DMN10H099SFG-7 [DIODES]

Qualified to AEC-Q101 Standards for High Reliability;
DMN10H099SFG-7
型号: DMN10H099SFG-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Qualified to AEC-Q101 Standards for High Reliability

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DMN10H099SFG  
100V N-CHANNEL ENHANCEMENT MODE MOSFET  
POWERDI®  
Product Summary  
Features and Benefits  
Low RDS(ON) – ensures on state losses are minimized  
I
D max  
V(BR)DSS  
RDS(ON) max  
Small form factor thermally efficient package enables higher  
density end products  
TA = +25°C  
80m@ VGS = 10V  
99m@ VGS = 6.0V  
4.2A  
Occupies just 33% of the board area occupied by SO-8 enabling  
smaller end product  
100V  
3.6A  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Mechanical Data  
Description  
This MOSFET has been designed to minimize the on-state resistance  
(RDS(on)) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case: POWERDI3333-8  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See diagram  
Terminals: Finish Matte Tin annealed over Copper leadframe.  
Solderable per MIL-STD-202, Method 208  
Applications  
Power Management Functions  
DC-DC Converters  
Weight: 0.034 grams (approximate)  
POWERDI3333-8  
Pin 1  
8
7
6
5
1
2
3
4
S
S
S
G
D
D
D
Top View  
Internal Schematic  
D
Top View  
Bottom View  
Ordering Information (Note 4)  
Part Number  
DMN10H099SFG-7  
DMN10H099SFG-13  
Compliance  
Standard  
Standard  
Case  
POWERDI3333-8  
POWERDI3333-8  
Packaging  
2000/Tape & Reel  
3000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html  
Marking Information  
N12 = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last digit of year (ex: 13 = 2013)  
WW = Week code (01 ~ 53)  
N12  
POWERDI is a registered trademark of Diodes Incorporated  
1 of 6  
www.diodes.com  
January 2014  
© Diodes Incorporated  
DMN10H1099SFG  
Document number: DS36371 Rev. 2 - 2  
DMN10H099SFG  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
100  
±20  
Units  
V
V
Gate-Source Voltage  
VGSS  
TA = +25°C  
TA = +70°C  
TA = +25°C  
Steady  
State  
4.2  
3.3  
A
A
A
ID  
ID  
ID  
Continuous Drain Current (Note 6) VGS = 10V  
5.8  
4.5  
t<10s  
T
A = +70°C  
A = +25°C  
T
Steady  
State  
3.6  
2.9  
TA = +70°C  
TA = +25°C  
Continuous Drain Current (Note 6) VGS = 6V  
5.2  
4.1  
t<10s  
A
A
ID  
TA = +70°C  
Pulsed Drain Current (10μs pulse, duty cycle = 1%)  
20  
IDM  
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
PD  
Value  
Units  
0.98  
0.57  
131  
TA = +25°C  
Total Power Dissipation (Note 5)  
W
TA = +70°C  
Steady state  
t<10s  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
R  
JA  
76  
2.31  
1.18  
55  
28  
6.9  
TA = +25°C  
TA = +70°C  
Steady state  
t<10s  
PD  
Thermal Resistance, Junction to Ambient (Note 6)  
RθJA  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
RθJC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
100  
-
-
-
-
V
BVDSS  
IDSS  
VGS = 0V, ID = 250μA  
VDS = 80V, VGS = 0V  
VGS = ±20V, VDS = 0V  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
-
-
1.0  
μA  
nA  
±100  
IGSS  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1.5  
2.0  
54  
3.0  
80  
99  
-
V
VGS(th)  
VDS = VGS, ID = 250μA  
-
-
-
-
V
V
GS = 10V, ID = 3.3A  
GS = 6.0V, ID = 3.0A  
Static Drain-Source On-Resistance  
mΩ  
RDS (ON)  
58  
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
13  
S
V
|Yfs|  
VSD  
VDS = 10V, ID = 3.3A  
VGS = 0V, IS = 3.2A  
0.77  
-
-
-
-
-
-
-
-
-
-
-
-
-
1172  
40.8  
31.3  
1.6  
-
-
-
-
-
-
-
-
-
-
-
-
pF  
pF  
pF  
Ciss  
Coss  
Crss  
Rg  
VDS = 50V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1.0MHz  
25.2  
12.2  
5.3  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Total Gate Charge VGS = 10V  
Total Gate Charge VGS = 4.5V  
Gate-Source Charge  
Qg  
Qg  
V
DS = 50V, ID = 3.3A  
Qgs  
Qgd  
tD(on)  
tr  
Gate-Drain Charge  
5.9  
Turn-On Delay Time  
5.4  
Turn-On Rise Time  
5.9  
VGS = 10V, VDS = 50V,  
RG = 6.0, ID = 3.3A  
Turn-Off Delay Time  
20.0  
7.3  
tD(off)  
tf  
Turn-Off Fall Time  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
POWERDI is a registered trademark of Diodes Incorporated  
2 of 6  
www.diodes.com  
January 2014  
© Diodes Incorporated  
DMN10H1099SFG  
Document number: DS36371 Rev. 2 - 2  
DMN10H099SFG  
10  
9
20.0  
16.0  
V
= 10V  
DS  
V
