BAS116LP3 [DIODES]

ULTRA-SMALL SURFACE MOUNT LOW LEAKAGE DIODE; 超小型表面贴装低漏二极管


型号：	BAS116LP3
厂家：	DIODES INCORPORATED
描述：	ULTRA-SMALL SURFACE MOUNT LOW LEAKAGE DIODE 超小型表面贴装低漏二极管二极管
文件：	总4页 (文件大小：83K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BAS116LP3

ULTRA-SMALL SURFACE MOUNT LOW LEAKAGE DIODE

Features

Mechanical Data

•

Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)

Ultra-Low Profile Package (0.3mm)

Very Low Leakage Current

•

Case: X3-DFN0603-2

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: Cathode Bar

Terminals: Finish − Matte Tin Finish over Copper Leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

Weight: 0.2mg (Approximate)

•

Low Capacitance

Ideal for Compact Battery Powered Portable Electronics

Lead Free By Design/RoHS Compliant (Note 1)

"Green" Device (Note 2)

Top View

Bottom View

Ordering Information (Note 3)

Part Number

BAS116LP3-7

Case

X3-DFN0603-2

Packaging

10,000/Tape & Reel

Notes:

1. No purposefully added lead.

2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.

3. For packaging details, go to our website at http://www.diodes.com.

Marking Information

BA = Product Type Marking Code

Bar Denotes Cathode Side

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www.diodes.com

January 2012

BAS116LP3

Document number: DS35241 Rev. 5 - 2

BAS116LP3

Maximum Ratings @T = 25°C unless otherwise specified

Characteristic

Symbol

V_RRM

V_RWM

V_R

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RMS Reverse Voltage

V_R(RMS)

I_FM

Forward Continuous Current (Note 4)

Repetitive Peak Forward Current

215

500

I_FRM

4.0

1.0

0.5

Non-Repetitive Peak Forward Surge Current

@ t = 1.0μs

@ t = 1.0ms

@ t = 1.0s

I_FSM

Thermal Characteristics

Characteristic

Symbol

Value

250

Unit

Power Dissipation (Note 4)

P_D

Thermal Resistance Junction to Ambient Air (Note 4)

Operating and Storage Temperature Range

500

°C/W

°C

R_θ

-65 to +150

T_J, T_STG

Electrical Characteristics @T = 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 5)

V_(BR)R

⎯

I_R= 100μA

I_F= 1.0mA

I_F= 10mA

I_F= 50mA

I_F= 150mA

0.75

0.9

1.0

0.95

1.10

1.20

1.35

Forward Voltage

V_F

⎯

1.15

V_R= 75V

10.0

100

500

Leakage Current (Note 5)

I_R

⎯

V_R= 1V, T_J= 150°C

V_R= 75V, T_J= 150°C

Total Capacitance

1.6

3.0

C_T

t_rr

⎯

V_R= 0, f = 1.0MHz

I_F= I_R= 10mA,

I_rr= 0.1 x I_R, R_L= 100Ω

Reverse Recovery Time

120

3000

Notes:

4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.

5. Short duration pulse test used to minimize self-heating effect.

300

250

200

150

100

125

150

0.4

0.8

1.2

1.6

T_A, AMBIENT TEMPERATURE (°C)

Fig. 1 Power Derating Curve, Total Package

V_F, INSTANTANEOUS FORWARD VOLTAGE (V)

Fig. 2 Typical Forward Characteristics

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www.diodes.com

January 2012

BAS116LP3

Document number: DS35241 Rev. 5 - 2

BAS116LP3

100

2.0

1.6

f = 1MHz

1.2

0.8

0.4

0.1

V_R, DC REVERSE VOLTAGE (V)

100

10 20 30 40 50 60 70 80 90 100

V_R, INSTANTANEOUS REVERSE VOLTAGE (V)

Fig. 3 Typical Reverse Characteristics

Fig. 4 Typical Total Capacitance vs. Reverse Voltage

Package Outline Dimensions

X3-DFN0603-2

Dim

Min

0.27

0.00

0.19

0.595 0.645

0.295 0.345

Max

0.35

0.03

0.29

Typ

0.30

0.02

0.24

0.62

0.32

0.355

0.19

A1 (2x)

0.14

0.24

b (2x)

All Dimensions in mm

L (2x)

Bottom View

Suggested Pad Layout

Dimensions

Value (in mm)

0.355

0.230

0.300

0.610

Y (2x)

X (2x)

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January 2012

BAS116LP3

Document number: DS35241 Rev. 5 - 2

BAS116LP3

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

www.diodes.com

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January 2012

BAS116LP3

Document number: DS35241 Rev. 5 - 2

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