DMN63D8LV [DIODES]

Dual N-Channel MOSFET;
DMN63D8LV
型号: DMN63D8LV
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Dual N-Channel MOSFET

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中文:  中文翻译
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DMN63D8LV  
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
Dual N-Channel MOSFET  
Low On-Resistance  
Low Input Capacitance  
Fast Switching Speed  
Small Surface Mount Package  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
ID  
V(BR)DSS  
RDS(ON)  
TA = 25°C  
200mA  
260mA  
4.2@ VGS = 5V  
2.8@ VGS = 10V  
30V  
Description  
This new generation MOSFET has been designed to minimize the  
on-state resistance (RDS(on)) and yet maintain superior switching  
performance, making it ideal for high efficiency power management  
applications.  
Mechanical Data  
Case: SOT563  
Case Material: Molded Plastic. UL Flammability Classification  
Rating 94V-0  
Applications  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe  
(Lead Free Plating). Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Weight: 0.006 grams (approximate)  
DC-DC Converters  
Power management functions  
Battery Operated Systems and Solid-State Relays  
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,  
Memories, Transistors, etc  
D2  
G1  
S1  
SOT563  
S2  
G2  
D1  
Top View  
Top View  
Internal Schematic  
ESD PROTECTED  
Ordering Information (Note 4)  
Part Number  
DMN63D8LV-7  
DMN63D8LV-13  
Case  
SOT563  
SOT563  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com.  
Marking Information  
3D8 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: Z = 2012)  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
Code  
Y
Z
A
B
C
D
E
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
www.diodes.com  
August 2012  
© Diodes Incorporated  
DMN63D8LV  
Document number: DS36022 Rev. 2 - 2  
DMN63D8LV  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
VDSS  
Value  
30  
Units  
V
V
Drain-Source Voltage  
Gate-Source Voltage  
Steady  
±20  
VGSS  
T
T
A = 25°C  
A = 70°C  
260  
200  
mA  
Continuous Drain Current (Note 5)  
VGS =10V  
ID  
State  
Steady  
State  
TA = 25°C  
TA = 70°C  
220  
160  
mA  
mA  
Continuous Drain Current (Note 5)  
VGS = 5V  
ID  
800  
Pulsed Drain Current (10μs pulse, duty cycle = 1%)  
IDM  
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
450  
Units  
mW  
°C/W  
°C  
Total Power Dissipation  
(Note 5)  
(Note 5)  
PD  
Thermal Resistance, Junction to Ambient  
Operating and Storage Temperature Range  
281  
Rθ  
JA  
-55 to 150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 6)  
Symbol Min  
Typ  
Max Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage  
30  
V
BVDSS  
IDSS  
1.0  
VGS = 0V, ID = 250μA  
VDS = 30V, VGS = 0V  
µA  
±10.0  
IGSS  
μA VGS = ±20V, VDS = 0V  
ON CHARACTERISTICS (Note 6)  
Gate Threshold Voltage  
0.8  
80  
-
1.5  
2.8  
3.8  
4.2  
4.5  
13  
V
VGS(th)  
0.8  
VDS = VGS, ID = 250μA  
GS = 10.0V, ID = 250mA  
V
VGS = 5.0V, ID = 250mA  
VGS = 4.5V, ID = 250mA  
VGS = 4.0V, ID = 250mA  
VGS = 2.5V, ID = 10mA  
VDS = 10V, ID = 0.115A  
VGS = 0V, IS = 115mA  
Static Drain-Source On-Resistance  
RDS (ON)  
Ω
Forward Transconductance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 7)  
Input Capacitance  
mS  
V
gFS  
1.2  
VSD  
22.0  
3.2  
Ciss  
Coss  
Crss  
RG  
Output Capacitance  
pF  
V
DS = 25V, VGS = 0V, f = 1.0MHz  
Reverse Transfer Capacitance  
Gate Resistance  
2.0  
79.9  
0.87  
0.43  
0.11  
0.11  
3.3  
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz  
Total Gate Charge VGS = 10V  
Total Gate Charge VGS = 4.5V  
