1 - 2  

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