DMN3030LFG-13 [DIODES]

Small Signal Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET;
DMN3030LFG-13
型号: DMN3030LFG-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Small Signal Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

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DMN3030LFG  
Green  
N-CHANNEL ENHANCEMENT MODE MOSFET  
POWERDI®  
Product Summary  
Features  
ID  
Low RDS(ON) – ensures on state losses are minimized  
Small form factor thermally efficient package enables higher  
density end products  
V(BR)DSS  
RDS(ON)  
Package  
TA = +25°C  
18m@ VGS = 10V  
27m@ VGS = 4.5V  
8.6A  
5.5A  
POWERDI  
3333-8  
30V  
Occupies just 33% of the board area occupied by SO-8 enabling  
smaller end product  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Description  
This new generation MOSFET has been designed to minimize the on-  
state resistance (RDS(on) and yet maintain superior switching  
)
performance, making it ideal for high efficiency power management  
applications.  
Mechanical Data  
Case: POWERDI3333-8  
Applications  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish Matte Tin annealed over Copper leadframe.  
Solderable per MIL-STD-202, Method 208 e3  
Weight: 0.072 grams (approximate)  
Backlighting  
DC-DC Converters  
Power Management Functions  
POWERDI3333-8  
8
Pin 1  
1
S
S
S
G
7
6
5
2
3
4
D
D
D
D
Top View  
Internal Schematic  
Top View  
Bottom View  
Ordering Information (Note 4)  
Part Number  
DMN3030LFG-7  
DMN3030LFG-13  
Case  
POWERDI3333-8  
POWERDI3333-8  
Packaging  
2000 / Tape & Reel  
3000 / Tape & Reel  
Notes:  
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.  
Marking Information  
N30 = Product marking code  
YYWW = Date code marking  
YY = Last digit of year (ex: 10 for 2010)  
WW = Week code (01 – 53)  
N30  
1 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMN3030LFG  
Document number: DS35499 Rev. 5 - 2  
POWERDI is a registered trademark of Diodes Incorporated.  
DMN3030LFG  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
30  
Units  
V
V
Gate-Source Voltage  
±25  
VGSS  
TA = +25°C  
TA = +70°C  
Steady  
State  
5.3  
4.2  
A
A
A
A
ID  
ID  
ID  
ID  
Continuous Drain Current (Note 5) VGS = 10V  
Continuous Drain Current (Note 6) VGS = 10V  
T
T
A = +25°C  
A = +70°C  
6.8  
5.2  
t<10s  
TA = +25°C  
A = +70°C  
Steady  
State  
8.6  
6.8  
T
TA = +25°C  
TA = +70°C  
11  
8.8  
t<10s  
Pulsed Drain Current (10μs pulse, duty cycle = 1%)  
70  
3
A
A
IDM  
IS  
Maximum Body Diode continuous Current  
Thermal Characteristics  
Characteristic  
Symbol  
PD  
Value  
0.9  
Units  
TA = +25°C  
Total Power Dissipation (Note 5)  
W
0.5  
148  
89  
2.3  
1.4  
56  
TA = +70°C  
Steady state  
t<10s  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
R  
JA  
TA = +25°C  
TA = +70°C  
Steady state  
t<10s  
PD  
Thermal Resistance, Junction to Ambient (Note 6)  
R  
JA  
34  
6.9  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
R  
JC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
BVDSS  
IDSS  
30  
100  
±1  
V
VGS = 0V, ID = 250µA  
VDS = 30V, VGS = 0V  
GS = ±25V, VDS = 0V  
Zero Gate Voltage Drain Current TJ = +25°C  
nA  
µA  
nA  
V
Gate-Source Leakage  
IGSS  
100  
VGS = ±20V, VDS = 0V  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
VGS(th)  
0.8  
1.2  
10  
16  
6
2.1  
18  
27  
V
VDS = VGS, ID = 250μA  
V
GS = 10V, ID = 10A  
Static Drain-Source On-Resistance  
RDS (ON)  
mꢀ  
VGS = 4.5V, ID = 7.5A  
VDS = 5V, ID = 10A  
VGS = 0V, IS = 1A  
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
Total Gate Charge VGS = 4.5V  
Total Gate Charge VGS = 10V  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
|Yfs|  
VSD  
S
V
0.7  
1.0  
Ciss  
Coss  
Crss  
Rg  
Qg  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
tD(off)  
tf  
751  
121  
110  
1.5  
9
17.4  
2.2  
3
2.5  
6.6  
19.0  
6.3  
VDS = 10V, VGS = 0V,  
f = 1.0MHz  
pF  
VDS = 0V, VGS = 0V, f = 1MHz  
VGS = 4.5V, VDS = 15V, ID =6A  
nC  
ns  
VGS = 10V, VDS = 15V,  
ID = 6A  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
VDD = 15V, VGS = 10V,  
RG = 6, RL = 1.8, ID = 6.7A  
Notes:  
5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to production testing.  
2 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMN3030LFG  
Document number: DS35499 Rev. 5 - 2  