Gate-Source Charge  
Qg  
Qg  
VGS = 10V, VDS = 30V,  
nC  
I
D = 150mA  
Qgs  
Qgd  
tD(on)  
tr  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
3.2  
VDD = 30V, ID = 0.115A, VGEN = 10V,  
RGEN = 25Ω  
nS  
Turn-Off Delay Time  
12.0  
6.3  
tD(off)  
tf  
Turn-Off Fall Time  
Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6 .Short duration pulse test used to minimize self-heating effect.  
7. Guaranteed by design. Not subject to production testing.  
2 of 6  
www.diodes.com  
August 2012  
© Diodes Incorporated  
DMN63D8LV  
Document number: DS36022 Rev. 2 - 2  
DMN63D8LV  
0.8  
0.7  
0.6  
0.5  
0.4  
V
= 10.0V  
GS  
V
= 5.0V  
DS  
V
= 4.5V  
GS  
0.6  
0.5  
0.4  
0.3  
0.2  
V
= 4.0V  
GS  
V
= 3.0V  
GS  
0.3  
0.2  
T
= 150°C  
A
T
A
= 125°C  
V
= 2.5V  
T
= 85°C  
GS  
A
0.1  
0
T
= 25°C  
0.1  
0
A
V
= 2.0V  
GS  
T
= -55°C  
A
0
1
2
3
4
5
0
1
2
3
4
5
VGS, GATE-SOURCE VOLTAGE (V)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
Figure 1 Typical Output Characteristic  
5
4
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
V
= 2.5V  
GS  
3
2
V
V
= 4.5V  
= 10V  
GS  
GS  
I
= 250mA  
D
I
= 100mA  
D
1
0
I
= 10mA  
D
1.5  
1.0  
0
0.1 0.2 0.3  
0.4 0.5 0.6 0.7 0.8  
0
5
10  
15  
20  
ID, DRAIN-SOURCE CURRENT (A)  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
Figure 4 Typical Drain-Source On-Resistance  
vs. Gate-Source Voltage  
1.6  
1.4  
10  
8
V
I
= 5.0V  
GS  
= 300mA  
V
= 4.5V  
D
GS  
V
= 4.0V  
GS  
I
= 200mA  
D
T
= 150°C  
A
1.2  
1.0  
6
4
T
= 125°C  
A
T
= 85°C  
A
T
T
= 25°C  
A
A
2
0
0.8  
0.6  
= -55°C  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8  
ID, DRAIN CURRENT (A)  
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Figure 6 On-Resistance Variation with Temperature  
0
25 50  
75 100 125 150  
°
C)  
Figure 5 Typical On-Resistance vs.  
Drain Current and Temperature  
3 of 6  
www.diodes.com  
August 2012  
© Diodes Incorporated  
DMN63D8LV  
Document number: DS36022 Rev. 2 - 2  
DMN63D8LV  
2.0  
1.8  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.6  
1.4  
1.2  
1.0  
I
= 1mA  
D
I
= 250µA  
D
V
= 4.0V  
GS  
I
= 200mA  
D
0.8  
0.6  
1.5  
1.0  
V
= 5.0V  
GS  
I
= 300mA  
D
-50 -25  
TJ, JUNCTION TEMPERATURE (  
Figure 8 Gate Threshold Variation vs. Ambient Temperature  
0
25  
50 75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
C)  
Figure 7 On-Resistance Variation with Temperature  
°
C)  
TJ, JUNCTION TEMPERATURE (  
°
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
T
A
= 150°C  
A
T
= 125°C  
T
= 85°C  
A
T
= 25°C  
A
T
= -55°C  
A
0.1  
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9 Diode Forward Voltage vs. Current  
4 of 6  
www.diodes.com  
August 2012  
© Diodes Incorporated  
DMN63D8LV  
Document number: DS36022 Rev. 2 - 2  
DMN63D8LV  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.  
A
SOT563  
Dim Min Max  
Typ  
B
C
A
B
C
D
G
H
K
L
0.15 0.30 0.20  
1.10 1.25 1.20  
1.55 1.70 1.60  
D
-
-
0.50  
G
H
0.90 1.10 1.00  
1.50 1.70 1.60  
0.55 0.60 0.60  
0.10 0.30 0.20  
0.10 0.18 0.11  
M
K
M
All Dimensions in mm  
L
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
C2  
C2  
Dimensions Value (in mm)  
Z
G
2.2  
1.2  
C1  
X
Y
C1  
C2  
0.375  
0.5  
1.7  
G
Y
Z
0.5  
X
5 of 6  
www.diodes.com  
August 2012  
© Diodes Incorporated  
DMN63D8LV  
Document number: DS36022 Rev. 2 - 2  
DMN63D8LV  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2012, Diodes Incorporated  
www.diodes.com  
6 of 6  
www.diodes.com  
August 2012  
© Diodes Incorporated  
DMN63D8LV  
Document number: DS36022 Rev. 2 - 2  

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