DF04S [DIODES]

1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER; 1.0A表面安装玻璃钝化整流桥
DF04S
型号: DF04S
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
1.0A表面安装玻璃钝化整流桥

整流二极管 桥式整流二极管 光电二极管
文件: 总2页 (文件大小:56K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DF005S - DF10S  
1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE  
RECTIFIER  
Features  
·
·
·
Glass Passivated Die Construction  
Diffused Junction  
Low Forward Voltage Drop, High Current  
Capability  
DF-S  
·
·
·
Surge Overload Rating to 50A Peak  
L
Dim  
A
Min  
7.40  
6.20  
0.22  
0.076  
Max  
7.90  
6.50  
0.30  
0.33  
10.40  
1.53  
8.51  
2.60  
5.20  
1.20  
G
Designed for Surface Mount Application  
Plastic Material - UL Flammability  
Classification 94V-0  
B
C
A B  
D E  
·
UL Listed Under Recognized Component Index,  
File Number E94661  
D
E
G
H
1.02  
8.13  
2.40  
5.00  
1.00  
Mechanical Data  
H
C
·
·
Case: Molded Plastic  
J
J
Terminals: Solder Plated Leads, Solderable  
per MIL-STD-202, Method 208  
K
K
L
·
·
·
·
Polarity: As marked on Case  
Approx. Weight: 0.38 grams  
Mounting Position: Any  
All Dimensions in mm  
Marking: Type Number  
@ TA = 25°C unless otherwise specified  
Maximum Ratings and Electrical Characteristics  
Single phase, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
DF  
005S  
DF  
DF  
02S  
DF  
04S  
DF  
06S  
DF  
08S  
DF  
10S  
Characteristic  
Symbol  
Unit  
01S  
100  
70  
VRMM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
50  
200  
140  
400  
600  
420  
800  
560  
1000  
700  
V
VRMS  
IO  
RMS Reverse Voltage  
35  
280  
1.0  
V
A
Average Forward Rectified Current  
@ TA = 40°C  
Non-Repetitive Peak Forward Surge Current, 8.3 ms  
single half-sine-wave superimposed on rated load  
(JEDEC method)  
IFSM  
50  
A
Forward Voltage (per element)  
@ IF = 1.0A  
VFM  
IRM  
1.1  
V
Peak Reverse Current at Rated  
DC Blocking Voltage (per element)  
@ TA = 25°C  
@ TA = 125°C  
10  
500  
µA  
I2t Rating for Fusing (t<8.3ms)  
I2t  
Cj  
10.4  
25  
A2s  
pF  
Typical Junction Capacitance (per element) (Note 1)  
Typical Thermal Resistance, Junction to Ambient  
(Note 2)  
RqJA  
40  
°C/W  
°C  
Tj, TSTG  
Operating and Storage Temperature Range  
-65 to +150  
Notes:  
1. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0V DC.  
2
2. Thermal resistance, junction to ambient, measured on PC board with 5.0mm (0.03mm thick) land areas.  
DS17001 Rev. H-2  
1 of 2  
DF005S-DF10S  
1.0  
10  
60 Hz Resistive or  
Inductive load  
Tj = 25°C  
Pulse Width = 300µs  
2% duty cycle  
1.0  
0.5  
0.1  
0.01  
0
40  
100  
120  
140  
0.8  
0.4  
1.0  
1.4  
80  
0.6  
1.2  
60  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 1 Output Current Derating Curve  
VF, INSTANTANEOUS FORWARD VOLTAGE (V)  
Fig. 2 Typ Forward Characteristics (per element)  
60  
100  
10  
1
Tj = 25°c  
Single half-sine-Wave  
(JEDEC Method)  
f = 1.0 Mhz  
Vsig = 50 mV p-p  
50  
40  
30  
20  
10  
0
1
10  
100  
1
10  
100  
VR, REVERSE VOLTAGE (V)  
NUMBER OF CYCLES AT 60 Hz  
Fig. 3 Max Non-Repetitive Peak Forward Surge Current  
Fig. 4 Typ Junction Capacitance (per element)  
100  
Tj = 125°C  
10  
1.0  
Tj = 25°C  
0.1  
0.01  
0
20  
40  
60  
100  
120  
140  
80  
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)  
Fig. 5 Typ Reverse Characteristics (per element)  
DS17001 Rev. H-2  
2 of 2  
DF005S-DF10S  

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