= 10V  
GS  
8
7
6
5
4
3
2
V
= 6.0V  
GS  
V
= 5.0V  
GS  
12.0  
8.0  
4.0  
0.0  
V
= 4.5V  
GS  
T
A
= 150°C  
A
T
= 125°C  
T
= 25°C  
T
= 85°C  
A
A
V
= 4.0V  
GS  
T
= -55°C  
A
1
0
V
= 3.5V  
GS  
1
2
3
4
5
0
1
2
3
4
5
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1 Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
0.1  
0.08  
0.06  
0.04  
0.5  
0.4  
I
= 3.3A  
V
= 6.0V  
D
GS  
0.3  
0.2  
0.1  
0
V
= 10V  
GS  
0.02  
0
I
= 3.0A  
D
2
4
6
8
10 12 14 16 18 20  
2
4
6
8
10 12 14 16 18 20  
0
VGS, GATE-SOURCE VOLTAGE (V)  
ID, DRAIN-SOURCE CURRENT (A)  
Figure 4 Typical Drain-Source On-Resistance  
vs. Gate-Source Voltage  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
0.16  
3
V
= 10V  
GS  
0.14  
0.12  
0.10  
0.08  
0.06  
T
= 150°C  
A
2.5  
2
V
I
= 10V  
GS  
= 5.0A  
D
T
= 125°C  
= 85°C  
A
T
1.5  
1
A
V
I
= 5V  
GS  
= 1.0A  
D
T
= 25°C  
A
0.04  
0.5  
0
T
= -55°C  
A
0.02  
0.00  
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Figure 6 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
0
1
2
3
4
5
6
7
8
9
10  
C)  
ID, DRAIN CURRENT (A)  
Figure 5 Typical On-Resistance vs.  
Drain Current and Temperature  
POWERDI is a registered trademark of Diodes Incorporated  
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www.diodes.com  
January 2014  
© Diodes Incorporated  
DMN10H1099SFG  
Document number: DS36371 Rev. 2 - 2  
DMN10H099SFG  
0.15  
0.12  
0.09  
0.06  
0.03  
0
2.5  
2.2  
1.9  
1.6  
1.3  
1
V
I
= 5V  
GS  
I = 1mA  
D
= 1.0A  
D
V
= 10V  
= 5A  
GS  
I
D
I = 250µA  
D
-50 -25  
0
25  
50  
75 100 125 150  
C)  
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Figure 7 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
TJ, JUNCTION TEMPERATURE (  
C)  
Figure 8 Gate Threshold Variation vs. Ambient Temperature  
10000  
10  
9
8
7
6
5
4
3
2
1
0
C
iss  
T
A
= 150°C  
A
1000  
100  
T
= 25°C  
A
T
= 125°C  
T
= 85°C  
A
T
= -55°C  
A
C
oss  
C
rss  
f = 1MHz  
10  
0
5
10 15 20 25 30 35 40 45 50  
VDS, DRAIN-SOURCE VOLTAGE (V)  
0
0.3  
0.6  
0.9  
1.2  
1.5  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9 Diode Forward Voltage vs. Current  
Figure 10 Typical Junction Capacitance  
10  
8
100  
10  
R
DS(on)  
V
= 50V  
Limited  
DS  
I
= 3.3A  
D
P
= 100µs  
W
DC  
P
6
4
1
= 10s  
W
P
= 1s  
W
P
= 100ms  
W
0.1  
P
= 20ms  
W
P
= 20ms  
W
P
= 10ms  
W
P
= 1ms  
W
0.01  
0.001  
2
0
TJ(max) = 150°C  
TA = 25°C  
Single Pulse  
DUT on 1 * MRP Board  
0
5
10  
15  
20  
25  
0.1  
1
10  
100  
1000  
Qg, TOTAL GATE CHARGE (nC)  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 11 Gate Charge  
Figure 12 SOA, Safe Operation Area  
POWERDI is a registered trademark of Diodes Incorporated  
4 of 6  
www.diodes.com  
January 2014  
© Diodes Incorporated  
DMN10H1099SFG  
Document number: DS36371 Rev. 2 - 2  
DMN10H099SFG  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
D = 0.02  
D = 0.01  
D = 0.005  
0.01  
RJA(t) = r(t) * R  
JA  
RJA = 72°C/W  
Duty Cycle, D = t1/ t2  
Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIMES (sec)  
Figure 13 Transient Thermal Resistance  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
POWERDI3333-8  
Dim Min Max Typ  
3.25 3.35 3.30  
3.25 3.35 3.30  
D2 2.22 2.32 2.27  
E2 1.56 1.66 1.61  
A
A3  
D
E
A1  
D
D2  
A
A1  
A3  
b
b2  
L
L1  
e
Z
0.75 0.85 0.80  
L
(4x)  
0
  
0.05 0.02  
0.203  
1
8
4
5
Pin 1 ID  
E2  
  
0.27 0.37 0.32  
0.20  
0.35 0.45 0.40  
b2  
(4x)  
  
  
E
0.39  
0.65  
0.515  
  
  
  
  
  
  
L1  
(3x)  
All Dimensions in mm  
Z (4x)  
e
b (8x)  
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
X
Dimensions  
Value (in mm)  
0.650  
G
C
G
0.230  
G1  
Y
Y1  
Y2  
Y3  
X
0.420  
3.700  
2.250  
1.850  
0.700  
2.370  
0.420  
8
5
4
Y2  
Y3  
G1  
Y1  
Y
1
X2  
X2  
C
POWERDI is a registered trademark of Diodes Incorporated  
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www.diodes.com  
January 2014  
© Diodes Incorporated  
DMN10H1099SFG  
Document number: DS36371 Rev. 2 - 2  
DMN10H099SFG  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2014, Diodes Incorporated  
www.diodes.com  
POWERDI is a registered trademark of Diodes Incorporated  
6 of 6  
www.diodes.com  
January 2014  
© Diodes Incorporated  
DMN10H1099SFG  
Document number: DS36371 Rev. 2 - 2  

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