POWERDI is a registered trademark of Diodes Incorporated.  
DMN3030LFG  
30  
25  
30  
25  
V
= 5.0V  
DS  
20  
15  
10  
20  
15  
10  
T
= 150°C  
A
T
= 125°C  
A
T
= 85°C  
A
5
0
5
0
T
= 25°C  
A
T
= -55°C  
A
0
0.5  
1.0  
1.5  
2.0  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
VGS, GATE-SOURCE VOLTAGE (V)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 2 Typical Transfer Characteristics  
Fig.1 Typical Output Characteristic  
0.040  
0.035  
0.020  
0.016  
V
= 4.5V  
GS  
V
= 4.5V  
GS  
T
= 150°C  
0.030  
0.025  
0.020  
0.015  
0.010  
A
T
= 125°C  
= 85°C  
A
0.012  
0.008  
T
A
V
= 10V  
GS  
T
= 25°C  
A
T
= -55°C  
A
0.004  
0
0.005  
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
ID, DRAIN-SOURCE CURRENT (A)  
ID, DRAIN CURRENT (A)  
Fig. 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
Fig. 4 Typical On-Resistance vs.  
Drain Current and Temperature  
1.6  
1.4  
0.040  
0.035  
V
= 10V  
GS  
I
= 10A  
D
0.030  
0.025  
V
= 4.5V  
GS  
V
= 4.5V  
= 5A  
GS  
I
= 5A  
D
1.2  
1.0  
I
D
0.020  
0.015  
0.010  
V
= 10V  
GS  
0.8  
0.6  
I
= 10A  
D
0.005  
0
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Fig. 6 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Fig. 5 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
C)  
C)  
3 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMN3030LFG  
Document number: DS35499 Rev. 5 - 2  
POWERDI is a registered trademark of Diodes Incorporated.  
DMN3030LFG  
2.0  
1.8  
30  
25  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
I
= 1mA  
D
20  
15  
10  
I
= 250µA  
D
T
= 25°C  
A
5
0
0.2  
0
-50 -25  
0
25  
50 75 100 125 150  
C)  
Fig. 7 Gate Threshold Variation vs. Ambient Temperature  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
TJ, JUNCTION TEMPERATURE (  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Fig. 8 Diode Forward Voltage vs. Current  
10,000  
10  
8
V
I
= 15V  
DS  
= 6A  
D
1,000  
6
4
C
iss  
C
oss  
100  
10  
C
rss  
2
0
f = 1MHz  
0
5
10  
15  
20  
25  
30  
0
2
4
6
8
10 12 14 16 18 20  
Qg, TOTAL GATE CHARGE (nC)  
Fig. 10 Gate Charge  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 9 Typical Junction Capacitance  
100  
10  
400  
350  
R
DS(on)  
Limited  
Single Pulse  
P
= 10µs  
W
R
R
T
= 148  
C/W  
= r * R  
JA  
JA  
JA(t)  
(t)  
300  
250  
200  
150  
100  
- T = P * R  
J
A
JA(t)  
DC  
1
P
= 10s  
W
P
= 1s  
W
P
= 100ms  
W
P
= 10ms  
W
P
= 1ms  
W
0.1  
TJ(max) = 150°C  
TA = 25°C  
P
= 100µs  
W
VGS = 10V  
Single Pulse  
DUT on 1 * MRP Board  
50  
0
0.01  
1E-05 1E-04 0.001 0.01 0.1  
1
10 100 1,000  
0.1  
1
10  
100  
t1, PULSE DURATION TIME (sec)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 11 Single Pulse Maximum Power Dissipation  
Fig. 12 SOA, Safe Operation Area  
4 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMN3030LFG  
Document number: DS35499 Rev. 5 - 2  
POWERDI is a registered trademark of Diodes Incorporated.  
DMN3030LFG  
1
D = 0.9  
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
0.01  
RJA(t) = r(t) * R  
RJA = 148°C/W  
JA  
Duty Cycle, D = t1/ t2  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10 100  
1,000  
t1, PULSE DURATION TIME (sec)  
Fig. 13 Transient Thermal Resistance  
Package Outline Dimensions  
POWERDI®3333-8  
Dim Min Max Typ  
A
A3  
D
E
3.25 3.35 3.30  
3.25 3.35 3.30  
A1  
D
D2 2.22 2.32 2.27  
E2 1.56 1.66 1.61  
D2  
A
A1  
A3  
b
b2  
L
0.75 0.85 0.80  
L
(4x)  
0
0.05 0.02  
0.203  
1
4
Pin 1 ID  
0.27 0.37 0.32  
b2  
(4x)  
0.20  
E
0.35 0.45 0.40  
E2  
L1  
e
Z
0.39  
0.65  
0.515  
8
5
L1  
(3x)  
All Dimensions in mm  
Z (4x)  
e
b (8x)  
Suggested Pad Layout  
X
G
Dimensions  
Value (in mm)  
0.650  
C
G
8
5
4
0.230  
Y2  
Y3  
G1  
Y1  
G1  
Y
Y1  
Y2  
Y3  
X
0.420  
3.700  
2.250  
1.850  
0.700  
2.370  
Y
1
X2  
0.420  
X2  
C
5 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMN3030LFG  
Document number: DS35499 Rev. 5 - 2  
POWERDI is a registered trademark of Diodes Incorporated.  
DMN3030LFG  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2013, Diodes Incorporated  
www.diodes.com  
6 of 6  
www.diodes.com  
March 2013  
© Diodes Incorporated  
DMN3030LFG  
Document number: DS35499 Rev. 5 - 2  
POWERDI is a registered trademark of Diodes Incorporated.  

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